CN217740980U - Water-cooling heat dissipation structure - Google Patents
Water-cooling heat dissipation structure Download PDFInfo
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- CN217740980U CN217740980U CN202222078292.3U CN202222078292U CN217740980U CN 217740980 U CN217740980 U CN 217740980U CN 202222078292 U CN202222078292 U CN 202222078292U CN 217740980 U CN217740980 U CN 217740980U
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Abstract
The utility model provides a water-cooling heat radiation structure, include: the center of the water-cooling plate shell is provided with a first through hole, the front side of the water-cooling plate shell is provided with a water chute, and the back side of the water-cooling plate shell is provided with a plurality of radiating grids; the water-cooling plate water sealing cover is arranged below the water-cooling plate shell and is mutually sealed with the edge of the water-cooling plate shell to form a water-cooling cavity; the front surface of the water sealing cover of the water cooling plate is provided with a plurality of radiating grids, the center of the water sealing cover is provided with a second through hole, and the position of the second through hole is opposite to the position of the first through hole; the inlet of the electromagnetic water valve is communicated with the water-cooling cavity, and the outlet of the electromagnetic water valve is connected with the second through hole; the front surface of the water-cooling shell bears the device to be cooled, cooling circulating water circularly enters and exits the water-cooling cavity through the water path plug, a plurality of water channels are formed in the water-cooling cavity, the outlet of the electromagnetic water valve sprays water to the first through hole, a water film is sprayed out of the upper part of the first through hole and is attached to the heating surface of the device to be cooled, and the device to be cooled is cooled by water. The utility model discloses use the water film as the heat dissipation filling medium of laser instrument and water-cooling board, reduced the test cycle of single laser instrument.
Description
Technical Field
The utility model belongs to device heat dissipation field, more specifically relates to a water-cooling heat radiation structure.
Background
In various key technologies of semiconductor high-power lasers, the solution of the heat dissipation problem is an extremely critical technology, and during the test operation of the semiconductor laser, the heat load is a key factor for limiting the normal operation of the laser. When the heat of the key components of the laser is accumulated to a certain degree, the performance of the laser is reduced, laser parameters are changed, equipment manufacturing is affected, and even the key components are burnt out when the laser is serious, so that the laser is scrapped.
In the aging test of the semiconductor laser, heat conduction is generally carried out between the laser and a heat sink by coating heat-conducting silicone grease. When the test laser is replaced, pretreatment and post-treatment work such as cleaning and coating are required, the process is complicated, and the efficiency is low. Therefore, the invention discloses a novel semiconductor laser heat dissipation structure which is very necessary for better meeting the heat dissipation requirement of test operation of a semiconductor laser.
SUMMERY OF THE UTILITY MODEL
To the defect of prior art, an object of the utility model is to provide a water-cooling heat radiation structure, aim at solving current semiconductor laser heat radiation structure and need adopt heat conduction silicone grease coating to carry out heat-conduction between laser instrument and heat abstractor, when changing test laser instrument, need clear away with preliminary treatment and aftertreatment work such as coating, the process is loaded down with trivial details, the problem of inefficiency.
In order to achieve the above object, the utility model provides a water-cooling heat radiation structure, include: the water cooling plate comprises a water cooling plate shell, a water cooling plate water sealing cover, a water path plug, an electromagnetic water valve plug and an electromagnetic water valve;
the center of the water cooling plate shell is provided with a first through hole, the front side of the water cooling plate shell is provided with a water guide groove, and the back side of the water cooling plate shell is provided with a plurality of radiating grids;
the water-cooling plate water sealing cover is arranged below the water-cooling plate shell and is mutually sealed with the edge of the water-cooling plate shell to form a water-cooling cavity; the front side of the water-cooling plate water sealing cover is provided with a plurality of radiating grids, the center of the water-cooling plate water sealing cover is provided with a second through hole, the position of the second through hole is opposite to the position of the first through hole, and the radiating grids on the front side of the water-cooling plate water sealing cover are mutually meshed with the radiating grids on the back side of the water-cooling plate shell;
the electromagnetic water valve is fixed on the back of the water sealing cover of the water cooling plate, the inlet of the electromagnetic water valve is communicated with the water cooling cavity through an electromagnetic water valve plug, and the outlet of the electromagnetic water valve is connected with the second through hole;
a waterway plug is arranged on the end surface of the water cooling plate shell; the water-cooling shell openly bears and treats the heat dissipation device, and the cooling cycle water is passed in and out by the water route plug circulation the water-cooling cavity forms many water courses in the water-cooling cavity, and the export of electromagnetism water valve is to first through-hole water spray, at first through-hole top blowout water film, with treat the heat dissipation device and generate heat the face laminating, treat the heat dissipation device and realize the water-cooling heat dissipation.
