CN219513056U

CN219513056U - DAF film tightening device for wafer detection

Info

Publication number: CN219513056U
Application number: CN202320480447.8U
Authority: CN
Inventors: 顾振鹏; 凌栋; 茅志敏
Original assignee: Suzhou Kangti Testing Technology Co ltd
Current assignee: Suzhou Kangti Testing Technology Co ltd
Priority date: 2023-03-14
Filing date: 2023-03-14
Publication date: 2023-08-11
Anticipated expiration: 2033-03-14

Abstract

The utility model discloses a DAF film tightening device for wafer detection, which comprises a wafer supporting seat for supporting a wafer main body, at least two compression tightening mechanisms for compressing and tightening an outer ring frame, wherein any compression tightening mechanism comprises a compression end, an adsorption micropore structure for adsorbing and fixing the wafer main body is arranged on the wafer supporting seat, and a plurality of material bearing alignment parts for bearing alignment are arranged on the peripheral wall of the wafer supporting seat. The utility model can realize the tight support of the DAF film on the wafer, meets the flatness of the surface to be detected of the wafer, and has smooth, effective and accurate visual detection. Through the design of the wafer supporting seat and the compression tightening mechanism which are matched through the associated transmission, the requirements of the relative linkage matching of the wafer supporting seat and the compression tightening mechanism are met, the driving is more reliable, stable and smooth, and the requirements of detection alignment adjustment and floating tightening matching are met. The whole design is succinct ingenious, possesses certain size compatibility, easily implants automatic check out test set, and supplementary operation is high-efficient smooth.

Description

DAF film tightening device for wafer detection

Technical Field

The utility model relates to a DAF film tightening device for wafer detection, and belongs to the technical field of wafer detection assistance.

Background

The DAF film is composed of two layers of adhesive surfaces and a middle layer of high heat conduction resin layer, one side of the adhesive surface is adhered to a semiconductor chip, is commonly used for packaging semiconductor elements, and can replace die bond adhesive. The method solves the problem that the existing soft solder and adhesive sheet used in the ultra-small and ultra-thin chip cannot be used for stacking and packaging. With the development of market demands of semiconductor power devices, ultra-small and ultra-thin chips and 3D stacked small-outline high-integration packages are the trend of development.

With the development of thinning and increasing capacity of smart phones and tablet computers, the requirements of thinning Flash Memory (Flash Memory) and Memory controller (Memory Controller) in the market are also continuously improved, so that the problems of processing and cutting of extremely thin wafers in the prior art are more challenging. The SDBG process can solve these problems and realize the following additional values. In order to meet the market demands of both 300mm and thin wafers in the market background of the increasing demand for thin wafers of 300mm, it has been developed how to reduce wafer breakage during handling and backside chipping during dicing, and to solve ultra-thin chip package solutions-Dicing Before Grinding (DBG) Process and Stealth Dicing Before Grinding (SDBG).

The wafer (Post Dicing wafer) after the normal dicing process, to which the DAF film is bonded, is tight, and similar to the case where the wafer (Post Dicing wafer) after dicing by these processes has a sagging DAF film, such a wafer includes a wafer body and an outer frame located at the periphery of the wafer body, the wafer body and the outer frame are provided with the DAF film, and a spacer connected by the DAF film is present between the wafer body and the outer frame. Because of the fact that the DAF film is loose, more complex reflections exist on the surface of the film during visual detection, which makes visual detection very difficult.

Disclosure of Invention

The utility model aims to solve the defects of the prior art, and provides a DAF film tightening device for wafer detection, aiming at solving the problem that the visual detection is greatly plagued by the collapse of a DAF film on a traditional wafer.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

a DAF film tightening device for wafer detection, wherein the wafer comprises a wafer main body and an outer ring frame,

the DAF film tightening device comprises a wafer supporting seat for supporting the wafer main body, at least two compression tightening mechanisms for compressing and tightening the outer ring frame, any compression tightening mechanism comprises a compression end,

the wafer supporting seat is provided with an adsorption micropore structure for adsorbing and fixing the wafer main body, and the peripheral wall of the wafer supporting seat is provided with a plurality of material supporting and aligning parts for supporting and aligning materials.

Preferably, the wafer support bracket and/or the pressure tightening mechanism includes a drive source for tightening or loosening the outer ring frame.

Preferably, a lifting driving source is arranged at the bottom of the wafer supporting seat, and the compression tightening mechanism comprises a fixed base for carrying the compression end.

Preferably, the fixed base is provided with a pivot rocker arm, one side of the free end of the pivot rocker arm is hinged with the wafer supporting seat, and the press-connection end is arranged on the pivot rocker arm.

Preferably, the pivot rocker arm is provided with a floating compression joint part with elastic displacement, and the compression joint end is arranged on the floating compression joint part.

Preferably, the floating crimping part comprises a floating pivot arm body arranged on the pivot rocker arm, and a floating spring is arranged between the floating pivot arm body and the pivot rocker arm.

Preferably, the pivot rocker arm is provided with a guide wheel seat for feeding support.

Preferably, the two sides of the wafer support seat are provided with the compression tightening mechanisms arranged in pairs, and relative adjustment displacement is arranged between the two compression tightening mechanisms.

The beneficial effects of the utility model are mainly as follows:

1. the method can realize the tight support of the DAF film on the wafer, meets the flatness of the surface to be detected of the wafer, and has smooth, effective and accurate visual detection.

2. Through the design of the wafer supporting seat and the compression tightening mechanism which are matched through the associated transmission, the requirements of the relative linkage matching of the wafer supporting seat and the compression tightening mechanism are met, the driving is more reliable, stable and smooth, and the requirements of detection alignment adjustment and floating tightening matching are met.

3. The whole design is succinct ingenious, possesses certain size compatibility, easily implants automatic check out test set, and supplementary operation is high-efficient smooth.

Drawings

Other features, objects and advantages of the present utility model will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:

fig. 1 is a schematic structural view of a DAF film tightening device for wafer inspection according to the present utility model.

Fig. 2 is a schematic view of another view angle structure of the DAF film tightening device for wafer inspection according to the present utility model.

Fig. 3 is a schematic side view of a DAF film tensioning apparatus for wafer inspection of the present utility model.

Fig. 4 is a schematic diagram of another side view of the DAF film tensioning apparatus for wafer inspection of the present utility model.

Description of the embodiments

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting of the utility model. It should be noted that, for convenience of description, only the portions related to the present utility model are shown in the drawings. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

The utility model provides a DAF film tightening device for wafer detection, which comprises a wafer main body and an outer ring frame, wherein the wafer main body is provided with a DAF film connected with the outer ring frame, and in some processes, the DAF film is loosened.

The DAF film tightening device comprises a wafer supporting seat 1 for supporting a wafer main body, at least two compression tightening mechanisms 2 for compressing and tightening an outer ring frame, wherein any compression tightening mechanism 2 comprises a compression end 20.

The wafer supporting seat 1 is provided with an adsorption micropore structure for adsorbing and fixing a wafer main body, and the peripheral wall of the wafer supporting seat is provided with a plurality of material supporting alignment parts 10 for supporting material alignment.

The specific implementation process and principle description:

when the wafer loading operation is carried out, the wafer is vertically and alternately loaded and fed by the ark box, the wafer is transferred to the DAF film tightening device after being subjected to negative pressure adsorption by the pick-up gripper, and the visual detection part is positioned at the top of the DAF film tightening device.

When the picking gripper is used for placing wafers, the material bearing alignment part 10 is used for carrying out relevant position adjustment matching, the wafers are placed after adjustment, the wafer main body is carried on the wafer bearing bracket 1 for adsorption fixation, and the outer ring frame is positioned at the bottoms of the two crimping ends 20.

The adsorption micropore structure is refined, dense vacuum micropores generated by material characteristics are formed in a bearing table on the wafer bearing seat 1, the wafer bearing seat belongs to the prior art, and vacuum adsorption is carried out through the adsorption micropore structure, so that uniform and stable adsorption of ultra-wave wafers with the thickness less than or equal to 100 mu m can be satisfied, and the phenomenon of uneven suction cracks on the ultra-thin wafers can be avoided.

When the placement is completed, the outer ring frame and the wafer main body are relatively displaced through the sinking action of the two compression joint ends 20 relative to the table top of the wafer supporting seat 1, so that the DAF film is pulled, the DAF film on the wafer main body is forced to be in a tight state, at the moment, the surface to be detected of the wafer is flat, and the visual detection is effective and reliable.

In one embodiment, the wafer support bracket and/or the pressure tightening mechanism is provided with a driving source for tightening or loosening the outer ring frame.

Specifically, three possible schemes exist, the first is: the wafer supporting seat is provided with lifting displacement and is relatively fixed by the compression tightening mechanism; the second is: the wafer supporting seat is relatively fixed, and the compression tightening mechanism is provided with lifting displacement; the third is: the wafer support base has lifting displacement, and the compression tightening mechanism also has lifting displacement.

Namely, after the wafer supporting seat supports and carries the wafer main body, the pressing end 20 can realize pressing relative stroke driving matching of the outer ring frame.

In one embodiment, the bottom of the wafer support bracket 1 is provided with a lifting driving source, and the compression tightening mechanism 2 comprises a fixed base 3 for carrying the compression end.

Namely, the lifting drive of the wafer supporting seat 1 is adopted to realize the relative tightening operation, specifically, the wafer supporting seat 1 descends when carrying out material bearing, the material passes through the feeding gap between the wafer supporting seat 1 and the compression joint end 20 to be carried, and after the wafer is fed, the wafer supporting seat 1 ascends to lift up the wafer main body, so that the tightening operation requirement is met.

The design of the lifting displacement of the wafer supporting seat 1 is adopted, so that the relative stroke adjustment and alignment requirements of the visual detection part can be met.

