CN218783931U - Aluminum-based circuit board with long service life - Google Patents
Aluminum-based circuit board with long service life Download PDFInfo
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- CN218783931U CN218783931U CN202222653275.8U CN202222653275U CN218783931U CN 218783931 U CN218783931 U CN 218783931U CN 202222653275 U CN202222653275 U CN 202222653275U CN 218783931 U CN218783931 U CN 218783931U
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- Prior art keywords
- circuit board
- heat
- board body
- heat dissipation
- drainage shell
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 claims abstract description 38
- 238000010521 absorption reaction Methods 0.000 claims abstract description 11
- 239000004519 grease Substances 0.000 claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 10
- 239000006096 absorbing agent Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application discloses a long-life aluminum-based circuit board, which comprises a circuit board body, wherein an electric element is arranged at the top of the circuit board body; the heat absorbing element comprises a heat absorbing plate which is arranged at the bottom of the circuit board body; the heat-conducting silicone grease is arranged between the heat absorbing plate and the circuit board body; the drainage shell is arranged at the bottom of the heat absorption plate, and the top of the drainage shell is open; a plurality of exhaust holes which penetrate through the opposite side walls of the drainage shell at intervals; the heat dissipation element is used for the air current to dispel the heat to heat absorbing element, and in daily use, through adopting above-mentioned technical scheme, the heat that produces when electric elements moves passes through the circuit board and heat conduction silicone grease transmits to absorber plate and drainage shell in, and the heat dissipation element moves, produces the air current, and the air current flows through drainage shell, exhaust hole and absorber plate, wraps up and holds the heat and leaves the circuit board body, prevents that electric elements operating temperature is too high, makes electric elements's life improve.
Description
Technical Field
The utility model relates to an aluminium base circuit board of high life.
Background
The production of the metal-based circuit board at the present stage mainly takes an aluminum-based single-sided circuit board as the aluminum metal is cheaper and is easy to process; the insulating layer is mainly filled with low-price epoxy resin and ceramic powder, however, in the using process of the circuit board, various electrical elements need to be installed on the circuit board, and in the operating process of the electrical elements, certain heat can be generated, if the heat cannot be timely dissipated, the electrical elements can be possibly damaged, the practical use is inconvenient, the service life of the circuit board is shortened, and therefore improvement is needed.
Disclosure of Invention
The utility model discloses aim at solving one of the technical problem that exists among the prior art.
The application provides an aluminium base circuit board of high life includes:
a circuit board body having an electric component mounted on a top thereof;
a heat absorbing member for absorbing heat in the circuit board body;
and the heat dissipation element is used for dissipating heat of the heat absorption element by the airflow.
The heat absorbing element includes:
the heat absorption plate is arranged at the bottom of the circuit board body;
the heat-conducting silicone grease is arranged between the heat absorbing plate and the circuit board body;
the drainage shell is arranged at the bottom of the heat absorption plate, and the top of the drainage shell is open;
a plurality of air vents which penetrate through the opposite side walls of the drainage shell at intervals.
The heat absorbing element further includes:
a plurality of heat dissipation plates arranged on the bottom surface of the heat absorption plate;
and the plurality of heat dissipation channels are positioned between the adjacent heat dissipation plates and are communicated with the exhaust holes.
The heat absorbing member further includes:
and the plurality of heat dissipation columns are fixedly arranged at the bottom of the inner cavity of the drainage shell.
The heat dissipating component includes:
the communicating groove penetrates through the circuit board body from top to bottom and is communicated with the inner cavity of the drainage shell;
and the fan is fixedly arranged above the circuit board body through a plurality of mounting units.
The mounting unit includes:
the bottom end of the strut is fixedly arranged on the heat absorbing plate, and the top end of the strut movably penetrates through the circuit board body and extends to the position below the fan;
and the fastener is used for fixedly connecting the fan and the support.
The mounting unit further includes:
and the pipe sleeve is sleeved outside the support, and two ends of the pipe sleeve are respectively abutted against the bottom of the fan and the top surface of the circuit board body.
The utility model has the advantages as follows:
1. through the arrangement of the heat absorbing plate, the heat-conducting silicone grease, the drainage shell, the exhaust holes, the heat dissipation plate, the heat dissipation channel and the heat dissipation column, the contact area of the circuit board body and air is increased, the heat dissipation speed in the circuit board body is improved, the electric elements on the circuit board body can dissipate heat quickly, and the service life is prolonged;
2. through the setting of fan, intercommunication groove, pillar, fastener and pipe box, the fan circular telegram produces the air current, forms the air current and supplies the drainage shell through the intercommunication groove, makes the air current pass through drainage shell, exhaust hole, heating panel and heat dissipation channel to consolidate the circuit board body, make circuit board body and absorber plate contact inseparable, further improve the radiating rate of circuit board body.
Drawings
FIG. 1 is a schematic diagram of a structural formula of a specific embodiment of a long-life aluminum-based circuit board according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a heat absorbing element in an embodiment of the present application.
Reference numerals
The heat dissipation structure comprises a circuit board body 1, an electrical component 2, a heat absorption plate 3, heat conduction silicone grease 4, a flow guide shell 5, an exhaust hole 6, a heat dissipation plate 7, a heat dissipation channel 8, a heat dissipation column 9, a communication groove 10, a fan 11, a support 12, a fastening piece 13 and a pipe sleeve 14.
Detailed Description
The technical solutions in the embodiments of the present application will be described below clearly with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present disclosure.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/", and generally means that the former and latter related objects are in an "or" relationship.
The server provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
As shown in fig. 1 to 2, the present embodiment provides a long-life aluminum-based circuit board, including a circuit board body 1, on the top of which an electrical component 2 is mounted; a heat absorbing member for absorbing heat in the circuit board body 1; and the heat dissipation element is used for dissipating heat of the heat absorption element by airflow.
Further, the heat absorbing element comprises a heat absorbing plate 3 which is arranged at the bottom of the circuit board body 1; a heat conductive silicone grease 4 disposed between the heat absorbing plate 3 and the circuit board body 1; the drainage shell 5 is arranged at the bottom of the heat absorption plate 3, and the top of the drainage shell is open; and a plurality of exhaust holes 6 which penetrate through the opposite side walls of the drainage shell 5 at intervals.
Furthermore, the heat absorbing element also comprises a plurality of heat dissipation plates 7 which are arranged on the bottom surface of the heat absorbing plate 3; and a plurality of heat dissipation channels 8 which are positioned between the adjacent heat dissipation plates 7 and are communicated with the exhaust holes 6.
Further, the heat absorbing element further comprises a plurality of heat dissipation columns 9 which are fixedly arranged at the bottom of the inner cavity of the drainage shell 5.
Further, the heat dissipation element comprises a communication groove 10 which penetrates through the circuit board body 1 from top to bottom and is communicated with the inner cavity of the drainage shell 5; and a fan 11 fixedly mounted above the circuit board body 1 by a plurality of mounting units.
Further, the mounting unit comprises a support 12, the bottom end of which is fixedly mounted on the heat absorbing plate 3, and the top end of which movably penetrates through the circuit board body 1 and extends to the lower part of the fan 11; and a fastener 13 for fixedly connecting the fan 11 with the strut 12.
Further, the mounting unit further comprises a sleeve 14, which is sleeved outside the pillar 12 and has two ends respectively abutting against the bottom of the fan 11 and the top surface of the circuit board body 1.
As some embodiments of the present application, a hole is drilled and opened in a circuit board body 1, a communication groove 10 is opened, then an electrical component 2 is arranged on the circuit board, a heat conductive silicone grease 4 is coated on the upper surface of a heat absorbing plate 3, each pillar 12 is aligned to a preset hole in the circuit board body 1, each pillar 12 passes through the drill hole, the heat absorbing plate 3 is adhered to the bottom of the circuit board body 1 through the heat conductive silicone grease 4, a fan 11 is mounted at the top end of each pillar 12 through a fastener 13, when the electrical component 2 on the circuit board body 1 is powered on to work, heat is transferred into the circuit board body 1, then transferred into the heat absorbing plate 3 through the heat absorbing plate 3, transferred into a flow guiding shell 5 through the heat absorbing plate 3, the fan 11 is turned on to generate an air flow, the air flow flowing to the communication groove 10 enters the flow guiding shell 5 through the communication groove 10, other air flows to each electrical component 2 through collision with the upper surface of the circuit board body 1, the air flow entering into each flow guiding shell 5 contacts with the inner wall of the flow guiding shell 5, then flows through the bottom surface of each exhaust hole 6, so that the heat absorbing plate 3 and the heat guiding shell 5 are quickly conducted, the heat is dissipated through the silicone grease 4, and the circuit board body 1 is tightly connected with the circuit board body 1;
preferably, the heat absorbing plate 3 is made of aluminum material, so that the weight is light and the heat dissipation is fast;
as some embodiments of the present application, as shown in fig. 2, a plurality of heat dissipation plates 7 are arranged at intervals on the bottom surface of the heat conduction plate to increase the contact area between the bottom surface of the heat conduction plate and the air flow, and a plurality of heat dissipation channels 8 formed between the heat dissipation plates 7 respectively correspond to the air vents 6, so that the surface of each heat dissipation plate 7 is fully contacted with the air flow, and the heat dissipation efficiency of the air flow on the heat conduction plate is further increased;
preferably, the bottom ends of the plurality of heat dissipation columns 9 are connected with the bottom of the inner cavity of the guide shell, the top ends of the plurality of heat dissipation columns pass through the communication groove 10 and extend to the upper part of the circuit board body 1, heat conducted into the guide shell is conducted into the heat dissipation columns 9, airflow flows through the surfaces of the heat dissipation columns 9 after being blown out of the fan 11, and the contact area between the inner cavity of the guide shell and the airflow is increased through the arrangement of the heat dissipation columns 9, so that the cooling speed of the guide shell by the airflow is increased, and the service life of each electrical element 2 on the circuit board body 1 is further prolonged;
as some embodiments of the present application, as shown in fig. 1, after the fan 11 and the support column 12 are fixed by the fastening member 13, the pipe sleeve 14 sleeved outside each support column 12 contacts with the top surfaces of the fan 11 and the circuit board body 1 at two ends respectively, limits the space between the fan 11 and the circuit board body 1, and applies pressure to the top of the circuit board body 1, so that the circuit board body 1 is clamped between the pipe sleeve 14 and the heat conducting plate, thereby preventing the occurrence of a gap between the circuit board body 1 and the heat conducting plate and causing poor heat dissipation of the circuit board body 1;
preferably, the fastening member 13 is a screw, and is fastened and connected with the pillar 12 through a screw hole after penetrating through a drill hole preset on the fan 11, so that the fan 11 is convenient to disassemble and assemble.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the present embodiments are not limited to those precise embodiments, which are intended to be illustrative rather than restrictive, and that various changes and modifications may be effected therein by one skilled in the art without departing from the scope of the appended claims.
Claims (7)
1. A long-life aluminum-based circuit board, comprising:
a circuit board body (1) having an electric component (2) mounted on the top thereof;
a heat absorbing element for absorbing heat in the circuit board body (1);
a heat dissipating element for dissipating heat from the heat absorbing element by the airflow.
2. A high lifetime aluminum based circuit board as claimed in claim 1, wherein said heat absorbing element comprises:
the heat absorption plate (3) is arranged at the bottom of the circuit board body (1);
the heat-conducting silicone grease (4) is arranged between the heat absorbing plate (3) and the circuit board body (1);
the drainage shell (5) is arranged at the bottom of the heat absorption plate (3) and is open at the top;
and the exhaust holes (6) penetrate through the opposite side walls of the drainage shell (5) at intervals.
3. A long-life aluminum-based circuit board according to claim 2, wherein said heat-absorbing element further comprises:
a plurality of heat dissipation plates (7) arranged on the bottom surface of the heat absorption plate (3);
and the plurality of heat dissipation channels (8) are positioned between the adjacent heat dissipation plates (7) and are communicated with the exhaust holes (6).
4. A long-life aluminum-based circuit board according to claim 2, wherein said heat-absorbing element further comprises:
and the heat dissipation columns (9) are fixedly arranged at the bottom of the inner cavity of the drainage shell (5).
5. A long-life aluminum-based circuit board according to any one of claims 2 to 4, characterized in that said heat-dissipating element comprises:
the communicating groove (10) penetrates through the circuit board body (1) from top to bottom and is communicated with the inner cavity of the drainage shell (5);
and the fan (11) is fixedly arranged above the circuit board body (1) through a plurality of mounting units.
6. A long-life aluminum-based circuit board according to claim 5, wherein said mounting unit comprises:
the bottom end of the strut (12) is fixedly arranged on the heat absorbing plate (3), and the top end of the strut movably penetrates through the circuit board body (1) and extends to the lower part of the fan (11);
a fastener (13) for fixedly connecting the fan (11) with a strut (12).
7. The long-life aluminum-based circuit board according to claim 6, wherein said mounting unit further comprises:
and the pipe sleeve (14) is sleeved on the outer side of the support post (12), and two ends of the pipe sleeve are respectively abutted against the bottom of the fan (11) and the top surface of the circuit board body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222653275.8U CN218783931U (en) | 2022-10-08 | 2022-10-08 | Aluminum-based circuit board with long service life |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222653275.8U CN218783931U (en) | 2022-10-08 | 2022-10-08 | Aluminum-based circuit board with long service life |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218783931U true CN218783931U (en) | 2023-03-31 |
Family
ID=85713566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222653275.8U Active CN218783931U (en) | 2022-10-08 | 2022-10-08 | Aluminum-based circuit board with long service life |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218783931U (en) |
-
2022
- 2022-10-08 CN CN202222653275.8U patent/CN218783931U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240410 Address after: 325204 North Industrial Park, Tangxia Town, Rui'an City, Wenzhou City, Zhejiang Province (Wenzhou Hongye Metal Co., Ltd.) Patentee after: Zhejiang Xinang Technology Co.,Ltd. Country or region after: China Address before: No. 128, Fengdu 3rd Road, International Automobile and Motorcycle Parts Industry Base, Rui'an City, Wenzhou City, Zhejiang Province, 325204 Patentee before: Ruian Chang'an Auto Parts Factory Country or region before: China |