CN219267227U - Display module assembly for improving conductive double-sided adhesive performance - Google Patents
Display module assembly for improving conductive double-sided adhesive performance Download PDFInfo
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- CN219267227U CN219267227U CN202320077964.0U CN202320077964U CN219267227U CN 219267227 U CN219267227 U CN 219267227U CN 202320077964 U CN202320077964 U CN 202320077964U CN 219267227 U CN219267227 U CN 219267227U
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Abstract
The utility model discloses a display module for improving conductive double-sided adhesive performance, which is applied to screen display technology and comprises a backlight iron frame, grid lines, conductive double-sided adhesive and an FPC flexible circuit board, wherein the grid lines are arranged on the backlight iron frame, the FPC flexible circuit board is provided with a copper exposure area, and the copper exposure area of the FPC flexible circuit board is covered on the grid lines through conductive double-sided adhesive. The conductive double-sided adhesive bonding method is characterized in that some grid lines are manufactured at the conductive double-sided adhesive bonding position on the surface of the backlight iron frame, the conductive double-sided adhesive is bonded on the grid lines, after the conductive double-sided adhesive is bonded and pressure-maintaining, the conductive pressure-sensitive adhesive fully enters the grooves of the grid lines, the bonding area of the conductive double-sided adhesive and the iron frame is greatly increased, the conductive double-sided adhesive bonding performance is improved, the problems of detachment and warping of a copper exposure area of the FPC flexible circuit board are prevented, the production efficiency is ensured to be stable, the ESD is effectively dredged, the main screen is protected, and the IC chip is protected.
Description
Technical Field
The utility model relates to the technical field of screen display, in particular to a display module capable of improving the conductive double-sided adhesive performance.
Background
In order to dredge ESD (electrostatic discharge), a window is usually opened on the back of a main screen FPC flexible circuit board to expose copper, a copper exposure area is adhered to a backlight iron frame through conductive double-sided adhesion, and grounding is achieved.
As disclosed in chinese patent (CN 215526303U), a backlight module for improving ESD of a mobile phone display module is disclosed, which includes a backlight iron frame and an FPC flexible circuit board bent to the back of the backlight iron frame, the back of the backlight iron frame and the FPC flexible circuit board are adhered and fixed by a conductive double-sided adhesive, a copper leakage site is disposed on the adhesion surface of the FPC flexible circuit board, the conductive double-sided adhesive includes a conductive region and a nonconductive region, the conductive region corresponds to the copper leakage site of the FPC flexible circuit board, and the region of the conductive double-sided adhesive except the conductive region is a nonconductive region. After the back light iron frame and the FPC flexible circuit board are fixed through the conductive double-sided adhesive tape, only the copper leakage position of the FPC flexible circuit board can be conducted with the back light iron frame through the conductive area, the non-copper leakage position area of the FPC flexible circuit board is adhered to the non-conductive area, so that other circuits of the FPC flexible circuit board can be prevented from being conducted with the back light iron frame through the conductive double-sided adhesive tape, static electricity can be conducted to the FPC flexible circuit board through the back light iron frame to be grounded and released, other circuits of the FPC flexible circuit board cannot be crosstalked, and the ESD resistance of a single body is improved.
However, when the present inventors embodied this device, the following drawbacks were found to exist: at present, the surface of a general backlight iron frame in the industry is not treated at all, and the risk that the adhesion of the conductive double sides is unstable due to the reduction of the dyne value of an adhesion interface caused by improper treatment of the backlight iron frame, improper treatment of a copper exposure area of an FPC flexible circuit board or pollution is caused.
Disclosure of Invention
Based on the above, it is necessary to provide a display module with improved conductive double-sided adhesive performance, which comprises a backlight iron frame, grid lines, conductive double-sided adhesive and an FPC flexible circuit board, wherein the grid lines are arranged on the backlight iron frame, the FPC flexible circuit board is provided with a copper exposure area, and the copper exposure area of the FPC flexible circuit board is covered on the grid lines through the conductive double-sided adhesive. The method is characterized in that grid lines are manufactured at positions where the conductive double-sided adhesive tape is stuck on the surface of the backlight iron frame. The grid lines can be manufactured by laser etching or liquid medicine etching or machining, the conductive double-sided adhesive is adhered to the grid lines, after the conductive double-sided adhesive is adhered and pressure maintaining, the conductive pressure-sensitive adhesive fully enters the grooves of the grid lines, the adhesion area of the conductive double-sided adhesive and the iron frame is greatly improved, and the conductive double-sided adhesive adhesion performance is improved.
