CN219437230U - Multilayer printed circuit board capable of rapidly radiating heat - Google Patents
Multilayer printed circuit board capable of rapidly radiating heat Download PDFInfo
- Publication number
- CN219437230U CN219437230U CN202320411507.0U CN202320411507U CN219437230U CN 219437230 U CN219437230 U CN 219437230U CN 202320411507 U CN202320411507 U CN 202320411507U CN 219437230 U CN219437230 U CN 219437230U
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- China
- Prior art keywords
- circuit board
- frame
- radiating
- fixedly connected
- multilayer printed
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a multilayer printed circuit board capable of rapidly radiating, which comprises a circuit board frame and a plurality of circuit boards stacked and installed in the circuit board frame, wherein the circuit board comprises a circuit board body, a plurality of uniformly distributed ventilation grooves and radiating grooves are formed in two sides of the circuit board body, the ventilation grooves penetrate through the circuit board body, the ventilation grooves are mutually perpendicular to the radiating grooves, and a radiating channel is provided for the circuit board body stacked in multiple layers through the design of the ventilation grooves and the radiating grooves, so that the rapid radiating function of the circuit board is realized.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a multilayer printed circuit board capable of rapidly radiating heat.
Background
Printed wiring boards, for the production of which many designers do not know the production process of the wiring board, are designed as the most basic wiring diagrams and cannot be directly used for production. Therefore, the line file needs to be modified and edited before actual production, and not only a film diagram which can be suitable for the production process of the factory needs to be manufactured, but also corresponding punching data, die opening data and other data which are useful for production need to be manufactured. It is directly related to various production engineering.
With the increasing intellectualization of electric appliances, a multilayer printed circuit board needs to be designed to meet the circuit design requirement of the electric appliances, but in the prior art, the multilayer printed circuit board is very unfavorable for heat dissipation due to the stacked placement, so that a multilayer printed circuit board with rapid heat dissipation needs to be designed.
Disclosure of Invention
The utility model aims to provide a multilayer printed circuit board capable of rapidly radiating heat, which solves the problems encountered in practical use.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides a quick radiating multilayer printed wiring board, includes circuit board frame and a plurality of circuit board of piling up and installing in the circuit board frame, the circuit board includes the circuit board body, and a plurality of evenly distributed's ventilation slot and heat dissipation groove have all been seted up to the both sides of circuit board body, and ventilation slot runs through the circuit board body, and ventilation slot and heat dissipation groove mutually perpendicular, through ventilation slot and heat dissipation groove's design, provide the heat dissipation passageway for the circuit board body that the multilayer piles up to realize the quick heat dissipation function of circuit board.
Preferably: the circuit grillage includes the cooling frame that the level set up, the equal fixedly connected with of both ends of cooling frame is vertical to be set up the leading truck, the spout has been seted up in the leading truck, the leading truck passes through the both ends sliding connection of the lifting frame that spout and level set up, the lifting frame is established to open-ended square frame for one side, the equal sliding connection in both ends of lifting frame opening part has movable clamp plate, and the tip bottom surface fixedly connected with vertical setting's of movable clamp plate locating lever, the equal fixedly connected with support frame in bottom both ends of cooling frame, sliding connection has movable support plate in the support frame, the middle part of lifting frame and the threaded rod threaded connection of vertical setting, the bottom and the supporting shoe rotation of threaded rod are connected, supporting shoe fixed connection is on the cooling frame, the top fixedly connected with handle of threaded rod, it rotates the threaded rod to be convenient through the handle.
In actual use, the handle drives the threaded rod to rotate, and the height of the lifting frame is freely adjusted through the action of threaded connection between the threaded rod and the lifting frame, so that the distance between the lifting frame and the supporting frame is adjusted, the lifting frame is suitable for clamping and fixing circuit boards with different thicknesses and different numbers, and the practicability of the lifting frame is improved.
Preferably: the inside of heat dissipation frame has offered a plurality of evenly distributed's louvres, equal fixedly connected with radiator fan in the louvre, and radiator fan is by municipal power supply system power supply, in the in-service use, through radiator fan's setting, can effectively improve the radiating effect of circuit board.
Preferably: the direction of the heat dissipation frame and the direction of the ventilation groove are mutually perpendicular.
Preferably: the circuit board body is provided with a mounting groove for pressing in the lifting frame and the movable pressing plate, and two ends of the mounting groove are provided with positioning holes for the positioning rods to penetrate through the circuit board body.
When the circuit board is disassembled, overhauled and replaced, the threaded rod is driven to rotate through the handle, the height of the lifting frame is adjusted through the threaded rod until the locating rod is separated from the circuit board body, and the operation is simple and convenient.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, through the design of the ventilation groove and the heat dissipation groove, a heat dissipation channel is provided for the circuit board body stacked in multiple layers, so that the rapid heat dissipation function of the circuit board is realized.
According to the utility model, the disassembly structure of the circuit board is designed, so that the operation is simple and convenient, and the working difficulty of staff is effectively reduced when the circuit board is overhauled and replaced.
Drawings
Fig. 1 is a schematic structural diagram of a fast heat dissipation multi-layer printed wiring board.
Fig. 2 is a schematic structural view of a circuit board frame of a multilayer printed circuit board for rapid heat dissipation.
Fig. 3 is a schematic diagram of a circuit board in a multilayer printed circuit board with rapid heat dissipation.
As shown in the figure: 1. a circuit board rack; 2. a circuit board; 3. a guide frame; 4. a lifting frame; 5. a heat dissipation frame; 6. a screw rod; 7. a support block; 8. a heat radiation hole; 9. a chute; 10. a support frame; 11. a movable support plate; 12. a positioning rod; 13. a movable pressing plate; 14. a handle; 15. a circuit board body; 16. a mounting groove; 17. a ventilation groove; 18. a heat sink; 19. and positioning holes.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
Referring to fig. 1 to 3, in the embodiment of the present utility model, a fast heat dissipation multilayer printed circuit board includes a circuit board frame 1 and a plurality of circuit boards 2 stacked in the circuit board frame 1, the circuit board 2 includes a circuit board body 15, a plurality of uniformly distributed ventilation slots 17 and heat dissipation slots 18 are formed on both sides of the circuit board body 15, the ventilation slots 17 penetrate the circuit board body 15, and the ventilation slots 17 and the heat dissipation slots 18 are mutually perpendicular, and through the design of the ventilation slots 17 and the heat dissipation slots 18, heat dissipation channels are provided for the circuit board body 15 stacked in multiple layers, thereby realizing the fast heat dissipation function of the circuit board.
The circuit grillage 1 includes the cooling frame 5 that the level set up, the equal fixedly connected with of both ends of cooling frame 5 is vertical the leading truck 3 of setting, spout 9 has been seted up in the leading truck 3, the leading truck 3 passes through the both ends sliding connection of spout 9 and the crane 4 that the level set up, the both ends of crane 4 opening part are all sliding connection has movable clamp plate 13 for establishing to open-ended square frame on one side, and the tip bottom surface fixedly connected with locating lever 12 of vertical setting of movable clamp plate 13, the equal fixedly connected with support frame 10 in bottom both ends of cooling frame 5, sliding connection has movable backup pad 11 in support frame 10, the middle part and the threaded rod 6 threaded connection of vertical setting of crane 4, the bottom and the supporting shoe 7 rotation of threaded rod 6 are connected, supporting shoe 7 fixedly connected with is on cooling frame 5, the top fixedly connected with handle 14 of threaded rod 6, it is convenient to rotate threaded rod 6 through handle 14.
In practical use, the handle 14 drives the threaded rod 6 to rotate, and the height of the lifting frame 4 is freely adjusted through the threaded connection between the threaded rod 6 and the lifting frame 4, so that the distance between the lifting frame 4 and the supporting frame 10 is adjusted, and the lifting frame is suitable for clamping and fixing circuit boards 2 with different thicknesses and different numbers, and the practicability of the lifting frame is improved.
