CN220272469U

CN220272469U - Package structure and electrical component

Info

Publication number: CN220272469U
Application number: CN202321737875.0U
Authority: CN
Inventors: 陈邦星; 曹凯
Original assignee: Innoscience Zhuhai Technology Co Ltd
Current assignee: Innoscience Zhuhai Technology Co Ltd
Priority date: 2023-07-03
Filing date: 2023-07-03
Publication date: 2023-12-29
Anticipated expiration: 2033-07-03

Abstract

The utility model relates to the technical field of semiconductor chip packaging, and provides a packaging structure and an electrical component. The packaging structure according to the embodiment of the utility model comprises: a substrate; a chip connected to the substrate; the chip comprises an electroplated metal layer and a chip body, wherein the electroplated metal layer is connected to the chip body, and the electroplated metal layer is arranged on one side of the chip body, which is away from the substrate; and the plastic package body at least partially wraps the electroplated metal layer. Through being connected with the electroplated metal layer in the one side that the chip deviates from the base plate, the heat that the chip produced in the course of the work can be well transmitted to the electroplated metal layer on with the base plate, and the heat of transmitting to the electroplated metal layer can be directly dispelled the heat to the external world from the electroplated metal layer, and the heat of transmitting to the base plate can dispel the heat to the external world from the base plate. Thereby realizing heat dissipation at two sides. And the electroplated metal layer is connected with the chip through electroplating, an adhesive material is not needed, the heat dissipation efficiency of the electroplated metal layer is higher, and the packaging of the chip is more efficient.

Description

Package structure and electrical component

Technical Field

The utility model relates to the technical field of semiconductor chip packaging, and provides a packaging structure and an electrical component.

Background

With the updating of electronic products, the requirements on chip packaging technology are also increasing. However, as the input/output density of the chip is higher, the heat dissipation requirement on the chip is higher, especially, the heat generated by the chip of the larger power electrical equipment is concentrated, and the performance of the chip is affected due to poor heat dissipation performance of the package by using the traditional packaging technology. The heat dissipation of the prior art packages has not been able to meet the usage requirements of the chip.

Disclosure of Invention

The present utility model is directed to solving at least one of the technical problems existing in the related art. Therefore, the utility model provides a packaging structure for solving the defect of poor heat dissipation capacity of the packaging structure in the prior art.

According to an embodiment of the first aspect of the present utility model, there is provided a package structure, including:

a substrate;

the chip is connected to the substrate and is suitable for radiating outwards to the substrate; the chip comprises an electroplated metal layer and a chip body, wherein the electroplated metal layer is connected to the chip body, and the electroplated metal layer is arranged on one side of the chip body, which is away from the substrate;

and the plastic package body at least partially wraps the electroplated metal layer and is suitable for fixing the chip on the substrate.

According to the packaging structure provided by the embodiment of the utility model, the electroplated metal layer is connected to one side of the chip, which is away from the substrate, so that heat generated in the working process of the chip can be well transferred to the electroplated metal layer and the substrate, the heat transferred to the electroplated metal layer can be directly radiated to the outside from the electroplated metal layer, and the heat transferred to the substrate can be radiated to the outside from the substrate. Thereby realizing heat dissipation at two sides. And the electroplated metal layer is connected with the chip through electroplating, an adhesive material is not needed, the heat dissipation efficiency of the electroplated metal layer is higher, and the packaging of the chip is more efficient.

According to one embodiment of the utility model, a side of the electroplated metal layer facing away from the chip is provided with a first heat sink.

According to one embodiment of the utility model, the side of the electroplated metal layer facing away from the chip is provided with a plurality of heat dissipation grooves, and the heat dissipation grooves are suitable for increasing the contact area of the electroplated metal layer.

According to one embodiment of the utility model, a heat conducting glue layer is arranged between the chip and the substrate, and the chip is connected with the substrate through the heat conducting glue layer.

According to one embodiment of the utility model, the plastic package body is flush with the lower surface of the substrate.

According to one embodiment of the present utility model, the electroplated metal layer is at least one of a copper metal layer, a nickel metal layer, a tin metal layer, a silver metal layer, or a gold metal layer.

According to one embodiment of the utility model, the chip body comprises an active surface of the chip body and a back surface of the chip body which are oppositely arranged, the active surface faces away from the substrate, the electroplated metal layer is formed on the active surface in an electroplating manner, and the active surface is electrically connected with the substrate through a metal wire.

