CN216697197U - Novel data processing of heat dissipation mode device - Google Patents
Novel data processing of heat dissipation mode device Download PDFInfo
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- CN216697197U CN216697197U CN202220355771.2U CN202220355771U CN216697197U CN 216697197 U CN216697197 U CN 216697197U CN 202220355771 U CN202220355771 U CN 202220355771U CN 216697197 U CN216697197 U CN 216697197U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a data processing device with a novel heat dissipation mode, which belongs to the technical field of industrial control and comprises a heat dissipation shell, a main processing module and an auxiliary module, wherein the main processing module is arranged in the heat dissipation shell, and a connecting contact pin is arranged on the main processing module; the auxiliary module is arranged in the heat dissipation shell, is electrically connected with the main processing module through the connecting contact pin and is used for assisting the main processing module to process data. According to the data processing device with the novel heat dissipation mode, the PCIE contact pin is arranged on the main processing module and is connected with the corresponding main processing module through the adapter card in the auxiliary module, so that the step of manual welding is avoided, and the safety is greatly improved; the circuit board of the main processing module adopts an embedded design, the size is small, the interfaces are rich, and the main component board in the main processing module is attached to the PCB, so that the circuit board can be effectively prevented from being adversely affected by vibration. The utility model has simple structure and obvious effect and is suitable for wide popularization.
Description
Technical Field
The utility model relates to the technical field of industrial control, in particular to a data processing device with a novel heat dissipation mode.
Background
In the industrial control industry, data backup and data exchange are data processing modes which are widely applied, the circuit board of the existing data processing equipment for data backup and data exchange is large in size, adaptability and use limitation in the industrial control field are large, the requirement on the storage environment of the equipment in the industrial control field is high, interfaces are required to be rich and flexible, the equipment is closed, no cooling fan is required, and the existing circuit board cannot meet the standard.
In view of the above problems, it is urgently needed to design a device to solve the problems of single interface, large heat dissipation limitation of a heat dissipation fan, large size of a circuit board and poor adaptability in the prior art.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned drawbacks, the present invention provides a data processing device with a novel heat dissipation method, so as to solve the problems of single interface, large heat dissipation limitation of a heat dissipation fan, large circuit board size, and poor adaptability existing in the prior art.
The utility model provides a data processing device with a novel heat dissipation mode, which comprises:
a heat dissipation housing;
the main processing module is arranged in the heat dissipation shell, and a connecting pin is arranged on the main processing module;
and the auxiliary module is arranged in the heat dissipation shell, passes through the connecting pin and is electrically connected with the main processing module and used for assisting the main processing module in data processing.
Preferably, the main processing module comprises:
the central processing unit is abutted against the heat dissipation shell, and the heat dissipation shell is used for conducting heat generated by the central processing unit and dissipating heat;
the circuit board is connected with the heat dissipation shell and arranged in the heat dissipation shell, and the central processing unit is arranged on the circuit board;
and the memory chip is arranged on the circuit board, electrically connected with the central processing unit and used for storing the data information processed by the central processing unit.
Preferably, the auxiliary module includes a switching module, the switching module is electrically connected with the main processing module and connected with the heat dissipation housing, the switching module includes a power supply module electrically connected with the main processing module, the power supply module is electrically connected with an alarm module, and the alarm module is used for alarming the power loss condition of the main processing module.
Preferably, the auxiliary module includes an extension module, the extension module is provided with a connection hole for the connection pin to pass through, and the extension module is electrically connected with the main processing module through the connection pin.
Preferably, the circuit board is of an embedded structure, and the central processing unit and the memory chip board are attached to the circuit board.
Preferably, the heat dissipation case includes:
the shell is connected with the main processing module;
the external interfaces are arranged on the shell and penetrate through the shell, and are provided with a plurality of external interfaces which are electrically connected with the main processing module and used for transmitting data processed by the main processing module to external equipment;
the heat dissipation supporting platform is integrally formed with the shell and arranged in the shell, and the heat dissipation supporting platform is abutted to the central processing unit and used for supporting the central processing unit and conducting heat generated by the central processing unit.
Preferably, the main processing module is provided with a plurality of connecting pins, the connecting pins correspond to the main processing module one by one, and the main processing modules are electrically connected with one another.
Preferably, the number of the main processing modules is two, the two main processing modules are respectively arranged at two ends inside the shell and are arranged in a central symmetry manner, and the switching module is arranged between the two main processing modules.
Preferably, the shell and the heat dissipation support platform are both made of aluminum; the shape of the heat dissipation support platform is the same as that of the central processing unit.
Preferably, the circuit board is provided with a pin interface for the connection pin to pass through; or/and the connecting pin is a PCIE pin.
