CN219280077U

CN219280077U - Blind hole electroplating device for thick-medium HDI plate

Info

Publication number: CN219280077U
Application number: CN202223265525.7U
Authority: CN
Inventors: 黄爱华; 张晓鹏; 余永新
Original assignee: Jiangxi Jingchao Technology Co ltd
Current assignee: Jiangxi Jingchao Technology Co ltd
Priority date: 2022-12-06
Filing date: 2022-12-06
Publication date: 2023-06-30
Anticipated expiration: 2032-12-06

Abstract

The utility model discloses a thick medium HDI plate blind hole electroplating device which comprises an electroplating bath, wherein a motor is arranged in the middle of the bottom surface of the electroplating bath, the output end of the motor penetrates through the bottom surface of the electroplating bath and is fixedly connected with a rotating rod, stirring blades are arranged on the rotating rod, and ultrasonic generators are arranged on two sides of the inner wall of the electroplating bath. According to the utility model, the HDI plate is placed in the placing groove, the placing groove is driven to move through the hydraulic cylinder, when the placing groove moves into the electroplating groove, the motor is started, the motor drives the stirring blade to rotate, so that electroplating liquid in the electroplating groove can be effectively stirred, the fluidity of the electroplating liquid in the electroplating groove is improved, the electroplating liquid can be fully contacted with the blind holes on the HDI plate, wherein the flowing effect of the electroplating liquid in the electroplating groove can be effectively increased through the matching use of the ultrasonic generator, the contact effect of the electroplating liquid on the blind holes on the HDI plate is further improved, and the electroplating effect on the blind holes of the HDI plate is conveniently improved.

Description

Blind hole electroplating device for thick-medium HDI plate

Technical Field

The utility model relates to the technical field of circuit board production, in particular to a blind hole electroplating device for a thick medium HDI board.

Background

High Density Interconnect (HDI) fabrication is one of the fastest growing areas in the printed circuit board industry. The HDI board (a circuit board with high wiring density in the micro blind hole technology) is divided into an inner layer circuit and an outer layer circuit, and the inner connection of each layer circuit is realized by a drilling and metallization method.

The current China patent with the publication number of CN214960366U discloses a blind hole electroplating device for an HDI circuit board, and the technical scheme is characterized in that: including the fixed station, the fixed station both sides are fixed to be equipped with the slide rail, the fixed station top is equipped with the mount, the mount passes through bracing piece and sliding rail connection, the mount bottom is connected with the lifter plate through the atmospheric pressure telescopic link, the lifter plate bottom slides and is equipped with the movable plate, the even fixed anchor clamps that are equipped with in movable plate bottom, the fixed plating bath that is equipped with in fixed station left side, the fixed circulating pump that is equipped with in plating bath below makes things convenient for the transportation and the electroplating of HDI circuit board through the slide rail, and it is more convenient to use, starts driving motor when electroplating, lets the continuous small amplitude removal of movable plate, can let the plating solution in the plating bath follow left and right slowly flow through the circulating pump simultaneously, and the rocking of circuit board mutually support for in the blind hole on the plating solution can fully get into the work piece, thereby better with the plating solution contact, showing and having promoted electroplating quality and efficiency.

The technical scheme has the following defects that although the sliding rail is used for conveniently conveying and electroplating the HDI circuit board, the technical scheme is more convenient to use, the moving plate is only moved in a small range through the motor, the contact effect of the electroplating solution and the circuit board cannot be improved, and the electroplating effect is easy to reduce.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides a thick-medium HDI board blind hole electroplating device which has the advantages of improving the contact effect of electroplating solution and a circuit board and having good electroplating effect, thereby solving the problems in the prior art.

(II) technical scheme

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a thick medium HDI board blind hole electroplating device, includes the plating bath, the bottom surface intermediate position department of plating bath installs the motor, and the output of motor runs through the bottom surface fixedly connected with bull stick of plating bath, be equipped with the stirring leaf on the bull stick, supersonic generator is installed to the inner wall both sides of plating bath, the both sides of plating bath are equipped with the backup pad, and the top surface of backup pad is equipped with the roof, pneumatic cylinder is installed to the top surface intermediate position department of roof, and the output of pneumatic cylinder runs through roof fixedly connected with push pedal, the below of push pedal is equipped with the standing groove, and the outside surface of standing groove runs through and is equipped with the through-hole, the standing groove passes through connecting block and push pedal fixed connection.

Preferably, a plurality of through holes are formed in the through holes, and the through holes are uniformly distributed on the outer side surface of the placing groove.

Preferably, the front end surface of the electroplating bath is fixedly connected with an overhaul plate through bolts, and a sealing strip is arranged between the overhaul plate and the electroplating bath.

Preferably, the bottom surface of the electroplating bath is provided with supporting legs, and the supporting legs and the supporting plate are on the same horizontal plane.

