CN220292457U - Liquid cooling heat abstractor and rack - Google Patents

Liquid cooling heat abstractor and rack Download PDF

Info

Publication number
CN220292457U
CN220292457U CN202321775770.4U CN202321775770U CN220292457U CN 220292457 U CN220292457 U CN 220292457U CN 202321775770 U CN202321775770 U CN 202321775770U CN 220292457 U CN220292457 U CN 220292457U
Authority
CN
China
Prior art keywords
liquid
water row
water
liquid cooling
row
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202321775770.4U
Other languages
Chinese (zh)
Inventor
吴秀兰
王远东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Colorful Co ltd
Original Assignee
Shenzhen Colorful Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Colorful Co ltd filed Critical Shenzhen Colorful Co ltd
Priority to CN202321775770.4U priority Critical patent/CN220292457U/en
Application granted granted Critical
Publication of CN220292457U publication Critical patent/CN220292457U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model provides a liquid cooling heat dissipation device and a cabinet, and belongs to the field of heat dissipation structures. The liquid cooling heat dissipation device comprises a liquid cooling plate, a water pump arranged on the liquid cooling plate, a liquid outlet pipe and a liquid inlet pipe which are respectively connected with an input port and an output port of the water pump, and further comprises a first water row and a second water row which are arranged in parallel at intervals, wherein the first water row is provided with a liquid outlet connected with the liquid outlet pipe, the second water row is provided with a liquid inlet connected with the liquid inlet pipe, and the liquid inlet of the first water row is communicated with the liquid outlet of the second water row. The beneficial effects of the utility model are as follows: by arranging at least two water rows connected in series, the parallel structure dissipates heat, and the heat dissipation capacity is greatly improved.

Description

Liquid cooling heat abstractor and rack
Technical Field
The present utility model relates to a heat dissipation structure, and more particularly, to a liquid cooling heat dissipation device and a cabinet with the same.
Background
The existing liquid cooling heat dissipation device is usually provided with a water row, and fans are additionally arranged on one side or two sides of the water row to improve the flow rate of wind, so that the heat dissipation capacity is improved. The water rows have dimensions of 120 x 120mm, 120 x 240mm or 120 x 360mm, which cannot be commonly used in 4U inserts. Even if a single water drain is placed in the plug box, the heat-relieving capacity is about 300W, and the daily heat dissipation requirement cannot be met.
Disclosure of Invention
In order to solve the problems in the prior art, the utility model provides a liquid cooling heat dissipation device and a cabinet provided with the liquid cooling heat dissipation device.
The liquid cooling heat dissipation device comprises a liquid cooling plate, a water pump arranged on the liquid cooling plate, a liquid outlet pipe and a liquid inlet pipe which are respectively connected with an input port and an output port of the water pump, and further comprises a first water row and a second water row which are arranged in parallel at intervals, wherein the first water row is provided with a liquid outlet connected with the liquid outlet pipe, the second water row is provided with a liquid inlet connected with the liquid inlet pipe, and the liquid inlet of the first water row is communicated with the liquid outlet of the second water row.
The utility model is further improved and further comprises a fan arranged between the first water row and the second water row.
According to the utility model, the fan is further improved, an ambient temperature detection device is arranged on the fan, and the ambient temperature detection device is connected with a controller of the fan.
According to the utility model, the radiating surfaces of the first water row and the radiating surfaces of the second water row are arranged in opposite directions, and the radiating surfaces and the blower between the radiating surfaces are fixed into an integral radiating unit.
According to the utility model, the number of the first water rows and the second water rows is more than one, and the number of the integral heat radiating units is more than 1.
The utility model is further improved, and the liquid cooling plate is provided with a heat conduction structure or a heat absorption structure for conducting heat of the heating device.
The utility model is further improved, and a protective shell is arranged above the liquid cooling plate.
The utility model also provides a cabinet, which comprises the liquid cooling heat dissipation device, a cabinet body and a heating device arranged in the cabinet body, wherein the first water row and the second water row are both fixed on the cabinet body, and the liquid cooling plate is arranged on the heating device to dissipate heat of the heating device.
According to the utility model, the cabinet is a 4U plug box, a PCB board is arranged in the 4U plug box, the liquid cooling board is fixedly connected with the PCB board, the sizes of the first water row and the second water row are 100mm x 100mm, and the heat-removing capacity of the liquid cooling heat dissipation device is more than 550W.
According to the utility model, the PCB is further improved, the PCB is also provided with an upper cover, the side surface of the upper cover is provided with a limiting structure matched with the outer diameters of the liquid outlet pipe and the liquid inlet pipe respectively, and one ends of the liquid outlet pipe and the liquid inlet pipe extend out of the upper cover and are fixedly connected with the first water row and the second water row on the cabinet body.
Compared with the prior art, the utility model has the beneficial effects that: the liquid cooling plate is fixed on the heating device, conducts heat for the heating device and takes away heat for heat dissipation through the liquid cooling heat dissipation device, and the heat dissipation device is provided with at least two water rows connected in series, so that the heat dissipation capacity is greatly improved, and compared with the existing single water row, the heat dissipation device can adapt to the size of the water row according to the size of the cabinet on the premise of meeting the heat dissipation effect, and can doubly improve the heat dissipation performance in a micro size;
the water exhaust fan hamburger structure is characterized in that the water rows are connected in parallel, and the fan is clamped between the two water rows in a hamburger mode to form an integral radiating unit, so that the radiating performance is further improved;
the fan is provided with the detection device for detecting the ambient temperature, and the rotating speed of the fan can be adjusted in real time according to the temperature of the GPU and the CPU as well as the ambient temperature, so that the temperature is stabilized in a proper range.
Drawings
FIG. 1 is a schematic diagram of a liquid-cooled heat sink according to the present utility model;
fig. 2 is an exploded view of the liquid cooling device according to the present utility model.
Detailed Description
The utility model will be described in further detail with reference to the drawings and examples.
As shown in fig. 1 and 2, as an embodiment of the present utility model, the liquid cooling heat dissipation device of the present embodiment is installed in a cabinet body of a 4U box, and dissipates heat to a PCB board 8 in the 4U box.
This example liquid cooling heat abstractor includes liquid cooling board 7, sets up on liquid cooling board 7 water pump 6, respectively with the input port and the drain pipe 9 and the feed liquor pipe 10 that link to each other of delivery port of water pump 6, still including first water row 1 and the second water row 2 that parallel clearance set up, first water row 1 is equipped with the liquid outlet 101 that links to each other with drain pipe 9, second water row 2 is equipped with the inlet 201 that links to each other with feed liquor pipe 10, the inlet of first water row 1 communicates with the liquid outlet of second water row 2, through setting up two water rows of establishing ties, the parallel structure heat dissipation has improved the heat dissipation ability greatly, compares current single water row, can be under the prerequisite that satisfies the radiating effect, according to the size adaptation water row's of rack size, can doubly improve the heat dissipation in the microminiature.
Preferably, the present example further comprises a fan 3, said fan 3 being arranged between said first water row 1 and said second water row 2. The radiating surface of the first water row 1 and the radiating surface of the second water row 2 are arranged in opposite directions, and the fan 3 between the radiating surface of the first water row 1 and the radiating surface of the second water row are fixed to form an integral radiating unit of a hamburger type, and air flow is accelerated through rotation of the fan, so that the radiating performance is further improved.
Preferably, the fan 3 of this example is provided with an environmental temperature detection device, and the environmental temperature detection device is connected with a controller of the fan, so that the rotating speed of the fan can be adjusted in real time according to the temperatures of the GPU, the CPU and the environmental temperature, and the temperature is stabilized in a proper range.
The liquid cooling board 7 top of this example still is equipped with the protective housing, makes liquid cooling board 6 and protective housing and its inside water pump constitute a heat radiation structure 4, improves the security to be convenient for assemble, in addition, be equipped with conduction heating device thermal heat conduction structure or heat absorption structure on the liquid cooling board 7, be convenient for faster take away the heat that produces on the PCB.
As an embodiment of the present utility model, the PCB board 8 of this embodiment is further provided with an upper cover 5, the side surface of the upper cover 5 is provided with a limiting structure that is respectively matched with the outer diameters of the liquid outlet pipe 9 and the liquid inlet pipe 10, and one ends of the liquid outlet pipe 9 and the liquid inlet pipe 10 extend out of the upper cover 5 and are fixedly connected with the first water row 1 and the second water row 2 on the cabinet body. Through upper cover 5, can keep apart heating device and other devices, prevent that heat from conducting to other devices, influence other device's performance to, can directional heat conduction to the water row, heat dissipation through the heat exchange of water row.
The cooling liquid in the water drain in this example may be water or another liquid medium. The size of the first water row 1 and the second water row 2 is 100mm x 100mm, and the heat decomposition capacity of the liquid cooling heat radiator reaches more than 550W.
The working principle of this example is:
the heat generated in the operation process of the PCB 8 is conducted to the liquid cooling plate 7, when the ambient temperature reaches a set value, the water pump 6 and the fan 3 start to work, and cooling liquid in the first water row 1 and the second water row 2 is driven to circularly flow in the liquid inlet pipe 10, the water pump 6, the liquid outlet pipe 9, the first water row 1, the second water row 2 and the liquid inlet pipe 10, and the heat dissipation surfaces of the first water row 1 and the second water row 2 dissipate the heat through heat exchange. The fan rotates to accelerate the air circulation and improve the heat exchange efficiency.
As another embodiment of the present utility model, the number of the first water rows 1 and the second water rows 2 in this embodiment is more than one and are alternately arranged in parallel, and the number of the integral heat dissipation units may be more than 2, so as to form a double-layer hamburger heat dissipation structure or a multi-layer hamburger heat dissipation structure, thereby adapting to the heat dissipation requirements of more cabinets. The heat dissipation structure is only required to be fixed on the heating element, the installation is very convenient, and the hamburger type structure can be widely applied to server heat dissipation, consumption heat dissipation, computer peripheral product heat dissipation, CPU heat dissipation, GPU heat dissipation and the like.
The above embodiments are preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model, which includes but is not limited to the embodiments, and equivalent modifications according to the present utility model are within the scope of the present utility model.

Claims (10)

1. The utility model provides a liquid cooling heat abstractor which characterized in that: including the liquid cooling board, set up on the liquid cooling board water pump, respectively with the input port and the delivery outlet continuous drain pipe and the feed liquor pipe of water pump, still including first water row and the second water row that the clearance set up side by side, first water row is equipped with the liquid outlet that links to each other with the drain pipe, the second water row is equipped with the inlet that links to each other with the feed liquor pipe, the inlet of first water row communicates with the liquid outlet of second water row.
2. The liquid-cooled heat sink of claim 1, wherein: the device further comprises a fan, wherein the fan is arranged between the first water row and the second water row.
3. The liquid-cooled heat sink of claim 2, wherein: the fan is provided with an ambient temperature detection device, and the ambient temperature detection device is connected with a controller of the fan.
4. The liquid-cooled heat sink of claim 2, wherein: the radiating surfaces of the first water row and the radiating surfaces of the second water row are arranged in opposite directions, and the radiating surfaces and the fan between the radiating surfaces are fixed to form an integral radiating unit.
5. The liquid-cooled heat sink of claim 4, wherein: the number of the first water rows and the second water rows is more than one, and the number of the integral heat radiating units is more than 1.
6. The liquid-cooled heat sink according to any one of claims 1-5, wherein: the liquid cooling plate is provided with a heat conduction structure or a heat absorption structure for conducting heat of the heating device.
7. The liquid-cooled heat sink of claim 6, wherein: and a protective shell is arranged above the liquid cooling plate.
8. A cabinet comprising the liquid-cooled heat sink of any one of claims 1-7, characterized in that: the heating device comprises a cabinet body and a heating device arranged in the cabinet body, wherein the first water row and the second water row are both fixed on the cabinet body, and the liquid cooling plate is arranged on the heating device and dissipates heat for the heating device.
9. The cabinet according to claim 8, wherein: the rack is 4U subrack, be equipped with the PCB board in the 4U subrack, the liquid cooling board with PCB board fixed connection, the size of first water row and second water row is 100mm, liquid cooling heat abstractor's heat release ability reaches more than 550W.
10. The cabinet according to claim 9, wherein: the PCB is also provided with an upper cover, the side surface of the upper cover is provided with a limiting structure which is matched with the outer diameters of the liquid outlet pipe and the liquid inlet pipe respectively, and one ends of the liquid outlet pipe and the liquid inlet pipe extend out of the upper cover and are fixedly connected with a first water row and a second water row on the cabinet body.
CN202321775770.4U 2023-07-07 2023-07-07 Liquid cooling heat abstractor and rack Active CN220292457U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321775770.4U CN220292457U (en) 2023-07-07 2023-07-07 Liquid cooling heat abstractor and rack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321775770.4U CN220292457U (en) 2023-07-07 2023-07-07 Liquid cooling heat abstractor and rack

Publications (1)

Publication Number Publication Date
CN220292457U true CN220292457U (en) 2024-01-02

Family

ID=89330684

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321775770.4U Active CN220292457U (en) 2023-07-07 2023-07-07 Liquid cooling heat abstractor and rack

Country Status (1)

Country Link
CN (1) CN220292457U (en)

Similar Documents

Publication Publication Date Title
US20120127655A1 (en) Server cabinet
US20080259566A1 (en) Efficiently cool data centers and electronic enclosures using loop heat pipes
CN204272576U (en) Control device of liquid cooling and there is the server of this device
US20200275584A1 (en) 3d extended cooling mechanism for integrated server
RU2522937C1 (en) Liquid cooling system for multiprocessor computation complex, package and heat sink module
CN106686959B (en) A kind of electromechanical equipment radiator
CN100456205C (en) Heat radiator
CN220292457U (en) Liquid cooling heat abstractor and rack
US20150062817A1 (en) Server
CN206672022U (en) A kind of computer chip water cooling plant
CN206788697U (en) A kind of high-efficient heat-dissipating computer motherboard
CN212061092U (en) Computer hardware overheat protection device
CN208314698U (en) Twin automatic cycle cooling device
CN209765429U (en) Heat dissipation system and cooling liquid distribution module thereof
CN210168376U (en) Data center water-cooling heat dissipation rack
CN209267884U (en) A kind of communication processor of remote transmission control
CN111399609A (en) High-efficient cooling system for computer
CN221125206U (en) Water-cooling heat dissipation type 2U server
CN100444368C (en) Integrated liquid cooling heat abstractor
CN213300901U (en) Intelligent environment-friendly cooler with detachable access door
CN217279502U (en) Intelligence cooling computer mainboard
CN204695197U (en) A kind of computer processor cooling system
CN215376252U (en) Computer CPU water-cooling radiator
CN216871164U (en) Water-cooling heat dissipation device with temperature control function
CN216956836U (en) Computer host with array type radiating fins

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant