CN220554231U - High-frequency copper-based sintered printed circuit board capable of automatically radiating heat - Google Patents
High-frequency copper-based sintered printed circuit board capable of automatically radiating heat Download PDFInfo
- Publication number
- CN220554231U CN220554231U CN202321839302.9U CN202321839302U CN220554231U CN 220554231 U CN220554231 U CN 220554231U CN 202321839302 U CN202321839302 U CN 202321839302U CN 220554231 U CN220554231 U CN 220554231U
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- Prior art keywords
- circuit board
- resistor
- transistor
- copper
- circuit
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 31
- 239000010949 copper Substances 0.000 title claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 239000011889 copper foil Substances 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 7
- 238000009423 ventilation Methods 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of circuit board heat dissipation and discloses an automatic heat dissipation high-frequency copper-based sintered printed circuit board which comprises a main board and a temperature control circuit, wherein one side of the main board is provided with the circuit board, one end of the circuit board is provided with the temperature control circuit, the input end of the temperature control circuit is a power end, the power end is connected with a first resistor and a third resistor, the other end of the first resistor is connected with a thermistor and a second resistor, the other end of the thermistor is connected with a base electrode of a transistor, the other end of the third resistor is connected with a collector electrode of the transistor, an emission set of the transistor is connected with one electrode of a fan, and the other end of the second resistor and the other electrode of the fan are connected with a ground wire. The high-frequency copper-based sintered printed circuit board with automatic heat dissipation can enable the fan and the buzzer to work automatically through the thermistor and the transistor of the temperature control circuit, so that the heat dissipation performance of the circuit is improved, and the heat dissipation cost of the circuit is greatly reduced.
Description
Technical Field
The utility model relates to the technical field of circuit board heat dissipation, in particular to an automatic heat dissipation high-frequency copper-based sintered printed circuit board.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances.
Along with the increasing number of components arranged on the circuit board, the circuit board can generate a large amount of heat energy during working, so that the heat dissipation of the circuit board is extremely important, the existing equipment generally dissipates the heat of the circuit board by an external device and cannot dissipate the heat according to the specific state of the circuit board, and in addition, the prior art dissipates the heat of the circuit board, so that the price of the equipment for dissipating the heat of the circuit board is high, and the problem is solved by providing an automatic heat dissipation high-frequency copper-based sintered printed circuit board.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the utility model provides the high-frequency copper-based sintered printed circuit board capable of automatically radiating, which has the advantages of automatically radiating according to the state of the circuit board, improving the anti-electromagnetic interference capability of the circuit, being low in cost and the like, and solves the problems that the prior art cannot radiate according to the specific state of the circuit board.
(II) technical scheme
In order to achieve the purposes of automatically radiating according to the state of the circuit board, improving the anti-electromagnetic interference capability of the circuit, and being low in cost, the utility model provides the following technical scheme: the utility model provides an automatic radiating high frequency copper-based sintering printed wiring board, includes the mainboard, temperature control circuit, the fan is connected through the spliced pole to mainboard one side, the fan sets up copper foil group all around, the mainboard opposite side sets up the circuit board, circuit board one end sets up temperature control circuit, temperature control circuit input is the power end, first resistance, third resistance and fourth resistance are connected to the power end, thermistor and second resistance are connected to the first resistance other end, base and the big resistance of transistor are connected to the thermistor other end, the collecting electrode of transistor is connected to the third resistance other end, an electrode of fan is connected to the emission collection of transistor, the base of second transistor is connected to the big resistance other end, the collecting electrode of second transistor is connected to the fourth resistance other end, an electrode of buzzer is connected to the projecting pole of second transistor, the other electrode of second resistance other end, fan another electrode and buzzer are connected to the ground wire.
Preferably, a thread cylinder is arranged at each of four corners of the main board, and screws are arranged in the thread cylinders and can be connected with other equipment by rotating the screws.
Preferably, the circuit board is formed by copper-based sintering printing, and round holes and circuit arrangement on the circuit board accord with the conventional copper-based circuit board.
Preferably, the thermistor has a negative temperature coefficient, and the resistance decreases with increasing temperature.
Preferably, the circuit board is embedded on one side of the main board, the temperature control circuit is embedded on the circuit board, and the fan is connected on the other side of the main board through screws.
Preferably, the transistor and the second transistor are NPN bipolar junction transistors.
Preferably, the copper foil group is composed of copper foils, and ventilation openings are arranged between the copper foils.
(III) beneficial effects
Compared with the prior art, the utility model provides the high-frequency copper-based sintered printed circuit board capable of automatically radiating heat, which has the following beneficial effects:
1. this automatic radiating high frequency copper base sintering printed wiring board, the rotational speed of fan is adjusted through temperature control circuit's thermistor and transistor, can make the circuit work under a relatively stable suitable temperature, effectively reduced the operating temperature of circuit, reduced the influence of circuit board temperature to the device life, improved the life of circuit device, through buzzer and big resistance, make the circuit can automatic alarm under the high temperature, improved the security stability of circuit.
