CN220674033U

CN220674033U - HDI board blind hole electroplating device

Info

Publication number: CN220674033U
Application number: CN202322311650.5U
Authority: CN
Inventors: 柳元香; 贺智琼; 贺志华
Original assignee: Shanghai Jump Line Technology Co ltd
Current assignee: Shanghai Jump Line Technology Co ltd
Priority date: 2023-08-28
Filing date: 2023-08-28
Publication date: 2024-03-26
Anticipated expiration: 2033-08-28

Abstract

The utility model relates to the technical field of circuit board processing, in particular to a blind hole electroplating device for an HDI board. The problem that the contact effect of the electroplating solution and the circuit board cannot be improved is solved. The electroplating device comprises a base, wherein an electroplating box body with an open top is arranged on the base, a stirring rod is connected in the electroplating box body in a rotating manner, two ends of the stirring rod are respectively connected with a swinging rod in a rotating manner, an elastic component is connected between the swinging rod and the end part of the stirring rod, the middle part of the swinging rod is magnetically connected with the stirring rod, the elastic component contracts when the swinging rod is magnetically attached to the stirring rod, a vacuum generator is further arranged in the electroplating box body, a hanging bracket is arranged on the base, a linear module which is longitudinally arranged is arranged on the hanging bracket, the output end of the linear module is connected with a circuit board body, the circuit board body is positioned right above the electroplating box body, and the stroke of the linear module is larger than the distance between the top end of the circuit board body and the opening of the electroplating box body. The utility model effectively expands the contact effect of the electroplating solution and the circuit board, improves the stirring effect, and does not influence the normal electroplating requirement.

Description

HDI board blind hole electroplating device

Technical Field

The utility model relates to the technical field of circuit board processing, in particular to a blind hole electroplating device for an HDI board.

Background

High Density Interconnect (HDI) fabrication is one of the fastest growing areas in the printed circuit board industry. The HDI board (a circuit board with high wiring density in the micro blind hole technology) is divided into an inner layer circuit and an outer layer circuit, and the inner connection of each layer circuit is realized by a drilling and metallization method.

The current China patent with the publication number of CN214960366U discloses a blind hole electroplating device for an HDI circuit board, and the technical scheme is characterized in that: including the fixed station, the fixed station both sides are fixed to be equipped with the slide rail, the fixed station top is equipped with the mount, the mount passes through bracing piece and sliding rail connection, the mount bottom is connected with the lifter plate through the atmospheric pressure telescopic link, the lifter plate bottom slides and is equipped with the movable plate, the even fixed anchor clamps that are equipped with in movable plate bottom, the fixed plating bath that is equipped with in fixed station left side, the fixed circulating pump that is equipped with in plating bath below makes things convenient for the transportation and the electroplating of HDI circuit board through the slide rail, and it is more convenient to use, starts driving motor when electroplating, lets the continuous small amplitude removal of movable plate, can let the plating solution in the plating bath follow left and right slowly flow through the circulating pump simultaneously, and the rocking of circuit board mutually support for in the blind hole on the plating solution can fully get into the work piece, thereby better with the plating solution contact, showing and having promoted electroplating quality and efficiency.

The prior art scheme has the following defects that the sliding rail is convenient for conveying and electroplating the HDI circuit board, and the use is more convenient.

However, in the above technical solution, the motor only moves the moving plate in a small range, and the contact effect between the plating solution and the circuit board cannot be improved, so that the plating effect is easily reduced.

Disclosure of Invention

The utility model provides a blind hole electroplating device for an HDI board, which effectively expands the contact effect of electroplating solution and a circuit board, improves the stirring effect and does not influence the normal electroplating requirement.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the utility model provides a HDI board blind hole electroplating device, includes the base, be equipped with open-ended electroplating box on the base, it is connected with the puddler to electroplate the rotation in the box, the both ends of puddler all rotate and be connected with the pendulum rod, be connected with elastomeric element between the tip of pendulum rod and puddler, the middle part of pendulum rod is connected with magnetism between the puddler, elastomeric element shrink when pendulum rod and puddler receive magnetism laminating, still be equipped with vacuum generator in the electroplating box, be equipped with the gallows on the base, be equipped with the straight line module of vertical setting on the gallows, the output of straight line module is connected with the circuit board body, the circuit board body is located directly over the electroplating box, the stroke of straight line module is greater than the distance of circuit board body top and electroplating box opening part.

Further, the distances between the inner ends of the two swinging rods and the rotation center of the stirring rod are different.

Further, the swing rod is located the outside of puddler, be equipped with the backup pad on the puddler, the inboard bottom butt backup pad of swing rod when swing rod and puddler laminating.

