CN219925708U - Full-automatic semiconductor grinding fluid supply system - Google Patents

Full-automatic semiconductor grinding fluid supply system Download PDF

Info

Publication number
CN219925708U
CN219925708U CN202321065506.1U CN202321065506U CN219925708U CN 219925708 U CN219925708 U CN 219925708U CN 202321065506 U CN202321065506 U CN 202321065506U CN 219925708 U CN219925708 U CN 219925708U
Authority
CN
China
Prior art keywords
liquid
fluid supply
pipeline
circulating
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202321065506.1U
Other languages
Chinese (zh)
Inventor
丁红伟
丁双伟
郭俊杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Yd Flow Electronic & Integration Co ltd
Original Assignee
Shanghai Yd Flow Electronic & Integration Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Yd Flow Electronic & Integration Co ltd filed Critical Shanghai Yd Flow Electronic & Integration Co ltd
Priority to CN202321065506.1U priority Critical patent/CN219925708U/en
Application granted granted Critical
Publication of CN219925708U publication Critical patent/CN219925708U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

The utility model discloses a full-automatic semiconductor grinding fluid supply system which comprises a plurality of stock solution barrels, a plurality of mixing barrels, a stock solution pump for pumping stock solution in the stock solution barrels to the mixing barrels for mixing through stock solution pipelines, a circulating pump for circulating mixed solution in the mixing barrels to the barrels through circulating pipelines, a liquid feeding pump for pumping the mixed solution in the mixing barrels to valve boxes through liquid feeding pipelines, valve boxes for distributing the mixed solution to other equipment, and pure water pipelines for conveying pure water to mix the pure water with the mixed solution in the circulating pipelines in proportion or clean all pipelines. The utility model can automatically prepare and supply the liquid, greatly improves the preparation efficiency of the grinding liquid, and the raw liquid pump, the circulating pump and the liquid feeding pump are two and mutually stand-by pumps, so that the stable and effective operation of the system can be ensured, and the grinding liquid can be supplied continuously for 24 hours.