2. The high-frequency copper-based sintered printed circuit board capable of automatically radiating heat can further radiate the circuit board and also can shield certain electromagnetic signals by arranging the copper foil set on the main board because the heat conductivity and the electromagnetic shielding performance of the copper foil are good, and the anti-interference capability of the circuit board is improved.
3. This automatic radiating high frequency copper base sintering printed wiring board sets up the vent through between copper foil group, can realize only using a small-size fan can spread the wind on whole circuit board, and can realize the heat dissipation and the high temperature warning of circuit board through a thermistor, has reduced circuit board heat dissipation cost greatly.
Drawings
FIG. 1 is a schematic side view of a motherboard according to the present utility model;
FIG. 2 is a schematic diagram of a circuit board side of a motherboard according to the present utility model;
FIG. 3 is a schematic view of a side of a motherboard with a fan according to the present utility model;
fig. 4 is a schematic diagram of a temperature control circuit according to the present utility model.
In the figure: 1 main board, 11 circuit board, 12 fan, 13 copper foil, 14 screw, 15 screw tube, 16 connecting column, 17 vent, 2 temperature control circuit, 21 first resistor, 22 second resistor, 23 third resistor, 24 thermistor, 25 transistor, 26 power end, 27 ground wire, 28 big resistor, 29 fourth resistor, 210 second transistor, 211 buzzer.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, an automatic radiating high-frequency copper-based sintered printed circuit board comprises a main board 1, a temperature control circuit 2, a thread cylinder 15 is respectively arranged at four corners of the main board 1, screws 14 are arranged in the thread cylinder 15 and can be connected with other devices through rotating the screws 14, one side of the main board 1 is connected with a fan 12 through a connecting column 16, copper foil groups 13 are arranged around the fan 12, the copper foil groups 13 are composed of copper foils, ventilation openings 17 are arranged between the copper foils, a circuit board 11 is arranged at the other side of the main board 1, the circuit board 11 is a circuit board formed by copper-based sintering, round holes and circuit arrangement on the circuit board 11 are consistent with the conventional copper-based circuit board, one end of the circuit board 11 is provided with the temperature control circuit 2, the circuit board 11 is embedded at one side of the main board 1, the temperature control circuit 2 is embedded on the circuit board 11, the fan 12 is connected at the other side of the main board 1 through screws, the input end of the temperature control circuit 2 is a power end 26, the power end 26 is connected with a first resistor 21, a third resistor 23 and a fourth resistor 29, the other end of the first resistor 21 is connected with a thermistor 24 and a second resistor 22, the other end of the thermistor 24 is connected with a base electrode of a transistor 25 and a large resistor 28, the thermistor 24 has a negative temperature coefficient, the resistor can be lowered along with the temperature rise, the transistor 25 is an NPN bipolar junction transistor, the other end of the third resistor 23 is connected with a collector electrode of the transistor 25, an emission set of the transistor 25 is connected with one electrode of the fan 12, the other end of the large resistor 28 is connected with a base electrode of a second transistor 210, the second transistor is an NPN bipolar junction transistor, the other end of the fourth resistor 29 is connected with a collector electrode of the second transistor 210, an emitter electrode of the second transistor 29 is connected with one electrode of a buzzer 211, the other end of the second resistor 22, the other electrode of the fan 12 is connected to the ground 27 with the other electrode of the buzzer 211.
The working principle is that when the circuit on the circuit board 11 works, the initial temperature is not high, the copper foil 13 dissipates heat to the circuit board 11, at this time, the resistance value of the thermistor 24 is larger, the base current of the transistor 25 is very small, the resistor 24 is temporarily unable to be conducted, the fan 12 does not work, when the temperature of the circuit board 11 continues to increase, the resistance value of the thermistor 24 is reduced, the base current of the transistor 25 is increased, the transistor 25 is conducted, the current can flow from the collector to the emitter and to the fan 12, the fan 12 starts to work, the circuit board 11 dissipates heat, wind spreads the whole circuit board 11 through the ventilation opening 17, when the temperature of the circuit board 11 continues to increase, the resistance value of the thermistor 24 is further reduced, the base current of the transistor 25 is increased, the emitter current of the transistor 25 is increased, the rotating speed of the fan 12 is increased, the heat dissipation degree of the circuit board 11 is increased, when the temperature continues to increase, the current provided by the large resistor 28 to the base of the second transistor 210 is enough to enable the second transistor 210 to be conducted, at this time, the high temperature is judged, the current can flow to the fourth resistor 29 and the second transistor 210 to the automatic buzzer 211, and the alarm circuit 211 is enabled.
In summary, according to the high-frequency copper-based sintered printed circuit board capable of automatically radiating heat, the thermistor 24 and the transistor 25 of the temperature control circuit 2 are used for adjusting the rotation speed of the fan 12, so that the circuit can work at a relatively stable and proper temperature, the working temperature of the circuit is effectively reduced, the influence of the temperature of the circuit board on the service life of a device is reduced, the service life of the circuit device is prolonged, and the circuit can automatically alarm at a high temperature through the buzzer 211 and the large resistor 28, so that the safety and stability of the circuit are improved.
The high-frequency copper-based sintered printed circuit board capable of automatically radiating heat can further radiate the circuit board 11 and also can shield certain electromagnetic signals by arranging the copper foil group 13 on the main board 1 because the heat conductivity and the electromagnetic shielding performance of the copper foil are good, so that the anti-interference capability of the circuit board is improved.
According to the high-frequency copper-based sintered printed circuit board capable of automatically radiating, the ventilation openings 17 are formed between the copper foil groups 13, so that wind can be distributed on the whole circuit board only by one small fan 12, and the heat radiation and high-temperature alarm of the circuit board can be realized by one thermistor 14, so that the heat radiation cost of the circuit board is greatly reduced.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides an automatic radiating high frequency copper base sintering printed wiring board, includes mainboard (1), accuse temperature circuit (2), its characterized in that: one side of the main board (1) is connected with a fan (12) through a connecting column (16), copper foil groups (13) are arranged around the fan (12), a circuit board (11) is arranged on the other side of the main board (1), one end of the circuit board (11) is provided with a temperature control circuit (2), the input end of the temperature control circuit (2) is a power supply end (26), the power supply end (26) is connected with the first resistor (21), the third resistor (23) and the fourth resistor (29), the other end of the first resistor (21) is connected with a thermistor (24) and a second resistor (22), the other end of the thermistor (24) is connected with the base electrode of the transistor (25) and the large resistor (28), the other end of the third resistor (23) is connected with the collector electrode of the transistor (25), the emitter set of the transistor (25) is connected to one electrode of the fan (12), the other end of the large resistor (28) is connected with the base electrode of the second transistor (210), the other end of the fourth resistor (29) is connected with the collector electrode of the second transistor (210), the emitter of the second transistor (29) is connected with one electrode of the buzzer (211), the other end of the second resistor (22), the other electrode of the fan (12) and the other electrode of the buzzer (211) are connected with a ground wire (27).
2. The high frequency copper-based sintered printed wiring board with automatic heat dissipation according to claim 1, wherein: four corners of the main board (1) are respectively provided with a thread cylinder (15), and screws (14) are arranged in the thread cylinders (15) and can be connected with other devices by rotating the screws (14).
3. The high frequency copper-based sintered printed wiring board with automatic heat dissipation according to claim 1, wherein: the circuit board (11) is formed by copper-based sintering printing, and the round holes and the circuit arrangement on the circuit board (11) are in accordance with the conventional copper-based circuit board.
4. The high frequency copper-based sintered printed wiring board with automatic heat dissipation according to claim 1, wherein: the thermistor (24) has a negative temperature coefficient, and the resistance decreases with increasing temperature.
5. The high frequency copper-based sintered printed wiring board with automatic heat dissipation according to claim 1, wherein: the circuit board (11) is embedded on one side of the main board (1), the temperature control circuit (2) is embedded on the circuit board (11), and the fan (12) is connected on the other side of the main board (1) through screws.
6. The high frequency copper-based sintered printed wiring board with automatic heat dissipation according to claim 1, wherein: the transistor (25) and the second transistor (210) are NPN bipolar junction transistors.
7. The high frequency copper-based sintered printed wiring board with automatic heat dissipation according to claim 1, wherein: the copper foil group (13) is composed of copper foils, and ventilation openings (17) are arranged between the copper foils.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321839302.9U CN220554231U (en) | 2023-07-13 | 2023-07-13 | High-frequency copper-based sintered printed circuit board capable of automatically radiating heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321839302.9U CN220554231U (en) | 2023-07-13 | 2023-07-13 | High-frequency copper-based sintered printed circuit board capable of automatically radiating heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220554231U true CN220554231U (en) | 2024-03-01 |
Family
ID=90002696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321839302.9U Active CN220554231U (en) | 2023-07-13 | 2023-07-13 | High-frequency copper-based sintered printed circuit board capable of automatically radiating heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220554231U (en) |
-
2023
- 2023-07-13 CN CN202321839302.9U patent/CN220554231U/en active Active
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| GR01 | Patent grant |