CN220692053U - Multicolor CSP packaging structure and CSP lamp thereof - Google Patents
Multicolor CSP packaging structure and CSP lamp thereof Download PDFInfo
- Publication number
- CN220692053U CN220692053U CN202322147207.9U CN202322147207U CN220692053U CN 220692053 U CN220692053 U CN 220692053U CN 202322147207 U CN202322147207 U CN 202322147207U CN 220692053 U CN220692053 U CN 220692053U
- Authority
- CN
- China
- Prior art keywords
- flip chip
- csp
- packaging
- fluorescent glue
- color
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 39
- 239000003292 glue Substances 0.000 claims abstract description 33
- 239000011324 bead Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000005286 illumination Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model relates to the technical field of LED illumination, in particular to a multicolor CSP (chip scale package) structure and a CSP lamp thereof, comprising a first flip chip, a second flip chip and packaging fluorescent glue; the first flip chip is connected with the packaging fluorescent glue and is positioned in the packaging fluorescent glue, the second flip chip is connected with the packaging fluorescent glue and is positioned in the packaging fluorescent glue, and the packaging fluorescent glue is coated on the first flip chip and the second flip chip.
Description
Technical Field
The utility model relates to the technical field of LED illumination, in particular to a multicolor CSP packaging structure and a CSP lamp thereof.
Background
The traditional multi-color lamp beads are adhered on the same substrate by adopting two lamp beads with different color temperatures, or the two dispensing areas are divided on one bracket to fix the fluorescent glue with different color temperatures.
The two chips of the two methods have wider space and occupy larger space of the substrate, and light spots still exist in mixed light.
Disclosure of Invention
The utility model aims to provide a multicolor CSP packaging structure and a CSP lamp thereof, which solve the problems that the space between two chips of the traditional multicolor lamp bead is larger, the occupied space is increased, and light spots exist in mixed light.
In order to achieve the above object, the present utility model provides a multicolor CSP packaging structure, which includes a first flip chip, a second flip chip, and a packaging fluorescent glue; the first flip chip is connected with the packaging fluorescent glue and is positioned in the packaging fluorescent glue, the second flip chip is connected with the packaging fluorescent glue and is positioned in the packaging fluorescent glue connection, and the packaging fluorescent glue is coated on the first flip chip and the second flip chip.
Wherein a pitch between the first flip chip and the second flip chip is below 200 microns.
Wherein the packaging fluorescent glue is formed by fluorescent powder mixed resin.
Wherein the number of the first flip chip and the second flip chip is plural.
The first flip chip is a low-color temperature CSP lamp bead, and the second flip chip is a blue light chip; or the first flip chip and the second flip chip are different-color-light CSP lamp beads or different-color-light flip chips.
The multicolor CSP lamp comprises a substrate, wherein the multicolor CSP packaging structure is arranged on the substrate.
The two chips of the multicolor CSP packaging structure are very close, the whole device volume is small, the space requirement on a circuit board is reduced, the chips with higher density can be integrated, and meanwhile, the color temperature transition is more natural when the two color temperatures are mixed, the displacement deviation sense is avoided, the light spots are smaller, and the light is uniform.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a schematic structural view of the encapsulated fluorescent glue of the present utility model.
Fig. 2 is a schematic view of a mounting structure of a first flip chip of the present utility model.
In the figure: 101-first flip chip, 102-second flip chip, 103-packaged fluorescent glue.
Detailed Description
The following detailed description of embodiments of the utility model, examples of which are illustrated in the accompanying drawings and, by way of example, are intended to be illustrative, and not to be construed as limiting, of the utility model.
Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a packaged fluorescent glue, and fig. 2 is a schematic structural diagram of a first flip chip.
The utility model provides a multicolor CSP packaging structure, which comprises a first flip chip 101, a second flip chip 102 and a packaging fluorescent glue 103, wherein the volume of the multicolor CSP packaging structure is reduced by reducing the distance between the two chips, and meanwhile, the color temperature transition is more natural.
