CN219998206U - Novel diode capable of uniformly radiating - Google Patents

Abstract

The utility model discloses a novel diode with uniform heat dissipation, which comprises a first conductor and a second conductor, wherein contact parts perpendicular to a body are arranged at adjacent ends of the first conductor and the second conductor, a chip which is also erected is placed in a gap between the two contact parts and is abutted to two sides of the chip, and a plastic package body is wrapped outside the two contact parts. The jumper wire of the conventional module diode is eliminated; special symmetrical terminal structure, the chip is arranged to be vertical to the terminal at 90 degrees; the large-area contact areas on the two sides of the chip enable the two sides of the chip to be in large-area contact with the copper conductor on the premise of not greatly increasing the copper consumption, so that the heat dissipation performance of the diode is greatly improved, and the temperature of the diode is reduced; the rated current carrying capacity of the junction box is improved, and because the whole structure is symmetrical, the molding stress of the plastic package is greatly reduced, and meanwhile, the stress of cutting ribs and the like after the molding can be greatly reduced.

Description

Novel diode capable of uniformly radiating

Technical Field

The utility model relates to the technical field of diode junction boxes, in particular to a novel diode with uniform heat dissipation.

Background

A diode is an electronic device made of semiconductor materials (silicon, selenium, germanium, etc.). The diode has two electrodes, an anode, also called anode; the negative electrode, called the cathode, turns on the diode when a forward voltage is applied between the two poles of the diode, and turns off the diode when a reverse voltage is applied. The on and off of the diode corresponds to the on and off of the switch.

The diode has unidirectional conductivity, and the current flows from the anode to the cathode through the tube when conducting. Diodes are one of the earliest emerging semiconductor devices and are very widely used. In particular, in various electronic circuits, diodes, resistors, capacitors, inductors and other components are reasonably connected to form circuits with different functions, so that various functions such as alternating current rectification, modulation signal detection, amplitude limiting, clamping, voltage stabilization of power supply voltage and the like can be realized.

The diodes for the photovoltaic junction box on the market are divided into an axial type and a module type, but the two packaging structures have various defects. The axial diode has the defects that the axial diode is limited by the diameter of a pin, and can meet the required heat dissipation requirement by being matched with an additional conductor, and the current axial diode can only package 1 chip and cannot meet the subsequent larger current requirement; the disadvantage of the module diode is that the connection between the chip and the two electrodes requires an additional jumper wire, which is small in size and is a current carrying and heat dissipating bottleneck of the module diode.

Disclosure of Invention

According to the technical problem to be solved, the novel diode with uniform heat dissipation is provided.

In order to achieve the above purpose, the novel diode capable of uniformly radiating comprises a first conductor and a second conductor, wherein contact parts perpendicular to a body are arranged at adjacent ends of the first conductor and the second conductor, a chip which is equally erected is placed in a gap between the two contact parts and is abutted to two sides of the chip, and a plastic package body is wrapped outside the two contact parts.

In a preferred embodiment, the present utility model may be further configured such that the bodies of the first and second conductors are connected to the respective contact portions by first and second bending portions.

In a preferred embodiment, the first bending portion may have a bending angle smaller than that of the second bending portion.

In a preferred embodiment, the utility model may be further configured such that the contact portion and the opposite surface of the chip are provided with a protruding fixing stage, and solder is provided in a gap between the chip and the fixing stage.

In a preferred embodiment, the first and second conductors have the same structure and are symmetrically arranged with the chip as a center line.

The utility model may be further configured in a preferred embodiment such that the length of the contact portions is at least equal to 2 sets of chips.

In a preferred embodiment, the present utility model may be further configured such that a gap between the fixing bases of the two contact portions is smaller than a thickness of the chip.

The novel diode capable of uniformly radiating and the battery box production line have the beneficial effects that jumper wires of conventional module diodes are eliminated; special symmetrical terminal structure, the chip is arranged to be vertical to the terminal at 90 degrees; the large-area contact areas on the two sides of the chip enable the two sides of the chip to be in large-area contact with the copper conductor on the premise of not greatly increasing the copper consumption, so that the heat dissipation performance of the diode is greatly improved, and the temperature of the diode is reduced; the rated current carrying capacity of the junction box is improved, and because the whole structure is symmetrical, the molding stress of the plastic package is greatly reduced, and meanwhile, the stress of cutting ribs and the like after the molding can be greatly reduced.

Drawings

The utility model will be described in further detail with reference to the drawings and the detailed description.

FIG. 1 is a schematic diagram of the overall structure of the present utility model.

Fig. 2 is a schematic diagram of the internal structure of the present utility model.

Fig. 3 is a perspective view of the internal structure of the present utility model.

In the figure, 1 is a plastic package; 2 is a first conductor; 3 is a second conductor; 4 is a contact portion; 5 is a fixed table; 6 is a chip; 7 is a first bending part; 8 is a second bending part.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

As shown in fig. 1 to 3, a novel diode with uniform heat dissipation comprises a first conductor 2 and a second conductor 3, wherein adjacent ends of the first conductor 2 and the second conductor 3 are respectively provided with a contact part 4 perpendicular to a body, a chip 6 which is equally erected is placed in a gap between the two contact parts 4 and is attached to two sides of the chip, the contact area between the conductor and the chip 6 is increased in a manner of vertical attachment, the heat productivity is reduced and the heat dissipation effect is improved under the condition that the current is not reduced, and the plastic package body 1 is wrapped outside the two contact parts 4.

The bodies of the first conductor 2 and the second conductor 3 are connected with the respective contact parts 4 through the first bending part 7 and the second bending part 8, and the contact parts 4 can be always vertical to the bodies of the conductors when the conductors are attached through the bending parts at the two positions.

The bending angle of the first bending part 7 is smaller than that of the second bending part 8, and the first bending part 7 with a small angle has larger pressure on the contact part 4, so that the first bending part 7 can be better attached to the chip 6.

The first conductor 2 and the second conductor 3 have the same structure and are symmetrically arranged by taking the chip 6 as a central line, so that the plastic package forming stress is greatly reduced due to the symmetrical integral structure, and meanwhile, the stress such as cutting ribs after plastic package forming can be also greatly reduced.

The length of the contact part 4 can be at least equal-distance placed with 2 groups of chips, a plurality of groups of chips 6 can be placed at one time, the contact part 4 is not limited by jumper wires, and more chips 6 can be placed by increasing the length of the contact part 4 according to the situation.

The clearance between the fixed tables 5 of the two contact parts 4 is smaller than the thickness of the chip 6, in order to further increase the fit between the contact parts 4 and the chip 6, an interference fit mode is adopted, so that the contact parts 4 can be tightly fitted with the chip 6, and the contact parts cannot fall off in the use process.

Example two

Compared with the first embodiment, the difference is that the contact portion 4 and the opposite surface of the chip 6 are provided with the protruding fixing table 5, and the solder is arranged in the gap between the chip 6 and the fixing table 5, so that the fixing table 5 is increased, and the chip 6 and the contact portion 4 can be welded and fixed through the thickness of the fixing table 5, so that the welding difficulty of the chip 6 and the contact portion 4 is reduced.

It should be noted that in this document relational terms such as first and second, and the like are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities.

The above examples are merely illustrative of the present utility model and are not meant to limit the scope of the present utility model, and all designs that are the same or similar to the present utility model are within the scope of the present utility model.

Claims (7)

1. The utility model provides a novel diode of even heat dissipation, its characterized in that includes electric conductor one (2) and electric conductor two (3), electric conductor one (2) and electric conductor two (3) adjacent end all be provided with body vertically contact portion (4), place same upright chip (6) in the clearance of two contact portions (4) and lean on with its both sides, the outside parcel of two contact portions (4) has plastic envelope body (1).

2. A novel diode with uniform heat dissipation according to claim 1, characterized in that the bodies of the first (2) and second (3) conductors are connected to the respective contact (4) by means of a first (7) and a second (8) bend.

3. A novel diode with uniform heat dissipation according to claim 2, characterized in that the bending angle of the first bending part (7) is smaller than the bending angle of the second bending part (8).

4. A novel diode with uniform heat dissipation according to claim 1 or 3, characterized in that the contact (4) is provided with a protruding fixing table (5) on the opposite side of the chip (6) and that solder is provided in the gap between the chip (6) and the fixing table (5).

5. The novel diode with uniform heat dissipation according to claim 4, wherein the first conductor (2) and the second conductor (3) have the same structure and are symmetrically arranged with the chip (6) as a central line.

6. A novel diode with uniform heat dissipation according to claim 5, characterized in that the length of the contact (4) is at least equal to 2 groups of chips.

7. A novel diode with uniform heat dissipation according to claim 6, characterized in that the gap between the fixed tables (5) of the two contact portions (4) is smaller than the thickness of the chip (6).