CN220022942U - Host module and camera device comprising same - Google Patents

Abstract

The utility model relates to a host module and an image pickup device comprising the same. The host module includes: a host housing having a receiving cavity; the main control component is arranged in the accommodating cavity and comprises a main circuit board and a main chip arranged on one side of the main circuit board; and the main heat conduction component is arranged in the accommodating cavity and connected between the main circuit board and the host shell and/or between the main chip and the host shell. The host module and the camera device comprising the host module provided by the utility model have better heat dissipation effect.

Description

Host module and camera device comprising same

Technical Field

The present utility model relates to the field of image capturing technologies, and in particular, to a host module and an image capturing apparatus including the same.

Background

The host module is used as a control module of the image pickup device, and the performance of the host module plays a crucial role in the image pickup device. The traditional host module has poor heat dissipation effect, so that the host module is easy to damage due to high temperature, and the service life of the camera device is shortened. Therefore, how to provide a host module capable of improving the heat dissipation effect is a problem to be solved.

Disclosure of Invention

In view of the foregoing, according to various embodiments of the present utility model, there are provided a host module and an image pickup apparatus including the same.

A host module, the host module comprising:

a host housing having a receiving cavity;

the main control component is arranged in the accommodating cavity and comprises a main circuit board and a main chip arranged on one side of the main circuit board; and

the main heat conduction assembly is arranged in the accommodating cavity and connected between the main circuit board and the host shell and/or between the main chip and the host shell.

In some embodiments, the main heat conduction component includes a first heat conduction member and/or a second heat conduction member, where the first heat conduction member is disposed on a side of the main circuit board facing away from the main chip and is connected to the host housing, and the second heat conduction member is disposed on a side of the main chip facing away from the main circuit board and is connected to the host housing.

In some of these embodiments, the dominant thermal assembly further comprises a first metal piece that abuts between the host housing and the first thermally conductive piece.

In some embodiments, the main heat conduction component further includes a second metal piece, where the second metal piece is disposed on a side of the main chip facing away from the main circuit board and is connected between the host housing and the second heat conduction piece.

In some embodiments, the device further comprises a wireless control assembly and an auxiliary heat conducting member, wherein the wireless control assembly and the auxiliary heat conducting member are both arranged in the accommodating cavity;

the wireless control component comprises a wireless circuit board and a wireless chip arranged on one side of the wireless circuit board, and the auxiliary heat conduction piece is connected between the wireless circuit board and the host shell and/or between the wireless chip and the host shell.

In some embodiments, the auxiliary heat conducting member is disposed on a side of the wireless chip facing away from the wireless circuit board.

In some embodiments, the wireless chip further comprises a second metal piece, wherein the second metal piece is arranged on one side of the wireless chip, which is away from the wireless circuit board, and is connected between the wireless chip and the host shell.

In some of these embodiments, the second metal piece is a square frame structure, and at least one of the main circuit board and the wireless circuit board is mounted on the second metal piece.

In some of these embodiments, at least one of the primary heat-conducting component and the auxiliary heat-conducting member is a heat-conducting silicone member.

An image pickup apparatus comprising:

a power supply module having a power supply housing;

the camera module is provided with a camera shell; and

the host module according to any one of the above embodiments, wherein any two of the power supply housing, the camera housing, and the host housing are disposed at intervals.

Above-mentioned host computer module and including its camera device is connected between main circuit board and host computer shell through setting up main heat conduction subassembly to/between main chip and the host computer shell, and leading heat subassembly can be with the heat that main chip work produced leading to the host computer shell to diffuse to outside through the host computer shell, have better radiating effect. Therefore, the probability of damage of the main control component due to high temperature can be reduced, and the service lives of the host module and the camera device can be prolonged conveniently.

The foregoing description is only an overview of the present utility model, and is intended to be implemented in accordance with the teachings of the present utility model in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present utility model more readily apparent.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the utility model. Also, like reference numerals are used to designate like parts throughout the figures.

In the drawings:

fig. 1 is a schematic diagram of an overall structure of an image capturing apparatus according to some embodiments of the present utility model.

