CN210957270U

CN210957270U - Laser diode array module

Info

Publication number: CN210957270U
Application number: CN201922365061.9U
Authority: CN
Inventors: 杜健; 孔维成; 杨思文; 付瑶; 孙阳; 陈易; 廖明慧; 马常伟; 葛君廷; 尹炜; 李洋
Original assignee: China Hualu Group Co Ltd
Current assignee: China Hualu Group Co Ltd
Priority date: 2019-12-25
Filing date: 2019-12-25
Publication date: 2020-07-07
Anticipated expiration: 2029-12-25

Abstract

The embodiment of the utility model discloses laser diode array module, a serial communication port, include: the module comprises a plurality of laser diodes, collimating lenses, compression pieces, a module front base, a module rear base and a module circuit board, wherein the collimating lenses, the compression pieces, the module front base, the module rear base and the module circuit board are arranged in a matched manner with the laser diodes; the laser diodes are arranged in an array mode in the side wall of one side of the module front base and are pressed and fixed by the module rear base, and the module rear base is used as a heat dissipation back plate and is directly contacted with a heat radiator of the module; and the collimating lens is pressed and fixed in the side wall of the other side of the front base of the module through a pressing sheet. The utility model discloses when satisfying collimation effect and uniformity, got rid of the collimation packing ring, simplified the module structure and can satisfy its heat dissipation requirement.

Description

Laser diode array module

Technical Field

The utility model relates to a laser technical field especially relates to a laser diode array module.

Background

A laser diode as a light source is started to be applied in various optical fields, a general assembly positioning structure is shown in figure 1, T1 is a light outlet, T2 is a pin, but the problems to be overcome are that ① a divergence angle of direct light emission of the laser diode is large, a collimating mirror is generally required to be added in front of the laser diode to convert divergent light into parallel light, the precision of the relative position of the collimating mirror and the laser diode is difficult to control, and the collimating effect is generally poor, ② a plurality of laser diodes are generally used together due to low power of the single laser diode, in the prior art, the collimating effect of the laser diodes in the laser diode array is poor in consistency, and the collimating effect of the whole array cannot be ensured, ③ a scheme of arranging a collimating washer between the laser diode and the collimating mirror is adopted in the prior art, in a large number of laser diode array modules, each unit is provided with a collimating washer, the operation is complicated, the operability is poor, ④ the heat productivity of the laser diode array is large, and the heat dissipation requirements of common heat sink are difficult to meet, and the limit that optical products taking the laser as the light source are popularized to the common civil market.

Disclosure of Invention

Based on this, for solving the not enough that prior art exists, a laser diode array module has especially been proposed.

A laser diode array module, comprising:

the module comprises a plurality of laser diodes, collimating lenses, compression pieces, a module front base, a module rear base and a module circuit board, wherein the collimating lenses, the compression pieces, the module front base, the module rear base and the module circuit board are arranged in a matched manner with the laser diodes; the laser diodes are arranged in an array mode in the side wall of one side of the module front base and are pressed and fixed by the module rear base, and the module rear base is used as a heat dissipation back plate and is directly contacted with a heat radiator of the module; and the collimating lens is pressed and fixed in the side wall of the other side of the front base of the module through a pressing sheet.

Optionally, in one embodiment, the module rear base has a planar convex structure, and is in contact with the laser diode through the planar convex structure.

Optionally, in one embodiment, the surface of the planar raised structure has a layer of thermally conductive silicone grease.

Optionally, in one embodiment, the pressing piece is fixed on the module front base through a pressing piece screw.

Optionally, in one embodiment, a groove for inserting the module circuit board is formed on the module rear base.

Optionally, in one embodiment, the module front base is fixed on the module rear base by assembling screws.

Implement the embodiment of the utility model provides a, will have following beneficial effect:

the utility model realizes the separation effect between the laser diode and the collimating lens by arranging the module front base with the detachable module base structure, thereby removing the collimating washer; and the module rear base is provided with a plane convex structure, when the module rear base is tightly pressed to the back of the laser diode, all the laser diodes can be ensured to be assembled according to the plane reference, and the light emitting directions of all the laser diodes are kept consistent. Therefore can say that the utility model discloses when satisfying collimation effect and uniformity, got rid of the collimation packing ring, simplified the module structure and can satisfy its heat dissipation requirement.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Wherein:

FIG. 1 is a schematic diagram of a typical structure of a prior art laser diode;

FIG. 2a is a schematic diagram illustrating an assembled laser diode array module according to an embodiment;

FIG. 2b is a schematic view of the module shown in FIG. 2a in a rear view;

fig. 3a is a schematic structural view of the laser diode array module according to an embodiment after being disassembled;

FIG. 3b is a schematic view of the module shown in FIG. 3a in a rear view;

FIG. 4 is a schematic structural view of the compression tab in one embodiment;

FIG. 5a is a schematic diagram of the front base of the module in one embodiment;

FIG. 5b is a schematic view of the module shown in FIG. 5a, illustrating a rear view of the front base;

FIG. 5c is a schematic diagram of the front side of the front base of the module shown in FIG. 5 a;

FIG. 5d is a schematic view of the back side of the front base of the module shown in FIG. 5 a;

FIG. 6a is a schematic diagram of the structure of the rear base of the module in one embodiment;

FIG. 6b is a schematic view of the rear base of the module shown in FIG. 6 a;

FIG. 6c is a schematic view of the rear side of the rear base of the module shown in FIG. 6 a;

FIG. 7 is a diagram illustrating the collimation of the modules in one embodiment;

in the figure: 1. compressing tightly piece screw, 2, compressing tightly piece, 3, collimating mirror, 4, module front base, 5, laser diode, 6, module back base, 7, module circuit board, 8, equipment screw.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present application. The first and second elements are both elements, but they are not the same element.

In view of the disadvantages of the prior art, in the present embodiment, a laser diode array module is provided, as shown in fig. 1 to 3, including: the device comprises a plurality of laser diodes 5, collimating lenses 3 which are matched with the laser diodes and are distributed, a pressing sheet 2, a module front base 4, a module rear base 6 which is detachably distributed on the module front base 4 and a module circuit board 7; the laser diodes 5 are arrayed in an array manner in the side wall of one side of the module front base 4 and are pressed and fixed by the module rear base 6, and the module rear base 6 is used as a heat dissipation back plate and is directly contacted with a heat radiator of the module; and the collimating lens 3 is pressed and fixed in the side wall of the other side of the module front base 4 through the pressing sheet 2. In the above scheme, the laser diodes 5 and the collimating lenses 3 are arranged in a one-to-one matching manner and are assembled in an array manner, wherein the collimating lenses 5 and the laser diodes 3 are assembled on the module front base from two sides of the module front base 4 respectively, and the module rear base 6 is directly contacted with the array laser diodes 5, so that the flatness effect of flattening the laser diode array mounting surface can be achieved, and meanwhile, the laser diodes are contacted with a radiator as a heat dissipation back plate. In addition, the present embodiment is described by taking an array of 16 laser diodes as an example, and the present invention is also applicable to other number of arrays.

In one embodiment, as shown in fig. 6a to 6c, the module rear base 6 has a planar convex structure D for keeping all the array diodes assembled flat, and is in contact with the laser diode 5 through the planar convex structure D; the plane convex structure D can easily ensure the flatness thereof through processing, thereby ensuring that all laser diodes are assembled according to the plane reference when the plane convex structure D is tightly pressed on the back surface of the laser diode 5, and ensuring that the light emitting directions of the laser diodes are consistent; in a more specific embodiment, the planar protrusion structure on the module rear substrate 6 may also be coated with a heat-conducting silicone grease (the heat-conducting silicone grease is commonly referred to as a heat-dissipating paste, and is made of an organic silicone as a main raw material, and a material with excellent heat resistance and heat-conducting property is added to the silicone grease to form a heat-conducting silicone grease-like compound, which is used for heat conduction and heat dissipation of electronic components such as power amplifiers, transistors, electronic tubes, CPUs, and the like, so as to ensure the stability of the electrical properties of electronic instruments, meters, and the like), that is, the surface of the planar protrusion structure has a heat-conducting silicone grease layer (not shown in the figure), and heat generated during the operation of the laser diode is conducted to the module. In a more specific embodiment, the module rear base is secured to the module front base 4 by assembly screws 8.

In one embodiment, the module rear base 6 is provided with a groove F for inserting the module circuit board 7 to assemble the circuit board; in a more specific embodiment, the module rear base 6 is connected with other heat dissipation structures to ensure heat dissipation performance; in a more specific embodiment, the module rear base 6 is further provided with a screw hole and a abdicating structure E reserved for installing the temperature sensor.

In a specific embodiment, the pressing sheet 2 is fixed on the module front base through a pressing sheet screw; a plurality of collimator lens openings A2 are uniformly distributed on the pressing sheet, 4-point pressing points A1 are arranged on the edge of each collimator lens opening, and besides the collimator lens openings A2, at least 2 screws A3 are guaranteed to be fastened on the periphery of each collimator lens opening A2, as shown in figure 4.

In one embodiment, besides the opening structure for inserting the collimating lens and the laser diode, the module front base 4 has a plurality of screw holes B and positioning holes C1, C2 on one side, i.e. the front side, of the module front base 4 for positioning and fixing the module front base and the module rear base, as shown in fig. 5B and 5 d; the other side, i.e. the back side, of the module front base 4 can also mount and fix the entire optical module to other optical structures through several screw holes B and positioning holes C1, C2, as shown in fig. 5a and 5C.

The utility model discloses an approximate assembling process does: mounting each collimating lens from the front side of a front base of the module (setting the left side direction of a picture as the front side), and pressing and fixing by the pressing sheet; installing each laser diode from the rear side of the front base, and pressing and fixing the laser diodes by the module rear base; the front base realizes the separation effect between the laser diode and the collimating lens, so that a collimating washer is not required to be arranged between the laser diode and the collimating lens; on the premise of ensuring the processing precision of the front base group, the distance requirement between the collimating mirror and the laser diode can be further ensured, and the collimation effect of the module is shown in fig. 7.

Implement the embodiment of the utility model provides an, will have following beneficial effect: the utility model discloses a set up detachable module base structure (this structure can realize that laser diode installs from module front base one end, and the collimating mirror installs from the module front base other end to compress tightly fixedly by module back base) to realize the separation effect between laser diode and the collimating mirror through module front base, thereby get rid of the collimating washer; and the module rear base is provided with a plane convex structure, when the module rear base is tightly pressed to the back of the laser diode, all the laser diodes can be ensured to be assembled according to the plane reference, and the light emitting directions of all the laser diodes are kept consistent. Therefore can say that the utility model discloses when satisfying collimation effect and uniformity, got rid of the collimation packing ring, simplified the module structure and can satisfy its heat dissipation requirement.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A laser diode array module, comprising:

2. The laser diode array module of claim 1, wherein the module back base has a planar raised structure and contacts the laser diodes through the planar raised structure.

3. The laser diode array module of claim 2, wherein the planar raised structure surface has a layer of thermally conductive silicone.

4. The laser diode array module of claim 1, wherein the hold-down tab is secured to the module front base by a hold-down tab screw.

5. The laser diode array module of claim 1, wherein the module rear base has a recess for insertion of a module circuit board.

6. The laser diode array module of claim 1, wherein the module front base is fixed to the module rear base by assembly screws.