Optionally, the heat dissipation structure further includes: a hollow plug and a pagoda joint;
the water cooling plate shell is provided with a third through hole, and the hollow plug is clamped into the third through hole;
the pagoda joint penetrates through the edge of the water-cooling plate shell and is connected with the hollow plug;
the positive periphery of water-cooling plate casing is equipped with and presets the height, the protruding positive height of water-cooling plate casing of hollow stopper is less than predetermine the height, when water level surpassed the height of hollow stopper in the water-cooling plate casing front, can follow the inside overflow of hollow stopper, outwards discharge through pagoda joint.
Optionally, the heat dissipation structure further includes: a water valve hanging plate;
the water valve hanging plate is fixed on the back of the water sealing cover of the water cooling plate and is fixedly connected with the electromagnetic water valve.
Optionally, the heat dissipation structure further includes: a seal ring;
the sealing ring is clamped in the second through hole, and the outlet of the electromagnetic water valve is inserted into the sealing ring.
Optionally, the hollow plug is a T-shaped hollow plug.
Optionally, the pagoda joint is an L-shaped pagoda joint.
Optionally, the seal ring is a T-shaped seal ring.
Optionally, an inlet of the electromagnetic water valve is connected with an electromagnetic water valve plug installed on the front face of the water-cooling plate water-sealing cover through a PU hose.
Optionally, the electromagnetic water valve plug is an L-shaped quick-connection plug.
Generally, through the utility model discloses above technical scheme that conceive compares with prior art, has following beneficial effect:
the utility model provides a water-cooling heat radiation structure, a large amount of heat dissipation grids are being distributed to the water-cooling inboard, have formed many tiny water courses in the water-cooling inboard, and high-speed rivers can take away the most heat of water-cooling shell body fast. The water-cooling plate shell is attached to the heating surface of the semiconductor laser through the water film, heat generated by the semiconductor laser can be transmitted to the water-cooling plate shell in time, and the heat of the water-cooling plate shell is taken away through high-speed circulating water on the inner side of the water-cooling plate, so that efficient heat dissipation of the semiconductor laser is realized.
The utility model provides a water-cooling heat radiation structure, simple structure can carry out the efficient heat dissipation to semiconductor laser in the test, makes the laser instrument have very high output stability, and simple and convenient when changing semiconductor laser need not to do a lot of preliminary treatment.
The utility model provides a water-cooling heat radiation structure, because the utility model discloses use the water film as the heat dissipation filling medium of laser instrument and water-cooling board, no washing can use when the laser instrument is changed, has reduced the test cycle of single laser instrument.
The utility model provides a water-cooling heat dissipation structure, which has relatively small volume and is easy to be arranged in large scale; the heat dissipation performance is better than that of a water-cooling heat dissipation device with the same volume; the operation requirement is low, and even if a large number of water pumps are arranged, the water pumps cannot have high requirements; the universality is high, and the laser is applicable to high-power semiconductor lasers with various sizes; the production cost is low: the water cooling plate is sealed by adopting a fastening structure, so that the water cooling plate is convenient to mount and dismount and has higher reliability; the technical requirements on equipment processing are not high; the high-power semiconductor laser device is convenient to replace during aging test.
Drawings
Fig. 1 is a general schematic view of a water-cooling heat dissipation structure provided by the present invention;
fig. 2 is a partial schematic view of a water-cooling heat dissipation structure provided by the present invention;
fig. 3 is a schematic view of the water-cooling heat dissipation structure according to the present invention, taken from above;
fig. 4 is a schematic view of the water-cooling heat dissipation structure according to the present invention, taken from a lower perspective;
the same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein: 1 is a water-cooling plate shell; 2 is a water-cooling plate water-sealing cover; 3 is a waterway quick-connection plug; 4 is a T-shaped hollow plug; 5 is an L-shaped quick-connection plug; 6 is an electromagnetic water valve; 8 is a water valve hanging plate; 9 is an L-shaped pagoda joint; 10 is a T-shaped sealing ring; and 14 is a semiconductor laser.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Among various key technologies of semiconductor high-power lasers, the solution of the heat dissipation problem is an extremely critical technology, and during the test operation of the semiconductor laser, the heat load is a key factor limiting the normal operation of the laser. When the heat of the key components of the laser is accumulated to a certain degree, the performance of the laser is reduced, laser parameters are changed, equipment manufacturing is affected, and even the key components are burnt out when the laser is serious, so that the laser is scrapped.