Description

Full-automatic semiconductor grinding fluid supply system
Technical Field
The utility model relates to the technical field of grinding fluid supply, in particular to a full-automatic semiconductor grinding fluid supply system.
Background
Chemical Mechanical Polishing (CMP) is used as an indispensable process in chip processing, not only in the wafer preparation stage, but also in the wafer processing process for global planarization of the wafer surface.
The existing system for supplying grinding fluid to silicon wafer grinding equipment is low in grinding fluid preparation efficiency, and when the equipment fails, the equipment must be stopped for maintenance, so that the production efficiency is greatly influenced.
Disclosure of Invention
In view of the above, the present utility model provides a fully automatic semiconductor polishing liquid supply system for solving the above-mentioned problems in the prior art.
A full-automatic supply system for semiconductor polishing liquid, comprising:
a plurality of stock solution barrels and a plurality of mixing barrels;
the stock solution pump is used for pumping stock solution in the stock solution barrel to the mixing barrel through the stock solution pipeline for mixing;
the circulating pump is used for pumping and circulating the mixed liquid in the mixing barrel back to the barrel through the circulating pipeline;
the liquid feeding pump is used for pumping the mixed liquid in the mixing barrel to the valve box through the liquid feeding pipeline;
a valve box for distributing the mixed liquid to other equipment;
and a pure water pipeline for conveying pure water to mix the pure water with the mixed liquid in the circulation pipeline in proportion or to clean all the pipelines;
the device comprises a raw liquid pipeline, a circulating pipeline and a liquid conveying pipeline, wherein the raw liquid pipeline, the circulating pipeline and the liquid conveying pipeline are all provided with sampling branch pipes, the raw liquid pipeline, the circulating pipeline and the liquid conveying pipeline are all connected with a waste liquid pipeline, and the circulating pipeline is provided with a hydrometer for detecting whether the mixing proportion of pure water and mixed liquid reaches the standard or not.
Preferably, the system further comprises a gas pipeline for purging and drying the cleaned pipeline.
Preferably, the air pipeline is also provided with an air quantity adjusting device.
Preferably, the stock solution pipeline is including connecting the first stock solution conveyer pipe in each stock solution bucket liquid outlet department, with the second stock solution conveyer pipe that all first stock solution conveyer pipes link to each other, set up at the end of second stock solution conveyer pipe and stretch into each third stock solution conveyer pipe of mixing the bucket respectively, all install the valve on first stock solution conveyer pipe, second stock solution conveyer pipe and the third stock solution conveyer pipe, all install a stock solution pump on every first stock solution conveyer pipe, the intake side of stock solution pump is provided with the stock solution communicating pipe that is used for the intercommunication two first stock solution conveyer pipes.
Preferably, two raw liquid pumps are arranged, and the two raw liquid pumps are standby pumps.
Preferably, the raw liquid pump is a pneumatic air bag pump.
Preferably, the circulation pipeline comprises a first circulation conveying pipe connected to the liquid outlet of each mixing barrel, a second circulation conveying pipe connected to all the first circulation conveying pipes, two third circulation conveying pipes arranged at the tail ends of the second circulation conveying pipes, a fourth circulation conveying pipe connected to the two third circulation conveying pipes, and a fifth circulation conveying pipe arranged at the tail end of the fourth circulation conveying pipe and respectively extending into each mixing barrel, valves are arranged on the first circulation conveying pipe, the third circulation conveying pipe, the fourth circulation conveying pipe and the fifth circulation conveying pipe, a circulation pump is arranged on each third circulation conveying pipe, and the specific gravity meter is arranged on the fourth circulation conveying pipe.
Preferably, the circulating pump adopts a magnetic levitation pump, and the two circulating pumps are standby pumps.
Preferably, the liquid conveying pipeline comprises a first liquid conveying pipe connected to the liquid outlet of each mixing barrel, a second liquid conveying pipe connected to all the first liquid conveying pipes, two third liquid conveying pipes arranged at the tail ends of the second liquid conveying pipes, a fourth liquid conveying pipe with two ends connected to the valve box and the two third liquid conveying pipes respectively, and a fifth liquid conveying pipe connected to the liquid outlet of the valve box and extending into each mixing barrel respectively, wherein valves are arranged on the first liquid conveying pipe, the third liquid conveying pipe, the fourth liquid conveying pipe and the fifth liquid conveying pipe, two liquid conveying pumps are arranged on one third liquid conveying pipe, and a liquid conveying communicating pipe used for communicating the third liquid conveying pipe with the other third liquid conveying pipe is arranged on a pipe section, between the two liquid conveying pumps, of the third liquid conveying pipe.
Preferably, the liquid feeding pump adopts a magnetic levitation pump, and the two liquid feeding pumps are standby pumps.
The beneficial effects of the utility model are as follows:
1. the full-automatic semiconductor grinding fluid supply system can automatically prepare and supply the liquid, greatly improves the preparation efficiency of the grinding fluid, and the raw fluid pump, the circulating pump and the liquid feeding pump are two mutually standby pumps, when one pump fails, the other pump can independently operate and work, the stable and effective operation of the system can be ensured, the shutdown is not needed, and the grinding fluid can be continuously supplied for 24 hours.
2. The stock solution pipeline, the circulating pipeline and the liquid conveying pipeline are all connected with sampling branch pipes, so that the stock solution, the mixed solution and the conveying liquid at the tail end can be sampled respectively, and the liquid preparation proportion at different stages can be monitored.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a piping diagram of the present utility model.
The meaning of the reference numerals in the figures is:
1 is a raw liquid barrel, and the liquid barrel is provided with a plurality of grooves,
2 is a mixing barrel, and the mixing barrel is provided with a plurality of grooves,
3 is a raw liquid pump,
4 is a circulating pump, and the water is pumped by the water pump,
5 is a liquid-feeding pump,
the valve box is shown as the reference numeral 6,
71 is a first raw liquid conveying pipe, 72 is a second raw liquid conveying pipe, 73 is a third raw liquid conveying pipe, 74 is a raw liquid communicating pipe,
81 is a first circulation conveying pipe, 82 is a second circulation conveying pipe, 83 is a third circulation conveying pipe, 84 is a fourth circulation conveying pipe, 85 is a fifth circulation conveying pipe, 86 is a hydrometer,
91 is a first liquid feeding pipe, 92 is a second liquid feeding pipe, 93 is a third liquid feeding pipe, 94 is a fourth liquid feeding pipe, 95 is a fifth liquid feeding pipe, 96 is a liquid feeding communicating pipe,
10 is a sampling branch pipe, and the sampling branch pipe,
11 is a waste liquid pipeline, and the waste liquid pipeline,
121 is a pure water supply header pipe, 122 is a first pure water supply branch pipe, 123 is a second pure water supply branch pipe, 124 is a third pure water supply branch pipe, 125 is a fourth pure water supply branch pipe, 126 is a fifth pure water supply branch pipe,
and 13 is a gas pipeline, and the gas pipeline is provided with a gas inlet,
14 is an air quantity adjusting device.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the present utility model is described below by means of specific embodiments shown in the accompanying drawings. It should be understood that the description is only illustrative and is not intended to limit the scope of the utility model. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present utility model.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that, although the terms first, second, third, etc. may be used in this disclosure to describe various information, these information should not be limited to these terms, but rather should not be construed as indicating or implying any relative importance. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.
In the description of the present utility model, unless otherwise specified and defined, it should be noted that the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, mechanical or electrical, or may be in communication with each other between two elements, directly or indirectly through intermediaries, as would be understood by those skilled in the art, in view of the specific meaning of the terms described above.
For a better understanding of the technical solution of the present utility model, the following detailed description of the present utility model refers to the accompanying drawings.
The utility model provides a full-automatic semiconductor grinding fluid supply system which comprises a stock solution barrel 1, a mixing barrel 2, a stock solution pump 3, a circulating pump 4, a liquid feeding pump 5, a valve box 6, a stock solution pipeline, a circulating pipeline, a liquid feeding pipeline, a pure water pipeline and a waste liquid pipeline.
The stock solution barrel 1 and the mixing barrel 2 are both provided with a plurality of stock solution barrels. The stock solution barrels 1 are used for storing concentrated grinding stock solution, and a plurality of stock solution barrels 1 are connected with each mixing barrel 2 through stock solution pipelines so as to pump the stock solution in the stock solution barrels 1 to the mixing barrels 2 through the stock solution pipelines by using the stock solution pump 3 for mixing.
The stock solution pipeline comprises first stock solution conveying pipes 71 connected to the liquid outlets of the stock solution barrels 1, second stock solution conveying pipes 72 connected to all the first stock solution conveying pipes 71, and third stock solution conveying pipes 73 arranged at the tail ends of the second stock solution conveying pipes 72 and respectively extending into the mixing barrels 2, and each first stock solution conveying pipe 71 is provided with a stock solution pump 3. In this embodiment, the stock solution barrels 1 are provided with 2, and the stock solution communicating pipes 74 for communicating the 2 first stock solution conveying pipes 71 are connected between the 2 first stock solution conveying pipes 71 connected with the 2 stock solution barrels 1, respectively, and two ends of the stock solution communicating pipes 74 are disposed on the water inlet sides of the 2 stock solution pumps 3, respectively. By providing the raw liquid communication pipe 74 between the 2 first raw liquid transport pipes 71, the raw liquid pumps 3 on the 2 first raw liquid transport pipes 71 can be made standby pumps.
Valves for controlling pipeline switch and flow rate are arranged on the first stock solution conveying pipe 71, the second stock solution conveying pipe 72 and the third stock solution conveying pipe 73, and the mixing proportion of the stock solutions conveyed in the two first stock solution conveying pipes 71 can be adjusted by controlling the opening of the valves on the two first stock solution conveying pipes 71.