In order to solve the technical problems, the utility model adopts the following technical scheme:
a display module for improving the adhesion performance of conductive double-sided adhesive is applied to the screen display technology.
The display module for improving the conductive double-sided adhesive performance specifically comprises:
the flexible printed circuit board comprises a backlight iron frame, grid lines and conductive double-sided adhesive and FPC flexible printed circuit boards, wherein the grid lines are arranged on the backlight iron frame, the FPC flexible printed circuit board is provided with a copper exposure area, and the copper exposure area of the FPC flexible printed circuit board is covered on the grid lines through the conductive double-sided adhesive and adhesive.
As a preferred implementation mode of the display module capable of improving the conductive double-sided adhesive performance, the grid lines comprise a plurality of grid warp threads and a plurality of grid weft threads which are arranged on the backlight iron frame, the grid warp threads are perpendicular to the grid weft threads and the upper edge and the lower edge of the backlight iron frame, the grid weft threads are perpendicular to the left edge and the right edge of the backlight iron frame, all the grid warp threads are parallel to each other, and all the grid weft threads are parallel to each other.
As a preferred embodiment of the display module for improving the conductive double-sided adhesive performance, the grid warp and the grid weft are provided with at least one groove.
As a preferred implementation mode of the display module capable of improving the adhesion performance of the conductive double-sided adhesive, the conductive double-sided adhesive comprises a release film, a first conductive pressure-sensitive adhesive, conductive cloth and a second conductive pressure-sensitive adhesive which are sequentially arranged from top to bottom.
As a preferred implementation mode of the display module capable of improving the conductive double-sided adhesive performance, the first conductive pressure-sensitive adhesive is attached to the copper exposure area of the FPC, and the second conductive pressure-sensitive adhesive is attached to the grid lines on the backlight iron frame.
As a preferred implementation mode of the display module capable of improving the conductive double-sided adhesive property, the conductive double-sided adhesive is 0.05MM ultrathin conductive double-sided adhesive.
As a preferred embodiment of the display module for improving the conductive double-sided adhesive performance, the grid lines are arranged in the middle and lower parts of the surface of the backlight iron frame.
As a preferred embodiment of the display module for improving the conductive double-sided adhesive performance, the grid lines are rectangular.
As a preferred implementation mode of the display module capable of improving the conductive double-sided adhesive performance, the areas of the grid lines are in one-to-one correspondence with the copper exposure areas of the FPC and the conductive double-sided adhesive.
As an optimized implementation mode of the display module capable of improving the conductive double-sided adhesive performance, the backlight iron frame is further provided with a cover plate, and the backlight iron frame is arranged on the cover plate.
Compared with the prior art, the utility model has the following beneficial effects:
comprises a backlight iron frame, grid lines, conductive double-sided adhesive and FPC flexible circuit boards, wherein the grid lines are arranged on the backlight iron frame
And on the frame, the FPC flexible circuit board is provided with a copper exposure area, and the copper exposure area of the FPC flexible circuit board is adhered and covered on the grid line through the double sides of the conductive 5. The method is characterized in that a plurality of grids are manufactured at positions of conducting double-sided adhesive bonding on the surface of a backlight iron frame
The wire and the grid line can be manufactured by adopting a laser etching or liquid medicine etching or machining mode, the conductive double-sided adhesive is adhered to the grid line, after the conductive double-sided adhesive is adhered and pressure maintaining, the conductive pressure-sensitive adhesive fully enters the grooves of the grid line, the adhesion area of the conductive double-sided adhesive and the iron frame is greatly improved, and the adhesion performance of the conductive double-sided adhesive is improved, so that the backlight iron frame is prevented from being treated incorrectly
When the copper exposing area of the FPC flexible circuit board is improperly treated or polluted to cause the problem of reduction of the dyne value of the bonding interface, 0, thereby preventing the copper exposing area of the FPC flexible circuit board from being separated and tilted, ensuring the stable production efficiency and ensuring that the bonding interface is stable
The ESD is effectively dredged, so that the main screen is protected, and the IC chip is protected.
