CN112827376A - Method for controlling concentration of mixed acid in semiconductor wet cleaning solution - Google Patents
Method for controlling concentration of mixed acid in semiconductor wet cleaning solution Download PDFInfo
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- CN112827376A CN112827376A CN202011634981.7A CN202011634981A CN112827376A CN 112827376 A CN112827376 A CN 112827376A CN 202011634981 A CN202011634981 A CN 202011634981A CN 112827376 A CN112827376 A CN 112827376A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000002253 acid Substances 0.000 title claims abstract description 39
- 239000004065 semiconductor Substances 0.000 title claims description 19
- 239000007788 liquid Substances 0.000 claims abstract description 207
- 230000001105 regulatory effect Effects 0.000 claims description 46
- 230000000087 stabilizing effect Effects 0.000 claims description 30
- 230000001276 controlling effect Effects 0.000 claims description 23
- 230000008859 change Effects 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 14
- 239000004020 conductor Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 30
- 239000007789 gas Substances 0.000 description 29
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/40—Mixing liquids with liquids; Emulsifying
- B01F23/49—Mixing systems, i.e. flow charts or diagrams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/40—Mixing liquids with liquids; Emulsifying
- B01F23/405—Methods of mixing liquids with liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/40—Mixing liquids with liquids; Emulsifying
- B01F23/48—Mixing liquids with liquids; Emulsifying characterised by the nature of the liquids
- B01F23/483—Mixing liquids with liquids; Emulsifying characterised by the nature of the liquids using water for diluting a liquid ingredient, obtaining a predetermined concentration or making an aqueous solution of a concentrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/20—Measuring; Control or regulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/20—Measuring; Control or regulation
- B01F35/22—Control or regulation
- B01F35/221—Control or regulation of operational parameters, e.g. level of material in the mixer, temperature or pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/71—Feed mechanisms
- B01F35/717—Feed mechanisms characterised by the means for feeding the components to the mixer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/71—Feed mechanisms
- B01F35/717—Feed mechanisms characterised by the means for feeding the components to the mixer
- B01F35/71805—Feed mechanisms characterised by the means for feeding the components to the mixer using valves, gates, orifices or openings
- B01F35/718051—Feed mechanisms characterised by the means for feeding the components to the mixer using valves, gates, orifices or openings being adjustable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/80—Forming a predetermined ratio of the substances to be mixed
- B01F35/88—Forming a predetermined ratio of the substances to be mixed by feeding the materials batchwise
- B01F35/883—Forming a predetermined ratio of the substances to be mixed by feeding the materials batchwise using flow rate controls for feeding the substances
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Accessories For Mixers (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a method for controlling the concentration of mixed acid in a conductor wet cleaning solution, which can accurately control the concentration of the mixed acid in the wet cleaning solution by installing a mixed acid device at the liquid inlet end of wet cleaning equipment, improve the proportioning precision of a reactive solution, greatly improve the proportioning efficiency of the reactive solution, solve the problem of unstable wet process execution caused by excessive or insufficient mixing of acid liquor, and effectively improve the performance and cleaning capability of the wet process.
Description
Technical Field
The invention relates to the technical field of semiconductor process equipment, in particular to a method for controlling the concentration of mixed acid in a semiconductor wet cleaning solution.
Background
In a semiconductor process or a semiconductor process, various reactive liquids, such as acid solution, alkali solution, organic solution, etc., are used, and particularly in a semiconductor wet process, a mixed solution of the reactive liquids is often used.
When preparing the mixed solution required by the semiconductor wet process, at present, it is common to connect all the pipes carrying different reactive solutions into the cleaning tank of the wet cleaning apparatus, and mix the different reactive solutions in the cleaning tank. The mode not only the ratio precision of different reactivity solutions in the washing tank is difficult to control, simultaneously different reactivity solutions are mixed evenly and also a large amount of time is consumed, but also pipelines in the washing tank are too much, and the pipelines occupy a large amount of space.
Disclosure of Invention
In view of the above, the present invention provides a method for controlling the concentration of mixed acid in a semiconductor wet cleaning solution, so as to solve the above problems in the prior art.
A method for controlling the concentration of mixed acid in a semiconductor wet cleaning solution specifically comprises the following steps:
connecting an acid mixing device with wet cleaning equipment, wherein the acid mixing device comprises a shell, and a liquid path unit and a gas path unit which are respectively arranged in different cavities in the shell;
the method comprises the following steps of simultaneously conveying various reactive solutions of different types to a liquid path unit of an acid mixing device for instantaneous mixing, and simultaneously controlling a gas path unit to adjust the pipeline pressure of the liquid path unit by a controller so as to adjust the flow of pipelines where the different reactive solutions are located, thereby controlling the ratio of the different reactive solutions;
and in the set initial mixing time, the mixed liquid obtained by mixing in the liquid path unit is discharged through a liquid discharge pipe, when the initial mixing time is over, whether the mixing proportion of the mixed liquid meets the set proportion requirement is judged, if so, the liquid path unit conveys the mixed liquid into an equipment groove of wet cleaning equipment, and if not, the controller controls an alarm to send an alarm signal to prompt a worker that the liquid preparation fails.
Preferably, the liquid path unit comprises a liquid mixing valve, a liquid discharge pipe, a liquid outlet pipe and a plurality of liquid inlet pipes, wherein the liquid discharge pipe and the liquid outlet pipe are respectively connected to a liquid outlet of the liquid mixing valve;
the liquid inlet pipes are connected to the liquid inlet of the liquid mixing valve in parallel and used for conveying different reactive solutions into the liquid mixing valve for instantaneous mixing;
the liquid discharge pipe is connected to a liquid outlet of the liquid mixing valve and is used for discharging the mixed liquid obtained in the initial mixing time;
the liquid outlet pipe is connected to the other liquid outlet of the liquid mixing valve and used for conveying mixed liquid with a mixing proportion meeting a set requirement to an equipment groove of wet cleaning equipment.
Preferably, a liquid path hand valve, a first pressure maintaining valve, a flow meter, a second pressure maintaining valve and a first switch valve are sequentially arranged on a pipeline of the liquid inlet pipe along the liquid flowing direction;
and a second switch valve is arranged on the liquid discharge pipe, and a third switch valve is arranged on the liquid discharge pipe.
Preferably, the gas circuit unit comprises a first pressure regulating gas pipe, a second pressure regulating gas pipe and a third pressure regulating gas pipe,
the pipeline structure of the first pressure regulating air pipe is the same as that of the third pressure regulating air pipe, and a first air path hand valve, a first pressure regulating valve, a first air filter and a plurality of electromagnetic proportional valves are sequentially arranged on the pipeline along the air flowing direction;
the plurality of electromagnetic proportional valves on the first pressure regulating air pipe are respectively connected with the second pressure stabilizing valves on the liquid inlet pipes through air pipes;
a plurality of electromagnetic proportional valves on the third pressure regulating air pipe are respectively connected with the first pressure stabilizing valves on the liquid inlet pipes through air pipes;
and a second gas path hand valve, a second pressure regulating valve, a second air filter and a plurality of electromagnetic valves are sequentially arranged on a pipeline of the second pressure regulating gas pipe along the gas flowing direction, and the plurality of electromagnetic valves are respectively connected with the first switch valve, the second switch valve and the third switch valve through gas pipes.
Preferably, the controller controls the gas circuit unit to adjust the pipeline pressure of the liquid circuit unit so as to adjust the flow rates of the pipelines in which the different reactive solutions are located, and the specific steps are as follows:
firstly, a controller respectively controls corresponding electromagnetic valves to open a first switch valve on each liquid inlet pipe and a second switch valve on a liquid discharge pipe, and different reactive solutions are respectively conveyed into each liquid inlet pipe;
then, the controller controls the pressure of each electromagnetic proportional valve on the third pressure regulating air pipe to adjust the liquid inlet pressure of the corresponding first pressure stabilizing valve, so that the pipeline pressure of each liquid inlet pipe is adjusted to a set value;
the controller controls the pressure of each electromagnetic proportional valve on the first pressure regulating air pipe to change the liquid inlet pressure of the corresponding second pressure stabilizing valve, so that each second pressure stabilizing valve adjusts the liquid flow in the liquid inlet pipe where the second pressure stabilizing valve is located.
Preferably, the first pressure regulating air pipe, the second pressure regulating air pipe and the third pressure regulating air pipe are respectively arranged in different cavities.
Preferably, a bypass pipe is connected to one of the liquid inlet pipes, and the bypass pipe is always in an open state.
Preferably, each liquid inlet pipe is also provided with a pump.
Preferably, the wet cleaning equipment is groove type wet cleaning equipment or single-chip type wet cleaning equipment.
