CN114076264A - LED lamp strip with diffusion layer on surface and manufacturing method thereof - Google Patents
LED lamp strip with diffusion layer on surface and manufacturing method thereof Download PDFInfo
- Publication number
- CN114076264A CN114076264A CN202010866675.XA CN202010866675A CN114076264A CN 114076264 A CN114076264 A CN 114076264A CN 202010866675 A CN202010866675 A CN 202010866675A CN 114076264 A CN114076264 A CN 114076264A
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- Prior art keywords
- led
- layer
- glue
- diffusion layer
- diffusion
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- 238000009792 diffusion process Methods 0.000 title claims abstract description 128
- 238000004519 manufacturing process Methods 0.000 title abstract description 21
- 239000010410 layer Substances 0.000 claims description 129
- 239000003292 glue Substances 0.000 claims description 62
- 239000012790 adhesive layer Substances 0.000 claims description 55
- 239000000843 powder Substances 0.000 claims description 55
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000011324 bead Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 229920006335 epoxy glue Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000011265 semifinished product Substances 0.000 description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/08—Refractors for light sources producing an asymmetric light distribution
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention relates to an LED lamp strip with a diffusion layer on the surface and a manufacturing method thereof, and particularly relates to an LED lamp strip with a diffusion layer on the surface and a manufacturing method thereof.
Description
Technical Field
The invention relates to an LED lamp strip and the application field thereof, in particular to an LED lamp strip with a diffusion layer on the surface and a manufacturing method thereof.
Background
The LED lamp area that prior art preparation used divide into:
LED lamp beads or LED chips are directly welded on a flexible circuit board to form a naked lamp strip, the naked lamp strip is directly used, and the lamp strip is directly emitted by punctiform light emitted by a plurality of LED lamps to form granular extremely-uneven and very-dazzling light.
Secondly, a layer of transparent adhesive is directly dripped on the flexible circuit board after the LED is welded on the flexible circuit board for use, the transparent adhesive only plays a waterproof role, and light emitted by the LED is still granular uneven dazzling light.
The utility model discloses a LED lamp area, including the LED lamp area, the LED lamp area is equipped with the light source, the light source is equipped with the LED lamp area, the LED lamp area is equipped with the light source, the light source is equipped with the LED lamp area, the LED lamp area is equipped with the light source, the LED lamp area is equipped with the LED lamp area, the light source is equipped with the LED lamp area, the LED lamp area is equipped with the light area, the diffusion layer, this mode must the diffusion layer resin is equipped with the diffusion effect just can reach even diffusion effect, because diffusion of diffusion is equipped with the very thick diffusion layer for the light area, the light area is equipped with the light area, because the diffusion layer is equipped with the very thick diffusion layer for the light area, the light area is equipped with the light area, the diffusion layer is equipped with the light area, the very big, the very thick diffusion layer for the light area, the very big, the diffusion layer is equipped with the very thick diffusion layer for the very thick diffusion layer is equipped with the very thick diffusion layer for the very little, the very little light area, because the very big, the very little light area, the very little, the very big, the very thick diffusion layer for the light area, the very big light area, the diffusion layer for the diffusion layer is equipped with the very little, the diffusion layer for the very little, the very little light area is equipped with the very little light area, the diffusion layer is equipped with the very little, the very little light area, the very thick diffusion layer for the very little.
How to make the granular dazzling light emitted by a plurality of LEDs on the lamp strip emit more uniformly and softly, and the light loss is smaller.
In order to solve the problem, the invention adopts the following method to manufacture the LED lamp strip with the diffusion layer on the surface, and overcomes the technology:
the method comprises the steps of firstly, uniformly mixing diffusion powder and transparent glue to prepare diffusion glue with diffusion powder, applying the diffusion glue on the transparent glue, or directly spraying the diffusion powder on uncured transparent glue to be adhered by the transparent glue, so that a layer of diffusion powder is adhered to the surface of the whole transparent glue, and heating and curing the glue or placing and curing the glue at normal temperature to prepare the LED lamp strip with the diffusion layer on the surface.
Disclosure of Invention
The invention relates to an LED lamp strip with a diffusion layer on the surface and a manufacturing method thereof, and particularly relates to an LED lamp strip with a diffusion layer on the surface and a manufacturing method thereof.
According to the method, firstly, diffusion powder and light-transmitting glue are mixed to prepare the diffusion glue with the diffusion powder, the diffusion glue is applied to the light-transmitting glue, or the diffusion powder is directly sprayed on the uncured light-transmitting glue and is adhered by the light-transmitting glue, so that a layer of diffusion powder is adhered to the whole light-transmitting glue surface, and the LED lamp belt with the diffusion layer is prepared after the glue is heated and cured or placed and cured at normal temperature.
According to the invention, the invention also provides an LED strip with a diffusion layer on the surface, which comprises: a flexible circuit board; LED or LED and control element; a transparent adhesive layer; a diffusion layer; characterized in that the LED is a flip LED bare chip or a flip LED chip with a fluorescent layer on the surface, or the LED lamp beads packaged on the bracket, the LED or the LED and the control element are welded on the flexible circuit board, the transparent adhesive layer covers the LED and the circuit board, or covering the LED, the control element and the circuit board, wherein the diffusion layer is formed by transparent adhesive mixed with a diffusion agent, or a diffusion layer formed by directly adhering diffusion powder on the surface of the transparent adhesive, wherein the diffusion layer is covered on the transparent adhesive layer or on the transparent adhesive layer and the circuit board, light emitted by the LED after electrification is changed into white light through the fluorescent layer, then passes through the transparent adhesive layer, and finally is diffused by the diffusion layer and then is emitted outwards, or the light emitted by the LED directly enters the transparent adhesive layer after being electrified and is finally diffused by the diffusion layer and then emitted outwards, so that the light emitted outwards is diffused into more uniform light.
According to the invention, the invention also provides an LED strip with a diffusion layer on the surface, which comprises: a flexible circuit board; LED or LED and control element; a fluorescent powder glue layer; a transparent adhesive layer; a diffusion layer; the LED is characterized in that an LED blue light chip is inversely arranged, the LED or the LED and a control element are welded on a flexible circuit board, a fluorescent powder glue layer covers the LED and the circuit board or covers the LED and the control element and the circuit board, a transparent glue layer covers the fluorescent powder glue layer and the circuit board or covers the fluorescent powder glue layer and the circuit board and the control element, the diffusion layer is a diffusion layer formed by glue mixed with a diffusant or a diffusion layer formed by directly sticking the diffusion powder on the surface of the transparent glue, the diffusion layer covers the transparent glue layer or covers the transparent glue layer and the circuit board, light emitted by the LED chip after being electrified is changed into white light through the fluorescent powder glue layer and then passes through the transparent glue layer, and finally the white light is emitted outwards after being diffused through the diffusion layer, so that the light emitted outwards is diffused into more uniform light.
According to a preferred embodiment of the present invention, the LED strip with the diffusion layer on the surface is characterized in that the transparent adhesive layer is a completely transparent adhesive layer or a semitransparent adhesive layer, and the function of the LED strip is to diffuse light emitted by the LED through the diffusion layer after the light emitted by the LED is sufficiently scattered by the transparent or semitransparent adhesive layer, so that the emitted light is more uniform.
According to a preferred embodiment of the present invention, the LED strip with a diffusion layer on a surface thereof is characterized in that the diffusing agent or the diffusing powder is a color-containing diffusing agent or a color-containing diffusing powder, light emitted from the LED changes color when passing through the diffusion layer when power is applied, and light emitted from the diffusion layer is the color-changed light.
According to a preferred embodiment of the present invention, the LED strip with a diffusion layer on the surface is characterized in that the diffuser or the diffusion powder contains black or silver diffuser or diffusion powder, when the LED strip is energized, light emitted from the LED passes through gaps between the black or silver diffuser or diffusion powder and then is emitted outwards when the LED strip is energized, and when the LED strip is not energized, the LED strip is a black or silver decorative strip.
According to a preferred embodiment of the present invention, the LED strip with a diffusion layer on a surface thereof is characterized in that the adhesive of the transparent adhesive layer is epoxy adhesive, PU adhesive or silicone adhesive.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a connected bare strip.
Fig. 2 is a schematic plan view of a single bare lamp strip.
Fig. 3 is a schematic cross-sectional view of a single bare lamp with a semi-finished product of a transparent adhesive layer in the longitudinal direction.
Fig. 4 is a schematic cross-sectional view of a long direction of an LED strip with a transparent adhesive layer and a diffusion layer on the surface.
Fig. 5 is a schematic cross-sectional view of a LED strip with a transparent adhesive layer and a diffusion layer on the surface in the short direction.
Fig. 6 is a schematic plan view of a monolithic bare lamp strip with components.
Fig. 7 is a schematic plan view of a half-finished product of a connected bare lamp strip with a row of phosphor glue layers.
Fig. 8 is a schematic plan view of a single bare lamp strip semi-finished product with a phosphor glue layer.
Fig. 9 is a schematic cross-sectional view of a single bare lamp with a semi-finished product of a transparent adhesive layer and a phosphor adhesive layer in the longitudinal direction.
Fig. 10 is a schematic cross-sectional view of a long direction of an LED strip with a transparent adhesive layer, a phosphor adhesive layer, and a diffusion layer on the surface.
Fig. 11 is a schematic cross-sectional view of a LED strip with a transparent adhesive layer, a phosphor adhesive layer, and a diffusion layer on the surface in the short direction.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Example one
1, manufacturing of single bare lamp strip
The method comprises the steps of adhering a blue light chip 1.1a with a fluorescent layer on the surface of an inverted LED and a resistor 1.1b to a plurality of connected flexible circuit boards 1.1 by using a die bonder and solder paste, welding the blue light chip 1.1a and the resistor 1.1b to the connected flexible circuit boards 1.1 through reflow soldering to form connected bare lamp strips, and then cutting the connected bare lamp strips into single bare lamp strips (shown in figures 1 and 2).
2, preparing the transparent adhesive layer
The single bare lamp strip is pasted on an aluminum profile with double-sided adhesive tape, then the single bare lamp strip is horizontally placed on a platform, after the single bare lamp strip is fixed, a layer of transparent adhesive tape 2.1 is applied to the upper surface of the bare lamp strip, and a blue light chip 1.1a with a fluorescent layer and a circuit board 1.1 are arranged on the blue light chip, so that a single bare lamp strip semi-finished product with the transparent adhesive layer is manufactured (shown in figure 3).
3, manufacturing the diffusion glue layer
The manufacturing method comprises the following steps:
immediately spraying a layer of diffusion powder on the transparent adhesive 2.1 before the transparent adhesive 2.1 of the single bare lamp strip semi-finished product with the transparent adhesive layer is not cured, uniformly adhering the diffusion powder on the surface of the transparent adhesive 2.1 to form a diffusion layer 3.1, then heating the diffusion layer in an oven, and taking the diffusion layer off an aluminum profile after the adhesive layer is cured to manufacture the LED lamp strip with the transparent adhesive layer and the diffusion layer on the surface (shown in figures 4 and 5).
The second manufacturing method comprises the following steps:
after the transparent adhesive 2.1 of the single bare lamp strip semi-finished product with the transparent adhesive layer is cured, diffusion powder and low-viscosity transparent adhesive are uniformly mixed to prepare diffusion adhesive, the diffusion adhesive is sprayed on the outer surface of the transparent adhesive layer 2.1 by using an adhesive spraying machine, and the diffusion adhesive is cured to form a diffusion layer 3.1, so that the LED lamp strip with the transparent adhesive layer and the diffusion layer on the surface is prepared (shown in figures 4 and 5).
Example two
1, manufacturing of single bare lamp strip
The inverted LED blue light chip 1.1c and the resistor 1.1b are attached to a plurality of the connected flexible circuit boards 1.1 by a die bonder and solder paste, and the inverted LED blue light chip 1.1c and the resistor 1.1b are soldered to the connected flexible circuit boards 1.1 by reflow soldering to manufacture the connected bare lamp strip with elements (shown in fig. 6).
2, manufacturing the fluorescent powder glue layer
The continuous bare lamp strip with the elements is placed on a glue dripping machine table, a layer of fluorescent powder glue 5.1 is applied to the position of a bare lamp strip chip to form fluorescent powder glue 5.1, the fluorescent powder glue covers an LED blue light chip 1.1c, a circuit board 1.1 and a resistor 1.1b, then the fluorescent powder glue is transferred into an oven to be heated and solidified to form a continuous bare lamp strip semi-finished product with a row of fluorescent powder glue layers, and then the continuous bare lamp strip is cut into a plurality of strips by a splitting machine to form a single bare lamp strip semi-finished product with the fluorescent powder glue layers (shown in figures 7 and 8).
3, preparing the transparent adhesive layer
The single bare lamp strip semi-finished product with the fluorescent powder adhesive layer is pasted on the aluminum profile with the double-sided adhesive tape, then the single bare lamp strip semi-finished product is horizontally placed on the platform, after the single bare lamp strip semi-finished product is fixed, a layer of transparent adhesive 2.1 is applied to the upper surface of the single bare lamp strip semi-finished product and is arranged on the fluorescent powder adhesive layer 5.1 and the circuit board 1.1, and the single bare lamp strip semi-finished product with the transparent adhesive layer and the fluorescent powder adhesive layer is manufactured (shown in figure 9).
4, manufacturing of diffusion glue layer
The manufacturing method comprises the following steps:
immediately spraying a layer of diffusion powder on the transparent adhesive 2.1 before the semi-finished transparent adhesive 2.1 of the single bare lamp strip with the transparent adhesive layer and the fluorescent powder adhesive layer is not cured, so that the diffusion powder is uniformly adhered on the surface of the transparent adhesive 2.1 to form a diffusion layer 3.1, then putting the diffusion layer on an oven for heating, and taking the diffusion layer off an aluminum profile after the adhesive layer is cured to manufacture the LED lamp strip with the transparent adhesive layer, the fluorescent powder adhesive layer and the diffusion layer on the surface (shown in figures 10 and 11).
The second manufacturing method comprises the following steps:
after the translucent adhesive 2.1 of the single bare lamp strip semi-finished product with the transparent adhesive layer and the fluorescent powder adhesive layer is cured, the diffusion adhesive prepared by uniformly mixing the diffusion powder and the translucent adhesive with low viscosity is sprayed on the outer surface of the transparent adhesive layer 2.1 by a glue spraying machine, so that the diffusion adhesive is cured to form a diffusion layer 3.1, and the LED lamp strip with the transparent adhesive layer, the fluorescent powder adhesive layer and the diffusion layer on the surface is prepared (shown in fig. 10 and 11).
The invention is described in detail with reference to the drawings, wherein specific embodiments of the LED strip with the diffusion layer on the surface and the manufacturing method thereof are described above. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (7)
1. A method for preparing LED lamp band with diffusion layer on surface includes welding LED or LED and control element on flexible circuit board, applying a layer of transparent glue or applying a layer of fluorescent powder glue first, applying a layer of transparent glue after fluorescent powder glue is solidified, applying a layer of diffusion glue or diffusion powder on surface of transparent glue.
2. A surface LED strip with a diffusion layer, comprising:
a flexible circuit board;
LED or LED and control element;
a transparent adhesive layer;
a diffusion layer;
characterized in that the LED is a flip LED bare chip or a flip LED chip with a fluorescent layer on the surface, or the LED lamp beads packaged on the bracket, the LED or the LED and the control element are welded on the flexible circuit board, the transparent adhesive layer covers the LED and the circuit board, or covering the LED, the control element and the circuit board, wherein the diffusion layer is formed by transparent adhesive mixed with a diffusion agent, or a diffusion layer formed by directly adhering diffusion powder on the surface of the transparent adhesive, wherein the diffusion layer is covered on the transparent adhesive layer or on the transparent adhesive layer and the circuit board, light emitted by the LED after electrification is changed into white light through the fluorescent layer, then passes through the transparent adhesive layer, and finally is diffused by the diffusion layer and then is emitted outwards, or the light emitted by the LED directly enters the transparent adhesive layer after being electrified and is finally diffused by the diffusion layer and then emitted outwards, so that the light emitted outwards is diffused into more uniform light.
3. A surface LED strip with a diffusion layer, comprising:
a flexible circuit board;
LED or LED and control element;
a fluorescent powder glue layer;
a transparent adhesive layer;
a diffusion layer;
the LED is characterized in that an LED blue light chip is inversely arranged, the LED or the LED and a control element are welded on a flexible circuit board, a fluorescent powder glue layer covers the LED and the circuit board or covers the LED and the control element and the circuit board, a transparent glue layer covers the fluorescent powder glue layer and the circuit board or covers the fluorescent powder glue layer and the circuit board and the control element, the diffusion layer is a diffusion layer formed by glue mixed with a diffusant or a diffusion layer formed by directly sticking the diffusion powder on the surface of the transparent glue, the diffusion layer covers the transparent glue layer or covers the transparent glue layer and the circuit board, light emitted by the LED chip after being electrified is changed into white light through the fluorescent powder glue layer and then passes through the transparent glue layer, and finally the white light is emitted outwards after being diffused through the diffusion layer, so that the light emitted outwards is diffused into more uniform light.
4. The LED strip with the diffusion layer on the surface as claimed in claim 1, 2 or 3, wherein the transparent adhesive layer is a completely transparent adhesive layer or a semitransparent adhesive layer, and the function is to diffuse the light emitted by the LED through the diffusion layer after the light is sufficiently scattered by the transparent or semitransparent adhesive layer, so that the emitted light is more uniform.
5. A LED strip with a diffusion layer on its surface as claimed in claim 1, 2 or 3, wherein the glue of said transparent glue layer is epoxy glue or PU glue or silicone glue.
6. A LED strip with a diffusion layer on its surface as claimed in claim 1, 2 or 3, wherein said diffusing agent or powder is a color-containing diffusing agent or powder, the light emitted from the LED changes color when passing through the diffusion layer when power is applied, and the light emitted from the diffusion layer is the color-changed light.
7. A LED strip with a diffusion layer on its surface as claimed in claim 1, 2 or 3, wherein said diffusing agent or powder is black or silver diffusing agent or powder, and when the LED strip is energized, the light emitted from the LED passes through the gap between the black or silver diffusing agent or powder and then is emitted to the outside through the diffusion layer, and when the LED strip is not energized, the LED strip is black or silver decorative strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010866675.XA CN114076264A (en) | 2020-08-19 | 2020-08-19 | LED lamp strip with diffusion layer on surface and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010866675.XA CN114076264A (en) | 2020-08-19 | 2020-08-19 | LED lamp strip with diffusion layer on surface and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114076264A true CN114076264A (en) | 2022-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010866675.XA Pending CN114076264A (en) | 2020-08-19 | 2020-08-19 | LED lamp strip with diffusion layer on surface and manufacturing method thereof |
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| CN (1) | CN114076264A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114659044A (en) * | 2022-05-06 | 2022-06-24 | 杭州杭科光电集团股份有限公司 | Manufacturing method of LED lamp filament, LED lamp filament support, LED lamp filament, bulb and manufacturing method of bulb |
-
2020
- 2020-08-19 CN CN202010866675.XA patent/CN114076264A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114659044A (en) * | 2022-05-06 | 2022-06-24 | 杭州杭科光电集团股份有限公司 | Manufacturing method of LED lamp filament, LED lamp filament support, LED lamp filament, bulb and manufacturing method of bulb |
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