The inside of heat dissipation frame 5 has offered a plurality of evenly distributed's louvre 8, all fixedly connected with radiator fan (not shown in the figure) in the louvre 8, and radiator fan is by municipal power supply system power supply, in the in-service use, through radiator fan's setting, can effectively improve the radiating effect of circuit board 2.
The direction of the heat dissipation frame 5 and the direction of the ventilation groove 17 are mutually perpendicular.
The circuit board body 15 is provided with a mounting groove 16 for pressing in the lifting frame 4 and the movable pressing plate 13, and two ends of the mounting groove 16 are provided with positioning holes 19 for the positioning rods 12 to penetrate through the circuit board body 15.
It should be noted that, when the circuit board is disassembled, overhauled and replaced, the handle 12 drives the threaded rod 6 to rotate, the threaded rod 6 adjusts the height of the lifting frame 4 until the positioning rod 12 is separated from the circuit board body 15, and the operation is simple and convenient.
Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.
Claims (5)
1. The utility model provides a quick radiating multilayer printed wiring board, includes circuit board frame (1) and a plurality of circuit board (2) of piling up and installing in circuit board frame (1), a serial communication port, circuit board (2) are including circuit board body (15), and a plurality of evenly distributed's ventilation groove (17) and heat dissipation groove (18) have all been seted up on the both sides of circuit board body (15), and ventilation groove (17) run through circuit board body (15), and ventilation groove (17) and heat dissipation groove (18) mutually perpendicular.
2. The multilayer printed circuit board capable of rapidly radiating according to claim 1, wherein the circuit board frame (1) comprises a horizontally arranged radiating frame (5), two ends of the radiating frame (5) are fixedly connected with a vertically arranged guide frame (3), a sliding groove (9) is formed in the guide frame (3), the guide frame (3) is in sliding connection with two ends of a horizontally arranged lifting frame (4) through the sliding groove (9), the lifting frame (4) is a square frame with one side being provided with an opening, two ends of the opening of the lifting frame (4) are fixedly connected with movable pressing plates (13), the bottom end bottom surface of the movable pressing plates (13) is fixedly connected with a locating rod (12) which is vertically arranged, two ends of the bottom of the radiating frame (5) are fixedly connected with a supporting frame (10), the middle of the lifting frame (4) is in threaded connection with a vertically arranged threaded rod (6), the bottom end of the threaded rod (6) is rotationally connected with a supporting block (7), the supporting block (7) is fixedly connected with a handle (14) which is fixedly connected with the top end of the threaded rod (6).
3. The rapid radiating multilayer printed circuit board according to claim 2, wherein a plurality of uniformly distributed radiating holes (8) are formed in the radiating frame (5), and radiating fans are fixedly connected in the radiating holes (8).
4. A fast cooling multilayer printed wiring board according to claim 2, characterized in that the cooling rack (5) and the ventilation slot (17) are oriented perpendicular to each other.
5. The rapid heat dissipation multilayer printed circuit board according to claim 1, wherein the circuit board body (15) is provided with a mounting groove (16) for pressing in the lifting frame (4) and the movable pressing plate (13), and both ends of the mounting groove (16) are provided with positioning holes (19) for the positioning rods (12) to penetrate through the circuit board body (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320411507.0U CN219437230U (en) | 2023-02-28 | 2023-02-28 | Multilayer printed circuit board capable of rapidly radiating heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320411507.0U CN219437230U (en) | 2023-02-28 | 2023-02-28 | Multilayer printed circuit board capable of rapidly radiating heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219437230U true CN219437230U (en) | 2023-07-28 |
Family
ID=87344707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320411507.0U Active CN219437230U (en) | 2023-02-28 | 2023-02-28 | Multilayer printed circuit board capable of rapidly radiating heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219437230U (en) |
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2023
- 2023-02-28 CN CN202320411507.0U patent/CN219437230U/en active Active
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