CN220543904U - Chip cooling device and live broadcast equipment - Google Patents

Abstract

The utility model discloses a chip cooling device and direct seeding equipment, wherein the chip cooling device comprises: the semiconductor refrigerating element, the cold conducting element, the heat transfer element, the heat dissipation component and at least one heat conduction pipe, wherein after the semiconductor refrigerating element is electrified, a cold source surface and a heat dissipation surface are formed on two opposite sides, one side of the cold conducting element is abutted against the cold source surface, the other side of the cold conducting element is abutted against the chip, the heat transfer element is abutted against the heat dissipation surface, the heat dissipation component and the heat transfer element are arranged at intervals, and the heat conduction pipe is used for connecting the heat transfer element and the heat dissipation component. The technical scheme of the utility model mainly aims at cooling the chip and avoiding the operation failure of the direct seeding equipment caused by overheat of the chip.

Description

Chip cooling device and live broadcast equipment

Technical Field

The utility model relates to the technical field of live broadcast equipment, in particular to a chip cooling device and live broadcast equipment.

Background

With the development scale of living broadcast trade is increasingly strong, the scene of living broadcast diversifies gradually, wherein, outdoor mainstream scene that becomes a living broadcast gradually, but when outdoor environment is in the high temperature state, the chip of living broadcast equipment is easy to passive high temperature and appear overheated condition, and then lead to living broadcast equipment to be difficult to normal operating, in current living broadcast equipment, the chip dispels the heat through the installation section bar radiator, thereby reach the purpose to the chip cooling, but in living broadcast equipment enters into the high temperature environment, the section bar radiator is not ideal to the heat dissipation cooling effect of chip, living broadcast equipment in the high temperature environment still can appear because of the chip temperature is too high and the condition of abnormal operation.

Disclosure of Invention

The utility model mainly aims to provide a chip cooling device which can cool a chip and avoid operation faults of direct seeding equipment caused by overheating of the chip.

In order to achieve the above object, the chip cooling device provided by the present utility model includes: the semiconductor refrigerating element, the cold conducting element, the heat transfer element, the heat dissipation component and at least one heat conduction pipe, wherein after the semiconductor refrigerating element is electrified, a cold source surface and a heat dissipation surface are formed on two opposite sides, one side of the cold conducting element is abutted against the cold source surface, the other side of the cold conducting element is abutted against the chip, the heat transfer element is abutted against the heat dissipation surface, the heat dissipation component and the heat transfer element are arranged at intervals, and the heat conduction pipe is used for connecting the heat transfer element and the heat dissipation component.

Optionally, the heat dissipation assembly includes a plurality of fins that set up at intervals, the fin is equipped with at least one through-hole, the heat pipe adaptation is worn to set up a plurality of corresponding settings the through-hole to with a plurality of fin interval connection.

Optionally, the surface of fin corresponds the through-hole protruding is equipped with the connecting cylinder, the heat pipe is established ties a plurality of corresponding settings the connecting cylinder to with a plurality of the fin interval connection, just the heat pipe with the inner wall butt of connecting cylinder.

Optionally, the heat transfer element is provided with an avoidance groove for placing the heat conducting pipe, the opening direction of the avoidance groove faces the semiconductor refrigeration element, and the outer pipe wall of the heat conducting pipe abuts against the bottom wall of the avoidance groove.

Optionally, the cold guide piece and the heat transfer piece are connected in a screw locking mode, and the semiconductor refrigeration piece is clamped between the cold guide piece and the heat transfer piece.

Optionally, the distance between two adjacent fins ranges from 2mm to 7mm.

Optionally, the thickness of the fin ranges from 0.2mm to 1.0mm.

Optionally, the chip cooling device is further provided with an annular heat-insulating piece, the heat-insulating piece is abutted against the heat transfer piece, and the annular hole of the heat-insulating piece is matched with the semiconductor refrigerating piece; when the chip is abutted against the cold guide piece, the heat insulation piece, the chip and the semiconductor refrigeration piece limit relatively independent heat insulation space.