The invention has the beneficial effects that:
1. the method is simple and convenient to operate, and can reduce the number of pipelines in the cleaning tank, thereby not only saving the process cost, but also reducing a large amount of occupied space of the pipelines.
2. According to the method, the mixed acid device is arranged at the liquid inlet end of the wet cleaning equipment, so that the concentration of the mixed acid in the wet cleaning solution can be accurately controlled, the proportioning precision of the reactive solution is improved, the proportioning efficiency of the reactive solution can be greatly improved, the problem of unstable execution of the wet process caused by excessive or insufficient mixing of acid liquor is solved, and the performance and the cleaning capability of the wet process are effectively improved.
3. The acid mixing device used in the method is an independent modularized device, can be applied to liquid preparation of various wet processes, and meanwhile, when the wet liquid is prepared, the acid mixing device is only required to be connected with groove type cleaning equipment or single-chip type cleaning equipment, so that the installation is very convenient, and the equipment integration capacity of the whole wet process production line is greatly improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a piping diagram of a liquid path unit.
Fig. 2 is a piping diagram of the first pressure-regulating gas pipe or the third pressure-regulating gas pipe.
Fig. 3 is a piping diagram of the second pressure-regulating gas pipe.
FIG. 4 is a schematic diagram of the acid mixing apparatus.
Fig. 5 is a flow chart of the method of the present invention.
The reference numerals in the figures have the meaning:
the air conditioner comprises a shell, a first air path hand valve 1, a first pressure regulating valve 2, a first air filter 3, an electromagnetic proportional valve 4, a second air path hand valve 5, a second pressure regulating valve 6, a second air filter 7, an electromagnetic valve 8, a liquid mixing valve 9, a liquid discharge pipe 10, a liquid discharge pipe 11, a liquid inlet pipe 12, a liquid path hand valve 13, a first pressure stabilizing valve 14, a flow meter 15, a second pressure stabilizing valve 16, a first switch valve 17, a second switch valve 18, a third switch valve 19, a bypass pipe 20 and a shell 21.
Detailed Description
For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present application is described in further detail below with reference to specific embodiments and with reference to the attached drawings.
In the description of the present application, unless explicitly stated or limited otherwise, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless specified or indicated otherwise; the terms "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, integrally connected, or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The invention provides a method for controlling the concentration of mixed acid in a semiconductor wet cleaning solution, which utilizes a mixed acid device to control the concentration of mixed acid in the semiconductor wet cleaning solution.
Specifically, the method for controlling the concentration of the mixed acid in the semiconductor wet cleaning solution comprises the following steps:
connecting an acid mixing device with wet cleaning equipment, wherein the acid mixing device comprises a shell, and a liquid path unit and a gas path unit which are respectively arranged in different cavities in the shell;
the method comprises the following steps of simultaneously conveying various reactive solutions of different types to a liquid path unit of an acid mixing device for instantaneous mixing, and simultaneously controlling a gas path unit to adjust the pipeline pressure of the liquid path unit by a controller so as to adjust the flow of pipelines where the different reactive solutions are located, thereby controlling the ratio of the different reactive solutions;
and in the set initial mixing time, the mixed liquid obtained by mixing in the liquid path unit is discharged through a liquid discharge pipe, when the initial mixing time is over, whether the mixing proportion of the mixed liquid meets the set proportion requirement is judged, if so, the liquid path unit conveys the mixed liquid into an equipment groove of wet cleaning equipment, and if not, the controller controls an alarm to send an alarm signal to prompt a worker that the liquid preparation fails.
The gas circuit unit of the acid mixing device adopted by the method is used for controlling the pipeline pressure of the liquid circuit unit.
The gas circuit unit comprises a first pressure regulating gas pipe, a second pressure regulating gas pipe and a third pressure regulating gas pipe, and the first pressure regulating gas pipe, the second pressure regulating gas pipe and the third pressure regulating gas pipe are respectively arranged in different cavities.
The pipeline structure of the first pressure regulating air pipe is the same as that of the third pressure regulating air pipe, and a first air hand valve 1, a first pressure regulating valve 2, a first air filter 3 and a plurality of electromagnetic proportional valves 4 are sequentially arranged on the two pipelines along the air flowing direction.