According to the scheme, the data processing device with the novel heat dissipation mode is a fanless dual-system data backup and data exchange device, a PCIE pin is arranged on a main processing module of the data processing device, and is connected with the corresponding main processing module through a switching card in an auxiliary module, so that the step of manual welding is avoided, and the safety is greatly improved; the circuit board of the main processing module adopts an embedded design, the size is small, the interfaces are rich, and main component boards in the main processing module are attached to the PCB, so that the adverse effect of vibration on the circuit board can be effectively prevented, and the influence of vibration on the data processing process of the main processing module in the using process is avoided; the main heating component on the main processing module directly contacts with the heat dissipation shell, and the heat dissipation shell efficiently dissipates heat, so that the problem of the service life of the fan, which affects the normal use of the equipment, can be avoided while saving energy, and the product requirements of the industrial control industry are completely met. The utility model solves the problems of single interface, large heat radiation limitation of the heat radiation fan, large volume of the circuit board and poor adaptability of the prior art, has simple structure and obvious effect and is suitable for wide popularization.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a data processing device with a novel heat dissipation method according to the present invention;
FIG. 2 is a schematic structural diagram of a main processing module of a data processing apparatus with a novel heat dissipation method according to the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation housing of a data processing device with a novel heat dissipation method according to the present invention;
FIG. 4 is a schematic structural diagram of a data processing apparatus with another novel heat dissipation method according to the present invention;
FIG. 5 is a schematic structural diagram of a main processing module of a data processing apparatus with a novel heat dissipation method according to the present invention;
fig. 6 is a schematic structural diagram of a front side of a main processing module of a data processing device with a novel heat dissipation method according to the present invention;
fig. 7 is a schematic structural diagram of a reverse side of a main processing module of a data processing device with a novel heat dissipation method according to the present invention.
In FIGS. 1-7:
1. a heat dissipation housing; 2. a main processing module; 3. an auxiliary module; 4. connecting pins; 11. a housing; 12. an external interface; 13. a heat dissipation support table; 21. a central processing unit; 22. a circuit board; 23. a memory chip; 31. a switching module; 32. an expansion module; 221. and a pin interface.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to fig. 7, a data processing device with a novel heat dissipation method according to an embodiment of the present invention will now be described. The data processing device with the novel heat dissipation mode comprises a heat dissipation shell 1, a main processing module 2 and an auxiliary module 3, wherein the main processing module 2 is arranged in the heat dissipation shell 1, and a connecting pin 4 is arranged on the main processing module 2; the auxiliary module 3 is disposed in the heat dissipation housing 1 and electrically connected to the main processing module 2 through the connecting pin 4, for assisting the main processing module 2 in data processing.
For convenience of description, please refer to fig. 2, one side of the main processing module 2 disposed opposite to the housing 11 is an inner side, and the other side of the housing 11 is an outer side; the setting position of the expansion module 32 relative to the main processing module 2 is set to be up, otherwise, the setting position is set to be down; the side of the external interface 12 disposed with respect to the housing 11 is left, and vice versa is right.
In this embodiment, connecting pin 4 includes a plurality of contact pin monomers that set up side by side, and the contact pin monomer is electrically conductive needle-like structure, and connecting pin 4 is used for portable data information transmission to the auxiliary module 3 with the processing of main processing module 2 on the one hand, and on the other hand makes main processing module 2 can dismantle with auxiliary module 3 and be connected, connects more swiftly and conveniently.
Compared with the prior art, the PCIE pin is arranged on the main processing module 2 of the data processing device with the novel heat dissipation mode and is connected with the corresponding main processing module 2 through the adapter card in the auxiliary module 3, so that the step of manual welding is eliminated, and the safety is greatly improved; the Circuit Board 22 of the main processing module 2 adopts an embedded design, the size is small, the interfaces are rich, and main component boards in the main processing module 2 are pasted on a PCB (Printed Circuit Board), so that the adverse effect of vibration on the Circuit Board 22 can be effectively prevented, and the influence of vibration on the data processing process of the main processing module 2 in the using process is avoided; the main heating component on the main processing module 2 directly contacts with the heat dissipation shell 1, the heat dissipation shell 1 efficiently dissipates heat, the service life of the fan can be prevented from being influenced by normal use of the equipment while energy is saved, the fan is not required to directly dissipate heat through the heat dissipation shell 1, and the heat dissipation device has the advantages of energy conservation, low power consumption, shock resistance and the like, and completely meets the product requirements of the industrial control industry.