When the stock solution pump works normally, one stock solution pump works, the other stock solution pump is used as a standby pump, stock solution in 2 stock solution barrels is pumped to 2 mixing barrels through stock solution pipelines respectively, and if the stock solution pump working currently fails, the other standby stock solution pump is started up and runs immediately, so that normal liquid supply cannot be influenced. In this embodiment, the raw liquid pump 3 is a pneumatic bellows pump with a maximum working pressure of 0.6Mpa and a maximum flow rate of 16L/min.
The mixing barrels 2 are also provided with a plurality of mixing barrels 2, the mixing barrels 2 are used for mixing the stock solution conveyed by the stock solution pipeline to mix grinding liquid, the grinding liquid can enter the circulating pipeline from the lower part of the mixing barrels 2, and the grinding liquid is circulated and returned into the barrels by the circulating pump 4 through the pumping of the circulating pipeline; or the grinding fluid can enter the liquid conveying pipeline from the lower part of the mixing barrel 2, and the grinding fluid is pumped to the valve box 6 through the liquid conveying pipeline by the liquid conveying pump 3, and then is conveyed to various using points or returned into the barrel by the valve box 6.
The circulation pipeline comprises a first circulation conveying pipe 81 connected to the liquid outlet at the bottom of each mixing barrel 2, a second circulation conveying pipe 82 connected to all the first circulation conveying pipes 81, two third circulation conveying pipes 83 arranged at the tail ends of the second circulation conveying pipes 82, a fourth circulation conveying pipe 84 connected to the two third circulation conveying pipes 83, and a fifth circulation conveying pipe 85 arranged at the tail ends of the fourth circulation conveying pipes 84 and respectively extending into each mixing barrel 2.
Each third circulation conveying pipe 83 is provided with a circulation pump 4, and the two circulation pumps 4 are standby pumps. When the circulating pump works normally, one circulating pump works, the other circulating pump is used as a standby pump, stock solution in the mixing barrel is pumped to the corresponding mixing barrel through the circulating pipeline by the circulating pump in a working state, and if the current working circulating pump fails, the other standby circulating pump is started up and runs immediately, so that normal liquid supply cannot be influenced. In this embodiment, the circulating pump 4 is a levitonix magnetic levitation pump, and the maximum working pressure is 0.3Mpa.
Valves for controlling the opening and closing of pipelines are arranged on the first circulation conveying pipe 81, the third circulation conveying pipe 83, the fourth circulation conveying pipe 84 and the fifth circulation conveying pipe 85, a flow valve for controlling the flow of the mixed liquid conveyed by the valves through the opening of the valves so as to adjust the mixing proportion of the mixed liquid and the pure water is also arranged on the third circulation conveying pipe 83, and a hydrometer 86 is arranged on the fourth circulation conveying pipe 84, wherein the hydrometer 86 is used for detecting whether the mixing proportion of the mixed liquid and the pure water reaches the standard.
The liquid delivery pipeline comprises a first liquid delivery pipe 91 connected to the liquid outlet at the lower part of each mixing barrel 2, a second liquid delivery pipe 92 connected to all the first liquid delivery pipes 91, two third liquid delivery pipes 93 arranged at the tail end of the second liquid delivery pipe 92, a fourth liquid delivery pipe 94 with two ends connected to a valve box and the two third liquid delivery pipes 93 respectively, and a fifth liquid delivery pipe 95 connected to the liquid outlet of the valve box 6 and extending into each mixing barrel 2 respectively, wherein two liquid delivery pumps 5 are arranged on one of the third liquid delivery pipes, and a liquid delivery communicating pipe 96 used for communicating the third liquid delivery pipe with the other third liquid delivery pipe is arranged on the pipe section of the third liquid delivery pipe between the two liquid delivery pumps. The two liquid delivery pumps 5 are standby pumps, one liquid delivery pump works and the other liquid delivery pump works as a standby pump in normal working conditions, and the liquid delivery pump in working conditions pumps the mixed stock solution in the mixing barrel to the valve box 6 through the liquid delivery pipeline, and then the mixed stock solution is conveyed to each using point or returned to the barrel by the valve box 6; if the current working liquid feeding pump fails, the stand-by liquid feeding pump starts up and runs, and normal liquid feeding is not affected. In this embodiment, the liquid feeding pump 5 is a Levitronix magnetic levitation pump, and can supply liquid for a pipeline with the total length of 150m, and the maximum flow is 70L/min.
Valves for controlling the opening and the closing of the pipeline and the flow rate are arranged on the first liquid conveying pipe 91, the third liquid conveying pipe 93, the fourth liquid conveying pipe 94 and the fifth liquid conveying pipe 95, and the mixing proportion of the mixed liquid and the pure water can be adjusted by controlling the opening of the valve corresponding to the valve on the third liquid conveying pipe 93.
The pure water (DI) is conveyed through a pure water pipeline. The pure water line may be used to not only transport pure water to mix the pure water with the mixed liquid in the third circulation pipe 83 or the third liquid feed pipe 93 in proportion, but also clean all the lines.
The stock solution pipeline, the circulating pipeline and the liquid feeding pipeline are all provided with sampling branch pipes 10, the sampling branch pipes on the stock solution pipeline are connected to the second stock solution conveying pipe 72, the sampling branch pipes on the circulating pipeline are connected to the fourth circulating conveying pipe 84, and the sampling branch pipes on the liquid feeding pipeline are connected to the fourth liquid feeding pipe 94.
The raw liquid pipeline, the circulating pipeline and the liquid feeding pipeline are all connected with a waste liquid pipeline 11.
The deionized water piping includes a deionized water supply main 121, a first deionized water supply branch pipe 122, a second deionized water supply branch pipe 123, a third deionized water supply branch pipe 124, a fourth deionized water supply branch pipe 125, and a fifth deionized water supply branch pipe 126 connected to the deionized water supply main 121.
The first pure water delivery branch pipes 122 are respectively connected with the 2 first raw liquid delivery pipes 71 of the raw liquid pipeline, and are used for cleaning the raw liquid pipeline. The pure water supplied through the first pure water supply branch pipe 122 can flow in the raw liquid pipeline, clean the raw liquid pipeline, the raw liquid barrel and the sampling branch pipe thereof, and the cleaned waste liquid can be discharged to the waste liquid treatment device through the waste liquid pipeline thereof.
The second pure water delivery branch pipe 123 is connected to a third liquid delivery pipe 93 of the liquid delivery pipe, to which a liquid delivery pump is mounted, for cleaning the liquid delivery pipe or mixing the delivered pure water with the mixed liquid in the pipe in a set ratio, and the second pure water delivery branch pipe 123 is provided with two water outlet pipe sections, one of which is connected to the water inlet side of the first liquid delivery pump and the other of which is connected to the water inlet side of the second liquid delivery pump. The pure water supplied through the second pure water supply branch pipe 123 can flow in the liquid supply pipe, the liquid supply pipe and the sampling branch pipe thereof can be cleaned, and the cleaned waste liquid can be discharged to the waste liquid treatment device through the waste liquid pipe thereof.
The third pure water delivery branch pipes 124 are respectively connected with the two third circulation delivery pipes 83 of the circulation pipeline, and are used for cleaning the circulation pipeline or mixing the delivered pure water with the mixed liquid in the pipeline according to a set proportion. The pure water supplied through the third pure water supply branch pipe 124 can flow in the circulation pipe, the sampling branch pipe thereof, and the mixing tank are cleaned, and the cleaned waste liquid can be discharged to the waste liquid treatment apparatus through the waste liquid pipe thereof.
The fourth pure water supply branch pipe 125 is connected to the fourth circulation pipe 84 of the circulation line for cleaning the circulation line. The pure water supplied through the fourth pure water supply branch pipe 125 can flow in the circulation pipe, clean the circulation pipe, its sampling branch pipe, and the mixing tank, and the cleaned waste liquid can be discharged to the waste liquid treatment apparatus through its waste liquid pipe.
The fifth pure water conveying branch pipe 126 is connected with the sampling branch pipe connected to the raw liquid pipeline, and is used for cleaning the sampling branch pipe, and the cleaned waste liquid can be discharged to the waste liquid treatment device through the waste liquid pipeline.
Preferably, the full-automatic semiconductor grinding fluid supply system further comprises a gas pipeline 13 for blowing and drying the cleaned pipeline, wherein the gas pipeline 13 is respectively connected with the raw fluid barrel 1, the pure water conveying main pipe 121 of the pure water pipeline and the mixing barrel 2. After all the pipelines and the mixing barrel are cleaned, N2 can be introduced into the pipelines, the mixing barrel 2 and the stock solution barrel 1 through the gas pipelines, and the pipelines are purged and dried.
The air pipeline is also provided with an air quantity adjusting device 14.
The on-off of all valves and the start-stop of the pump in the system are controlled by a controller.
In the actual use process, the raw liquid pump 3 pumps the raw liquid in the raw liquid barrel to the mixing barrel 2 through the raw liquid pipeline, the stirring mechanism in the mixing barrel 2 uniformly stirs the raw liquid, then the raw liquid is discharged into the circulating pipeline from the liquid outlet at the lower part of the mixing barrel, the raw liquid is mixed with pure water sent by the pure water pipeline in the circulating pipeline according to a set proportion, and then the mixture flows into the mixing barrel 2 again through the circulating pipeline to be uniformly stirred, so that the grinding liquid is prepared. The prepared grinding fluid is discharged into a fluid delivery pipeline from a lower fluid outlet of the mixing barrel 2, and is delivered to a valve box 6 through the fluid delivery pipeline, and the valve box 6 conveys the grinding fluid to each use point or returns to the mixing barrel 2.
When the cleaning is needed, the electric control module controls the corresponding valve on the pure water pipeline to be opened, pure water enters the stock solution pipeline, the circulating pipeline or the liquid conveying pipeline through the pure water pipeline, the cleaned waste liquid can be discharged to the waste liquid treatment device through the waste liquid hanging pipeline, then the electric control module controls the corresponding valve on the gas pipeline to be opened, and the gas pipeline blows nitrogen to purge and dry each pipeline.
It should be understood that the described embodiments are merely some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Claims (10)