The electromagnetic proportional valves on the first pressure regulating air pipe are respectively connected with the second pressure stabilizing valves on the liquid inlet pipes through air pipes, the number of the electromagnetic proportional valves 4 on the first pressure regulating air pipe is the same as that of the second pressure stabilizing valves in the liquid path unit, namely, one electromagnetic proportional valve 4 correspondingly controls only one second pressure stabilizing valve.
The electromagnetic proportional valves on the third pressure regulating air pipe are respectively connected with the first pressure stabilizing valves on the liquid inlet pipes through air pipes, the number of the electromagnetic proportional valves 4 on the third pressure regulating air pipe is the same as that of the first pressure stabilizing valves in the liquid path unit, namely, one electromagnetic proportional valve 4 correspondingly controls only one first pressure stabilizing valve.
And a second air path hand valve 5, a second pressure regulating valve 6, a second air filter 7 and a plurality of electromagnetic valves 8 are sequentially arranged on the pipeline of the second pressure regulating air pipe along the air flowing direction, the number of the electromagnetic valves 8 is the same as that of the switch valves, and one electromagnetic valve correspondingly controls only one switch valve.
The liquid path unit of the acid mixing device adopted by the method comprises a liquid mixing valve 9, a liquid discharge pipe 10, a liquid outlet pipe 11 and a plurality of liquid inlet pipes 12, wherein the liquid discharge pipe 10 and the liquid outlet pipe 11 are respectively connected to the liquid outlet of the liquid mixing valve 9, and the plurality of liquid inlet pipes 12 are connected to the liquid inlet of the liquid mixing valve 9 in parallel.
A plurality of inlet pipes 12 are used to feed the different reactive solutions into the mixing valve 9 for instantaneous mixing. In order to prevent the proportion of the mixed liquid in the liquid mixing valve from not meeting the requirement of the set proportion when the liquid mixing is started, the mixed liquid obtained by mixing in the liquid mixing valve 9 for the first n minutes (initial set time) needs to be discharged through the liquid discharge pipe 10, and then the mixed liquid is discharged into the equipment tank of the wet cleaning equipment through the liquid discharge pipe 11.
A liquid path hand valve 13, a first pressure maintaining valve 14, a flow meter 15, a second pressure maintaining valve 16 and a first switch valve 17 for changing the on-off of the pipeline of the liquid inlet pipe 12 according to the control of the gas path unit are sequentially arranged on the pipeline of each liquid inlet pipe 12 along the liquid flowing direction.
The first pressure stabilizing valve 14 mainly plays a role in stabilizing pressure and is used for stabilizing the pressure of a pipeline in the liquid inlet pipe 12 at a set pressure, the first pressure stabilizing valve 14 is connected with an electromagnetic proportional valve on a third pressure regulating air pipe through an air pipe, the electromagnetic proportional valve is electrically connected with a controller, and the controller can control the pressure of the electromagnetic proportional valve so as to change the liquid inlet pressure of the first pressure stabilizing valve and stabilize the pressure of the pipeline in the liquid inlet pipe at the set value.
The second pressure maintaining valve 16 is used for adjusting the liquid flow in the liquid inlet pipe 12 according to the control of the gas circuit unit. Specifically, the second pressure maintaining valve 16 is connected with the electromagnetic proportional valve 4 on the first pressure regulating gas pipe through a gas pipe, and the electromagnetic proportional valve 4 is electrically connected with the controller. The controller can be a controller in a semiconductor wet process, and can also be an independent controller arranged on the acid mixing device. The controller can control the pressure of the electromagnetic proportional valve 4 to change the liquid inlet pressure of the second pressure stabilizing valve 16, and the liquid flow in the liquid inlet pipe 12 is adjusted through the pressure change.
The flow meter 15 is used for monitoring the liquid flow in the liquid inlet pipe 12 in real time and transmitting the detected signal to the controller, and the flow meter 15 is electrically connected with the controller. When the flow meter 15 detects that the liquid flow in the liquid inlet pipe 12 is lower than or higher than a set value, the controller controls the alarm to send out an alarm signal so as to prompt a worker that the liquid preparation fails.
Preferably, a pump is further disposed on the liquid inlet pipe 12.
The liquid discharge pipe 10 is connected to a liquid outlet of the liquid mixing valve 9 and is used for discharging the mixed liquid obtained in the first n minutes in the liquid mixing valve 9, and the second switch valve 18 is installed on the liquid discharge pipe 10.
