CN206042656U - Piston heat transfer radiator - Google Patents
Piston heat transfer radiator Download PDFInfo
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- CN206042656U CN206042656U CN201621042788.3U CN201621042788U CN206042656U CN 206042656 U CN206042656 U CN 206042656U CN 201621042788 U CN201621042788 U CN 201621042788U CN 206042656 U CN206042656 U CN 206042656U
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- piston
- heat transfer
- heat
- thermal conductive
- conductive shell
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Abstract
The utility model discloses a piston heat transfer radiator, it relates to the remote heat transfer of high -power water -tight equipment chip in the communications field. It is including thermally conductive housing, heat conduction piston, base, heat pipe, heat conduction filler, sealing screw, joint strip, sealed cushion and the spring of taking cooling fin. It when realizing that the crate is sealed, the effective control to the contact force of chip, prevent that the chip from damaging because of pressure is too big, it has also realized the large -span heat transfer of the chip far away apart from chassis wall to still have simple structure, low cost, the commonality is good and the reliability is high characteristics. The specially adapted heat -generating chip high -power sealed electronic equipment far away apart from chassis wall.
Description
Technical field
The utility model is related to the applicable radiator of high-power sealed and electronic equipment in communication measurement and control area.It is particularly suitable
In the electronic equipment to needing the heat transfer of remote, large span.
Background technology
Heater members are mainly close to cabinet inwall by the heat-removal modalities of water-tight equipment at present, and type of thermal communication crosses the machine of being thermally conducted to
Box outer wall, then to outside space heat elimination by way of the fin of cabinet outer wall is with free convection and radiation.This mode has
Many weak points, especially for the more one-board cabinet of interface, euthermic chip apart from cabinet wall farther out, traditional metal
Part adds the heat-conducting mode of chill bar to be difficult the size of control chip pressure, especially for the surface mounting component of BGA package,
The excessive ball-pads for being easily damaged device of pressure, cause chip work or reduce device lifetime.On the other hand, due to sending out
Apart from cabinet wall farther out, thermal conduction resistance is sharply increased hot chip, strong influence radiating effect.
Utility model content
Technical problem to be solved in the utility model is to propose a kind of " piston " formula suitable for sealed cabinet to dissipate
Hot device, while control chip pressure, reduction thermal conduction resistance, takes into account the sealing property of cabinet so as to suitable for sealing
The radiating of equipment.
Technical problem to be solved in the utility model is realized by technical scheme below:
A kind of piston type heat transfer radiator, including the thermal conductive shell 1 with cooling fin, heat conducting piston 2 and spring 3;Outside heat conduction
There is the accommodation space for housing heat conducting piston 2 and spring 3 inside shell 1;Spring 3 is located in accommodation space, one end of spring 3 with
The upper surface of accommodation space is connected, and the other end is connected with the top of heat conducting piston 2;The lateral wall of heat conducting piston 2 with it is accommodating
Between the madial wall in space, gap coordinates, and the bottom of heat conducting piston 2 is for contacting with heater.
Wherein, also include the base 4 with perforate, thermal conductive shell 1 is mutually fixedly connected with base 4, heat conducting piston 2 is in ladder
Shape, bottom area are less than apex area, and the bottom of heat conducting piston 2 passes through the perforate of base 4.
Wherein, between thermal conductive shell 1 and heat conducting piston 2 filled with heat-conducting medium aviation silicone grease oil in prepsetting gap.
Wherein, the top of heat conducting piston 2 is provided with the groove matched with spring 3.
Wherein, at least one steam vent is provided with the outer wall of thermal conductive shell 1.
Wherein, also including heat pipe 5, heat pipe 5 is fixed on the outer wall of thermal conductive shell 1.
Wherein, base 4 is provided with limited post.
Wherein, the top of thermal conductive shell 1 offers circular hole and base 4 for installing sealing screw 6 and seal gasket 7
The aperture for installing fixing screws is provided with circular hole opposite position;The top of thermal conductive shell 1 is offered for installing
The groove of sealing joint strip.
The utility model is compared background technology and is had the advantage that:
The utility model while realizing that cabinet is sealed, contact of the effective control to chip, prevent chip because
Pressure is excessive and damage, it also achieve the chip apart from cabinet wall farther out large span heat transfer, for high-power sealed cabinet
For, radiated rib is exposed to outside cabinet, directly carries out heat convection with air, can effectively reduce the heat of remotely transferring
Resistance, increases heat transfer efficiency.And also have the advantages that simple structure, with low cost, versatility are good and reliability is high.
Description of the drawings:
Fig. 1 is heat spreader structures profile and thermal circuits;
Fig. 2 is radiator sealing screw scheme of installation;
Fig. 3 is radiator schematic appearance;
Fig. 4 is that radiator installs profile in the chassis;
Fig. 5 is the outside drawing that radiator is installed in the chassis.
Specific embodiment:
For making the purpose of this utility model, technical scheme and advantage clearer, with reference to accompanying drawing Fig. 1 to Fig. 5, to this practicality
New embodiment is described in further detail.
Such as Fig. 1 and Fig. 2, a kind of piston type heat transfer radiator, including the thermal conductive shell 1 with cooling fin, heat conducting piston 2, bullet
Spring 3, the base 4 with perforate, heat pipe 5, sealing screw 6 and seal gasket 7;Thermal conductive shell 1 is mutually fixedly connected with base 4, interior
Portion forms the accommodation space for housing heat conducting piston 2 and spring 3;The top of heat conducting piston 2 is provided with recessed with what spring 3 matched
Groove;Spring 3 is located in accommodation space, and one end of spring 3 is connected with the upper surface of accommodation space, the other end and heat conducting piston 2
Top be connected;Gap cooperation, thermal conductive shell 1 and heat conduction between the madial wall of the lateral wall and accommodation space of heat conducting piston 2
Filled with heat-conducting medium aviation silicone grease oil in prepsetting gap between piston 2, its thermal conductivity factor is 0.0966W/m.K;Heat conduction is lived
The bottom of plug 2 is for contacting with heater;Heat conducting piston 2 is stepped, and bottom area is less than apex area, heat conducting piston 2
Bottom through base 4 perforate;Base 4 is provided with limited post.
The top of thermal conductive shell 1 offer for install on the circular hole and base 4 of sealing screw 6 and seal gasket 7 with circle
Hole opposite position is provided with the aperture for installing fixing screws;The top of thermal conductive shell 1 is offered for installing sealing
At least one steam vent is provided with the groove of adhesive tape, and the outer wall of thermal conductive shell 1;Heat pipe 5 is fixed on the outer wall of thermal conductive shell 1
On.Concrete implementation step includes:
1) heat transfer that chip 11 in printed board is produced is on heat conducting piston 2, then sequentially passed through by heat conducting piston 2
Conductive filler medium, thermal conductive shell 1 and heat pipe 5 between shell and piston is eventually through the cooling fin and environment on thermal conductive shell
Air carries out heat convection;
2) can be with the contact between regulating piston and chip by spring 3;
3) power suffered on radiator can be delivered on the base plate of cabinet 8 so as to protect by the spacing pillar of base 4
Chip is not damaged by;
4) such as Fig. 5, the utility model is applied to wall large span heat transfer farther out of the chip 11 apart from cabinet 8, can be in cabinet
Cover plate 9 is open, and cooling fin is exposed cabinet 8, contacts realization sealing with cabinet cover plate 9 by the adhesive tape 10 on thermal conductive shell 1.
Installation process is as follows:
1) heat pipe 5 is welded to the surrounding of thermal conductive shell 1;
2) by the outer surface uniform application aviation silicone grease oil of heat conducting piston 2;
3) successively spring 3, heat conducting piston 2 and base 4 are installed on thermal conductive shell 1;
4) first sealing screw 6 is pulled down when installing, radiator is installed on the base plate of cabinet, then pass through installation sealing
The hole mounting seat screw of screw 6, screws the sealing screw 6 with seal gasket 7.
Whole radiator is assembled into, schematic appearance is as shown in Figure 3.
Design feature is as follows:
1) contact between heat conducting piston 2 and chip 11 is adjusted by spring and is controlled, by rational design spring
The height of decrement and spacing pillar can offset the impact of chip height tolerance completely, and can control contact
5.5lb within;
2) maximal clearance 0.03mm is coordinated using gap between heat conducting piston 2 and thermal conductive shell 1, to move down on piston 2
The dynamic contact for adjusting chip, while can cause " piston " and housing between full of air, increased thermal conduction resistance, although
Gap very little, it is also necessary to exclude air in gap to reduce thermal resistance.Gap, aviation grease viscosity are filled using aviation grease
Greatly, flowing is difficult, less demanding to the sealing property of radiator, which includes grease and may also operate as lubrication;
3) foot of radiator 4 has four limited posts to be connected with the base plate of cabinet by screw, suffered by such radiator
Power is delivered on cabinet by spacing pillar, protects chip not acted on by other external force;
4) radiation processes are:The heat of chip first passes to heat conducting piston 2, via conductive filler medium, heat pipe 5 and heat conduction outside
Shell 1, carries out heat convection eventually through the radiated rib on thermal conductive shell 1 and air.The heat-transfer path of total such as Fig. 1,
Its entire thermal resistance is:
RAlways=Rc+Rc-p+Rt+Rp-h+Rh+Rh-k
In formula, each thermal resistance meaning is as follows:
a)RcFor chip internal thermal resistance, it is assumed that uniform during the heat flow of chip surface, its back side is contacted with piston type point, heat
Amount can only reach piston by chip center region mostly, and this is equivalent to a bulk resistance.By effectively heat transfer radius and chip