Preferably, a liquid discharge pipe is arranged on one side of the bottom surface of the electroplating tank, and a valve is arranged on the liquid discharge pipe.

Preferably, the placement tank is matched with the electroplating tank.

Preferably, the support legs are arranged in a plurality, and the support legs are uniformly distributed at four corners of the bottom surface of the electroplating bath.

Preferably, the ultrasonic generators are arranged in two, and the two ultrasonic generators are uniformly distributed on two sides of the inner wall of the electroplating bath.

(III) beneficial effects

Compared with the prior art, the utility model provides a thick medium HDI plate blind hole electroplating device, which has the following beneficial effects:

(1) According to the utility model, the HDI plate is placed in the placing groove, the placing groove is driven to move through the hydraulic cylinder, when the placing groove moves into the electroplating groove, the motor is started, the motor drives the stirring blade to rotate, so that electroplating liquid in the electroplating groove can be effectively stirred, the mobility of the electroplating liquid in the electroplating groove is improved, the electroplating liquid can be fully contacted with the blind holes on the HDI plate, wherein the flowing effect of the electroplating liquid in the electroplating groove can be effectively increased through the matching use of the ultrasonic generator, the contact effect of the electroplating liquid on the blind holes on the HDI plate is further improved, and the electroplating effect on the blind holes of the HDI plate is conveniently improved.

(2) According to the utility model, the push plate is driven to move by the hydraulic cylinder, the placing groove is driven to move by the connecting block, when the placing groove moves into the electroplating bath, the blind holes of the HDI plate in the placing groove can be electroplated, wherein after electroplating, the placing groove is driven to move by the hydraulic cylinder, when the placing groove moves out of the electroplating bath, the electroplated HDI plate can be taken out, the automatic loading and unloading of the HDI plate are facilitated, and the practicability of the HDI plate is improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a blind hole electroplating device for a thick dielectric HDI plate according to the present utility model;

FIG. 2 is an enlarged view of a blind hole electroplating device for a thick dielectric HDI plate according to the present utility model;

FIG. 3 is a front view of a blind hole electroplating device for a thick dielectric HDI plate according to the present utility model;

FIG. 4 is a schematic diagram of a structure of a placement groove of a blind hole electroplating device for a thick dielectric HDI plate according to the present utility model.

Legend description:

1. plating bath; 2. an ultrasonic generator; 3. stirring blades; 4. a motor; 5. a support plate; 6. a top plate; 7. a hydraulic cylinder; 8. a push plate; 9. a placement groove; 10. a liquid discharge pipe; 11. a valve; 12. a support leg; 13. a through hole; 14. a connecting block; 15. and (5) an access panel.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in the specific direction, and thus should not be construed as limiting the present utility model; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-4, a thick medium HDI board blind hole electroplating device, including plating bath 1, bottom surface intermediate position department of plating bath 1 installs motor 4, and the output of motor 4 runs through the bottom surface fixedly connected with bull stick of plating bath 1, be equipped with stirring leaf 3 on the bull stick, ultrasonic generator 2 is installed to the inner wall both sides of plating bath 1, the both sides of plating bath 1 are equipped with backup pad 5, and the top surface of backup pad 5 is equipped with roof 6, pneumatic cylinder 7 is installed to the top surface intermediate position department of roof 6, and the output of pneumatic cylinder 7 runs through roof 6 fixedly connected with push pedal 8, the below of push pedal 8 is equipped with standing groove 9, and the outside surface of standing groove 9 runs through and is equipped with through-hole 13, standing groove 9 passes through connecting block 14 and push pedal 8 fixed connection, wherein put into standing groove 9 with the HDI board, move through pneumatic cylinder 7, when standing groove 9 moves to plating bath 1 in, motor 4 is opened, motor 4 drives stirring leaf 3 and rotates, can effectively stir the plating solution in plating bath 1, make plating solution can fully contact with the blind hole on the HDI board, wherein the effect of plating solution through the blind hole 2 is contacted with the plating solution, thereby the effect is improved, further has improved in the plating effect, electroplating effect i board is more effective, electroplating effect is achieved, and electroplating effect is improved.

In one embodiment, the through holes 13 are provided with a plurality of through holes 13, and the through holes 13 are uniformly distributed on the outer side surface of the placement groove 9, wherein through the use of the through holes 13, the electroplating solution can circulate in the placement groove 9, so that the contact effect of the electroplating solution on the blind holes of the HDI plate is improved, and the electroplating effect on the blind holes of the HDI plate is improved.

In one embodiment, the front end surface of the electroplating bath 1 is fixedly connected with an access plate 15 through bolts, and a sealing strip is arranged between the access plate 15 and the electroplating bath 1, wherein the parts in the electroplating bath 1 can be maintained and overhauled by loosening the bolts and removing the access plate 15.

In one embodiment, the bottom surface of the plating tank 1 is provided with the support legs 12, and the support legs 12 and the support plate 5 are on the same horizontal plane, wherein the support legs 12 support the plating tank 1, which is beneficial to improving the stability of the plating tank 1.

In one embodiment, the drain pipe 10 is provided on the bottom surface side of the plating vessel 1, and the valve 11 is installed on the drain pipe 10, wherein the plating solution in the plating vessel 1 can be discharged by opening the valve 11 on the drain pipe 10.

In one embodiment, the placement tank 9 is mated with the plating tank 1 to facilitate plating of the HDI board in the placement tank 9.

In one embodiment, the plurality of support legs 12 are provided together, and the plurality of support legs 12 are uniformly distributed at four corners of the bottom surface of the electroplating tank 1, wherein the plurality of support legs 12 support the electroplating tank 1, which is beneficial to improving the stability of the electroplating tank 1.

In an embodiment, the ultrasonic generator 2 is provided with two ultrasonic generators, and the two ultrasonic generators 2 are uniformly distributed on two sides of the inner wall of the electroplating bath 1, wherein the flowing effect of the electroplating solution in the electroplating bath 1 can be effectively increased through the matched use of the ultrasonic generators 2, the contact effect of the electroplating solution on the blind holes on the HDI plate is further improved, and the electroplating effect on the blind holes of the HDI plate is further improved.

In one embodiment, the control panel control circuit is implemented by simple programming by those skilled in the art, and is only used without modification, and thus the control mode and circuit connection will not be described in detail.

Working principle:

during the use, put into standing groove 9 with the HDI board, drive standing groove 9 through pneumatic cylinder 7 and remove, when standing groove 9 removes to plating bath 1 in, open motor 4, motor 4 drives stirring vane 3 and rotates, can effectively stir the plating solution in plating bath 1, make the plating solution can fully contact with the blind hole on the HDI board, wherein through the cooperation of ultrasonic generator 2, can effectively increase the flow effect of plating solution in plating bath 1, further improve the contact effect of plating solution to the blind hole on the HDI board, thereby be convenient for improve the electroplating effect to the HDI board blind hole, wherein drive push pedal 8 through pneumatic cylinder 7 and remove, move through connecting block 14, when standing groove 9 removes to plating bath 1 in, can electroplate the HDI board blind hole in the standing groove 9, wherein after the electroplating processing, drive standing groove 9 through pneumatic cylinder 7 and remove, when standing groove 9 plating bath shifts out 1, can take out the HDI board after the electroplating, be convenient for carry out the unloading to the HDI board is automatic, be favorable to improve its practicality.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a thick medium HDI board blind hole electroplating device, includes plating bath (1), its characterized in that, motor (4) are installed to bottom surface intermediate position department of plating bath (1), and the output of motor (4) runs through the bottom surface fixedly connected with bull stick of plating bath (1), be equipped with stirring leaf (3) on the bull stick, supersonic generator (2) are installed to the inner wall both sides of plating bath (1), the both sides of plating bath (1) are equipped with backup pad (5), and the top surface of backup pad (5) is equipped with roof (6), pneumatic cylinder (7) are installed to the top surface intermediate position department of roof (6), and the output of pneumatic cylinder (7) runs through roof (6) fixedly connected with push pedal (8), the below of push pedal (8) is equipped with standing groove (9), and the outside surface of standing groove (9) runs through and is equipped with through-hole (13), standing groove (9) are through connecting block (14) and push pedal (8) fixedly connected.

2. The device for electroplating the blind holes of the thick-medium HDI plate according to claim 1, wherein a plurality of through holes (13) are formed in total, and the plurality of through holes (13) are uniformly distributed on the outer side surface of the placing groove (9).

3. The blind hole electroplating device for the thick-medium HDI plate according to claim 1, wherein an access plate (15) is fixedly connected to the front end surface of the electroplating bath (1) through bolts, and a sealing strip is arranged between the access plate (15) and the electroplating bath (1).

4. The blind hole electroplating device for the thick-medium HDI plate according to claim 1, wherein the bottom surface of the electroplating bath (1) is provided with supporting legs (12), and the supporting legs (12) and the supporting plate (5) are on the same horizontal plane.

5. The device for electroplating the blind holes of the thick-medium HDI plate according to claim 1, wherein a drain pipe (10) is arranged on one side of the bottom surface of the electroplating bath (1), and a valve (11) is arranged on the drain pipe (10).

6. A device for blind hole electroplating of a thick dielectric HDI board according to claim 1, wherein the placement tank (9) is matched to the electroplating tank (1).

7. The device for blind hole electroplating of a thick-medium HDI plate according to claim 4, wherein a plurality of the supporting legs (12) are provided together, and the plurality of supporting legs (12) are uniformly distributed at four corners of the bottom surface of the electroplating bath (1).

8. The device for electroplating the blind holes of the thick-medium HDI plate according to claim 1, wherein two ultrasonic generators (2) are arranged in total, and the two ultrasonic generators (2) are uniformly distributed on two sides of the inner wall of the electroplating bath (1).