CN216413032U - Silicon wafer separating device - Google Patents
Silicon wafer separating device Download PDFInfo
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- CN216413032U CN216413032U CN202123269394.5U CN202123269394U CN216413032U CN 216413032 U CN216413032 U CN 216413032U CN 202123269394 U CN202123269394 U CN 202123269394U CN 216413032 U CN216413032 U CN 216413032U
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- conveyor
- sucker
- silicon wafer
- conveying
- cylinder
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 44
- 239000010703 silicon Substances 0.000 title claims abstract description 44
- 241000252254 Catostomidae Species 0.000 claims description 5
- 239000003292 glue Substances 0.000 abstract description 3
- 238000004026 adhesive bonding Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 30
- 238000000034 method Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses silicon chip burst device, which comprises a frame, be equipped with first conveyor and second conveyor in the frame, first conveyor includes a pair of conveyer belt, first conveyor's the top and bottom is equipped with first sucking disc device and second sucking disc device respectively, first sucking disc device includes lift cylinder and sucking disc, first conveyor top is equipped with image sensor and thickness sensor, first conveyor top is equipped with the translation cylinder of drive lift cylinder round trip movement between first conveyor and second conveyor. This burst device passes through image sensor n face and p face respectively to thickness sensor detects and whether glues the piece, and the sucking disc device that sets up about utilizing separates to gluing the piece, and then makes the silicon chip of p face up and n face up carry along two conveyor respectively, and then quick burst, and the automation level is high, improves burst efficiency, saves artifically, reduces bad piece rate.
Description
Technical Field
The application relates to the field of silicon wafer separation, in particular to a silicon wafer separation device.
Background
In the semiconductor production process, a semiconductor silicon wafer is divided into an n surface and a p surface after sintering, the n surfaces of adjacent silicon wafers are bonded together, the silicon wafers are manually sliced at present, and the bonded n surfaces are difficult to separate due to large sintering bonding force, so the silicon wafers are soaked by acid for a long time and then manually sliced, and even if the silicon wafers are soaked for a long time, the silicon wafers are easily damaged, and the slicing efficiency is low.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a silicon wafer slicing device to overcome the defects in the prior art.
In order to achieve the purpose, the utility model provides the following technical scheme:
the embodiment of the application discloses silicon chip burst device, its characterized in that: the automatic feeding device comprises a rack, a first conveying device and a second conveying device which are identical in structure are arranged on the rack side by side, the first conveying device comprises a pair of conveying belts which are arranged side by side, a gap is clamped between the pair of conveying belts, a first sucker device and a second sucker device which are identical in structure are arranged above and below the first conveying device respectively, the first sucker device comprises a lifting cylinder and a sucker, the sucker is arranged at the output end of the lifting cylinder, the lifting cylinder drives the sucker to extend into the gap, the two suckers of the first sucker device and the second sucker device are arranged in opposite directions, an image sensor is arranged above the first conveying device on the side, away from the conveying direction of the conveying belts, of the first sucker device, a thickness sensor is arranged above the first conveying device on the side, facing the image sensor, and a translation cylinder is arranged above the first conveying device, the translation cylinder drives the lifting cylinder of the first suction disc device to move back and forth between the first conveying device and the second conveying device.
Preferably, in the silicon wafer slicing device, the translation cylinder is fixedly connected with the frame through a connecting frame, a slide rail parallel to the translation cylinder is arranged on the connecting frame, the translation cylinder is a rodless cylinder, a moving plate is connected to the translation cylinder in a matching manner, the moving plate is connected with the slide rail in a sliding manner, and a lifting cylinder of the first suction cup device is fixed on the moving plate.
Preferably, in the above silicon wafer slicing apparatus, the chuck is a bernoulli chuck.
Preferably, in the silicon wafer slicing device, the thickness sensor is a high-precision contact type digital sensor.
Preferably, in the above silicon wafer slicing apparatus, the image sensor is connected to the frame through a support frame.
Preferably, in the above silicon wafer slicing apparatus, the second chuck device is fixed to the frame.
Compared with the prior art, the utility model has the advantages that:
this burst device passes through image sensor n face and p face respectively to thickness sensor detects and whether glues the piece, and the sucking disc device that sets up about utilizing separates to gluing the piece, and then makes the silicon chip of p face up and n face up carry along two conveyor respectively, and then quick burst, and the automation level is high, improves burst efficiency, saves artifically, reduces bad piece rate.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a silicon wafer slicing apparatus according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described in detail below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1, the silicon wafer slicing apparatus in this embodiment includes a frame 1, a first conveyor 2 and a second conveyor 3 with the same structure are arranged side by side on the frame 1, the first conveyor 2 includes a pair of conveyor belts 4 arranged side by side, a gap 5 is held between the pair of conveyor belts 4, a first chuck device 6 and a second chuck device 7 with the same structure are respectively arranged above and below the first conveyor 2, the first chuck device 6 includes a lifting cylinder 8 and a chuck 9, the chuck 9 is arranged at an output end of the lifting cylinder 8, the lifting cylinder 8 drives the chuck 9 to extend into the gap 5, the two chucks 9 of the first chuck device 6 and the second chuck device 7 are arranged opposite to each other, an image sensor 10 is arranged above the first conveyor 6 on a side of the first chuck device 6 facing away from a conveying direction of the conveyor belts 4, a thickness sensor 11 is arranged above the first conveyor 2 on a side of the first chuck device 6 facing the image sensor 10, a translation cylinder 12 is arranged above the first conveying device 6, and the translation cylinder 12 drives a lifting cylinder 8 of the first suction disc device 6 to move back and forth between the first conveying device 2 and the second conveying device 3.
Further, the translation cylinder 12 is fixedly connected with the rack 1 through a connecting frame 13, a sliding rail 14 parallel to the translation cylinder 12 is arranged on the connecting frame 13, the translation cylinder 12 is a rodless cylinder, a moving plate 15 is connected to the translation cylinder 12 in a matching manner, the moving plate 15 is connected with the sliding rail 14 in a sliding manner, and the lifting cylinder 8 of the first suction cup device 6 is fixed on the moving plate 15.
Further, the suction cup 9 is a bernoulli suction cup.
Further, the thickness sensor 10 is a high-precision contact digital sensor.
Further, the image sensor 11 is connected to the frame via a support frame 16.
Further, a second suction cup device 7 is fixed to the frame 1.
In this technical scheme, this burst device passes through image sensor n face and p face respectively to thickness sensor detects and whether glues the piece, and the sucking disc device that sets up from top to bottom is utilized and is separated the piece, and then makes the silicon chip that the p face is up and n face is up carry along two conveyor respectively, and then quick burst, and automatic level is high, improves burst efficiency, saves the manual work, reduces bad piece rate.
The specific implementation principle is as follows:
the silicon chip is sequentially conveyed along a pair of conveying belts of the first conveying device, and the image sensor detects whether the upward end face of the silicon chip is a p face;
1. if the silicon wafer is a p surface, the thickness sensor detects the thickness of the silicon wafer, the silicon wafer is adhered when the thickness exceeds the thickness of a single silicon wafer, the upper lifting cylinder and the lower lifting cylinder drive the suckers to move oppositely, the suckers act, the lifting cylinders move back to separate the adhered silicon wafers, the silicon wafer with the p surface facing upwards is conveyed to the second conveying device through the translation cylinder to be conveyed, and the lifting cylinder of the second sucker device drives the silicon wafer adsorbed by the suckers to be placed on the first conveying device to be conveyed;
2. if the silicon wafer is a p surface, the thickness sensor detects the thickness of the silicon wafer, the thickness is equal to the thickness of a single silicon wafer, the lifting cylinder of the first suction disc device drives the connected suction disc to descend to suck the silicon wafer on the first conveying belt, the silicon wafer is moved to the position above the second conveying device through the translation cylinder, and the silicon wafer is placed on the second conveying device to be conveyed;
3. if the number of the n surfaces is n, the n surfaces are directly conveyed along the first conveying device.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely a detailed description of the present application, and it should be noted that modifications and embellishments could be made by those skilled in the art without departing from the principle of the present application, and these should also be considered as the protection scope of the present application.
Claims (6)
1. A silicon wafer slicing device is characterized in that: the automatic feeding device comprises a rack, a first conveying device and a second conveying device which are identical in structure are arranged on the rack side by side, the first conveying device comprises a pair of conveying belts which are arranged side by side, a gap is clamped between the pair of conveying belts, a first sucker device and a second sucker device which are identical in structure are arranged above and below the first conveying device respectively, the first sucker device comprises a lifting cylinder and a sucker, the sucker is arranged at the output end of the lifting cylinder, the lifting cylinder drives the sucker to extend into the gap, the two suckers of the first sucker device and the second sucker device are arranged in opposite directions, an image sensor is arranged above the first conveying device on the side, away from the conveying direction of the conveying belts, of the first sucker device, a thickness sensor is arranged above the first conveying device on the side, facing the image sensor, and a translation cylinder is arranged above the first conveying device, the translation cylinder drives the lifting cylinder of the first suction disc device to move back and forth between the first conveying device and the second conveying device.
2. The silicon wafer slicing device according to claim 1, wherein: the translation cylinder is fixedly connected with the rack through a connecting frame, a sliding rail parallel to the translation cylinder is arranged on the connecting frame, the translation cylinder is a rodless cylinder, a moving plate is connected to the translation cylinder in a matched mode and is connected with the sliding rail in a sliding mode, and the lifting cylinder of the first suction cup device is fixed to the moving plate.
3. The silicon wafer slicing device according to claim 1, wherein: the suction cup is a Bernoulli suction cup.
4. The silicon wafer slicing device according to claim 1, wherein: the thickness sensor is a high-precision contact type digital sensor.
5. The silicon wafer slicing device according to claim 1, wherein: the image sensor is connected with the frame through a support frame.
6. The silicon wafer slicing device according to claim 1, wherein: the second sucker device is fixed on the frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123269394.5U CN216413032U (en) | 2021-12-21 | 2021-12-21 | Silicon wafer separating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123269394.5U CN216413032U (en) | 2021-12-21 | 2021-12-21 | Silicon wafer separating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216413032U true CN216413032U (en) | 2022-04-29 |
Family
ID=81285887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123269394.5U Active CN216413032U (en) | 2021-12-21 | 2021-12-21 | Silicon wafer separating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216413032U (en) |
-
2021
- 2021-12-21 CN CN202123269394.5U patent/CN216413032U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240319 Address after: No. 1001 Jingang Avenue, Yangshe Town, Zhangjiagang City, Suzhou City, Jiangsu Province, 215600 Patentee after: ZHANGJIAGANG ULTRASONIC & ELECTRIC Co.,Ltd. Country or region after: Zhong Guo Address before: Room 1, Lixiang village, yangshe Town, Zhangjiagang City, Suzhou City, Jiangsu Province Patentee before: ZHANGJIAGANG DECHANG AUTOMATIC TECHNOLOGY CO.,LTD. Country or region before: Zhong Guo |