The ratio of the heat transfer radius of itself is determining Rc, chip is to piston thermal resistance Rc-p, it is the thermal conduction resistance of metal contact, it is desirable to the greatest extent
Amount reduces this thermal resistance and can reduce the general R of this thermal contact resistance by way of filling heat-conducting silicone grease or flexible heat conductive padc-p;
B) thermal resistance R of piston itselft, heat is diffused into piston by pistons end, forms a diffusion thermal resistance herein by circle
The process of post uniform heat conduction, ignores blockage effect;
C) thermal resistance R from piston to thermal conductive shellp-h, using herein by multilayer cylinder thermal resistance calculation;
D) thermal resistance R of thermal conductive shell itselfh, by thermal resistance R of thermal conductive shell side wall1With thermal resistance R of cooling fin bottom substrate2
It is composed in series, as shown in figure 1, L1It is shell wall thermally conductive pathways length, L2It is cooling fin bottom substrate thickness, outer casing inner wall diameter
dh, outer shell outer wall width square dc, dpFor piston diameter, k is the thermal conductivity factor of thermal conductive shell material, then thermal resistance RhFor:
E) thermal resistance R between cooling fin and airh-k, can be calculated according to the heat-conducting method of Straight Fins of Uniform Cross-section, its value is;δ be cooling fin substrate thickness, A1For the surface area of apleuria side, A2For there is rib side surface area;
F) this example radiator is applied to sealed cabinet, chassis cover plate opening can be exposed the fin of radiator, by machine
Conductive seal rubber strip between cover plate and radiator realizes sealing, such as Fig. 4, Fig. 5.
Claims (8)
1. a kind of piston type heat transfer radiator, including the thermal conductive shell with cooling fin (1), it is characterised in that:Also live including heat conduction
Plug (2) and spring (3);There is the accommodation space for housing heat conducting piston (2) and spring (3) inside thermal conductive shell (1);Spring
(3) it is located in accommodation space, one end of spring (3) is connected with the upper surface of accommodation space, the other end and heat conducting piston (2)
Top is connected;Between the lateral wall and the madial wall of accommodation space of heat conducting piston (2), gap coordinates, the bottom of heat conducting piston (2)
Hold for contacting with heater.
2. a kind of piston type heat transfer radiator according to claim 1, it is characterised in that:Also include the base with perforate
(4), thermal conductive shell (1) is mutually fixedly connected with base (4), and heat conducting piston (2) is stepped, and bottom area is less than apex area,
Perforate of the bottom of heat conducting piston (2) through base (4).
3. a kind of piston type heat transfer radiator according to claim 1, it is characterised in that:Thermal conductive shell (1) is lived with heat conduction
Filled with heat-conducting medium aviation silicone grease oil in prepsetting gap between plug (2).
4. a kind of piston type heat transfer radiator according to claim 1, it is characterised in that:Heat conducting piston is set at the top of (2)
There is the groove matched with spring (3).
5. a kind of piston type heat transfer radiator according to claim 1, it is characterised in that:On the outer wall of thermal conductive shell (1)
It is provided with least one steam vent.
6. a kind of piston type heat transfer radiator according to claim 1, it is characterised in that:Also include heat pipe (5), heat pipe
(5) it is fixed on the outer wall of thermal conductive shell (1).
7. a kind of piston type heat transfer radiator according to claim 2, it is characterised in that:Base (4) is provided with limited post.
8. a kind of piston type heat transfer radiator according to claim 2, it is characterised in that:Thermal conductive shell is opened at the top of (1)
Be provided with for install be provided with circular hole opposite position on the circular hole and base (4) of sealing screw (6) and seal gasket (7) for
The aperture of fixing screws is installed;The top of thermal conductive shell (1) offers the groove for installing sealing joint strip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621042788.3U CN206042656U (en) | 2016-09-08 | 2016-09-08 | Piston heat transfer radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621042788.3U CN206042656U (en) | 2016-09-08 | 2016-09-08 | Piston heat transfer radiator |
Publications (1)
Publication Number | Publication Date |
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CN206042656U true CN206042656U (en) | 2017-03-22 |
Family
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Family Applications (1)
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CN201621042788.3U Active CN206042656U (en) | 2016-09-08 | 2016-09-08 | Piston heat transfer radiator |
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CN (1) | CN206042656U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110167325A (en) * | 2019-06-24 | 2019-08-23 | Oppo广东移动通信有限公司 | Radiator and electronic equipment |
-
2016
- 2016-09-08 CN CN201621042788.3U patent/CN206042656U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110167325A (en) * | 2019-06-24 | 2019-08-23 | Oppo广东移动通信有限公司 | Radiator and electronic equipment |
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