As another embodiment of the present invention, the structure of the data processing device with the novel heat dissipation method is basically the same as that in the above embodiment, and the difference is that the main processing module 2 includes a central processing unit 21, a circuit board 22, and a memory chip 23, wherein the central processing unit 21 abuts against the heat dissipation housing 1, and the heat dissipation housing 1 is used for conducting heat generated by the central processing unit 21 and dissipating heat; the circuit board 22 is connected with the heat dissipation shell 1 and is arranged in the heat dissipation shell 1, and the central processing unit 21 is arranged on the circuit board 22; the memory chip 23 is disposed on the circuit board 22 and electrically connected to the central processing unit 21, and is used for storing data information processed by the central processing unit 21. The CPU 21 is abutted to the heat dissipation shell 1, namely, the heat dissipation adopts a mode of conducting heat to the heat dissipation shell 1, so that the condition that the equipment cannot be normally used due to the fault of the heat dissipation fan can be reduced.
As another embodiment of the present invention, the structure of the data processing apparatus with the novel heat dissipation method is basically the same as that in the above embodiment, but the difference is that the auxiliary module 3 includes a switching module 31, the switching module 31 is electrically connected to the main processing module 2 and is connected to the heat dissipation housing 1, the switching module 31 includes a power supply module electrically connected to the main processing module 2, the power supply module is electrically connected to an alarm module, and the alarm module is used for alarming the power loss condition of the main processing module 2.
As another embodiment of the present invention, the structure of the data processing device with the novel heat dissipation method is basically the same as that in the above embodiment, but the difference is that the auxiliary module 3 includes an extension module 32, a connection hole for passing the connection pin 4 is provided on the extension module 32, and the extension module 32 is electrically connected to the main processing module 2 through the connection pin 4. The data processing device with the novel heat dissipation mode can be applied to application platforms such as firewall and audit as single-system cooperation software.
As another embodiment of the present invention, the structure of the data processing device with the novel heat dissipation method is basically the same as that in the above embodiment, but the difference is that the circuit board 22 is an embedded structure, and the cpu 21 and the memory chip 23 are attached to the circuit board 22. The circuit board 22 adopts an embedded design, so that the CPU, the memory, the network card and the main interface board are mounted on the circuit board 22, and the main components all adopt a board pasting mode, so that the whole volume of the equipment is reduced, the space is saved, the shock resistance is improved, and meanwhile, the small volume and rich interfaces are realized.
As another embodiment of the present invention, the structure of the data processing device with the novel heat dissipation method is basically the same as that in the above embodiment, but the difference is that the heat dissipation housing 1 includes a housing 11, an external interface 12, and a heat dissipation support platform 13, where the housing 11 is connected to the main processing module 2; the external interfaces 12 are arranged on the shell 11 and penetrate through the shell 11, the external interfaces 12 are provided with a plurality of external interfaces 12, the external interfaces 12 are electrically connected with the main processing module 2 and used for transmitting data processed by the main processing module 2 to external equipment, and the external interfaces 12 can be arranged into interfaces of different types; the heat dissipation support platform 13 is integrally formed with the housing 11 and disposed in the housing 11, and the heat dissipation support platform 13 abuts against the central processing unit 21 for supporting the central processing unit 21 and conducting heat generated by the central processing unit 21.
In this embodiment, the main processing module 2 is provided with a plurality of connecting pins 4, which are in one-to-one correspondence with the main processing module 2, and the plurality of main processing modules 2 are electrically connected to each other. The shell 11 and the heat dissipation support platform 13 are made of aluminum; the shape of the heat radiation support base 13 is the same as that of the cpu 21. For convenience of description, the heat dissipation housing 1 is manually disassembled, and all that is required to achieve the above-mentioned related performance function of the heat dissipation housing 1 is within the scope of protection of the present application.
As another embodiment of the present invention, the structure of the data processing device with the novel heat dissipation method is basically the same as that in the above embodiment, but the difference is that two main processing modules 2 are provided, the two main processing modules 2 are respectively disposed at two ends inside the housing 11 and are arranged in central symmetry, that is, the two main processing modules 2 are respectively disposed at the top and the bottom inside the housing 11, and the adaptor module 31 is disposed between the two main processing modules 2. The data processing device with the novel heat dissipation mode can be used as dual-system cooperation software applied to a data exchange platform.
In this embodiment, the circuit board 22 is provided with a pin interface 221 for the connection pin 4 to pass through; the connection pin 4 is a PCIE pin, and the connection of the PCIE pin on the circuit board 22 can flexibly expand various expansion cards, or is in butt joint with other circuit board cards to perform data transmission and exchange, so that the stability is more reliable.
In this embodiment, the housing 11 includes an upper cover, a lower cover and a surrounding barrier, and the external interfaces 12 are all disposed on the surrounding barrier; the upper cover and the lower cover are both provided with anti-skid grains which are made of elastic materials, so that on one hand, the friction force between the shell 11 and the placing plane is increased, and on the other hand, the shock absorption effect is conveniently realized; all be equipped with the flange on upper cover and the lower cover, upper cover and lower cover all with enclose to keep off can dismantle and be connected, the installation back, external interface 12 is sheltered from completely to the flange, effectively avoids falling carelessly behind external interface 12 damaged. It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the utility model.