Fig. 2 is a schematic diagram of the overall structure of a host module in the image capturing apparatus shown in fig. 1.

FIG. 3 is a schematic diagram of an overall structure of the host module shown in FIG. 2 from another perspective.

Fig. 4 is a cross-sectional view of the host module shown in fig. 2 along the A-A direction.

Fig. 5 is an enlarged schematic view of a partial structure B in the host module shown in fig. 4.

Reference numerals:

1. an image pickup device;

10. a host module; 11. a host housing; 111. a receiving chamber; 112. a first plate member; 113. a second plate member; 114. a third plate member; 115. a fourth plate member; 12. a main control assembly; 121. a main circuit board; 122. a main chip; 13. a dominant thermal component; 131. a first heat conductive member; 132. a second heat conductive member; 133. a first metal piece; 134. a second metal piece; 14. a wireless control assembly; 141. a wireless circuit board; 142. a wireless chip; 15. an auxiliary heat conductive member;

20. a power supply module;

30. and an image pickup module.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

Referring to fig. 1 and fig. 2 together, the present utility model provides an image capturing apparatus 1, where the image capturing apparatus 1 may be an aerial device, a modularized camera, or the like. The image capturing apparatus 1 includes a host module 10, a power supply module 20, and an image capturing module 30, wherein the power supply module 20 is electrically connected to the image capturing module 30 and the host module 10, the power supply module 20 is used for supplying power to the image capturing module 30 and the host module 10, and the host module 10 is used for controlling the image capturing module 30 to capture images.

Referring to fig. 3, 4 and 5, the power supply module 20 has a power supply housing, the camera module 30 has a camera housing, the host module 10 also has a host housing 11, and any two of the power supply housing, the camera housing and the host housing 11 are disposed at intervals. During the operation of the power supply module 20, the camera module 30 and the host module 10, all three generate heat and diffuse to the external environment of the camera device 1 through the respective housings. Any two of the power supply shell, the camera shell and the host shell 11 are arranged at intervals, so that the degree of mutual interference of heat between the modules is small, and the modules can work normally and radiate heat.

Specifically, the layout of the power supply module 20, the image pickup module 30, and the host module 10 may be set as needed. For example, taking fig. 1 as an example, the host module 10 and the camera module 30 may be disposed on the same side of the power supply module 20, and the host module 10 and the camera module 30 are disposed along the longitudinal direction of the power supply module 20. By such a layout, the compactness of the layout of the image pickup apparatus 1 can be improved, and the volume of the image pickup apparatus 1 can be made smaller.

The camera module 30 and the power supply module 20 are conventional in the art, and therefore will not be described herein.

The host module 10 includes a host housing 11, a main control component 12, and a main heat conduction component 13, where the host housing 11 has a receiving cavity 111, and the main control component 12 and the main heat conduction component 13 are both disposed in the receiving cavity 111. The main control assembly 12 includes a main circuit board 121 and a main chip 122 disposed on one side of the main circuit board 121, and the main heat conduction assembly 13 is connected between the main circuit board 121 and the main housing 11 and/or between the main chip 122 and the main housing 11.

The main housing 11 may be a cylinder, a cuboid, or other shapes, and preferably, the main housing 11 is a cuboid, so that components are regularly arranged inside the main housing 11.

The main housing 11 may be made of rubber, plastic, metal or other materials, and preferably, the main housing 11 is made of plastic. The plastics have certain heat conduction ability, can be with the heat diffusion that includes main control module 12 production to external environment in the host computer shell 11, and moreover, plastics are at the in-process of heat conduction, and the intensification is slower, and be unlikely to overheated, then the user is difficult for scalding when contacting host computer shell 11, and the security is better.

The main circuit board 121 mainly plays a role of bearing the main chip 122, the main chip 122 is arranged on one side of the main circuit board 121 and is electrically connected with the power supply module 20 and the image pickup module 30, and when the power supply module 20 supplies power to the main chip 122 and the image pickup module 30, the main chip 122 can control the image pickup module 30 to pick up images. The main circuit board 121 and the main chip 122 are conventional in the art, and will not be described herein.