Of course, in the state where relative position adjustment exists, the proposal also provides that the tightening adjustment scheme can be realized. Specifically, as shown in fig. 1 and 2, the fixed base 3 is provided with a pivot arm 4, a free end side of the pivot arm 4 is hinged to the wafer support bracket, and the press-fit end 20 is provided on the pivot arm 4. The pivot rocker arm is provided with a floating compression joint part with elastic displacement, and the compression joint end is arranged on the floating compression joint part 5.

The specific implementation process and principle description:

that is, the matching design of the wafer supporting seat and the pivot rocker arm 4 is adopted, when the wafer supporting seat supports the material, the pivot rocker arm 4 is driven to pivot to move, so that the press-connection end 20 is higher than the table top of the wafer supporting seat, after the material is carried, the wafer supporting seat is lifted, the press-connection end 20 is relatively pressed down to the outer ring frame by utilizing the lever characteristic, and the floating press-connection part 5 provides a certain buffer stroke, so that the tightening of the floating press-connection part is more reliable, and meanwhile, the condition that the film body is damaged due to overpressure cannot occur.

In one embodiment, the floating crimp 5 includes a floating pivot arm disposed on the pivot rocker arm with a floating spring 50 disposed between the floating pivot arm and the pivot rocker arm.

Specifically, during normal feeding, the floating spring 50 is in a normal supporting state, the initial position requirement of the crimping end 20 is met, and when the crimping end 20 is subjected to a reverse acting force during the pressing operation, the reverse acting force enables the floating spring 50 to maintain a tensile elastic force recovery state, and the tightening requirement is met.

In one embodiment, the pivot rocker arm is provided with a guide wheel seat 6 for feeding support.

The guide wheel seat 6 plays a role in feeding, guiding, conveying and supporting, and meanwhile, after equipment detection and reset, the guide wheel seat can realize the reset bearing of the outer ring frame, and meets the matching requirement of the transfer bearing of the rear-end wafer.

In one embodiment, the wafer support bracket is provided with compression tightening mechanisms arranged in pairs on two sides, and relative adjustment displacement is arranged between the two compression tightening mechanisms.

Specifically, in general, the horizontal guide rod is used to realize the horizontal adjustment of the fixed base 3, so as to meet the requirement of the outer ring frame size matching of wafers with different diameter specifications, and certainly, a certain floating stroke can be provided, and when the wafers are carried, the outer ring frame is used for flaring matching, so that the relative matching is tighter and the relative matching position is more accurate.

Through the description, the DAF film tightening device for wafer detection can realize tightening support of the DAF film on the wafer, and meets the flatness of the surface to be detected of the wafer, so that the visual detection is smooth, effective and accurate. Through the design of the wafer supporting seat and the compression tightening mechanism which are matched through the associated transmission, the requirements of the relative linkage matching of the wafer supporting seat and the compression tightening mechanism are met, the driving is more reliable, stable and smooth, and the requirements of detection alignment adjustment and floating tightening matching are met. The whole design is succinct ingenious, possesses certain size compatibility, easily implants automatic check out test set, and supplementary operation is high-efficient smooth.

The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus/apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus/apparatus.

Thus far, the technical solution of the present utility model has been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of protection of the present utility model is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present utility model, and such modifications and substitutions will fall within the scope of the present utility model.

Claims

1. A DAF membrane tightening device for wafer detects, the wafer includes wafer main part and outer lane frame, its characterized in that:

2. The DAF film tensioning apparatus for wafer inspection of claim 1, wherein:

the wafer support bracket and/or the pressure tightening mechanism includes a driving source for tightening or loosening the outer ring frame.

3. The DAF film tensioning apparatus for wafer inspection of claim 2, wherein:

the bottom of the wafer supporting seat is provided with a lifting driving source, and the compression tightening mechanism comprises a fixed base used for carrying the compression end.

4. A DAF film tensioning apparatus for wafer inspection according to claim 3, wherein:

the fixing base is provided with a pivot rocker arm, one side of the free end of the pivot rocker arm is hinged with the wafer supporting seat, and the press-connection end is arranged on the pivot rocker arm.

5. The DAF film tensioning apparatus for wafer inspection of claim 4, wherein:

the pivot rocker arm is provided with a floating compression joint part with elastic displacement, and the compression joint end is arranged on the floating compression joint part.

6. The DAF film tensioning apparatus for wafer inspection of claim 5, wherein:

the floating crimping part comprises a floating pivot arm body arranged on the pivot rocker arm, and a floating spring is arranged between the floating pivot arm body and the pivot rocker arm.

7. The DAF film tensioning apparatus for wafer inspection of claim 4, wherein:

the pivot rocker arm is provided with a guide wheel seat for feeding support.

8. The DAF film tightening device for wafer inspection according to any one of claims 1 to 7, wherein:

the wafer supporting seat is characterized in that the two sides of the wafer supporting seat are provided with the compression tightening mechanisms which are arranged in pairs, and relative adjustment displacement is arranged between the two compression tightening mechanisms.