In the present specification, the embodiments are described in a progressive manner, and each embodiment focuses on differences from other embodiments, and the same or similar parts between the embodiments are referred to each other. Details which are not described in detail in the embodiments of the utility model belong to the prior art which is known to the person skilled in the art.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a data processing of novel heat dissipation mode device which characterized in that includes:
a heat-dissipating housing (1);
the main processing module (2) is arranged in the heat dissipation shell (1), and a connecting pin (4) is arranged on the main processing module (2);
and the auxiliary module (3) is arranged in the heat dissipation shell (1), is electrically connected with the main processing module (2) through the connecting pin (4) and is used for assisting the main processing module (2) in data processing.
2. The data processing device with the novel heat dissipation mode as set forth in claim 1, wherein the main processing module (2) comprises:
the central processing unit (21) is abutted with the heat dissipation shell (1), and the heat dissipation shell (1) is used for conducting heat generated by the central processing unit (21) and dissipating heat;
the circuit board (22) is connected with the heat dissipation shell (1) and arranged in the heat dissipation shell (1), and the central processing unit (21) is arranged on the circuit board (22);
and the memory chip (23) is arranged on the circuit board (22), is electrically connected with the central processing unit (21) and is used for storing data information processed by the central processing unit (21).
3. The data processing device with the novel heat dissipation mode according to claim 2, wherein the auxiliary module (3) includes a switching module (31), the switching module (31) is electrically connected to the main processing module (2) and to the heat dissipation housing (1), the switching module (31) includes a power supply module electrically connected to the main processing module (2), the power supply module is electrically connected to an alarm module, and the alarm module is configured to alarm a power loss condition of the main processing module (2).
4. The data processing device with the novel heat dissipation mode as claimed in claim 1, wherein the auxiliary module (3) comprises an extension module (32), a connection hole for the connection pin (4) to pass through is formed in the extension module (32), and the extension module (32) is electrically connected with the main processing module (2) through the connection pin (4).
5. The data processing device with the novel heat dissipation mode as claimed in claim 2, wherein the circuit board (22) is of an embedded structure, and the central processing unit (21) and the memory chip (23) are attached to the circuit board (22) in a board manner.
6. The data processing device with the novel heat dissipation mode according to claim 3, wherein the heat dissipation casing (1) comprises:
a housing (11) connected to the main processing module (2);
the external interfaces (12) are arranged on the shell (11) and penetrate through the shell (11), the external interfaces (12) are provided with a plurality of external interfaces, and the external interfaces (12) are electrically connected with the main processing module (2) and used for transmitting data processed by the main processing module (2) to external equipment;
the heat dissipation supporting platform (13) is integrally formed with the shell (11) and is arranged in the shell (11), and the heat dissipation supporting platform (13) is abutted to the central processing unit (21) and is used for supporting the central processing unit (21) and conducting heat generated by the central processing unit (21).
7. The data processing device with the novel heat dissipation mode as claimed in claim 1, wherein a plurality of main processing modules (2) are provided, the connecting pins (4) correspond to the main processing modules (2) one by one, and the plurality of main processing modules (2) are electrically connected with one another.
8. The data processing device with the novel heat dissipation mode as claimed in claim 6, wherein two main processing modules (2) are provided, the two main processing modules (2) are respectively disposed at two ends inside the casing (11) and are arranged in a central symmetry manner, and the adaptor module (31) is disposed between the two main processing modules (2).
9. The data processing device with the novel heat dissipation mode is characterized in that the shell (11) and the heat dissipation support platform (13) are both made of aluminum; the shape of the heat dissipation support platform (13) is the same as that of the central processing unit (21).
10. The data processing device with the novel heat dissipation mode as claimed in claim 6, wherein a pin interface (221) for the connection pin (4) to pass through is arranged on the circuit board (22); or/and the connecting pin (4) is a PCIE pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220355771.2U CN216697197U (en) | 2022-02-22 | 2022-02-22 | Novel data processing of heat dissipation mode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220355771.2U CN216697197U (en) | 2022-02-22 | 2022-02-22 | Novel data processing of heat dissipation mode device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216697197U true CN216697197U (en) | 2022-06-07 |
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ID=81828135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220355771.2U Active CN216697197U (en) | 2022-02-22 | 2022-02-22 | Novel data processing of heat dissipation mode device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216697197U (en) |
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2022
- 2022-02-22 CN CN202220355771.2U patent/CN216697197U/en active Active
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