Drawings
In order to more clearly illustrate the aspects of the present utility model, the drawings that are required to be used in the description of the embodiments will be described below
It will be apparent from the following description that the drawings are examples of embodiments of the utility model, and that other drawings may be made by those skilled in the art without the benefit of the inventive faculty.
Fig. 1 is a schematic structural diagram of a display module for improving the adhesion performance of conductive double-sided adhesive tape according to the present utility model;
FIG. 2 is an enlarged view of a portion of the grid lines of FIG. 1;
FIG. 3 is a schematic view of the structure of the FPC flexible circuit board of the present utility model;
fig. 4 is a schematic cross-sectional view of the utility model.
The labels in figure 0 are illustrated below:
the back light iron frame 1, grid lines 2, conductive double-sided adhesive 3, FPC flexible circuit board 4, copper exposure area 5, grid warp 21, grid weft 22, groove 23, release film 31, first conductive pressure-sensitive adhesive 32, conductive cloth 33, second conductive pressure-sensitive adhesive 34 and cover plate 6.
Detailed Description
In order to make the present utility model better understood by those skilled in the art, the following description will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
0 as in the background art, the surface of the backlight iron frame 1 commonly used in the industry at present is not treated, and the risk that the backlight iron frame is inappropriately treated, the copper exposure area 5 of the FPC flexible circuit board 4 is inappropriately treated or polluted, so that the dyne value of the bonding interface is reduced and the conductive double-sided adhesive 3 is not firmly bonded exists.
In order to solve the technical problem, the utility model provides a display module for improving the conductive double-sided adhesive performance, which is applied to a screen display technology.
Specifically, referring to fig. 1 and 3, a display module for improving the adhesion performance of conductive double-sided adhesive tape specifically includes:
the flexible printed circuit board comprises a backlight iron frame 1, grid lines 2, conductive double-sided adhesive tapes 3 and an FPC flexible printed circuit board 4, wherein the grid lines 2 are arranged on the backlight iron frame 1, the FPC flexible printed circuit board 4 is provided with copper exposure areas 5, and the copper exposure areas 5 of the FPC flexible printed circuit board 4 are adhered and covered on the grid lines 2 through the conductive double-sided adhesive tapes 3. The method is characterized in that grid lines 2 are manufactured at the positions where the conductive double-sided adhesive 3 is adhered to the surface of the backlight iron frame 1, the grid lines 2 can be manufactured by adopting a laser etching or liquid medicine etching or machining mode, the conductive double-sided adhesive 3 is adhered to the grid lines 2, after the conductive double-sided adhesive 3 is adhered and maintained, the conductive pressure-sensitive adhesive fully enters the grooves 23 of the grid lines 2, the adhering area of the conductive double-sided adhesive 3 and the iron frame is greatly increased, the adhering performance of the conductive double-sided adhesive 3 is improved, and therefore the condition that the FPC flexible circuit board 4 fails due to copper exposure and grounding is avoided, ESD is effectively dredged, a main screen is protected, and an IC chip is protected.
In order to make the person skilled in the art better understand the solution of the present utility model, the technical solution of the embodiment of the present utility model will be clearly and completely described below with reference to the accompanying drawings.
It should be noted that, under the condition of no conflict, the embodiments of the present utility model and the features and technical solutions in the embodiments may be combined with each other.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
Example 1
Referring to fig. 1-3, a display module for improving the adhesion performance of conductive double-sided adhesive includes a backlight frame 1, grid lines 2, conductive double-sided adhesive 3, and an FPC flexible circuit board 4, wherein the grid lines 2 are disposed on the backlight frame 1, the FPC flexible circuit board 4 is provided with a copper exposure area 5, and the copper exposure area 5 of the FPC flexible circuit board 4 is adhered and covered on the grid lines 2 through the conductive double-sided adhesive 3.
Specifically, the grid lines 2 include a plurality of grid warp threads 21 and a plurality of grid weft threads 22 which are arranged on the backlight iron frame 1, the grid warp threads 21 are perpendicular to the grid weft threads 22 and the upper and lower edges of the backlight iron frame 1, the grid weft threads 22 are perpendicular to the left and right edges of the backlight iron frame 1, all the grid warp threads 21 are parallel to each other, and all the grid weft threads 22 are parallel to each other.
Specifically, the grid warp 21 and the grid weft 22 are provided with at least one groove 23.
The iron frame 1 is used for providing the ground place for FPC flexible circuit board 4, a plurality of net warp 21 and a plurality of net weft 22 in the gridlines 2 have increased more horizontal and vertical lines for the iron frame 1 in a poor light, and the recess 23 that its centers on out can be better with the abundant absorption of conductive thermosensitive adhesive in the conductive double faced adhesive 3, has promoted the bonding area of conductive double faced adhesive 3 and iron frame by a wide margin to make FPC flexible circuit board 4 can be more firm and the omnidirectional paste in no dead angle on the iron frame 1 in a poor light, thereby better dredge ESD (electrostatic discharge).
According to the display module capable of improving the conductive double-sided adhesive performance, the grid lines 2 are arranged on the backlight iron frame 1, the conductive double-sided adhesive 3 is absorbed better through the grid lines 2, so that the backlight iron frame 1 and the FPC flexible circuit board 4 are bonded better, the problem that the bonding interface dyne value is reduced due to improper treatment of the backlight iron frame 1, improper treatment of the copper exposing area 5 of the FPC flexible circuit board 4 or pollution is prevented, the problem that the copper exposing area 5 of the FPC flexible circuit board 4 breaks away from and warps is prevented, the main screen is protected, the IC chip is protected, and the production efficiency is guaranteed to be stable.
Example 2
The display module for improving the adhesion performance of the conductive double-sided adhesive according to embodiment 1 is further optimized, specifically, as shown in fig. 1 to 4, the conductive double-sided adhesive 3 includes a release film 31, a first conductive pressure-sensitive adhesive 32, a conductive fabric 33 and a second conductive pressure-sensitive adhesive 34 sequentially disposed from top to bottom.
Specifically, the first conductive pressure-sensitive adhesive 32 is attached to the copper exposure area 5 of the FPC flexible circuit board 4, and the second conductive pressure-sensitive adhesive 34 is attached to the grid lines 2 on the backlight frame 1.
Specifically, the conductive double-sided adhesive tape 3 is 0.05MM ultrathin conductive double-sided adhesive tape 3.
Through the above structural design, the release film 31 is torn, the first conductive pressure-sensitive adhesive 32 can be attached to the copper exposing area 5 of the FPC flexible circuit board 4, the second conductive pressure-sensitive adhesive 34 is attached to the grid lines 2 on the backlight iron frame 1, the release film 31 can be a PET high-brightness film or a PET transfer film, and the conductive pressure-sensitive adhesive is used for leading ESD to the backlight iron frame 1.
Example 3
Further optimizing a display module for improving the conductive double-sided adhesive property provided in embodiment 1 or 2, as shown in fig. 1 to 4, the grid lines 2 are disposed in the lower part of the surface of the backlight frame 1.
Specifically, the grid lines 2 are rectangular in shape.
Specifically, the area of the grid line 2 corresponds to the copper exposure area 5 of the FPC flexible circuit board 4 and the shape and the size of the conductive double-sided adhesive tape 3 one by one.
Specifically, the backlight iron frame 1 is further provided with a cover plate 6, and the backlight iron frame 1 is arranged on the cover plate 6.
The cover plate 6 is used for fixedly connecting the backlight iron frame 1, so that the problem that the copper exposing area 5 of the FPC flexible circuit board 4 breaks away from and warps is solved, the shape and the size of the grid line 2 and the shape and the size of the conductive double-sided adhesive 3 are strictly set according to the shape and the size of the copper exposing area 5 of the FPC flexible circuit board 4, the ESD leakage is avoided, in addition, the thickness, the depth and the density of the grid line 2 can be adjusted according to the requirement, and the problem that the bonding interface dyne value is reduced due to improper treatment of the backlight iron frame 1, improper treatment of the copper exposing area 5 of the FPC flexible circuit board 4 or pollution is avoided, the problem that the copper exposing area 5 of the FPC flexible circuit board 4 breaks away from and warps is solved, the production efficiency is ensured to be stable, the ESD is effectively dredged, the main screen is protected, and the IC chip is protected.
The use process of the display module for improving the conductive double-sided adhesive performance provided by the utility model is as follows:
firstly, setting the grid lines 2 at the middle lower part of the backlight iron frame 1 by adopting a laser etching or liquid medicine etching or machining mode, pasting the conductive double-sided adhesive 3 on the copper exposure area 5 of the FPC flexible circuit board 4, tearing the release film 31, pasting the FPC flexible circuit board 4 pasted with the conductive double-sided adhesive 3 on the grid lines 2, and enabling the copper exposure area 5 of the FPC flexible circuit board 4 to correspond to the areas of the grid lines 2 one by one.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
It is apparent that the above-described embodiments are only some embodiments of the present utility model, but not all embodiments, and the preferred embodiments of the present utility model are shown in the drawings, which do not limit the scope of the patent claims. This utility model may be embodied in many different forms, but rather, embodiments are provided in order to provide a thorough and complete understanding of the present disclosure. Although the utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing description, or equivalents may be substituted for elements thereof. All equivalent structures made by the content of the specification and the drawings of the utility model are directly or indirectly applied to other related technical fields, and are also within the scope of the utility model.
Claims (10)
1. The utility model provides a promote conductive double-sided sticky performance's display module assembly, its characterized in that includes backlight frame (1), gridline (2), conductive double-sided sticky (3), FPC flexible circuit board (4), gridline (2) set up backlight frame (1) is last, FPC flexible circuit board (4) are provided with and reveal copper district (5), FPC flexible circuit board (4) reveal copper district (5) are passed through conductive double-sided sticky (3) bonding cover on gridline (2).
2. The display module for improving the conductive double-sided adhesive performance according to claim 1, wherein the grid lines (2) comprise a plurality of grid warp threads (21) and a plurality of grid weft threads (22) which are arranged on the backlight iron frame (1), the grid warp threads (21) are perpendicular to the grid weft threads (22) and the upper and lower edges of the backlight iron frame (1), the grid weft threads (22) are perpendicular to the left and right edges of the backlight iron frame (1), all the grid warp threads (21) are parallel to each other, and all the grid weft threads (22) are parallel to each other.
3. A display module for improving the adhesion properties of electrically conductive double-sided tape according to claim 2, characterized in that the grid warp (21) and the grid weft (22) are provided with at least one groove (23).
4. The display module for improving the adhesion performance of the conductive double-sided adhesive according to claim 1, wherein the conductive double-sided adhesive (3) comprises a release film (31), a first conductive pressure-sensitive adhesive (32), a conductive cloth (33) and a second conductive pressure-sensitive adhesive (34) which are sequentially arranged from top to bottom.
5. The display module assembly for improving the adhesion performance of the conductive double-sided tape according to claim 4, wherein the first conductive pressure-sensitive adhesive (32) is attached to the copper exposure area (5) of the FPC flexible circuit board (4), and the second conductive pressure-sensitive adhesive (34) is attached to the grid lines (2) on the backlight iron frame (1).
6. The display module for improving the adhesion performance of the conductive double-sided adhesive tape according to claim 1, wherein the conductive double-sided adhesive tape (3) is 0.05MM ultrathin conductive double-sided adhesive tape (3).
7. The display module for improving the adhesion performance of the conductive double-sided adhesive according to claim 1, wherein the grid lines (2) are arranged in the middle and below the surface of the backlight iron frame (1).
8. The display module assembly for improving the adhesion performance of the conductive double-sided adhesive tape according to claim 1, wherein the grid lines (2) are rectangular.
9. The display module for improving the adhesion performance of the conductive double-sided adhesive tape according to claim 1, wherein the area of the grid line (2) corresponds to the copper exposure area (5) of the flexible printed circuit (4) of the FPC in a one-to-one correspondence to the shape and the size of the conductive double-sided adhesive tape (3).
10. The display module for improving the conductive double-sided adhesive performance according to claim 1, wherein the backlight iron frame (1) is further provided with a cover plate (6), and the backlight iron frame (1) is arranged on the cover plate (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320077964.0U CN219267227U (en) | 2023-01-10 | 2023-01-10 | Display module assembly for improving conductive double-sided adhesive performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320077964.0U CN219267227U (en) | 2023-01-10 | 2023-01-10 | Display module assembly for improving conductive double-sided adhesive performance |
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| Publication Number | Publication Date |
|---|---|
| CN219267227U true CN219267227U (en) | 2023-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320077964.0U Active CN219267227U (en) | 2023-01-10 | 2023-01-10 | Display module assembly for improving conductive double-sided adhesive performance |
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| Country | Link |
|---|---|
| CN (1) | CN219267227U (en) |
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2023
- 2023-01-10 CN CN202320077964.0U patent/CN219267227U/en active Active
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