CN220823590U - Multilayer circuit board with good heat dissipation effect - Google Patents
Multilayer circuit board with good heat dissipation effect Download PDFInfo
- Publication number
- CN220823590U CN220823590U CN202322388831.8U CN202322388831U CN220823590U CN 220823590 U CN220823590 U CN 220823590U CN 202322388831 U CN202322388831 U CN 202322388831U CN 220823590 U CN220823590 U CN 220823590U
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- CN
- China
- Prior art keywords
- circuit board
- heat
- heat dissipation
- cooling liquid
- multilayer circuit
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 46
- 230000000694 effects Effects 0.000 title claims abstract description 21
- 239000000110 cooling liquid Substances 0.000 claims description 50
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000001816 cooling Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board with good heat dissipation effect, which comprises a heat conducting plate and an exchanger.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board with good heat dissipation effect.
Background
The multilayer circuit board is a design with a vertical open structure in which circuit connection and signal transmission are provided by internal wiring between layers, a heat dissipation layer can be introduced in the multilayer circuit board design, and structures such as heat dissipation copper-plated or heat dissipation holes are added at required positions, so that heat dissipation performance is improved, which is helpful for controlling the working temperature of a circuit and improving stability and reliability.
According to the search of Chinese utility model publication number: CN219437229U discloses a multilayer circuit board, the utility model comprises a first heat-conducting plate, a heat-radiating plate, a second heat-conducting plate and heat-radiating fins, the first heat-conducting plate is embedded in the chute, a plurality of heat-radiating plates are embedded on the lower surface of the first heat-conducting plate, the second heat-conducting plate is embedded between two circuit boards, a plurality of heat-radiating fins are arranged on two opposite surfaces of the second heat-conducting plate, so that heat generated during the operation of the circuit board is conveniently and timely dispersed, the problem that the heat is accumulated to cause higher temperature of the circuit board, the conduction efficiency of the circuit board is affected, and meanwhile, the influence of overhigh temperature on the service life of the circuit board is avoided.
However, when the above technical scheme is implemented, there are the following problems: when the heat dissipation plate is used, the heat dissipation plate is arranged on the upper layer and the lower layer of the multi-layer circuit board, so that the heat conduction paths of the upper layer and the lower layer circuit board are increased, the heat dissipation effect of the middle layer circuit board is poorer than that of the upper layer and the lower layer circuit board, meanwhile, the surface area of the heat dissipation plate is mainly dependent on heat dissipation, but the area of the heat dissipation plate is limited, for the circuit board with high power or dense heat, the area of the heat dissipation plate is possibly insufficient to effectively dissipate heat, and in addition, the heat dissipation plate is usually dependent on natural convection or auxiliary wind flow of the surrounding environment, but under some special conditions, such as limited space or insufficient natural wind flow, the heat dissipation plate can not obtain enough cooling effect.
Disclosure of utility model
The utility model aims to provide a multilayer circuit board with good heat dissipation effect, so as to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a multilayer circuit board that radiating effect is good, includes mounting bracket and heat abstractor, the internally connected of mounting bracket has the circuit board, the both sides of circuit board are provided with the slider, the spout has been seted up on the inside wall of mounting bracket, the rear side of mounting bracket is connected with maintains the door plant, the top of circuit board is provided with heat abstractor, the top of circuit board is provided with the heat-conducting plate, the top of heat-conducting plate is provided with radiating fin.
Preferably, the heat conducting plate is provided with a plurality of heat conducting holes, and the heat conducting holes are equidistantly arranged.
Preferably, the radiating fins are provided with a plurality of mounting holes, the mounting holes and the heat conducting holes are arranged in a one-to-one correspondence manner, and fan blades are arranged in the mounting holes.
Preferably, a heat dissipation plate is arranged above the heat dissipation fins, and the heat dissipation plate is wavy.
Preferably, a plurality of heat pipes are arranged in the heat dissipation plate, and copper metal liquid alloy is filled in the heat pipes.
Preferably, an exchanger is arranged above the heat dissipation plate, a plurality of cooling liquid pipelines are arranged in the exchanger, and the cooling liquid pipelines are communicated.
Preferably, the mounting bracket bottom threaded connection has the water pump, one side of water pump is provided with the cooling liquid tank.
Preferably, one side of the cooling liquid tank is connected with the water pump through a hose, the water pump is connected with one side of the cooling liquid pipeline through a hose, and the other side of the cooling liquid pipeline is connected with the cooling liquid tank through a hose.