1. A full-automatic supply system for semiconductor polishing liquid, comprising:
a plurality of stock solution barrels and a plurality of mixing barrels;
the stock solution pump is used for pumping stock solution in the stock solution barrel to the mixing barrel through the stock solution pipeline for mixing;
the circulating pump is used for pumping and circulating the mixed liquid in the mixing barrel back to the barrel through the circulating pipeline;
the liquid feeding pump is used for pumping the mixed liquid in the mixing barrel to the valve box through the liquid feeding pipeline;
a valve box for distributing the mixed liquid to each use point;
and a pure water pipeline for conveying pure water to mix the pure water with the mixed liquid in the circulation pipeline in proportion or to clean all the pipelines;
the device comprises a raw liquid pipeline, a circulating pipeline and a liquid conveying pipeline, wherein the raw liquid pipeline, the circulating pipeline and the liquid conveying pipeline are all provided with sampling branch pipes, the raw liquid pipeline, the circulating pipeline and the liquid conveying pipeline are all connected with a waste liquid pipeline, and the circulating pipeline is provided with a hydrometer for detecting whether the mixing proportion of pure water and mixed liquid reaches the standard or not.
2. The full-automatic semiconductor polishing liquid supply system according to claim 1, further comprising a gas line for purging and drying the cleaned line.
3. The full-automatic semiconductor polishing liquid supply system according to claim 2, wherein an air quantity adjusting device is further arranged on the air pipeline.
4. The full-automatic semiconductor grinding fluid supply system according to claim 1, wherein the fluid supply pipeline comprises first fluid supply pipes connected to the fluid outlets of the fluid tanks, second fluid supply pipes connected to all the first fluid supply pipes, and third fluid supply pipes arranged at the ends of the second fluid supply pipes and respectively extending into the mixing tanks, valves are installed on the first fluid supply pipes, the second fluid supply pipes and the third fluid supply pipes, a fluid pump is installed on each of the first fluid supply pipes, and fluid communication pipes for communicating the two first fluid supply pipes are arranged on the water inlet sides of the fluid pumps.
5. The full-automatic semiconductor polishing liquid supply system according to claim 4, wherein two raw liquid pumps are provided, and the two raw liquid pumps are standby pumps.
6. The full-automatic semiconductor polishing slurry supply system according to claim 5, wherein the raw liquid pump is a pneumatic bellows pump.
7. The full-automatic semiconductor grinding fluid supply system according to claim 1, wherein the circulating pipeline comprises a first circulating conveying pipe connected to the liquid outlet of each mixing barrel, a second circulating conveying pipe connected to all the first circulating conveying pipes, two third circulating conveying pipes arranged at the tail ends of the second circulating conveying pipes, a fourth circulating conveying pipe connected to the two third circulating conveying pipes, and a fifth circulating conveying pipe arranged at the tail ends of the fourth circulating conveying pipes and respectively extending into each mixing barrel, valves are arranged on the first circulating conveying pipe, the third circulating conveying pipe, the fourth circulating conveying pipe and the fifth circulating conveying pipe, a circulating pump is arranged on each third circulating conveying pipe, and the specific gravity meter is arranged on the fourth circulating conveying pipe.
8. The full-automatic semiconductor polishing liquid supply system according to claim 7, wherein the circulating pump is a magnetic levitation pump, and the two circulating pumps are standby pumps.
9. The full-automatic semiconductor grinding fluid supply system according to claim 1, wherein the fluid supply pipeline comprises a first fluid supply pipe connected to the fluid outlet of each mixing barrel, a second fluid supply pipe connected to all the first fluid supply pipes, two third fluid supply pipes arranged at the tail ends of the second fluid supply pipes, a fourth fluid supply pipe with two ends connected to the valve box and the two third fluid supply pipes respectively, and a fifth fluid supply pipe connected to the fluid outlet of the valve box and extending into each mixing barrel respectively, wherein valves are installed on the first fluid supply pipe, the third fluid supply pipe, the fourth fluid supply pipe and the fifth fluid supply pipe, two fluid supply pumps are installed on one of the third fluid supply pipes, and a fluid supply communicating pipe for communicating the third fluid supply pipe with the other third fluid supply pipe is arranged on a pipe section of the third fluid supply pipe located between the two fluid supply pumps.
10. The full-automatic semiconductor grinding fluid supply system according to claim 9, wherein the fluid-feeding pump is a magnetic levitation pump, and the two fluid-feeding pumps are standby pumps.
CN202321065506.1U 2023-05-06 2023-05-06 Full-automatic semiconductor grinding fluid supply system Active CN219925708U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321065506.1U CN219925708U (en) 2023-05-06 2023-05-06 Full-automatic semiconductor grinding fluid supply system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321065506.1U CN219925708U (en) 2023-05-06 2023-05-06 Full-automatic semiconductor grinding fluid supply system

Publications (1)

Publication Number Publication Date
CN219925708U true CN219925708U (en) 2023-10-31

Family

ID=88503759

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321065506.1U Active CN219925708U (en) 2023-05-06 2023-05-06 Full-automatic semiconductor grinding fluid supply system

Country Status (1)

Country Link
CN (1) CN219925708U (en)

Similar Documents

Publication Publication Date Title
US8517802B2 (en) Slurry system for semiconductor fabrication
US11396083B2 (en) Polishing liquid supply device
US20140216505A1 (en) Substrate cleaning apparatus and substrate cleaning method
CN113334245B (en) Grinding fluid supply system
CN219925708U (en) Full-automatic semiconductor grinding fluid supply system
CN219849015U (en) Semiconductor chemical grinding fluid conveying and mixing device
CN215586008U (en) Mixed acid device capable of controlling concentration of mixed acid in semiconductor wet cleaning solution
CN219798855U (en) Grinding fluid mixing sampling valve box
CN219922773U (en) Mixing barrel for semiconductor grinding fluid supply system
CN220136736U (en) Liquid sampling unit for grinding liquid supply system
CN112827376A (en) Method for controlling concentration of mixed acid in semiconductor wet cleaning solution
CN211198615U (en) Phosphoric acid concentration system for preventing pipeline silting
JP7133518B2 (en) Polishing liquid supply device
JP2010089180A (en) Slurry feeder for polishing substrate chemical machine, and polishing system
CN219922617U (en) Grinding fluid mixing cabinet
CN110486626A (en) A kind of long-distance slurry conveying pipeline multi-level pumping plant batch feed device and method
JP6698921B1 (en) Polishing liquid supply device
CN219925709U (en) Grinding fluid supply equipment
CN219849332U (en) Grinding fluid mixing device for sampling different stages of process
CN220197353U (en) Grinding fluid mixing and circulating system
CN115464561A (en) Grinding fluid supply device, system and method
CN215586009U (en) Mixed acid system for semiconductor wet process
CN217449932U (en) Silicon wafer grinding fluid feeding system
US20160101393A1 (en) Car wash chemical delivery devices, systems, and associated methods
CN217763065U (en) Liquid circulation device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant