CN219802666U - High heat conduction type multi-layer aluminum-based plate structure - Google Patents
High heat conduction type multi-layer aluminum-based plate structure Download PDFInfo
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- CN219802666U CN219802666U CN202320952796.5U CN202320952796U CN219802666U CN 219802666 U CN219802666 U CN 219802666U CN 202320952796 U CN202320952796 U CN 202320952796U CN 219802666 U CN219802666 U CN 219802666U
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- layer aluminum
- aluminum substrate
- substrate structure
- heat
- structure according
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 41
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract description 9
- 238000009434 installation Methods 0.000 claims description 20
- 238000001125 extrusion Methods 0.000 claims description 14
- 239000000428 dust Substances 0.000 abstract description 13
- 238000001816 cooling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000883990 Flabellum Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a high heat conduction type multi-layer aluminum-based plate structure, which comprises the following components: a mounting box; the setting groove is arranged in the middle of the top of the mounting box, and the bottom of the setting groove is provided with a heat dissipation hole; the air-driving device is arranged in the middle of the bottom of the inner cavity of the setting groove, the top of the inner cavity of the setting groove is fixedly provided with a mounting plate, the top of the mounting plate is fixedly provided with a heat-dissipating device, and the top of the heat-dissipating device is fixedly connected with a circuit board; the two sliding grooves are respectively formed in two sides of the outer surface of the mounting box, an elastic device is arranged in the sliding grooves, and a dust-proof device is sleeved on the outer surface of the elastic device. The utility model provides a high heat conduction type multi-layer aluminum substrate structure, which can enable a user to pull a dustproof device through the restoring elasticity of a spring and match with the restoring elasticity of the spring to enable a dustproof net to vibrate, so that dust blocked on the surface of the dustproof net is shaken off.
Description
Technical Field
The utility model relates to the field of multi-layer aluminum substrates, in particular to a high-heat-conductivity multi-layer aluminum substrate structure.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and generally a single panel is composed of three layers of structures, namely a circuit layer (copper foil), an insulating layer and a metal base layer, is also designed into a double-sided board for high-end use, has the structures of the circuit layer, the insulating layer, the aluminum base, the insulating layer and the circuit layer, and is rarely applied to a multi-layer board, and can be formed by attaching a common multi-layer board with the insulating layer and the aluminum base.
At present, after some high heat conduction double-sided aluminum substrates existing in the market are used in surface mounting of an LED lamp, heat is generated due to the fact that the LED lamp works, the surface of the aluminum substrate is scalded, and the inside of the aluminum substrate is scalded after long-time use, so that a cooling fan is generally arranged inside the aluminum substrate.
The utility model discloses a high heat conduction double-sided aluminium base board of publication No. CN217546420U, the radiator fan of the device also can carry out the heat to aluminium base board heat conduction post and aluminium base board heating panel and dispel the heat, radiator fan still can carry out more comprehensive wind-force heat dissipation to the heat conduction insulating layer surface through supplementary heating panel simultaneously, the effectual radiating effect who improves aluminium base board, radiator fan carries out continuous heat dissipation to the heat conduction insulating layer, but the air current that radiator fan produced can guide external dust to the surface of louvre, along with the extension of live time, there is more dust to block up at the louvre limit, influence the radiating effect.
Therefore, it is necessary to provide a high thermal conductivity multi-layer aluminum substrate structure to solve the above-mentioned problems.
Disclosure of Invention
The utility model provides a high heat conduction type multi-layer aluminum substrate structure, which solves the problem that the air flow generated by a cooling fan can guide external dust to the surface of a cooling hole, and more dust is blocked at the side of the cooling hole along with the extension of the service time, so that the cooling effect is affected.
In order to solve the technical problems, the utility model provides a high heat conduction type multi-layer aluminum-based plate structure, which comprises: a mounting box;
the installation box comprises an installation box body, a mounting box and a heat dissipation device, wherein the installation box body is provided with a mounting box;
the air-driving device is arranged in the middle of the bottom of the inner cavity of the setting groove, the top of the inner cavity of the setting groove is fixedly provided with a mounting plate, the top of the mounting plate is fixedly provided with a heat-dissipating device, and the top of the heat-dissipating device is fixedly connected with a circuit board;
the two sliding grooves are respectively formed in two sides of the outer surface of the installation box, an elastic device is arranged in the sliding grooves, and a dustproof device is sleeved on the outer surface of the elastic device.
Preferably, the dustproof device comprises a setting plate, a dustproof net is arranged in the middle of the setting plate, a connecting cylinder is fixedly arranged at the top of the setting plate, sliding blocks are fixedly arranged on two sides of an inner cavity of the connecting cylinder, sliding holes are formed in the sliding blocks, and a pull rod is fixedly arranged in the middle of the bottom of the setting plate.
Preferably, the elastic device comprises a sliding rod, and a spring is sleeved on the outer surface of the sliding rod.
Preferably, the wind driving device comprises a first servo motor, and an output shaft of the first servo motor is fixedly connected with fan blades.
Preferably, the heat dissipating device comprises a heat dissipating block, and a bump is arranged on the surface of the heat dissipating block.
Preferably, the installation box is fixedly installed on two sides of the inside of the installation box, a second servo motor is arranged in the installation box, and an output shaft of the second servo motor is fixedly connected with an extrusion device.
Preferably, the extrusion device comprises a rotating block, and one side of the outer surface of the rotating block is fixedly provided with the extrusion block.
Compared with the related art, the high-heat-conductivity multi-layer aluminum substrate structure provided by the utility model has the following beneficial effects:
the utility model provides a high heat conduction type multi-layer aluminum substrate structure, which can enable a user to pull a dustproof device through the restoring elasticity of a spring and match with the restoring elasticity of the spring to enable a dustproof net to vibrate, so that dust blocked on the surface of the dustproof net is shaken off.
Drawings
FIG. 1 is a schematic diagram of a first embodiment of a high thermal conductivity multi-layer aluminum substrate structure according to the present utility model;
FIG. 2 is an enlarged schematic view of the portion A shown in FIG. 1;
FIG. 3 is a schematic view of the dust-proof device shown in FIG. 1;
FIG. 4 is a schematic diagram of a second embodiment of a high thermal conductivity multi-layer aluminum substrate structure according to the present utility model;
FIG. 5 is an enlarged schematic view of the portion B shown in FIG. 4;
fig. 6 is a schematic view of the pressing device shown in fig. 5.
Reference numerals in the drawings: 1. mounting box, 2, set up groove, 3, wind-driving device, 31, first servo motor, 32, flabellum, 4, mounting panel, 5, heat abstractor, 51, radiator, 52, lug, 6, circuit board, 7, dust keeper, 71, set up the board, 72, dust screen, 73, slider, 74, slide hole, 75, pull rod, 76, connecting cylinder, 8, spout, 9, elastic device, 91, slide bar, 92, spring, 10, set up box, 11, second servo motor, 12, extrusion device, 121, rotary block, 122, extrusion piece.
Detailed Description
The utility model will be further described with reference to the drawings and embodiments.
Referring to fig. 1, fig. 2 and fig. 3 in combination, fig. 1 is a schematic structural diagram of a first embodiment of a high thermal conductivity multi-layer aluminum substrate structure according to the present utility model; FIG. 2 is an enlarged schematic view of the portion A shown in FIG. 1; fig. 3 is a schematic view of the dust-proof device shown in fig. 1. A high thermal conductivity multi-layer aluminum substrate structure comprising: a mounting box 1;
the installation groove 2 is arranged in the middle of the top of the installation box 1, and a heat dissipation hole 13 is formed in the bottom of the installation groove 2;
the air-driving device 3 is arranged in the middle of the bottom of the inner cavity of the setting groove 2, the top of the inner cavity of the setting groove 2 is fixedly provided with a mounting plate 4, the top of the mounting plate 4 is fixedly provided with a heat dissipation device 5, and the top of the heat dissipation device 5 is fixedly connected with a circuit board 6;
the two sliding grooves 8 are respectively arranged on two sides of the outer surface of the installation box 1, an elastic device 9 is arranged in the sliding groove 8, and a dust-proof device 7 is sleeved on the outer surface of the elastic device 9.
Two sliding grooves 8 are respectively arranged at the bottoms of the left side and the right side of the outer surface of the mounting box 1.
The dustproof device 7 comprises a setting plate 71, a dustproof net 72 is arranged in the middle of the setting plate 71, a connecting cylinder 76 is fixedly arranged at the top of the setting plate 71, sliding blocks 73 are fixedly arranged on two sides of the inner cavity of the connecting cylinder 76, sliding holes 74 are formed in the sliding blocks 73, and a pull rod 75 is fixedly arranged in the middle of the bottom of the setting plate 71.
The diameter of the setting plate 71 and the mounting box 1 are adapted, and the dust screen 72 can block the entry of dust.
The connecting cylinder 76 is sleeved on the outer surface of the installation box 1, and the two sliding blocks 73 are respectively fixed at the tops of the left side and the right side of the inner cavity of the connecting cylinder 76.
The elastic device 9 comprises a sliding rod 91, and a spring 92 is sleeved on the outer surface of the sliding rod 91.
The sliding block 73 and the sliding groove 8 are matched, and can only slide up and down in the sliding groove 8, the sliding block 73 is sleeved on the outer surface of the sliding rod 91 through the sliding hole 74, the top end of the spring 92 is connected with the sliding block 73, and the bottom end is connected with the bottom of the inner cavity of the sliding groove 8.
The wind driving device 3 comprises a first servo motor 31, and an output shaft of the first servo motor 31 is fixedly connected with fan blades 32.
The heat dissipating device 5 includes a heat dissipating block 51, and a bump 52 is provided on a surface of the heat dissipating block 51.
The bump 52 enhances the absorption capacity of the heat dissipating block 51, enhancing the heat dissipating effect.
The working principle of the high heat conduction type multi-layer aluminum-based plate structure provided by the utility model is as follows:
when the dust-proof device is in operation, a user holds the pull rod 75 to pull downwards, drives the slide block 73 to slide downwards along the slide rod 91 through the slide hole 74, presses the spring 92, then releases the pull rod 75, the restoring elasticity of the spring 92 pushes the dust-proof device 7 upwards, the restoring effect of the spring 92 drives the dust-proof device 7 to shake up and down, and dust blocked on the surface of the dust-proof net 72 shakes down.
Compared with the related art, the high-heat-conductivity multi-layer aluminum substrate structure provided by the utility model has the following beneficial effects:
the utility model provides a high heat conduction type multi-layer aluminum substrate structure, which can lead a user to pull a dustproof device 7 through the restoring elasticity of a spring 92 and match the restoring elasticity of the spring 92 to enable a dustproof net 72 to vibrate, so that dust blocked on the surface of the dustproof net 72 is shaken off.
Second embodiment
Referring to fig. 4, fig. 5 and fig. 6 in combination, another high heat conductivity type multi-layer aluminum substrate structure is proposed according to a second embodiment of the present utility model. The second embodiment is merely a preferred manner of the first embodiment, and implementation of the second embodiment does not affect the implementation of the first embodiment alone.
Specifically, the second embodiment of the present utility model provides a high heat conduction type multi-layer aluminum substrate structure, which is different in that a setting box 10 is fixedly installed on two sides of the inside of the installation box 1, a second servo motor 11 is arranged inside the setting box 10, and an output shaft of the second servo motor 11 is fixedly connected with an extrusion device 12.
The output shaft of the second servomotor 11 is fixedly connected in the middle of the rotary block 121.
The extrusion device 12 comprises a rotating block 121, and an extrusion block 122 is fixedly arranged on one side of the outer surface of the rotating block 121.
The pressing block 122 rotates with the rotating block 121, the pressing block 122 pushes the connection cylinder 76 downward, and the restoring elastic force of the spring 92 pushes the connection cylinder 76 upward as the pressing block 122 no longer presses the connection cylinder 76.
The working principle of the high heat conduction type multi-layer aluminum-based plate structure provided by the utility model is as follows:
when in operation, firstly, a user controls the output shaft of the second servo motor 11 to rotate through an external power supply to drive the rotating block 121 to rotate, the extruding block 122 is driven to intermittently extrude the connecting cylinder 76 when the rotating block 121 rotates, and when the extruding block 122 downwardly extrudes the connecting cylinder 76, the connecting cylinder 76 drives the sliding block 73 to move downwards along the sliding rod 91 through the sliding hole 74 and extrudes the spring 92.
When the extrusion block 122 continues to rotate along with the output shaft of the second servo motor 11, the extrusion block 122 does not extrude the connecting cylinder 76 any more, and the restoring elastic force of the spring 92 pushes the sliding block 73 upwards, so that the connecting cylinder 76 vibrates and shakes off dust blocked on the surface.
Compared with the related art, the high-heat-conductivity multi-layer aluminum substrate structure provided by the utility model has the following beneficial effects:
the utility model provides a high heat conduction type multi-layer aluminum substrate structure, wherein an output shaft of a second servo motor 11 is controlled by an external power supply to rotate so as to drive an extrusion device 12 to intermittently push a dust-proof device 7 downwards.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (7)
1. A high thermal conductivity multi-layer aluminum substrate structure, comprising: a mounting box;
the installation box comprises an installation box body, a mounting box and a heat dissipation device, wherein the installation box body is provided with a mounting box;
the air-driving device is arranged in the middle of the bottom of the inner cavity of the setting groove, the top of the inner cavity of the setting groove is fixedly provided with a mounting plate, the top of the mounting plate is fixedly provided with a heat-dissipating device, and the top of the heat-dissipating device is fixedly connected with a circuit board;
the two sliding grooves are respectively formed in two sides of the outer surface of the installation box, an elastic device is arranged in the sliding grooves, and a dustproof device is sleeved on the outer surface of the elastic device.
2. The high-heat-conductivity multi-layer aluminum substrate structure according to claim 1, wherein the dustproof device comprises a setting plate, a dustproof net is arranged in the middle of the setting plate, a connecting cylinder is fixedly arranged at the top of the setting plate, sliding blocks are fixedly arranged on two sides of an inner cavity of the connecting cylinder, sliding holes are formed in the sliding blocks, and a pull rod is fixedly arranged in the middle of the bottom of the setting plate.
3. The high thermal conductivity multi-layer aluminum substrate structure according to claim 1, wherein the elastic device comprises a sliding rod, and a spring is sleeved on the outer surface of the sliding rod.
4. The high thermal conductivity multi-layer aluminum substrate structure according to claim 1, wherein the wind driving device comprises a first servo motor, and an output shaft of the first servo motor is fixedly connected with fan blades.
5. The high thermal conductivity multi-layer aluminum substrate structure according to claim 1, wherein the heat dissipating device comprises a heat dissipating block, and a bump is disposed on a surface of the heat dissipating block.
6. The high heat conduction type multi-layer aluminum substrate structure according to claim 1, wherein the installation boxes are fixedly installed on two sides of the inside of each installation box, a second servo motor is arranged in each installation box, and an output shaft of each second servo motor is fixedly connected with an extrusion device.
7. The high thermal conductivity multi-layer aluminum substrate structure according to claim 6, wherein the extrusion device comprises a rotating block, and an extrusion block is fixedly arranged on one side of the outer surface of the rotating block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320952796.5U CN219802666U (en) | 2023-04-25 | 2023-04-25 | High heat conduction type multi-layer aluminum-based plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320952796.5U CN219802666U (en) | 2023-04-25 | 2023-04-25 | High heat conduction type multi-layer aluminum-based plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219802666U true CN219802666U (en) | 2023-10-03 |
Family
ID=88153804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320952796.5U Active CN219802666U (en) | 2023-04-25 | 2023-04-25 | High heat conduction type multi-layer aluminum-based plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219802666U (en) |
-
2023
- 2023-04-25 CN CN202320952796.5U patent/CN219802666U/en active Active
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| GR01 | Patent grant |