Compared with the prior art, the utility model has the beneficial effects that:
According to the utility model, through the heat conducting plate, the heat radiating fins, the heat radiating plate and the heat exchanger, the corresponding circuit boards can be respectively radiated through the heat conducting plate, the heat radiating fins, the heat radiating plate and the heat exchanger, the problem that the heat radiating effect of the middle circuit board is poor compared with that of the upper circuit board and the lower circuit board is avoided, the heat radiating area is increased as much as possible through the heat conducting holes and the wave-shaped heat radiating plate, meanwhile, the cooling liquid in the cooling liquid tank is introduced into the cooling liquid pipeline through the water pump, the cooling liquid flows in the cooling liquid pipeline to absorb heat, and the hot cooling liquid is discharged into the cooling liquid tank, so that the circulation of the cooling liquid is realized, the circuit boards are not only radiated by the cooling fin, the area of the cooling fin is possibly insufficient to effectively radiate heat, and the problem that the cooling fin possibly cannot obtain enough cooling effect under some special conditions, such as limited space or insufficient natural wind flow is solved.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present utility model.
FIG. 2 is a schematic view of a heat conducting plate and a heat dissipating fin according to the present utility model.
Fig. 3 is a schematic diagram of a heat dissipating plate structure according to the present utility model.
Fig. 4 is a schematic view of the rear side structure of the mounting frame of the present utility model.
In the figure: 1. a mounting frame; 2. a circuit board; 3. a slide block; 4. a chute; 5. maintaining the door plate; 6. a heat sink; 601. a heat conductive plate; 602. a heat conduction hole; 603. a heat radiation fin; 604. a mounting hole; 605. a fan blade; 606. a heat dissipation plate; 607. a heat pipe; 608. an exchanger; 609. a coolant pipe; 610. a water pump; 611. a cooling liquid tank.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, an embodiment of the present utility model is provided: the utility model provides a multilayer circuit board that radiating effect is good, includes mounting bracket 1 and heat abstractor 6, and the internal connection of mounting bracket 1 has circuit board 2, and the both sides of circuit board 2 are provided with slider 3, have seted up spout 4 on the inside wall of mounting bracket 1, and the rear side of mounting bracket 1 is connected with maintains door plant 5, and the top of circuit board 2 is provided with heat abstractor 6, and the top of circuit board 2 is provided with heat-conducting plate 601, and the top of heat-conducting plate 601 is provided with radiating fin 603.
Specifically, a plurality of heat conducting holes 602 are formed in the heat conducting plate 601, the heat conducting holes 602 are equidistantly formed, the contact area between the heat conducting plate 601 and the circuit board 2 can be increased by increasing the heat conducting holes 602, the heat transfer efficiency is improved, meanwhile, the circuit board 2 is facilitated to more uniformly conduct heat to all parts of the heat conducting plate 601, and then the heat dissipation capacity of the heat dissipation fins 603 is improved.
Specifically, a plurality of mounting holes 604 are formed in the radiating fins 603, the mounting holes 604 and the heat conducting holes 602 are arranged in a one-to-one correspondence, and the fan blades 605 are arranged in the mounting holes 604, so that the air flow of the fan blades 605 can be ensured to be directly aligned with the heat conducting holes 602 by arranging the fan blades 605 and the heat conducting holes 602 in a one-to-one correspondence, the air flow of the fan blades 605 can effectively carry away heat released in the heat conducting holes 602, the heat dissipation is accelerated, and the heat dissipation effect is improved.
Specifically, the heat dissipation plate 606 is arranged above the heat dissipation fins 603, the heat dissipation plate 606 is in a wave shape, the surface area can be increased due to the wave-shaped high-low fluctuation and curve design, the heat dissipation plate 606 can be fully contacted with the surrounding environment, meanwhile, more turbulence can be generated by guiding air, and the movement and mixing of heat are increased, so that the transfer efficiency of the heat and the surrounding air is improved.
Specifically, the heat dissipation plate 606 is internally provided with the plurality of heat pipes 607, the copper metal liquid alloy is filled in the heat pipes 607, and the copper metal liquid alloy in the heat pipes 607 can rapidly transfer heat from the circuit board 2 to other areas of the heat dissipation plate 606, so that the heat can be rapidly and uniformly dispersed, the heat conduction efficiency is improved, and the heat dissipation plate 606 can rapidly and effectively dissipate the heat.
Specifically, an exchanger 608 is disposed above the cooling plate 606, a plurality of cooling liquid pipes 609 are disposed inside the exchanger 608, the plurality of cooling liquid pipes 609 are communicated with each other, and cooling liquid in the cooling liquid pipes 609 absorbs heat emitted by the cooling plate 606.
Specifically, the bottom of the mounting frame 1 is in threaded connection with a water pump 610, one side of the water pump 610 is provided with a cooling liquid tank 611, cooling liquid in the cooling liquid tank 611 is introduced into the cooling liquid removing pipeline 609 through the water pump 610, the cooling liquid flows in the cooling liquid pipeline 609, and heat emitted by the cooling plate 606 is absorbed.