The main heat conduction component 13 and the main circuit board 121 may be directly connected or indirectly connected, and similarly, the main heat conduction component 13 and the host housing 11 may be directly connected or indirectly connected. The direct connection means a manner in which two members are connected without an intermediate member, and the indirect connection means a manner in which two members are connected through at least one intermediate member. The connection mode of the main heat conduction assembly 13 and the main circuit board 121 and the host housing 11 can be selected according to the requirements.

The main heat component 13 is used for guiding heat of the main control component 12 to the host housing 11 to dissipate heat through the host housing 11. Illustratively, the main heat conduction member 13 may be connected only between the main circuit board 121 and the host housing 11, or the main heat conduction member 13 may be connected only between the main chip 122 and the host housing 11, or the main heat conduction member may be connected between the main circuit board 121 and the host housing 11, or between the main chip 122 and the host housing 11.

In the host module 10, since the main chip 122 controls the operation of most of the power-on components, the power consumption of the main chip 122 is considerable, and the heat generated during operation is also large, resulting in a high temperature of the main chip 122 and the main circuit board 121 in contact therewith. The main heat conduction component 13 is connected between the main circuit board 121 and the host housing 11, and/or between the main chip 122 and the host housing 11, so that the main heat conduction component 13 can conduct heat generated by the operation of the main chip 122 to the host housing 11 and diffuse the heat to the outside through the host housing 11, thereby having better heat dissipation effect. In this way, the probability of damage to the main control unit 12 due to high temperature can be reduced, which facilitates the extension of the service lives of the host module 10 and the image pickup apparatus 1.

In some embodiments of the present utility model, the main heat conduction assembly 13 includes a first heat conduction member 131 and/or a second heat conduction member 132, where the first heat conduction member 131 is disposed on a side of the main circuit board 121 facing away from the main chip 122 and is connected to the host housing 11, and the second heat conduction member 132 is disposed on a side of the main chip 122 facing away from the main circuit board 121 and is connected to the host housing 11.

Preferably, the main heat conduction assembly 13 includes a first heat conduction member 131 and a second heat conduction member 132, the first heat conduction member 131 and the second heat conduction member 132 are respectively disposed on two sides of the main circuit board 121 and the main chip 122 facing away from each other, the first heat conduction member 131 is directly connected with the main circuit board 121, and the second heat conduction member 132 is directly connected with the main chip 122. In this embodiment, the heat generated by the main chip 122 can be transferred to the external environment through the main circuit board 121, the first heat conductive member 131 and the host housing 11, and can also be transferred to the external environment through the second heat conductive member 132 and the host housing 11. That is, a large amount of heat generated by the operation of the main chip 122 can be transferred and diffused to the external environment through the plurality of branches, so that the heat dissipation effect is better.

Further, in some embodiments of the present utility model, the main heat conduction assembly 13 further includes a first metal member 133, and the first metal member 133 is abutted between the host housing 11 and the first heat conduction member 131.

The first metal member 133 may have a plate-like, sheet-like, frame-like or other shape. Preferably plate-shaped. The first metal member 133, the first heat conductive member 131, and the main circuit board 121 are stacked in this order. In this way, the occupied space of the first metal piece 133, the first heat conducting piece 131 and the main circuit board 121 can be reduced, and a larger contact area is further provided between two adjacent components, so that heat transfer is facilitated.

In addition, the thermal conductivity of the metal is good. Through setting up first metalwork 133 butt between host computer shell 11 and first heat conduction spare 131, first metalwork 133 can be with the heat that first heat conduction spare 131 led on the host computer shell 11 fast transfer, has better heat conduction efficiency and heat conduction effect.

Further, in some embodiments of the present utility model, the main heat conduction assembly 13 further includes a second metal piece 134, where the second metal piece 134 is disposed on a side of the main chip 122 facing away from the main circuit board 121, and is connected between the host housing 11 and the second heat conduction piece 132.

The second metal member 134 is in direct contact with the second heat conductive member 132, and depending on the layout in the host housing 11, the second metal member 134 may be disposed in direct contact with the host housing 11 or in indirect contact with the host housing 11 through an intermediate member.

