CN220731497U

CN220731497U - Explosion-proof diode

Info

Publication number: CN220731497U
Application number: CN202322227375.9U
Authority: CN
Inventors: 王太阳; 俞银; 谭仲坤; 蒋运权
Original assignee: Guangdong Huixin Electronic Technology Co ltd
Current assignee: Guangdong Huixin Electronic Technology Co ltd
Priority date: 2023-08-17
Filing date: 2023-08-17
Publication date: 2024-04-05
Anticipated expiration: 2033-08-17

Abstract

The utility model relates to the field of diodes, in particular to an explosion-proof diode, which comprises a shell, an explosion-proof layer arranged on the inner wall of the shell, a diode chip arranged in the explosion-proof layer, an anode component connected with the diode chip, a heat dissipation layer connected below the anode component and a cathode component connected with one side of the heat dissipation layer, wherein the heat dissipation layer is arranged on the inner wall of the shell; the inner wall of the explosion-proof layer is provided with a plurality of explosion-proof bumps along the circumferential direction of the inner wall; the heat dissipation layer comprises a first heat conduction layer, a temperature sensing layer, a second heat conduction layer and a cooling layer which are sequentially stacked from top to bottom, wherein the temperature sensing layer is connected with the cooling layer, and a heat dissipation bottom plate is connected below the cooling layer. The utility model aims to provide an explosion-proof diode with good heat dissipation effect and good safety performance.

Description

Explosion-proof diode

Technical Field

The utility model relates to the field of diodes, in particular to an explosion-proof diode.

Background

A diode is a two-electrode electronic component with asymmetric conductance. An ideal diode has zero resistance between the anode and cathode when the two electrodes are on in the forward direction, and infinite resistance when the two electrodes are off, i.e., current is allowed to flow through the diode in only one direction. Therefore, the diode has the characteristic of unidirectional conduction and can play a role in rectification.

The existing diode shell is mostly simple and sealed, heat can be generated when an internal electronic element works, the heat can be slowly emitted to the outside through the shell under normal conditions, once the circuit is overheated, the heat generated in the diode can be increased, the heat cannot be emitted in time, the diode can have explosion risk, and the shell cannot effectively resist explosion impact of the diode and is broken.

Disclosure of Invention

Based on the above, the utility model aims to provide an explosion-proof diode with good heat dissipation effect and good safety performance.

The utility model adopts the following technical scheme:

an explosion-proof diode comprises a shell, an explosion-proof layer arranged on the inner wall of the shell, a diode chip arranged in the explosion-proof layer, an anode component connected with the diode chip, a heat dissipation layer connected below the anode component, and a cathode component connected with one side of the heat dissipation layer; the inner wall of the explosion-proof layer is provided with a plurality of explosion-proof bumps along the circumferential direction of the inner wall; the heat dissipation layer comprises a first heat conduction layer, a temperature sensing layer, a second heat conduction layer and a cooling layer which are sequentially stacked from top to bottom, wherein the temperature sensing layer is connected with the cooling layer, and a heat dissipation bottom plate is connected below the cooling layer.

The technical scheme is further improved in that the explosion-proof layer is a PC plastic layer.

The technical scheme is further improved in that the positive electrode assembly comprises a first base island and a positive electrode pin connected to one side of the first base island, and the positive electrode of the diode chip is connected to the first base island.

The technical scheme is further improved in that the negative electrode assembly comprises a second base island and a negative electrode pin connected to one side of the second base island, and the second base island is connected to the negative electrode of the diode chip through a lead.

The technical scheme is further improved in that the temperature sensing layer is a thermosensitive film resistor layer.

The technical scheme is further improved in that the cooling layer is a semiconductor refrigeration sheet layer.

The technical scheme is further improved in that the first heat conduction layer and the second heat conduction layer are both carbon fiber layers.

The technical scheme is further improved in that the heat dissipation layer further comprises a first wiring, a second wiring and a third wiring.

According to a further improvement of the technical scheme, the first wiring is connected to one side of the temperature sensing layer, the second wiring is connected to one side of the cooling layer, and the temperature sensing layer is connected with the cooling layer in series through the third wiring.

The technical scheme is further improved in that a plurality of radiating fins are uniformly arranged below the radiating bottom plate at equal intervals.

The beneficial effects of the utility model are as follows:

according to the utility model, the explosion-proof layer is arranged, and the explosion-proof protruding blocks are arranged on the explosion-proof layer, so that when part of heat generated by the internal fragmentation of the diode forms a bulge between two adjacent explosion-proof protruding blocks, the explosion of the diode is effectively prevented, and the safety of the diode is improved; meanwhile, the temperature sensing layer and the cooling layer are arranged, so that the linkage of temperature detection and temperature control is realized, the diode is kept in an environment with relatively constant temperature, active refrigeration and heat dissipation are realized, and the heat dissipation effect is effectively improved.