Further, a first electromagnet is arranged on the swing rod, a first iron block is arranged on the stirring rod, and when the first electromagnet is electrified, the first electromagnet is magnetically connected with the first iron block and the elastic component is in a compressed state.

Further, the elastic component is a telescopic spring.

Further, the inner side of the swing rod is provided with a plurality of flexible steel wires distributed along the length direction of the swing rod.

Further, the elastic component supports the swing rod when the first iron block and the first electromagnet are powered off, and the swing rod is located between two ends of the stirring rod.

Further, a servo motor is arranged at the bottom of the electroplating box body, the output end of the servo motor is vertically connected with the stirring rod, and the distances between the inner ends of the two swinging rods and the output end of the servo motor are different.

Further, the linear module is a screw motor module.

Further, the output end of the screw motor module is connected with a second electromagnet, the top end of the circuit board body is connected with a second iron block, and the second electromagnet is magnetically connected with the second iron block.

The utility model has the beneficial effects that:

the contact effect of the electroplating solution and the circuit board is effectively enlarged, the stirring effect is improved, and the normal electroplating requirement is not influenced.

Drawings

FIG. 1 is a schematic diagram of a blind hole electroplating device of the HDI board;

FIG. 2 is a schematic diagram of a connection structure of a stirring rod and a swinging rod;

reference numerals illustrate:

1. a base; 2. electroplating box body; 3. a stirring rod; 4. swing rod; 5. an elastic member; 6. a vacuum generator; 7. a hanging bracket; 8. a linear module; 9. a circuit board body; 10. a support plate; 11. a first electromagnet; 12. a first iron block; 13. a flexible steel wire; 14. a servo motor; 15. a second electromagnet; 16. and a second iron block.

Detailed Description

The utility model will be further described with reference to examples and drawings, to which reference is made, but which are not intended to limit the scope of the utility model.

As shown in fig. 1 and 2, an HDI board blind hole electroplating device comprises a base 1, an electroplating box body 2 with an opening at the top end is arranged on the base 1, a stirring rod 3 is rotationally connected to the electroplating box body 2, two ends of the stirring rod 3 are rotationally connected with a swinging rod 4, an elastic component 5 is connected between the swinging rod 4 and the end part of the stirring rod 3, the middle part of the swinging rod 4 is magnetically connected with the stirring rod 3, the elastic component 5 contracts when the swinging rod 4 and the stirring rod 3 are magnetically attached, a vacuum generator 6 is further arranged in the electroplating box body 2, a hanging bracket 7 is arranged on the base 1, a linear module 8 which is longitudinally arranged is arranged on the hanging bracket 7, the output end of the linear module 8 is connected with a circuit board body 9, the circuit board body 9 is positioned right above the electroplating box body 2, and the stroke of the linear module 8 is larger than the distance between the top end of the circuit board body 9 and the opening of the electroplating box body 2.

In this embodiment, the distance between the inner ends of the two swing rods 4 and the rotation center of the stirring rod 3 is different.

In this embodiment, the swing rod 4 is located at the outer side of the stirring rod 3, the stirring rod 3 is provided with a support plate 10, and the bottom of the inner side of the swing rod 4 abuts against the support plate 10 when the swing rod 4 is attached to the stirring rod 3.

In this embodiment, the swing rod 4 is provided with a first electromagnet 11, the stirring rod 3 is provided with a first iron block 12, and when the first electromagnet 11 is electrified, the first electromagnet 11 is magnetically connected with the first iron block 12, and the elastic component 5 is in a compressed state.

In this embodiment, the elastic member 5 is a telescopic spring.

In this embodiment, the inner side of the swing rod 4 is provided with a plurality of flexible steel wires 13 distributed along the length direction of the swing rod.

In this embodiment, the elastic component 5 supports the swing rod 4 when the first iron block 12 and the first electromagnet 11 are powered off, and the swing rod 4 is located between two ends of the stirring rod 3.

In this embodiment, a servo motor 14 is disposed at the bottom of the electroplating tank 2, an output end of the servo motor 14 is vertically connected with the stirring rod 3, and distances between inner ends of the two swinging rods 4 and the output end of the servo motor 14 are different.

In this embodiment, the linear module 8 is a screw motor module.

In this embodiment, the output end of the screw motor module is connected with a second electromagnet 15, the top end of the circuit board body 9 is connected with a second iron block 16, and the second electromagnet 15 is magnetically connected with the second iron block 16. Through the second electromagnet 15 and the second iron block 16 that set up, carry out circular telegram and power failure to the second electromagnet 15 can quick assembly disassembly circuit board body 9, easy dismounting.