Optionally, the thermal insulation member is configured as a fluffy fiber material, or an elastic foam material.

Optionally, the cold guide is provided with a cold guide protrusion abutting the chip.

The utility model also provides direct seeding equipment, which comprises a chip and the chip cooling device with the technical characteristics, wherein the surface of the chip is abutted against the cold guide.

After the chip cooling device provided by the technical scheme of the utility model is electrified, the semiconductor refrigerating sheet in the device forms a cold source surface and a heat release surface, and because the cold source surface is continuously in a low-temperature state, the operation heat of the chip can be continuously transferred to the cold source surface and then transferred to the heat release surface through the electronic effect of the semiconductor refrigerating sheet and then transferred to the heat release component through the heat conduction pipe, thereby realizing the release of the operation heat of the chip. In the process, on one hand, the semiconductor refrigerating sheet can provide a high-efficiency refrigerating effect, so that the excessive heat of the chip can be timely thermally conducted to the semiconductor refrigerating sheet; on the other hand, the heat conduction pipe can timely transfer the heat of the heat release surface to the heat radiation component and release the heat to the air, so that the normal operation of the semiconductor refrigerating sheet is ensured, and the normal operation of the chip cooling device is further ensured, and therefore, the temperature of the chip is efficiently controlled in a reasonable range, and the normal operation of direct seeding equipment is further ensured.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a chip cooling device according to an embodiment of the present utility model;

FIG. 2 is an exploded view of FIG. 1;

FIG. 3 is a schematic structural diagram of the connection relationship of the heat pipes in FIG. 1;

fig. 4 is a schematic view of the structure of the fin in fig. 1.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				100	Semiconductor refrigerating element	400	Heat dissipation assembly
110	Cold source surface	410	Fin type
				120	Exothermic heatFlour with a plurality of grooves	411	Through hole
200	Cold guide	412	Connecting cylinder
				210	Cold guide convex part	420	Connection channel
300	Heat transfer element	500	Heat conduction pipe
				310	Avoidance groove	600	Thermal insulation piece

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in abutment, or in communication between two elements or in interaction with each other, unless explicitly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The utility model provides a chip cooling device.

Referring to fig. 1 to 4, in an embodiment of the present utility model, the chip cooling device includes: the semiconductor refrigeration device comprises a semiconductor refrigeration device 100, a cold guide device 200, a heat transfer device 300, a heat dissipation assembly 400 and at least one heat conduction pipe 500, wherein after the semiconductor refrigeration device 100 is electrified, a cold source surface 110 and a heat release surface 120 are formed on two opposite sides, one side of the cold guide device 200 is abutted against the cold source surface 110, the other side is abutted against a chip, the heat transfer device 300 is abutted against the heat release surface 120, the heat dissipation assembly 400 and the heat transfer device 300 are arranged at intervals, and the heat conduction pipe 500 is used for connecting the heat transfer device 300 and the heat dissipation assembly 400.

Specifically, the temperature of the chip is transferred to the cold source surface 110 by heat conduction, and under the electronic effect of the semiconductor refrigeration sheet, the heat transferred to the cold source surface 110 is transferred to the heat release surface 120, so as to ensure that the cold source surface 110 is continuously in a low temperature state; in order to ensure the heat dissipation effect of the heat dissipation assembly 400, the heat conducted to the heat dissipation assembly 400 is prevented from flowing back to the heat dissipation surface 120, so that the heat dissipation assembly 400 is arranged at intervals on the heat dissipation surface 120, meanwhile, a heat conduction pipe 500 is arranged between the heat dissipation surface 120 and the heat dissipation assembly 400, and the heat of the heat dissipation surface 120 is conducted to the heat dissipation assembly 400 through the heat conduction pipe 500 and then is dissipated into the air through the heat dissipation assembly 400, so that the cooling effect on the chip is realized.

It should be appreciated that semiconductor refrigeration sheets are a common electronic refrigeration technology that provides high performance cooling, and use the electronic effect to transfer heat from one region to another, replacing conventional refrigerants (e.g., refrigerant gas); the semiconductor cooling sheet is small, exquisite, light, reliable and durable, environment-friendly, has good temperature control capability, can be suitable for equipment with various sizes and shapes, and can reduce the maintenance cost of the equipment, so the chip cooling device of the scheme adopts the semiconductor cooling sheet to control the temperature of the chip.

After the chip cooling device provided by the technical scheme of the utility model is electrified, the semiconductor refrigeration sheets in the device form the cold source surface 110 and the heat release surface 120, and as the cold source surface 110 is continuously in a low-temperature state, the operation heat of the chip can be continuously transferred to the cold source surface 110 and then transferred to the heat release surface 120 through the electronic effect of the semiconductor refrigeration sheets and then transferred to the heat release assembly 400 through the heat conduction pipe 500, so that the release of the operation heat of the chip is realized. In the process, on one hand, the semiconductor refrigerating sheet can provide a high-efficiency refrigerating effect, so that the excessive heat of the chip can be timely thermally conducted to the semiconductor refrigerating sheet; on the other hand, the heat conducting pipe 500 can timely transfer the heat of the heat release surface 120 to the heat radiation component 400 and release the heat into the air, so that the normal operation of the semiconductor refrigerating sheet is ensured, and the normal operation of the chip cooling device is further ensured, and thus, the temperature of the chip is efficiently controlled in a reasonable range, and the normal operation of direct seeding equipment is further ensured.

Referring to fig. 3, optionally, the heat dissipating assembly 400 includes a plurality of fins 410 disposed at intervals, the fins 410 are provided with at least one through hole 411, and the heat pipe 500 is adapted to pass through the plurality of through holes 411 disposed correspondingly, so as to connect the plurality of fins 410 at intervals. It will be appreciated that when a plurality of the fins 410 are disposed at intervals, the through holes 411 respectively form at least one connection channel 420; the heat pipe 500 is correspondingly inserted through the connecting channel 420, and the outer wall of the heat pipe 500 abuts against the wall of the through hole 411, so that the heat pipe 500 transfers the heat of the heat release surface 120 to the fins 410 and dissipates the heat into the air through the fins 410. The abutting arrangement between the heat conducting pipe 500 and the fins 410 can ensure the heat conducting effect between the two, meanwhile, the fins 410 are penetrated through the heat conducting pipe 500 at intervals, so that the heat radiating effect between the two adjacent fins 410 is not interfered with each other, and the heat radiating effect of the heat radiating component 400 is improved. In other embodiments, the heat sink assembly 400 is configured as a liquid cooling device.

Referring to fig. 3 and 4, optionally, a connecting cylinder 412 is protruding from a surface of the fin 410 corresponding to the through hole 411, the heat-conducting tube 500 is connected in series with a plurality of corresponding connecting cylinders 412, so as to connect the fins 410 at intervals, and the heat-conducting tube 500 abuts against an inner wall of the connecting cylinder 412. It will be appreciated that when a plurality of the fins 410 are spaced apart, the connecting cylinder 412 correspondingly forms at least one of the connecting channels 420; when the heat pipe 500 passes through the connection channel 420, the heat pipe 500 abuts against the connection channel 420. In this way, the contact area between the heat conducting tube 500 and the fin 410 is increased, on one hand, the connection between the heat conducting tube 500 and the connecting cylinder 412 is more stable due to the abutting action of the heat conducting tube 500 and the connecting cylinder 412, and on the other hand, the heat conducting area between the heat conducting tube 500 and the connecting cylinder is increased, so that the heat of the heat conducting tube 500 can be transferred to the fin 410 more quickly and efficiently, and the heat dissipation efficiency of the chip cooling device is improved. In other embodiments, the fins 410 are disposed on the bottom plate at intervals, and the heat pipe 500 is disposed against the bottom plate.

Referring to fig. 2, optionally, the heat transfer member 300 is provided with a relief groove 310 in which the heat conducting tube 500 is disposed, the opening direction of the relief groove 310 is toward the semiconductor refrigeration member 100, and the outer tube wall of the heat conducting tube 500 abuts against the bottom wall of the relief groove 310. The heat conducting pipe 500 is disposed between the heat release surface 120 and the heat transfer element 300, so that heat of the heat release surface 120 can be conducted to the heat conducting pipe 500 along the heat release element directly abutting against the heat release element to be further transferred to the heat dissipation element, and can be indirectly transferred to the heat conducting pipe 500 through air between the heat release surface and the heat conducting pipe 500 to be further transferred to the heat dissipation element, thereby increasing a heat conduction path of the heat dissipation surface, improving heat conduction efficiency to a certain extent, and further improving heat dissipation efficiency. Further, the heat conducting pipe 500 is disposed in the avoiding groove 310, and two sides of the heat conducting pipe 500 are respectively abutted against the heat release surface 120 and the heat transfer member 300.

In other embodiments, the heat pipe 500 abuts against the surface of the relief groove 310 on the side away from the semiconductor refrigeration member 100.

Referring to fig. 1, alternatively, the cold guide member 200 and the heat transfer member 300 are connected by means of screw locking, and the semiconductor refrigeration member is clamped between the cold guide member 200 and the heat transfer member 300, so that the connection stability between the cold guide member 200 and the heat transfer member 300 is enhanced, and the semiconductor refrigeration member 100 clamped between the two is stably connected with the two due to the limiting effect of the two, i.e. a stable connection relationship is maintained between the three, thereby ensuring the heat conduction effect between the three.

Alternatively, the distance between two adjacent fins 410 is in the range of 2mm to 7mm. When the distance between two adjacent fins 410 is not less than 2mm, the two adjacent fins 410 can exchange heat with air sufficiently; meanwhile, because the heat dissipation assembly 400 is limited in volume, in order to properly increase the heat dissipation surface, the number of fins 410 can be increased accordingly to ensure the heat dissipation effect of the heat dissipation assembly 400, so that the distance between two adjacent fins 410 is set to be not more than 7mm.

Optionally, the thickness of the fin 410 ranges from 0.2mm to 1.0mm. To ensure rigidity of the fin 410, the thickness of the fin 410 is not less than 0.2mm; meanwhile, the too thick fin 410 can affect the manufacturing efficiency of the fin 410 and the weight of the product, so that the thickness of the fin 410 is not more than 1.0mm in order to ensure that the manufacturing efficiency of the fin 410 and the weight of the product are not too heavy.

Referring to fig. 2, optionally, the chip cooling device is further provided with an annular heat preservation member 600, the heat preservation member 600 is disposed against the heat transfer member 300, and the annular hole of the heat preservation member 600 is adapted to be provided with the semiconductor refrigeration member 100; when the chip abuts against the cold guide 200, the heat insulating member 600, the chip and the semiconductor refrigerator 100 limit a relatively independent heat insulating space, so that the cold source surface 110 and the cold guide 200 are located in the heat insulating space, and the heat insulating space isolates the cold source surface 110, the cold guide 200 and the air outside, thereby being beneficial to maintaining the cold source surface 110 and the cold guide 200 in a low temperature state and reducing the possibility of heat exchange with the outside air; additionally, the external air is difficult to contact the cold source surface 110 and the cold guide 200, so that condensed water is difficult to form on the surfaces of the cold source surface 110 and the cold guide 200, and normal operation of the semiconductor refrigerator 100 is ensured.

Further, the thermal insulation member 600 is configured as a fluffy fiber material, or an elastic foam material. It should be appreciated that the shape and size of the thermal insulation 600 may be adjusted to enable the thermal insulation 600 to enclose a relatively independent thermal insulation space with the chip, semiconductor refrigeration device 100. Therefore, the thermal insulation piece 600 can be made of the above materials, so that the thermal insulation effect of the thermal insulation piece 600 is ensured, and the thermal insulation piece 600 can be deformed to be matched with the connecting chip.

Referring to fig. 2, optionally, the cold guide 200 is provided with a cold guide protrusion 210 abutting the chip. It should be understood that the heat conduction is performed in a collision and vibration manner between molecules, and the longer the path is, the more heat is conducted, so that the temperature of the surface of the cold guide protrusion 210 is lower than the temperature of the peripheral surface thereof, therefore, by providing the cold guide protrusion 210, the temperature difference between the chip and the cold guide member 200 is further enlarged, so that the heat of the chip can be more rapidly conducted to the semiconductor refrigeration member 100, the heat conduction efficiency between the cold guide member 200 and the chip is improved to a certain extent, and the cooling effect of the chip cooling device on the chip is further improved.

The utility model also provides a direct seeding device, which comprises a chip and a chip cooling device, wherein the specific structure of the chip cooling device refers to the embodiment, and as the direct seeding device adopts all the technical schemes of all the embodiments, the direct seeding device at least has all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted. Wherein the surface of the chip abuts against the cold guide 200.

The foregoing description is only of the optional embodiments of the present utility model, and is not intended to limit the scope of the utility model, and all the equivalent structural changes made by the description of the present utility model and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (10)

1. A chip cooling device, comprising:

the semiconductor refrigerating piece is provided with a cold source surface and a heat release surface on two opposite sides after being electrified;

one side of the cold guide piece is abutted against the cold source surface, and the other side is abutted against the chip;

a heat transfer member abutting the heat release surface;

the heat dissipation component and the heat transfer element are arranged at intervals; and

at least one heat pipe for connecting the heat transfer member and the heat dissipation assembly.

2. The chip cooling device according to claim 1, wherein the heat dissipation assembly comprises a plurality of fins arranged at intervals, the fins are provided with at least one through hole, and the heat conduction pipe is adapted to pass through the plurality of through holes correspondingly arranged so as to connect the plurality of fins at intervals.

3. The chip cooling device according to claim 2, wherein a connecting cylinder is arranged on the surface of the fin corresponding to the through hole in a protruding manner, the heat conducting tube is connected in series with a plurality of corresponding connecting cylinders so as to connect the fins at intervals, and the heat conducting tube is abutted against the inner wall of the connecting cylinder.

4. The chip cooling device according to claim 2, wherein the heat transfer member is provided with an escape groove in which the heat transfer tube is placed, an opening direction of the escape groove is set toward the semiconductor cooling member, and an outer tube wall of the heat transfer tube abuts against a bottom wall of the escape groove.

5. The chip cooling device of claim 4 wherein the cold guide and the heat transfer member are connected by means of screw locking, and the semiconductor cooling member is sandwiched between the cold guide and the heat transfer member.

6. The chip cooling device according to claim 2, wherein the distance between two adjacent fins is 2 mm-7 mm;

and/or the thickness of the fin ranges from 0.2mm to 1.0mm.

7. The chip cooling device according to claim 1, wherein the chip cooling device is further provided with an annular heat-preserving member, the heat-preserving member is arranged in abutting connection with the heat transfer member, and the annular ring of the heat-preserving member is adapted to be provided with the semiconductor refrigerating member;

when the chip is abutted against the cold guide piece, the heat insulation piece, the chip and the semiconductor refrigeration piece limit relatively independent heat insulation space.

8. The chip cooling device of claim 7 wherein the thermal insulation member is configured as a fluffy fiber material or a resilient foam material.

9. The chip cooling device according to any one of claims 1 to 8, wherein the cooling guide is provided with a cooling guide protrusion abutting the chip.

10. A live broadcast device, comprising:

a chip; and

the chip cooling device of any one of claims 1 to 9, wherein a surface of the chip abuts the cold guide.