Drawings

FIG. 1 is a schematic diagram of an explosion-proof diode according to the present utility model;

FIG. 2 is a cross-sectional view of the explosion-proof diode of FIG. 1;

fig. 3 is a schematic structural diagram of a heat dissipation layer of the explosion-proof diode of fig. 1.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "vertical direction", "upper", "lower", "horizontal", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific azimuth, and are constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," "fourth," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, connected via an intermediary, or connected by communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

As shown in fig. 1 to 3, an explosion-proof diode includes a case 10, an explosion-proof layer 20 provided on an inner wall of the case 10, a diode chip 11 provided inside the explosion-proof layer 20, a positive electrode assembly 30 connected to the diode chip 11, a heat dissipation layer 40 connected below the positive electrode assembly 30, and a negative electrode assembly 50 connected to one side of the heat dissipation layer 40; the inner wall of the explosion-proof layer 20 is provided with a plurality of explosion-proof bumps 21 along the circumferential direction thereof; the heat dissipation layer 40 includes a first heat conduction layer 41, a temperature sensing layer 42, a second heat conduction layer 43, and a cooling layer 44, which are sequentially stacked from top to bottom, the temperature sensing layer 42 is connected to the cooling layer 44, and a heat dissipation bottom plate 45 is connected to the lower side of the cooling layer 44.

Further, the explosion-proof layer 20 is a PC plastic layer. The PC plastic has good cohesiveness, can carry out sticky connection when the diode bursts, prevents the diode from burst, and further improves the safety of the diode.

Further, the positive electrode assembly 30 includes a first base island 31, a positive electrode pin 32 connected to one side of the first base island 31, and a positive electrode of the diode chip 11 is connected to the first base island 31; the cathode assembly 50 includes a second base island 51 and a cathode pin 52 connected to one side of the second base island 51, and the second base island 51 is connected to the cathode of the diode chip 11 through a lead. The positive electrode pin 32 and the negative electrode pin 52 are used as conductive media to be connected with an external power supply to supply power to the temperature sensing layer 42 and the cooling layer 44, so that the use convenience of the utility model is further improved.

Further, the temperature-sensitive layer 42 is a thermosensitive thin film resistor layer. The thermistor plays a role of a temperature switch, senses the temperature change to control the cooling layer 44 to refrigerate, and conducts heat to the heat dissipation bottom plate 45 for heat dissipation.

Further, the cooling layer 44 is a semiconductor refrigeration sheet. The semiconductor refrigeration sheet has a cold end facing the temperature sensing layer 42 and a hot end facing the heat dissipating bottom plate 45, and can be used as a heat pump to transfer heat from the cold end side to the hot end.

Further, the first heat conducting layer 41 and the second heat conducting layer 43 are carbon fiber layers. The carbon fiber is adopted as the heat conducting layer, so that the heat conducted to the heat conducting layer is uniformly dispersed, uniform conduction of the heat is realized, and the heat dissipation effect is improved.

Further, a plurality of heat dissipation fins 46 are uniformly arranged below the heat dissipation bottom plate 45 at equal intervals. Through the radiating fins 46, the radiating effect of the radiating bottom plate 45 is effectively improved, and then the heat dissipation inside the diode is improved.

Further, the heat dissipation layer 40 further includes a first wiring 47, a second wiring 48, and a third wiring 49; the first wire 47 is connected to one side of the temperature-sensitive layer 42, the second wire 48 is connected to one side of the cooling layer 44, and the temperature-sensitive layer 42 is connected in series with the cooling layer 44 through the third wire 49. The external power supply supplies power to the temperature sensing layer 42 and the cooling layer 44 through the first wiring 47 and the second wiring 48 respectively, when the internal temperature of the diode rises, the resistance value of the thermosensitive thin film resistor is reduced, and the voltage of the external power supply is gradually added to the cooling layer 44 connected with the temperature sensing layer in series, so that the cooling layer 44 is refrigerated and dissipates heat.

The foregoing description of the preferred embodiments of the utility model has been presented only in a specific and detailed description, and is not to be construed as limiting the scope of the utility model. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the spirit of the utility model, and the utility model is intended to encompass such modifications and improvements.

Claims

1. The explosion-proof diode is characterized by comprising a shell, an explosion-proof layer arranged on the inner wall of the shell, a diode chip arranged in the explosion-proof layer, an anode component connected with the diode chip, a heat dissipation layer connected below the anode component and a cathode component connected with one side of the heat dissipation layer; the inner wall of the explosion-proof layer is provided with a plurality of explosion-proof bumps along the circumferential direction of the inner wall; the heat dissipation layer comprises a first heat conduction layer, a temperature sensing layer, a second heat conduction layer and a cooling layer which are sequentially stacked from top to bottom, wherein the temperature sensing layer is connected with the cooling layer, and a heat dissipation bottom plate is connected below the cooling layer.

2. The explosion-proof diode of claim 1, wherein the explosion-proof layer is a PC plastic layer.

3. The explosion-proof diode as set forth in claim 1, wherein the positive electrode assembly includes a first base island, a positive electrode pin connected to one side of the first base island, and a positive electrode of the diode chip is connected to the first base island.

4. The explosion-proof diode of claim 1, wherein the cathode assembly comprises a second island, a cathode pin connected to one side of the second island, the second island being connected to the cathode of the diode chip by a lead.

5. The explosion-proof diode of claim 1, wherein the temperature-sensitive layer is a thermistor layer.

6. The explosion-proof diode of claim 1, wherein the cooling layer is a semiconductor refrigeration sheet.

7. The explosion-proof diode of claim 1, wherein the first and second thermally conductive layers are carbon fiber layers.

8. The explosion-proof diode of claim 1, wherein the heat dissipation layer further comprises a first connection, a second connection, and a third connection.

9. The explosion-proof diode of claim 8, wherein the first wire is connected to one side of a temperature sensing layer, the second wire is connected to one side of a cooling layer, and the temperature sensing layer is connected in series with the cooling layer through the third wire.

10. The explosion-proof diode of claim 1, wherein a plurality of radiating fins are uniformly arranged below the radiating bottom plate at equal intervals.