Working principle:

when the electroplating device is used, as shown in fig. 1 and 2, electroplating liquid is led into the electroplating box body 2 to fill the electroplating box body to a preset liquid level, the circuit board body 9 can be fully submerged, the first electromagnet 11 is in power failure, the first electromagnet 11 and the first iron block 12 lose magnetic connection, the elastic component 5 is naturally elongated, the elastic component 5 supports the swinging rod 4 when the first iron block 12 and the first electromagnet 11 are in power failure, and the swinging rod 4 is located between two ends of the stirring rod 3, one end of the swinging rod 4 is prevented from extending to the outer side of the stirring rod 3, the stirring space of the swinging rod 4 is ensured to be in a space above the stirring rod 3, the space occupying the outer side of the stirring rod 3 is prevented from being influenced, the stirring rod 3 is driven to rotate through the servo motor 14, the distance between the inner ends of the two swinging rods 4 and the output end of the servo motor 14 is different, the two swinging rods 4 are convenient to stir and mix electroplating liquid in different spaces, as shown in fig. 2, the flexible steel wire 13 is driven to rotate under the centrifugal effect of the swinging rod 4, the stirring space of the electroplating liquid is smoothly enlarged, the stirring effect is improved, after the stirring is finished, the first electromagnet 11 is electrified, the swinging rod 4 is driven to be in the power under the magnetic effect, the effect is driven to be in the contact with the supporting plate 10, the flexible steel wire 10 is effectively connected under the supporting plate 10, the vibration wire 13 is hidden by the flexible circuit board, the flexible circuit is driven under the vibration wire 13, the vibration circuit board is not normally, the normal circuit board is hidden by the stirring circuit board is hidden, the requirements is no need, the electroplating circuit board is placed in the electroplating circuit is 3, and the electroplating circuit is required to be placed in the circuit board 9, and the circuit is required to be normally, and the circuit board is placed in the circuit 9, and the circuit board 9, and the circuit is required to be normally is in use.

All technical features in the embodiment can be freely combined according to actual needs.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

The foregoing embodiments are preferred embodiments of the present utility model, and other embodiments are included, without departing from the spirit of the present utility model.

Claims

1. The utility model provides a HDI board blind hole electroplating device, includes the base, be equipped with open-ended electroplating box on the base, it is connected with the puddler to electroplate the rotation in the box, a serial communication port, the both ends of puddler all rotate and are connected with the pendulum rod, be connected with elastomeric element between the tip of pendulum rod and puddler, the middle part of pendulum rod is connected with magnetism between the puddler, elastomeric element shrink when pendulum rod and puddler receive magnetism laminating, still be equipped with vacuum generator in the electroplating box, be equipped with the gallows on the base, be equipped with the straight line module of vertical setting on the gallows, the output of straight line module is connected with the circuit board body, the circuit board body is located electroplating box directly over, the stroke of straight line module is greater than the distance of circuit board body top and electroplating box opening part.

2. The HDI board blind via plating apparatus according to claim 1, wherein the distance between the inner ends of the two swing arms and the rotation center of the stirring rod is different.

3. The device for electroplating the blind holes of the HDI plate according to claim 2, wherein the swing rod is positioned on the outer side of the stirring rod, the stirring rod is provided with a supporting plate, and the bottom of the inner side of the swing rod is abutted against the supporting plate when the swing rod is attached to the stirring rod.

4. The HDI board blind hole electroplating device according to claim 3, wherein the swing rod is provided with a first electromagnet, the stirring rod is provided with a first iron block, and the first electromagnet is magnetically connected with the first iron block and the elastic component is in a compressed state when the first electromagnet is electrified.

5. The HDI board blind via plating apparatus according to claim 4, wherein said resilient member is a spring.

6. The HDI board blind hole electroplating device according to claim 2, wherein a plurality of flexible steel wires distributed along the length direction of the swing rod are arranged on the inner side of the swing rod.

7. The HDI board blind via plating apparatus according to claim 4, wherein the elastic member supports the swing link when the first iron block and the first electromagnet are de-energized, and the swing link is located between both ends of the stirring rod.

8. The device for electroplating the blind holes of the HDI plate according to claim 2, wherein a servo motor is arranged at the bottom of the electroplating box body, the output end of the servo motor is vertically connected with a stirring rod, and the distances between the inner ends of the two swinging rods and the output end of the servo motor are different.

9. The HDI board blind via plating apparatus according to claim 1, wherein said linear module is a screw motor module.

10. The HDI board blind hole plating apparatus according to claim 9, wherein the output end of the screw motor module is connected with a second electromagnet, the top end of the circuit board body is connected with a second iron block, and the second electromagnet is magnetically connected with the second iron block.