The liquid outlet pipe 11 is connected to another liquid outlet of the liquid mixing valve 9, and is used for conveying mixed liquid with a mixing ratio meeting a set requirement to an equipment groove of wet cleaning equipment, and the liquid outlet pipe 11 is provided with a third switch valve 19.
The first switch valve 17, the second switch valve 18 and the third switch valve 19 are respectively connected with the corresponding electromagnetic valves 8 on the second pressure regulating air pipe through air pipes. The electromagnetic valve 8 is used for controlling the on-off of the corresponding switch valve connected with the electromagnetic valve, thereby controlling the on-off of the corresponding pipeline.
In this embodiment, the liquid path unit is provided with three liquid inlet pipes 12, the three liquid inlet pipes 12 are respectively used for conveying ammonia water, hydrogen peroxide and deionized water, and the bypass pipe 20 is connected to the liquid inlet pipe for conveying deionized water. In order to ensure the activity of the deionized water in the inlet pipe, the bypass pipe 20 is always in an open state.
When the mixed acid solution needs to be prepared, the controller sends a control signal to the electromagnetic valves PV101-PV104 (wherein PV101-PV103 are respectively used for controlling the on-off of the three first switch valves 17, and PV104 is used for controlling the on-off of the second switch valve 18), the electromagnetic valves PV101-PV104 open the first switch valves 17 on the three liquid inlet pipes and the second switch valves 18 on the liquid outlet pipe 10 according to the received control signal, and ammonia water, hydrogen peroxide and deionized water are respectively conveyed to the liquid inlet pipes 12 corresponding to the electromagnetic valves PV101-PV 104;
meanwhile, the controller respectively controls three electromagnetic proportional valves on the third pressure regulating gas pipe, so that each electromagnetic proportional valve respectively controls the liquid inlet pressure of the corresponding first pressure stabilizing valve 14, and the pipeline pressure of the three liquid inlet pipes is adjusted to a set value through the first pressure stabilizing valves 14; then, the controller controls the pressure of the three electromagnetic proportional valves 4 on the first pressure regulating air pipe to change the air pressure of the corresponding second pressure stabilizing valve 16, so that each second pressure stabilizing valve 16 adjusts the liquid flow rate in the corresponding liquid inlet pipe.
The liquids fed through the three liquid inlet pipes 12 are instantaneously mixed in the liquid mixing valve 9, and in order to prevent the ratio of the mixed liquid in the liquid mixing valve 9 from not reaching the set ratio requirement when the liquid mixing is started, the mixed liquid obtained by mixing in the liquid mixing valve 9 is discharged through the liquid discharge pipe 10 within the set initial mixing time.
When the set initial mixing time is over, the flowmeters 15 on the three liquid inlet pipes 12 transmit the respective detected pipeline flow of the corresponding pipeline to the controller, and the controller processes the received signals and judges whether the liquid flow proportion in the three liquid inlet pipes meets the set proportion requirement or not.
If the liquid flow proportions in the three liquid inlet pipes reach the set proportion requirement, the liquid mixing is successful, the concentration of mixed acid reaches the requirement, the controller controls the electromagnetic valve PV105 to open the third switch valve 19 on the liquid outlet pipe 11, and controls the electromagnetic valve PV104 to close the second switch valve 18 on the liquid outlet pipe 10, so that the mixed liquid in the mixed liquid valve 9 is discharged into an equipment groove of the wet cleaning equipment from the liquid outlet pipe 11;
if the liquid flow proportion in the three liquid inlet pipes does not reach the set proportion requirement, the liquid mixing failure is indicated, and the controller can control the alarm to send out an alarm signal so as to prompt a worker that the liquid preparation fails.
In this embodiment, the controller may be a PLC controller.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (9)
1. A method for controlling the concentration of mixed acid in a semiconductor wet cleaning solution is characterized by comprising the following steps:
connecting an acid mixing device with wet cleaning equipment, wherein the acid mixing device comprises a shell, and a liquid path unit and a gas path unit which are respectively arranged in different cavities in the shell;
the method comprises the following steps of simultaneously conveying various reactive solutions of different types to a liquid path unit of an acid mixing device for instantaneous mixing, and simultaneously controlling a gas path unit to adjust the pipeline pressure of the liquid path unit by a controller so as to adjust the flow of pipelines where the different reactive solutions are located, thereby controlling the ratio of the different reactive solutions;
and in the set initial mixing time, the mixed liquid obtained by mixing in the liquid path unit is discharged through a liquid discharge pipe, when the initial mixing time is over, whether the mixing proportion of the mixed liquid meets the set proportion requirement is judged, if so, the liquid path unit conveys the mixed liquid into an equipment groove of wet cleaning equipment, and if not, the controller controls an alarm to send an alarm signal to prompt a worker that the liquid preparation fails.
2. The method according to claim 1, wherein the liquid path unit comprises a liquid mixing valve, a liquid discharge pipe and a plurality of liquid inlet pipes, wherein the liquid discharge pipe and the liquid discharge pipe are respectively connected to a liquid outlet of the liquid mixing valve;
the liquid inlet pipes are connected to the liquid inlet of the liquid mixing valve in parallel and used for conveying different reactive solutions into the liquid mixing valve for instantaneous mixing;
the liquid discharge pipe is connected to a liquid outlet of the liquid mixing valve and is used for discharging the mixed liquid obtained in the initial mixing time;
the liquid outlet pipe is connected to the other liquid outlet of the liquid mixing valve and used for conveying mixed liquid with a mixing proportion meeting a set requirement to an equipment groove of wet cleaning equipment.
3. The method for controlling the concentration of mixed acid in the wet semiconductor cleaning solution according to claim 2, wherein a liquid path hand valve, a first pressure maintaining valve, a flow meter, a second pressure maintaining valve and a first switch valve are sequentially installed on a pipeline of the liquid inlet pipe along the liquid flowing direction;
and a second switch valve is arranged on the liquid discharge pipe, and a third switch valve is arranged on the liquid discharge pipe.
4. The method according to claim 3, wherein the gas circuit unit comprises a first pressure-regulating gas pipe, a second pressure-regulating gas pipe and a third pressure-regulating gas pipe,
the pipeline structure of the first pressure regulating air pipe is the same as that of the third pressure regulating air pipe, and a first air path hand valve, a first pressure regulating valve, a first air filter and a plurality of electromagnetic proportional valves are sequentially arranged on the pipeline along the air flowing direction;
the plurality of electromagnetic proportional valves on the first pressure regulating air pipe are respectively connected with the second pressure stabilizing valves on the liquid inlet pipes through air pipes;
a plurality of electromagnetic proportional valves on the third pressure regulating air pipe are respectively connected with the first pressure stabilizing valves on the liquid inlet pipes through air pipes;
and a second gas path hand valve, a second pressure regulating valve, a second air filter and a plurality of electromagnetic valves are sequentially arranged on a pipeline of the second pressure regulating gas pipe along the gas flowing direction, and the plurality of electromagnetic valves are respectively connected with the first switch valve, the second switch valve and the third switch valve through gas pipes.
5. The method for controlling the concentration of mixed acid in a wet semiconductor cleaning solution according to claim 4, wherein the step of controlling the gas circuit unit to adjust the pressure of the pipeline of the liquid circuit unit by the controller so as to adjust the flow rates of the pipelines in which the different reactive solutions are located comprises the following steps:
firstly, a controller respectively controls corresponding electromagnetic valves to open a first switch valve on each liquid inlet pipe and a second switch valve on a liquid discharge pipe, and different reactive solutions are respectively conveyed into each liquid inlet pipe;
then, the controller controls the pressure of each electromagnetic proportional valve on the third pressure regulating air pipe to adjust the liquid inlet pressure of the corresponding first pressure stabilizing valve, so that the pipeline pressure of each liquid inlet pipe is adjusted to a set value;
the controller controls the pressure of each electromagnetic proportional valve on the first pressure regulating air pipe to change the liquid inlet pressure of the corresponding second pressure stabilizing valve, so that each second pressure stabilizing valve adjusts the liquid flow in the liquid inlet pipe where the second pressure stabilizing valve is located.
6. The method for controlling the concentration of mixed acid in semiconductor wet cleaning solution according to claim 4, wherein the first pressure-regulating gas pipe, the second pressure-regulating gas pipe and the third pressure-regulating gas pipe are respectively arranged in different chambers.
7. The method as claimed in claim 2, wherein a bypass pipe is connected to one of the inlet pipes, and the bypass pipe is always open.
8. The method as claimed in claim 2, wherein a pump is further disposed on each liquid inlet pipe.
9. The method for controlling the concentration of mixed acid in a semiconductor wet cleaning solution according to claim 1 or 2, wherein the wet cleaning equipment is a tank type wet cleaning equipment or a single-wafer type wet cleaning equipment.
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