An electrical component provided according to an embodiment of the second aspect of the present utility model comprises:

the packaging structure;

and the substrate is connected to the circuit board.

According to one embodiment of the utility model, the circuit board includes opposite first and second sides; the first side of the circuit board is connected with the packaging structure, and the second side of the circuit board is connected with the second radiator.

According to one embodiment of the utility model, the device further comprises an air supply component, wherein an air path of the air supply component passes through one side of the electroplated metal layer, which is away from the substrate.

Drawings

In order to more clearly illustrate the utility model or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a package structure according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a package structure according to another embodiment of the present utility model;

FIG. 3 is a schematic structural diagram of a package structure according to another embodiment of the present utility model;

fig. 4 is a schematic structural view of an electrical component provided in one embodiment of the present utility model.

Reference numerals:

100. a package structure; 110. a substrate; 120. a chip; 121. an active surface; 122. a back surface; 123. a chip body; 124. electroplating a metal layer; 130. a plastic package body; 140. a first heat sink; 150. a heat dissipation groove; 160. a heat conducting adhesive layer;

200. an electrical component; 210. a circuit board; 220. and a second heat sink.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present utility model will be understood in detail by those of ordinary skill in the art.

Referring to fig. 1 to 3, in an embodiment of a package structure 100, the package structure 100 includes: a substrate 110, a chip 120, and a molding compound 130. The chip 120 is connected to the substrate 110, and the chip 120 is adapted to dissipate heat to the substrate 110; the chip 120 includes a metal plating layer 124 and a chip body 123, wherein the metal plating layer 124 is connected to the chip body 123, and the metal plating layer 124 is disposed on a side of the chip body 123 away from the substrate 110. The plastic package 130 at least partially encapsulates the electroplated metal layer 124, and is adapted to fix the chip 120 to the substrate 110.

According to the package structure 100 of the embodiment of the utility model, the electroplated metal layer 124 is connected to the side of the chip 120 away from the substrate 110, so that heat generated in the working process of the chip 120 can be well transferred to the electroplated metal layer 124 and the substrate 110, the heat transferred to the electroplated metal layer 124 can be directly radiated from the electroplated metal layer 124 to the outside, and the heat transferred to the substrate 110 can be radiated from the substrate 110 to the outside. Thereby realizing heat dissipation at two sides. In addition, the electroplated metal layer 124 is connected with the chip 120 through electroplating, an adhesive material is not needed, the heat dissipation efficiency of the electroplated metal layer 124 is higher, and the packaging of the chip 120 is more efficient.

It should be noted that the electroplated metal layer 124 may be connected to the chip 120 by electroplating during Wafer processing (i.e., wafer level step) of the chip 120. The electroplated metal layer 124 may be further connected to the chip 120 by electroplating during packaging.

In the related art, since the surface of the chip 120 is very fragile and easily damaged, the chip 120 cannot be directly used as a working surface, and if a plated metal layer 124 is to be plated on the chip 120, it is necessary to connect the chip 120 to the substrate 110 first, and then to plate the plated metal layer 124 for heat dissipation using the substrate 110 as a working surface. The chip 120 is always connected to the substrate 110 on one side, and if other operations are to be performed between the chip 120 and the substrate 110 (e.g., the electroplated metal layer 124 is also provided between the chip 120 and the substrate 110), the connection between the chip 120 and the substrate 110 needs to be released, which is very troublesome. In the process of manufacturing the wafer for manufacturing the chip 120, the electroplated metal layer 124 is connected to the chip 120 by electroplating, and the electroplated metal layer 124 can cut the wafer after electroplating to form the chip 120, and then package the chip 120 connected with the electroplated metal layer 124. This allows for more flexibility in the processing of forming the electroplated metal layer 124. The chip 120 is not required to be packaged on the substrate 110, so that the manufacturing steps are more flexible and simple, and the production efficiency can be greatly improved.

In one embodiment, the electroplated metal layer 124 is connected to both sides of the chip 120, so that the heat dissipation effect of the package structure 100 to both sides is better.

Referring to fig. 2, a first heat sink 140 is disposed on a side of the electroplated metal layer 124 facing away from the chip 120 according to an embodiment of the utility model. It will be appreciated that the electroplated metal layer 124 is in intimate contact with the surface of the chip 120 to transfer heat generated internally by the chip 120. The electroplated metal layer 124 may be used in combination with a heat spreader to further improve the heat dissipation of the package structure 100. The heat sink is usually made of copper or aluminum, and has a certain heat dissipation area and heat dissipation capability, so that heat on the surface of the chip 120 can be dissipated as soon as possible, thereby maintaining the normal operating temperature of the chip 120. Thus, the electroplated metal layer 124 of the chip 120 and the heat spreader function in concert to ensure the stability and reliability of the chip 120.

Referring to fig. 3, a side of the electroplated metal layer 124 facing away from the chip 120 is provided with a plurality of heat dissipation grooves 150, and the heat dissipation grooves 150 are adapted to increase the contact area of the electroplated metal layer 124. It is understood that the heat sink 150 may be directly plated on the plated metal layer 124. The heat dissipation grooves 150 can effectively increase the surface area of the electroplated metal layer 124, and increase the contact area with air, thereby promoting the heat generated inside the chip 120 to be dissipated more quickly. In addition, the heat dissipation grooves 150 can optimize air flow, reduce air resistance and eddy current, and improve heat dissipation efficiency.

Referring to fig. 1, a thermal conductive adhesive layer 160 is disposed between the chip 120 and the substrate 110, and the chip 120 is connected to the substrate 110 through the thermal conductive adhesive layer 160 according to an embodiment of the present utility model. It will be appreciated that the heat-conducting glue is a material with high heat-conducting properties, which mainly serves to connect the chip 120 and the substrate 110, and has a certain heat-dissipating capacity. However, the heat dissipation effect of the chip 120 is affected by the problems of unevenness, minute gaps, oxide layers, and the like between the chip 120 and the substrate 110. At this time, the thermal conductive adhesive is laid between the chip 120 and the substrate 110, so that the micro gap can be filled, the oxide layer is eliminated, the contact area between the chip 120 and the substrate 110 is increased, and the heat transfer efficiency is improved, and the thermal conductive adhesive layer 160 is formed between the chip 120 and the substrate 110 by injection molding, so that a continuous thermal conductive channel can be formed, and the heat transfer is promoted. The heat conductive adhesive layer 160 is generally made of a material with high heat conductivity, such as silica gel, epoxy resin, etc., and has good heat conductivity, plasticity and high temperature resistance.

Referring to fig. 1, according to an embodiment of the present utility model, the plastic package 130 is flush with the lower surface of the substrate 110. It is understood that when the lower surfaces of the molding compound 130 and the substrate 110 are leveled, it is ensured that the contact surface therebetween is leveled, thereby improving the mounting stability of the device. And the substrate 110 can be exposed at least on one side, and can not be completely shielded by the plastic package 130, so as to effectively increase the heat dissipation efficiency of the package structure 100.

According to one embodiment of the present utility model, the electroplated metal layer 124 is at least one of a copper metal layer, a nickel metal layer, a tin metal layer, a silver metal layer, or a gold metal layer. It will be appreciated that the material of the heat dissipating metal should have good thermal conductivity for better heat dissipation. Copper, nickel, tin, silver, and gold are all excellent heat conductive materials and therefore they are commonly used to plate the metal layer 124.

Referring to fig. 1, according to an embodiment of the present utility model, a chip body 123 includes an active surface 121 of the chip body 123 and a back surface 122 of the chip body 123 opposite to each other, the active surface 121 faces away from the substrate 110, a metal plating layer 124 is formed on the active surface 121 by electroplating, and the active surface 121 is electrically connected to the substrate 110 through a metal wire. It can be understood that the active surface 121 of the chip body 123 is a main processing unit in the circuit, and elements such as transistors in the integrated circuit can generate a large amount of heat during operation, and the electroplated metal layer 124 can quickly dissipate the heat generated by the chip 120 by contacting the active surface 121, so as to prevent the chip 120 from overheating, thereby ensuring stable operation of the circuit.

It should be noted that the active surface 121 faces away from the substrate 110, which helps to improve the performance and stability of the chip 120. The capacitance between the signal transmission line and the ground plane is smaller and impedance matching is easier to achieve. And facilitate testing of the chip 120.

Referring to fig. 4, referring to an electrical component 200 provided in an embodiment of the present utility model, the electrical component 200 includes: the package structure 100 and the circuit board 210 described above; the substrate 110 is connected to the circuit board 210. Since the electrical component 200 includes the above-mentioned package structure 100, all the technical effects of the package structure 100 are not described herein.

In one embodiment, the circuit board 210 includes a heat conductive member (not shown), and the heat conductive member is disposed at a position of the circuit board 210 corresponding to the substrate 110. It will be appreciated that during operation of the chip 120, a large amount of heat is generated by the chip 120 and transferred to the circuit board 210 along with the substrate 110, which may affect the performance and lifetime of the chip 120 if the circuit board 210 cannot dissipate heat in time. By arranging the heat conducting component, the heat dissipation of the chip 120 can be effectively accelerated, the stability and the reliability of the system are improved, and the thermal stress of the chip 120 is effectively reduced.

According to one embodiment of the utility model, the heat conducting member is a ceramic heat conducting member. The ceramic material has higher high temperature resistance, can bear the temperature of hundreds of degrees, and can not deform, expand and the like. This capability makes the ceramic circuit board 210 more reliable in operation in high temperature environments. In addition, the ceramic material has excellent electrical insulation performance, and can prevent current leakage and short circuit. This is particularly important for circuits requiring high precision signal transmission. The ceramic material also resists attack by various chemicals, thereby extending the life of the circuit board 210.

According to one embodiment of the utility model, the circuit board 210 includes opposite first and second sides; the first side of the circuit board 210 is connected to the package structure 100, and the second side of the circuit board 210 is connected to the second heat sink 220. It can be appreciated that, by the second heat spreader 220, the heat dissipation efficiency of the package structure 100 toward the circuit board 210 can be effectively enhanced.

According to one embodiment of the present utility model, the air supply assembly further includes an air supply member having an air path passing through a side of the electroplated metal layer 124 facing away from the base plate 110. It is appreciated that the air moving component may increase the air flow rate and increase the heat dissipation efficiency of the electrical assembly 200.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

In embodiments of the utility model, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A package structure (100), comprising:

a substrate (110);

-a chip (120) connected to the substrate (110), the chip (120) being adapted to dissipate heat outwards towards the substrate (110); the chip (120) comprises an electroplated metal layer (124) and a chip body (123), wherein the electroplated metal layer (124) is connected to the chip body (123), and the electroplated metal layer (124) is arranged on one side of the chip body (123) away from the substrate (110);

and a plastic package (130) at least partially surrounding the electroplated metal layer (124) and adapted to fix the chip (120) to the substrate (110).

2. The package structure (100) according to claim 1, wherein a side of the electroplated metal layer (124) facing away from the chip (120) is provided with a first heat sink (140).

3. The package structure (100) according to claim 1, wherein a side of the electroplated metal layer (124) facing away from the chip (120) is provided with a number of heat dissipation grooves (150), the heat dissipation grooves (150) being adapted to increase the contact area of the electroplated metal layer (124).

4. The package structure (100) according to claim 1, wherein a thermal conductive glue layer (160) is provided between the chip (120) and the substrate (110), and the chip (120) is connected to the substrate (110) through the thermal conductive glue layer (160).

5. The package structure (100) of claim 1, wherein the plastic package body (130) is flush with a lower surface of the substrate (110).

6. The package structure (100) according to any one of claims 1 to 5, wherein the electroplated metal layer (124) is at least one of a copper metal layer, a nickel metal layer, a tin metal layer, a silver metal layer, or a gold metal layer.

7. The package structure (100) according to any one of claims 1 to 5, wherein the chip body (123) includes an active surface (121) of the chip body (123) and a back surface (122) of the chip body (123) disposed opposite to each other, the active surface (121) faces away from the substrate (110), the electroplated metal layer (124) is formed on the active surface (121) by electroplating, and the active surface (121) is electrically connected to the substrate (110) by a metal wire.

8. An electrical assembly (200), comprising:

the package structure (100) of any of claims 1 to 7;

-a circuit board (210), said substrate (110) being connected to said circuit board (210).

9. The electrical assembly (200) of claim 8, wherein the circuit board (210) includes opposing first and second sides; a first side of the circuit board (210) is connected with the packaging structure (100), and a second side of the circuit board (210) is connected with a second radiator (220).

10. The electrical assembly (200) of claim 8, further comprising an air-moving member having an air path passing through a side of the electroplated metal layer (124) facing away from the substrate (110).