Specifically, one side of the cooling liquid tank 611 is connected with the water pump 610 through a hose, the water pump 610 is connected with one side of the cooling liquid pipeline 609 through a hose, the other side of the cooling liquid pipeline 609 is connected with the cooling liquid tank 611 through a hose, cooling liquid in the cooling liquid tank 611 is introduced into the cooling liquid pipeline 609 through the water pump 610, the cooling liquid flows in the cooling liquid pipeline 609 to absorb heat, and hot cooling liquid is discharged into the cooling liquid tank 611, so that circulation of the cooling liquid is realized.
Working principle: when the circuit board is used, heat of the circuit board 2 is transferred to the radiating fins 603 through the heat conducting plate 601, the heat emitted by the heat conducting plate 601 is blown away through the fan blades 605, then the circuit board 2 is subjected to primary heat radiation, the heat which cannot be timely blown away by the fan blades 605 is absorbed through the heat pipes 607, the heat is circularly absorbed in the cooling liquid pipelines 609 and the cooling liquid tank 611 through cooling liquid, and then the circuit board 2 is subjected to secondary heat radiation, so that the heat radiation effect of the circuit board 2 is ensured, the heat conducting plate 601, the heat radiating plate 606 and the exchanger 608 are all in the mounting frame 1 through the sliding blocks 3 and the sliding grooves 4, the disassembly and the maintenance are convenient, in addition, the cooling liquid pipelines can be maintained through the disassembly and the maintenance door plate 5, the leakage of the cooling liquid pipelines is prevented, and the danger is caused.
The foregoing is merely exemplary embodiments of the present utility model, and specific structures and features that are well known in the art are not described in detail herein. It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a multilayer circuit board that radiating effect is good, includes mounting bracket (1) and heat abstractor (6), its characterized in that: the inside of mounting bracket (1) is connected with circuit board (2), the both sides of circuit board (2) are provided with slider (3), spout (4) have been seted up on the inside wall of mounting bracket (1), the rear side of mounting bracket (1) is connected with maintains door plant (5), the top of circuit board (2) is provided with heat abstractor (6), the top of circuit board (2) is provided with heat-conducting plate (601), the top of heat-conducting plate (601) is provided with fin (603).
2. The multilayer circuit board with good heat dissipation effect according to claim 1, wherein: a plurality of heat conduction holes (602) are formed in the heat conduction plate (601), and the heat conduction holes (602) are equidistantly arranged.
3. The multilayer circuit board with good heat dissipation effect according to claim 1, wherein: a plurality of mounting holes (604) are formed in the radiating fins (603), the mounting holes (604) and the heat conducting holes (602) are arranged in a one-to-one correspondence mode, and fan blades (605) are arranged in the mounting holes (604).
4. The multilayer circuit board with good heat dissipation effect according to claim 1, wherein: a heat dissipation plate (606) is arranged above the heat dissipation fins (603), and the heat dissipation plate (606) is wavy.
5. The multilayer circuit board with good heat dissipation effect according to claim 4, wherein: a plurality of heat pipes (607) are arranged in the heat dissipation plate (606), and copper metal liquid alloy is filled in the heat pipes (607).
6. The multilayer circuit board with good heat dissipation effect according to claim 4, wherein: an exchanger (608) is arranged above the radiating plate (606), a plurality of cooling liquid pipelines (609) are arranged inside the exchanger (608), and the plurality of cooling liquid pipelines (609) are communicated.
7. The multilayer circuit board with good heat dissipation effect according to claim 1, wherein: the water pump (610) is connected to the bottom of the mounting frame (1) in a threaded mode, and a cooling liquid tank (611) is arranged on one side of the water pump (610).
8. The multilayer circuit board with good heat dissipation effect according to claim 7, wherein: one side of the cooling liquid tank (611) is connected with the water pump (610) through a hose, the water pump (610) is connected with one side of the cooling liquid pipeline (609) through a hose, and the other side of the cooling liquid pipeline (609) is connected with the cooling liquid tank (611) through a hose.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322388831.8U CN220823590U (en) | 2023-09-04 | 2023-09-04 | Multilayer circuit board with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322388831.8U CN220823590U (en) | 2023-09-04 | 2023-09-04 | Multilayer circuit board with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220823590U true CN220823590U (en) | 2024-04-19 |
Family
ID=90671781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322388831.8U Active CN220823590U (en) | 2023-09-04 | 2023-09-04 | Multilayer circuit board with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220823590U (en) |
-
2023
- 2023-09-04 CN CN202322388831.8U patent/CN220823590U/en active Active
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| GR01 | Patent grant |