Through setting up second metalwork 134 and connecting between host computer shell 11 and second heat conduction spare 132, second metalwork 134 can be with the heat that second heat conduction spare 132 led on the host computer shell 11 fast transfer, has better heat conduction efficiency and heat conduction effect.

In some embodiments of the present utility model, the host module 10 further includes a wireless control component 14 and an auxiliary heat conducting member 15, where the wireless control component 14 and the auxiliary heat conducting member 15 are disposed in the accommodating cavity 111; the wireless control assembly 14 includes a wireless circuit board 141 and a wireless chip 142 disposed on one side of the wireless circuit board 141, and the auxiliary heat conducting member 15 is connected between the wireless circuit board 141 and the host housing 11 and/or between the wireless chip 142 and the host housing 11.

The wireless circuit board 141 mainly functions to carry the wireless chip 142. The wireless chip 142 is disposed on one side of the wireless circuit board 141 and electrically connected to the power supply module 20 and the main chip 122, and when the power supply module 20 supplies power to the wireless chip 142, the main chip 122 can transmit the image fed back by the image capturing module to an external terminal through the wireless chip 142, so as to wirelessly output the image captured by the image capturing module 30.

The wireless circuit board 141 and the wireless chip 142 are conventional in the art, and will not be described herein.

During operation of the host module 10, the wireless chip 142 does not continuously perform wireless output of images, and the wireless chip 142 works to generate less heat than the main chip 122, but the temperature of the wireless chip 142 is still higher than the room temperature. In order to avoid high temperature damage of the wireless chip 142, the auxiliary heat conductive member 15 is provided.

The auxiliary heat conducting member 15 is used for conducting heat of the wireless control module 14 to the host housing 11 to dissipate the heat through the host housing 11. For example, the auxiliary heat conductive member 15 may be connected only between the wireless circuit board 141 and the host housing 11, or the auxiliary heat conductive member 15 may be connected only between the wireless chip 142 and the host housing 11, or the wireless chip 142 may be connected between the wireless circuit board 141 and the host housing 11, and between the wireless chip 142 and the host housing 11.

By arranging the auxiliary heat conducting member 15 to be connected between the wireless circuit board 141 and the host housing 11 and/or between the wireless chip 142 and the host housing 11, the auxiliary heat conducting member 15 can conduct heat generated by the operation of the wireless chip 142 to the host housing 11 and diffuse the heat to the outside through the host housing 11, so that a better heat dissipation effect is achieved. In this way, the probability of damage to the wireless control unit 14 due to high temperature can be reduced, and the service lives of the host module 10 and the image pickup apparatus 1 can be prolonged.

In some embodiments of the present utility model, at least one of the main heat conduction component 13 and the auxiliary heat conduction member 15 is a heat conduction silica gel member.

The fact that the main heat assembly 13 is a heat conductive silicone member means that each component in the main heat assembly 13 is a heat conductive silicone member. The following embodiments are all described taking the main heat conduction component 13 including the first heat conduction member 131 and the second heat conduction member 132 as an example.

For example, only the first and second heat conductive members 131 and 132 may be heat conductive silicone members, or only the auxiliary heat conductive member 15 may be a heat conductive silicone member. Preferably, the first heat conducting member 131, the second heat conducting member 132 and the auxiliary heat conducting member 15 are all heat conducting silica gel members.

The heat-conducting silica gel member has excellent heat-conducting property and elastic deformation property. The heat conductive silicone member can conduct heat of the component in contact therewith to the external environment to achieve a superior heat dissipation effect of the host module 10. Further, the heat conductive silicone member is deformed so that the component in contact therewith can be mounted into the host housing 11, so that the assembly can be completed even if the manufacturing accuracy of the heat conductive silicone member and the component in contact with the heat conductive silicone member is low. Therefore, the heat dissipation effect of the host module 10 can be improved and the manufacturing accuracy of the host module 10 can be reduced due to the arrangement of the heat-conducting silica gel member.

In some embodiments of the present utility model, the auxiliary heat conducting member 15 is disposed on a side of the wireless chip 142 facing away from the wireless circuit board 141.

The auxiliary heat conductive member 15 may be directly connected to the main body housing 11, or may be indirectly connected to the main body housing 11 through at least one intermediate member.

Specifically, the auxiliary heat conductive member 15 is in contact with the wireless chip 142, and heat generated by the operation of the wireless chip 142 can be transferred to the host housing 11 through the auxiliary heat conductive member 15 and finally spread to the external environment.

Since the heat generated by the wireless chip 142 is less than that generated by the main chip 122, the heat dissipation requirement can be satisfied by only providing the auxiliary heat conducting member 15 on the side of the wireless chip 142 facing away from the wireless circuit board 141. Furthermore, the heat generated by the wireless chip 142 can be directly transferred to the outside through the auxiliary heat conductive member 15, with high heat transfer efficiency. Compared with the arrangement of the auxiliary heat conducting members 15 on two opposite sides of the wireless circuit board 141 and the wireless chip 142, the arrangement of the internal components of the host module 10 is reduced, so that the volume of the host module 10 is reduced.

In some embodiments of the present utility model, the host module 10 further includes a second metal piece 134, where the second metal piece 134 is disposed on a side of the wireless chip 142 facing away from the wireless circuit board 141, and is connected between the wireless chip 142 and the host housing 11.

Specifically, the second metal member 134 is in direct contact with the auxiliary heat conducting member 15, and the heat generated by the operation of the wireless chip 142 is sequentially dissipated to the outside through the auxiliary heat conducting member 15, the second metal member 134 and the host housing 11.

By arranging the second metal piece 134 to connect between the wireless chip 142 and the host housing 11, the second metal piece 134 can rapidly transfer the heat conducted by the auxiliary heat conducting piece 15 to the host housing 11, so that the wireless chip has better heat conducting efficiency and heat conducting effect.

In some embodiments of the present utility model, the second metal piece 134 is a square frame structure, the main control component 12 and the main heat conduction component 13 are disposed on the same side of the second metal piece 134, the wireless control component 14 and the auxiliary heat conduction component 15 are also disposed on the same side of the second metal piece 134, but the main control component 12 and the wireless control component 14 are disposed on two sides of the second metal piece 134 that are disposed adjacently. Taking fig. 4 as an example, the main control unit 12 and the main heat conduction unit 13 are disposed on the upper side of the second metal member, and the wireless control unit 14 and the auxiliary heat conduction unit 15 are disposed on the right side of the second metal member.

With this design, the heat interference between the main control component 12 and the wireless control component 14 is small, so that the main control component 12 and the wireless control component 14 can still work normally. It will be appreciated that the main chip 122 of the main control module 12 and/or the wireless chip 142 of the wireless control module 14 may be susceptible to high temperature burnout when the heat between the main control module 12 and the wireless control module 14 is relatively high.

In some embodiments of the present utility model, the host housing 11 includes a first plate 112, a second plate 113, a third plate 114 and a fourth plate 115 sequentially connected, the first plate 112 and the main control assembly 12 are located on the same side of the second metal piece 134, the second plate 113 and the wireless control assembly 14 are located on the same side of the second metal piece 134, the third plate 114 is located on a side of the second metal piece 134 facing away from the wireless control assembly 14, and the fourth plate 115 connects the first plate 112, the second plate 113 and the third plate 114.

Please combine fig. 1, fig. 2 and fig. 3, the second plate 113 is disposed opposite to the power supply module, the third plate 114 is disposed towards the power supply module, and the fourth plate 115 is disposed towards the image capturing module, so that the first plate 112 and the second plate 113 are not shielded by the power supply module and the image capturing module. Referring to fig. 4 together, the first plate 112 is located on the upper side of the second metal piece 134, the second plate 113 is located on the right side of the second metal piece 134, and the third plate 114 is located on the left side of the second metal piece 134. The heat generated by the operation of the main control component 12 is mainly diffused to the external environment through the first plate 112, and the heat generated by the operation of the wireless control component 14 is mainly diffused to the outside through the second plate 113, and the heat dissipation effect of the main control component 12 and the wireless control component 14 is better because the first plate 112 and the second plate 113 are not shielded by the power supply module and the camera module.

Referring again to fig. 4, in some embodiments of the present utility model, the second metal piece 134 has a square frame structure, and at least one of the main circuit board 121 and the wireless circuit board 141 is mounted on the second metal piece 134.

That is, the second metal member 134 is used as a heat conducting member, which not only can conduct the heat generated by the operation of the main control assembly 12 and the wireless control assembly 14 to the outside, but also can support and mount the main control assembly 12 and the wireless control assembly 14 to facilitate the assembly of the main control assembly 12 and the wireless control assembly 14.

The host module 10 and the camera device 1 comprising the same are connected between the main circuit board 121 and the host housing 11 and/or between the main chip 122 and the host housing 11 by arranging the main heat conducting component 13, and the main heat conducting component 13 can conduct heat generated by the operation of the main chip 122 to the host housing 11 and diffuse the heat to the outside through the host housing 11, so that the camera device has a better heat dissipation effect. In this way, the probability of damage to the main control unit 12 due to high temperature can be reduced, which facilitates the extension of the service lives of the host module 10 and the image pickup apparatus 1.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. A host module, the host module comprising:

a main body housing (11) having a housing chamber (111);

the main control assembly (12) is arranged in the accommodating cavity (111) and comprises a main circuit board (121) and a main chip (122) arranged on one side of the main circuit board (121); and

and the main heat conduction assembly (13) is arranged in the accommodating cavity (111) and is connected between the main circuit board (121) and the host shell (11) and/or between the main chip (122) and the host shell (11).

2. The host module according to claim 1, wherein the main heat conducting assembly (13) comprises a first heat conducting member (131) and/or a second heat conducting member (132), the first heat conducting member (131) being arranged at a side of the main circuit board (121) facing away from the main chip (122) and being connected with the host housing (11), and the second heat conducting member (132) being arranged at a side of the main chip (122) facing away from the main circuit board (121) and being connected with the host housing (11).

3. The host module according to claim 2, wherein the dominant thermal assembly (13) further comprises a first metal piece (133), the first metal piece (133) being abutted between the host housing (11) and the first thermal conductive piece (131).

4. The host module according to claim 2, wherein the main heat conducting component (13) further comprises a second metal member (134), the second metal member (134) being disposed on a side of the main chip (122) facing away from the main circuit board (121) and being connected between the host housing (11) and the second heat conducting member (132).

5. The host module according to any one of claims 1 to 4, further comprising a wireless control assembly (14) and an auxiliary heat conducting member (15), wherein the wireless control assembly (14) and the auxiliary heat conducting member (15) are both disposed in the accommodating cavity (111);

the wireless control assembly (14) comprises a wireless circuit board (141) and a wireless chip (142) arranged on one side of the wireless circuit board (141), and the auxiliary heat conduction member (15) is connected between the wireless circuit board (141) and the host shell (11) and/or between the wireless chip (142) and the host shell (11).

6. The host module according to claim 5, wherein the auxiliary heat conducting member (15) is disposed on a side of the wireless chip (142) facing away from the wireless circuit board (141).

7. The host module according to claim 6, further comprising a second metal member (134), wherein the second metal member (134) is disposed on a side of the wireless chip (142) facing away from the wireless circuit board (141), and is connected between the wireless chip (142) and the host housing (11).

8. The host module of claim 7, wherein the second metal piece (134) is a square frame structure, and at least one of the main circuit board (121) and the wireless circuit board (141) is mounted on the second metal piece (134).

9. The host module according to claim 5, wherein at least one of the main heat conduction component (13) and the auxiliary heat conduction member (15) is a heat conduction silicone member.

10. An image pickup apparatus, comprising:

a power supply module (20) having a power supply housing;

the camera module is provided with a camera shell; and

the host module according to any one of the preceding claims 1 to 9, wherein any two of the power supply housing, the camera housing and the host housing (11) are arranged at intervals.