For the present embodiment, the first flip chip 101 is connected to the encapsulation fluorescent glue 103 and is located inside the encapsulation fluorescent glue 103, the second flip chip 102 is connected to the encapsulation fluorescent glue 103 and is located inside the encapsulation fluorescent glue 103, the encapsulation fluorescent glue 103 is coated on the first flip chip 101 and the second flip chip 102, the first flip chip 101 is a low color temperature CSP lamp bead, during processing, the first flip chip 101 and the second flip chip 102 are arranged in the same or different electrode directions according to a fixture at a fixed position, a width-limited thickness fixture is placed in the arranged first flip chip 101 and the second flip chip 102, a pre-prepared fluorescent glue film is tiled thereon, the method comprises the steps of heating by using a film pressing machine, vacuumizing, baking and solidifying a flat-pressing fluorescent film, and finally transversely and vertically cutting the film by adopting a rotary cutter or a laser, water cutting and other unlimited modes to obtain a whole multi-color CSP packaging device, wherein the XY value of the color coordinates of the first flip chip 101 is below 0.4,0.35, the first flip chip 101 is in a pink color, the display fingers are unlimited, the electrode directions of the first flip chip 101 and the second flip chip 102 can be in the same direction or in opposite directions, and because the two chips of the multi-color CSP packaging structure are very close, the whole device volume becomes very small, the space requirement on a circuit board is reduced, a higher-density chip can be integrated, and meanwhile, the color temperature transition is more natural, no displacement deviation sense is caused, the light spots are smaller, and the light rays are uniform when two color temperature light mixing is performed.
Wherein a pitch between the first flip chip 101 and the second flip chip 102 is 200 micrometers or less.
Next, the encapsulation fluorescent glue 103 is made of a fluorescent powder mixed resin, and the encapsulation fluorescent glue 103 is made of one or more fluorescent powder and mixed resin, and encapsulates the first flip chip 101 and the second flip chip 102.
Meanwhile, the number of the first flip chip 101 and the second flip chip 102 is plural, and the sizes of the first flip chip 101 and the second flip chip 102 are not limited.
Finally, the number of the first flip chip 101 and the second flip chip 102 is plural.
In a preferred embodiment, the first flip chip 101 is a low color temperature CSP bead, and the second flip chip 102 is a blue light chip.
In a preferred embodiment, the first flip chip 101 and the second flip chip 102 are different color light CSP beads or different color light flip chips.
The multicolor CSP lamp comprises a substrate, wherein the multicolor CSP packaging structure is arranged on the substrate.
The foregoing disclosure is only illustrative of one or more preferred embodiments of the present application and is not intended to limit the scope of the claims hereof, as it is to be understood by those skilled in the art that all or part of the process of implementing the described embodiment may be practiced otherwise than as specifically described and illustrated by the appended claims.
Claims (7)
1. The multicolor CSP packaging structure is characterized by comprising a first flip chip, a second flip chip and packaging fluorescent glue;
the first flip chip is connected with the packaging fluorescent glue and is positioned in the packaging fluorescent glue, the second flip chip is connected with the packaging fluorescent glue and is positioned in the packaging fluorescent glue connection, and the packaging fluorescent glue is coated on the first flip chip and the second flip chip.
2. The multi-color CSP packaging of claim 1, wherein,
the first flip chip and the second flip chip have a pitch of 200 microns or less.
3. The multi-color CSP packaging of claim 1, wherein,
the packaging fluorescent glue is formed by fluorescent powder mixed resin.
4. The multi-color CSP packaging of claim 1, wherein,
the number of the first flip chip and the second flip chip is plural.
5. The multi-color CSP packaging of claim 1, wherein,
the first flip chip is a low-color temperature CSP lamp bead, and the second flip chip is a blue light chip.
6. The multi-color CSP packaging of claim 1, wherein,
the first flip chip and the second flip chip are different-color-light CSP lamp beads or different-color-light flip chips.
7. A multicolor CSP lamp comprising a substrate, wherein the substrate is provided with a multicolor CSP package as claimed in any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322147207.9U CN220692053U (en) | 2023-08-09 | 2023-08-09 | Multicolor CSP packaging structure and CSP lamp thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322147207.9U CN220692053U (en) | 2023-08-09 | 2023-08-09 | Multicolor CSP packaging structure and CSP lamp thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220692053U true CN220692053U (en) | 2024-03-29 |
Family
ID=90372636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322147207.9U Active CN220692053U (en) | 2023-08-09 | 2023-08-09 | Multicolor CSP packaging structure and CSP lamp thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220692053U (en) |
-
2023
- 2023-08-09 CN CN202322147207.9U patent/CN220692053U/en active Active
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