In the aging test of the semiconductor laser, heat conduction is generally carried out between the laser and a heat sink by coating heat-conducting silicone grease. When the test laser is replaced, pretreatment and post-treatment work such as cleaning and coating are required, the process is complicated, and the efficiency is low. Therefore, the invention discloses a novel semiconductor laser heat dissipation structure which is very necessary for better meeting the heat dissipation requirement of test operation of a semiconductor laser.
The utility model relates to a water-cooling radiator for high-power semiconductor laser, in semiconductor laser operation working process, high-power semiconductor laser can produce a large amount of invalid heat power consumptions, and this kind of heat load is the key factor that restricts the normal work of laser, has influenced high-power semiconductor laser's normal ageing and test work. In order to solve the problem of low heat dissipation efficiency of the existing laser module, the heat sink is manufactured.
As shown in fig. 1 to 4, the utility model provides a water-cooling heat dissipation structure, the device include the water-cooling board casing 1 of heat dissipation body, the water-cooling board water-sealing cover 2 in sealed water route, the water route of connecting tube way connect plug 3 soon, connect the L type of water spray solenoid valve and connect plug 5 soon, electromagnetism water valve 6, water valve link plate 8, the L type pagoda that the overflow was used connects 9, the hollow stopper 4 of T type, T type sealing washer 10. The back of the water cooling plate shell 1 is provided with N radiating grids, the center of the shell is provided with a water spraying hole, and the front of the shell is provided with a tree-shaped water guide groove; the front surface of the water cooling plate water sealing cover 2 is provided with N +1 or N-1 radiating grids which are meshed with the N radiating grids on the back surface of the water cooling plate shell 1, the water cooling plate water sealing cover 2 is arranged on the back surface of the water cooling plate shell 1 through a screw array, and sealant is coated on a seam to guarantee the sealing of a water cooling road; the waterway quick-connection plug 3 is arranged on the end surface of the water cooling plate shell 1 through self threads; the L-shaped quick-connection plug-5 is arranged on the back of the water-cooling plate water-sealing cover 2 through threads of the L-shaped quick-connection plug-5; the inlet/outlet of the electromagnetic water valve 6 is provided with 1L-shaped quick-connection plug, the inlet of the electromagnetic water valve 6 is connected with the L-shaped quick-connection plug 5 arranged on the water-cooling plate water-sealing cover 2 through a PU hose, the outlet of the electromagnetic water valve 6 is inserted into a T-shaped sealing ring 10 on the water-cooling plate water-sealing cover 2, and the valve body of the electromagnetic water valve 6 is fixed on a water valve hanging plate 8 through screws; the water valve hanging plate 8 is used for connecting the electromagnetic water valve 6 and the water cooling plate water sealing cover-2; the L-shaped pagoda joint 9 is arranged on the back surface of the water cooling plate shell 1 through threads of the L-shaped pagoda joint; the T-shaped sealing ring 10 is clamped on the back surface of the water cooling plate shell 1, and a hose connected with an outlet of the electromagnetic water valve 6 is inserted into the inner side of the T-shaped sealing ring; the T-shaped hollow plug 4 is clamped on the front surface of the water cooling plate shell 1 to form a small dam.
The semiconductor laser 14 is pressed on the front surface of the semi-water-cooling plate shell 1, and a water film sprayed out through the water spraying holes is tightly connected with the water-cooling plate shell, so that the contact thermal resistance is reduced, and a high-efficiency heat dissipation channel is formed.
In specific implementation, different semiconductor lasers can be quickly replaced according to the requirements of testing the semiconductor laser key devices, and the continuous and stable high-power output of the semiconductor lasers can be maintained.
It should be noted that the utility model provides a water-cooling heat abstractor does not confine to being applicable to the semiconductor laser field, still can carry out high-efficient water-cooling heat dissipation to other types of device, consequently the utility model discloses do not do any to be injectd to the device's specifically applicable field.
It will be understood by those skilled in the art that the foregoing is merely exemplary of the present invention, and is not intended to limit the invention to the particular forms disclosed, and all changes, equivalents and modifications that fall within the spirit and scope of the invention are intended to be embraced thereby.
Claims (9)
1. A water-cooling heat dissipation structure, comprising: the water cooling plate comprises a water cooling plate shell, a water cooling plate water sealing cover, a water path plug, an electromagnetic water valve plug and an electromagnetic water valve;
the center of the water cooling plate shell is provided with a first through hole, the front side of the water cooling plate shell is provided with a water guide groove, and the back side of the water cooling plate shell is provided with a plurality of radiating grids;
the water-cooling plate water sealing cover is arranged below the water-cooling plate shell and is mutually sealed with the edge of the water-cooling plate shell to form a water-cooling cavity; the front side of the water-cooling plate water sealing cover is provided with a plurality of radiating grids, the center of the water-cooling plate water sealing cover is provided with a second through hole, the position of the second through hole is opposite to the position of the first through hole, and the radiating grids on the front side of the water-cooling plate water sealing cover are mutually meshed with the radiating grids on the back side of the water-cooling plate shell;
the electromagnetic water valve is fixed on the back of the water sealing cover of the water cooling plate, the inlet of the electromagnetic water valve is communicated with the water cooling cavity through an electromagnetic water valve plug, and the outlet of the electromagnetic water valve is connected with the second through hole;
a waterway plug is arranged on the end surface of the water cooling plate shell; the water-cooling shell openly bears and treats the heat dissipation device, and the cooling cycle water is passed in and out by the water route plug circulation the water-cooling cavity forms many water courses in the water-cooling cavity, and the export of electromagnetism water valve is to first through-hole water spray, at first through-hole top blowout water film, with treat the heat dissipation device and generate heat the face laminating, treat the heat dissipation device and realize the water-cooling heat dissipation.
2. The heat dissipation structure of claim 1, further comprising: a hollow plug and a pagoda joint;
the water cooling plate shell is provided with a third through hole, and the hollow plug is clamped into the third through hole;
the pagoda joint penetrates through the edge of the water-cooling plate shell and is connected with the hollow plug;
the water-cooling plate shell is characterized in that a preset height is arranged on the periphery of the front face of the water-cooling plate shell, the height of the hollow plug protruding out of the front face of the water-cooling plate shell is smaller than the preset height, when the water level in the front face of the water-cooling plate shell exceeds the height of the hollow plug, the water can overflow from the inside of the hollow plug, and is discharged outwards through the pagoda joint.
3. The heat dissipation structure according to claim 1, further comprising: a water valve hanging plate;
the water valve hanging plate is fixed on the back of the water sealing cover of the water cooling plate and is fixedly connected with the electromagnetic water valve.
4. The heat dissipation structure according to claim 1, further comprising: a seal ring;
the sealing ring is clamped in the second through hole, and the outlet of the electromagnetic water valve is inserted into the sealing ring.
5. The heat dissipation structure of claim 2, wherein the hollow plug is a T-shaped hollow plug.
6. The heat dissipating structure of claim 2, wherein the pagoda joint is an L-shaped pagoda joint.
7. The heat dissipating structure of claim 4, wherein the sealing ring is a T-shaped sealing ring.
8. The heat dissipation structure of claim 1, wherein the inlet of the electromagnetic water valve is connected with an electromagnetic water valve plug arranged on the front surface of the water sealing cover of the water cooling plate through a PU hose.
9. The heat dissipation structure of claim 1 or 8, wherein the electromagnetic water valve plug is an L-shaped quick-connect plug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222078292.3U CN217740980U (en) | 2022-08-05 | 2022-08-05 | Water-cooling heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222078292.3U CN217740980U (en) | 2022-08-05 | 2022-08-05 | Water-cooling heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217740980U true CN217740980U (en) | 2022-11-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222078292.3U Active CN217740980U (en) | 2022-08-05 | 2022-08-05 | Water-cooling heat dissipation structure |
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| CN (1) | CN217740980U (en) |
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- 2022-08-05 CN CN202222078292.3U patent/CN217740980U/en active Active
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