CN211858641U - High-current diode device - Google Patents
High-current diode device Download PDFInfo
- Publication number
- CN211858641U CN211858641U CN202020841487.7U CN202020841487U CN211858641U CN 211858641 U CN211858641 U CN 211858641U CN 202020841487 U CN202020841487 U CN 202020841487U CN 211858641 U CN211858641 U CN 211858641U
- Authority
- CN
- China
- Prior art keywords
- metal plate
- metal base
- lead frame
- diode
- transverse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Rectifiers (AREA)
Abstract
The utility model discloses a large current diode device, which comprises 2 diode chips, a metal base and a lead frame, wherein an epoxy packaging layer is coated on the 2 diode chips, the metal base and the lead frame, the upper surface of the metal base is provided with 2 supporting parts, the 2 diode chips are positioned right above the metal base, and one ends of the 2 diode chips with the same polarity are respectively and electrically connected with the 2 supporting parts of the metal base through a soldering tin layer; the lead frame further comprises a transverse metal plate and a first vertical metal plate and a second vertical metal plate which are respectively arranged at two ends of the transverse metal plate, wherein the center of the transverse metal plate is provided with 2 welding convex blocks which protrude downwards. The utility model discloses existing volume that does benefit to further reduction device and the area that occupies the PCB circuit board satisfy the market to the miniaturized demand of product, also be favorable to diffusing out diode chip heat fast.
Description
Technical Field
The utility model relates to a semiconductor device technical field especially relates to a heavy current diode device.
Background
The diode device is an electronic device with unidirectional conduction current, a semiconductor diode is internally provided with two lead terminals of a PN junction, and the electronic device has unidirectional current conduction according to the direction of an applied voltage and is widely applied to electronic products, communication and the like. Generally, a chip-transistor diode is a p-n junction interface formed by sintering a p-type semiconductor and an n-type semiconductor. Space charge layers are formed on two sides of the interface to form a self-established electric field. When the applied voltage is equal to zero, the diffusion current and the drift current caused by the self-established electric field are equal to each other due to the concentration difference of carriers on two sides of the p-n junction, so that the p-n junction is in an electric balance state, and the diffusion current and the drift current are also diode characteristics under a normal state.
Disclosure of Invention
The utility model aims at providing a heavy current diode device, this heavy current diode device existing volume that is favorable to further reducing the device and the area that occupies the PCB circuit board satisfy the market to the miniaturized demand of product, also are favorable to diffusing out diode chip heat fast, have prolonged semiconductor device's life.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a high-current diode device comprises 2 diode chips, a metal base and a lead frame, wherein an epoxy packaging layer is coated on the 2 diode chips, the metal base and the lead frame, the upper surface of the metal base is provided with 2 supporting parts, the 2 diode chips are positioned right above the metal base, one ends with the same polarity are respectively and electrically connected with the 2 supporting parts of the metal base through a soldering tin layer, and a first lead part positioned at the lower end of the metal base extends out of the epoxy packaging layer;
the lead frame further comprises a transverse metal plate, and a first vertical metal plate and a second vertical metal plate which are respectively positioned at two ends of the transverse metal plate, wherein the center of the transverse metal plate is provided with 2 welding convex blocks which protrude downwards, the transverse metal plate of the lead frame is positioned right above the diode chip, the 2 welding convex blocks are respectively and electrically connected with the other ends of the 2 diode chips with the same polarity through a soldering tin layer, one end of each of the first vertical metal plate and the second vertical metal plate, which is opposite to the transverse metal plate, is a second lead part, and the second lead part extends out of the epoxy packaging layer.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the welding bump of the upper transverse metal plate of the lead frame is electrically connected with the anode of the diode chip, and the second pin part of the lead frame is used as the anode input end.
2. In the above scheme, the supporting portion of the metal base is electrically connected to the cathode of the diode chip, and the first pin portion of the metal base is used as the cathode input end.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses heavy current diode device, its metal base's upper surface has 2 supporting parts, 2 diode chips are located directly over the metal base and its respective homopolar one end is connected with 2 supporting parts of metal base electricity through the soldering tin layer respectively, the first pin portion that is located the metal base lower extreme extends from the epoxy encapsulation layer; the lead frame further comprises a transverse metal plate, a first vertical metal plate and a second vertical metal plate, the first vertical metal plate and the second vertical metal plate are respectively positioned at two ends of the transverse metal plate, the transverse metal plate of the lead frame is positioned right above the diode chip, the center of the transverse metal plate is electrically connected with the other ends of the 2 diode chips with the same polarity through a soldering tin layer, one end of each of the first vertical metal plate and the second vertical metal plate, which is back to the transverse metal plate, is a second lead part, and the second lead part extends out of the epoxy packaging layer, so that the size of the device and the area occupied by a PCB (printed circuit board) are further reduced, the miniaturization requirement of the market on products is met, the heat of the diode chips is rapidly diffused, and the service life of the semiconductor device is prolonged; and the center of the transverse metal plate is provided with 2 welding convex blocks which protrude downwards, the transverse metal plate of the lead frame is positioned right above the diode chip, and the 2 welding convex blocks are respectively and electrically connected with the other ends of the 2 diode chips with the same polarity through the soldering tin layer, so that the risk of cold joint is greatly reduced, the reliability of the electrical property is further improved, and the service life is further prolonged.
Drawings
FIG. 1 is a schematic diagram of a structure of a large current diode device according to the present invention;
fig. 2 is a schematic diagram of a cross-sectional structure of a large current diode device according to the present invention.
In the above drawings: 1. a diode chip; 2. a metal base; 21. a support portion; 22. a first lead part; 3. a lead frame; 4. an epoxy encapsulation layer; 5. a solder layer; 6. a transverse metal plate; 61. welding the convex blocks; 7. a first vertical metal plate; 8. a second vertical metal plate; 9. a second lead portion.
Detailed Description
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1: a high-current diode device comprises 2 diode chips 1, a metal base 2 and a lead frame 3, wherein an epoxy packaging layer 4 is coated on the 2 diode chips 1, the metal base 2 and the lead frame 3, the upper surface of the metal base 2 is provided with 2 supporting parts 21, the 2 diode chips 1 are positioned right above the metal base 2, one ends with the same polarity are respectively and electrically connected with the 2 supporting parts 21 of the metal base 2 through a soldering tin layer 5, and a first lead part 22 positioned at the lower end of the metal base 2 extends out of the epoxy packaging layer 4;
the lead frame 3 further comprises a transverse metal plate 6 and a first vertical metal plate 7 and a second vertical metal plate 8 which are respectively positioned at two ends of the transverse metal plate 6, wherein the center of the transverse metal plate 6 is provided with 2 welding convex blocks 61 which protrude downwards and outwards, the transverse metal plate 6 of the lead frame 3 is positioned right above the diode chip 1, the 2 welding convex blocks 61 are respectively and electrically connected with the other ends of the diode chips 1 with the same polarity through a soldering tin layer 5, one end of each of the first vertical metal plate 7 and the second vertical metal plate 8, which is opposite to the transverse metal plate 6, is a second lead part 9, and the second lead part 9 extends out of the epoxy packaging layer 4.
The welding convex block 61 of the upper transverse metal plate 6 of the lead frame 3 is electrically connected with the anode of the diode chip 1, and the second lead part 9 of the lead frame 3 is used as an anode input end.
The support part 21 of the metal base 2 is electrically connected with the cathode of the diode chip 1, and the first pin part 22 of the metal base 2 is used as a cathode input end.
Example 2: a high-current diode device comprises 2 diode chips 1, a metal base 2 and a lead frame 3, wherein an epoxy packaging layer 4 is coated on the 2 diode chips 1, the metal base 2 and the lead frame 3, the upper surface of the metal base 2 is provided with 2 supporting parts 21, the 2 diode chips 1 are positioned right above the metal base 2, one ends with the same polarity are respectively and electrically connected with the 2 supporting parts 21 of the metal base 2 through a soldering tin layer 5, and a first lead part 22 positioned at the lower end of the metal base 2 extends out of the epoxy packaging layer 4;
the lead frame 3 further comprises a transverse metal plate 6 and a first vertical metal plate 7 and a second vertical metal plate 8 which are respectively positioned at two ends of the transverse metal plate 6, wherein the center of the transverse metal plate 6 is provided with 2 welding convex blocks 61 which protrude downwards and outwards, the transverse metal plate 6 of the lead frame 3 is positioned right above the diode chip 1, the 2 welding convex blocks 61 are respectively and electrically connected with the other ends of the diode chips 1 with the same polarity through a soldering tin layer 5, one end of each of the first vertical metal plate 7 and the second vertical metal plate 8, which is opposite to the transverse metal plate 6, is a second lead part 9, and the second lead part 9 extends out of the epoxy packaging layer 4.
The welding convex block 61 of the upper transverse metal plate 6 of the lead frame 3 is electrically connected with the anode of the diode chip 1, and the second lead part 9 of the lead frame 3 is used as an anode input end.
The support part 21 of the metal base 2 is electrically connected with the cathode of the diode chip 1, and the first pin part 22 of the metal base 2 is used as a cathode input end.
When the high-current diode device is adopted, the device is beneficial to further reducing the volume of the device and occupying the area of a PCB (printed circuit board), the requirement of the market on miniaturization of products is met, the heat of a diode chip is also favorably diffused quickly, and the service life of a semiconductor device is prolonged; and the center of the transverse metal plate is provided with 2 welding convex blocks which protrude downwards, the transverse metal plate of the lead frame is positioned right above the diode chip, and the 2 welding convex blocks are respectively and electrically connected with the other ends of the 2 diode chips with the same polarity through the soldering tin layer, so that the risk of cold joint is greatly reduced, the reliability of the electrical property is further improved, and the service life is further prolonged.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (3)
1. A high current diode device, characterized by: the LED packaging structure comprises 2 diode chips (1), a metal base (2) and a lead frame (3), wherein an epoxy packaging layer (4) is coated on the 2 diode chips (1), the metal base (2) and the lead frame (3), the upper surface of the metal base (2) is provided with 2 supporting parts (21), the 2 diode chips (1) are positioned right above the metal base (2), one ends with the same polarity are respectively and electrically connected with the 2 supporting parts (21) of the metal base (2) through a soldering tin layer (5), and a first lead part (22) positioned at the lower end of the metal base (2) extends out of the epoxy packaging layer (4);
the lead frame (3) further comprises a transverse metal plate (6) and a first vertical metal plate (7) and a second vertical metal plate (8) which are respectively positioned at two ends of the transverse metal plate (6), wherein 2 welding convex blocks (61) protruding downwards are arranged in the center of the transverse metal plate (6), the transverse metal plate (6) of the lead frame (3) is positioned right above the diode chip (1), the 2 welding convex blocks (61) are respectively and electrically connected with the other ends of the 2 diode chips (1) with the same polarity through a soldering tin layer (5), one end of each of the first vertical metal plate (7) and the second vertical metal plate (8), which is opposite to the transverse metal plate (6), is a second lead part (9), and the second lead part (9) extends out of the epoxy packaging layer (4).
2. The high current diode device of claim 1, wherein: and a welding convex block (61) of the upper transverse metal plate (6) of the lead frame (3) is electrically connected with the anode of the diode chip (1), and a second lead part (9) of the lead frame (3) is used as an anode input end.
3. The high current diode device of claim 1, wherein: the support part (21) of the metal base (2) is electrically connected with the cathode of the diode chip (1), and the first pin part (22) of the metal base (2) is used as a cathode input end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020841487.7U CN211858641U (en) | 2020-05-19 | 2020-05-19 | High-current diode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020841487.7U CN211858641U (en) | 2020-05-19 | 2020-05-19 | High-current diode device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211858641U true CN211858641U (en) | 2020-11-03 |
Family
ID=73235654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020841487.7U Active CN211858641U (en) | 2020-05-19 | 2020-05-19 | High-current diode device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211858641U (en) |
-
2020
- 2020-05-19 CN CN202020841487.7U patent/CN211858641U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211743142U (en) | Double-chip heat-conducting patch diode | |
| CN211858641U (en) | High-current diode device | |
| CN211858642U (en) | High-voltage-resistant power diode device | |
| CN211858640U (en) | Large-current parallel semiconductor device | |
| CN211858638U (en) | Surface mount type semiconductor device | |
| CN212062428U (en) | Surface mount transient diode device | |
| CN211929482U (en) | Unidirectional TVS semiconductor device | |
| CN113192938B (en) | Large-current non-polar Schottky diode | |
| CN112687676B (en) | Crimping IGBT sub-module and crimping IGBT module | |
| CN211858639U (en) | Half-bridge rectifier device | |
| CN203775045U (en) | Intelligent semiconductor power module | |
| CN209785910U (en) | Large-current semiconductor power device | |
| CN211858643U (en) | Half-bridge semiconductor packaging structure | |
| CN211957631U (en) | Packaging structure of full-wave rectification chip | |
| CN211957629U (en) | Micro bridge stack semiconductor device | |
| CN201657457U (en) | Low-power unidirectional full-wave bridge type rectifier | |
| CN218482223U (en) | Semiconductor packaging structure | |
| CN111584453B (en) | High-reliability surface-mounted half-wave device | |
| CN211957630U (en) | SOD packaged semiconductor device | |
| CN219246668U (en) | Novel double-crystal frame structure of diode | |
| CN220556592U (en) | DPIM three-phase rectification module | |
| CN211858637U (en) | Paster half-wave rectifier | |
| CN211957634U (en) | Semiconductor integrated device structure | |
| CN219626657U (en) | Flat rectifier bridge lead frame | |
| CN211295085U (en) | Multi-chip series connection packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |