CN219421167U - FPC module capable of avoiding steel sheet reinforcement grounding failure - Google Patents
FPC module capable of avoiding steel sheet reinforcement grounding failure Download PDFInfo
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- CN219421167U CN219421167U CN202320584758.9U CN202320584758U CN219421167U CN 219421167 U CN219421167 U CN 219421167U CN 202320584758 U CN202320584758 U CN 202320584758U CN 219421167 U CN219421167 U CN 219421167U
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- steel sheet
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- grounding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The utility model discloses an FPC module for avoiding grounding failure of steel sheet reinforcement, which comprises an FPC main board, wherein a connector is arranged on the front surface of the FPC main board, a steel sheet reinforcement is arranged on the back surface of the FPC main board, the steel sheet reinforcement is in bonding connection with the FPC main board through a non-conductive adhesive, a plurality of copper exposure grounding windows are arranged on the FPC main board, a pair of preset steel sheet open holes are arranged on the steel sheet reinforcement, a pair of preset adhesive open holes are arranged on the non-conductive adhesive, and the positions of the steel sheet open holes and the adhesive open holes are matched with the copper exposure grounding windows. Because the steel sheet reinforcement is bonded and connected with the FPC main board by adopting the non-conductive adhesive, electrostatic damage caused by grounding failure of the steel sheet reinforcement is effectively avoided, and thus, the functional failure of the connector is avoided. Moreover, the conductive performance of the conductive silver paste is superior to that of the conductive thermosetting adhesive, so that the conductive silver paste is favorable for quick electrostatic dispersion.
Description
Technical Field
The utility model relates to an FPC module, in particular to an FPC module capable of avoiding steel sheet reinforcement grounding failure.
Background
In general, in order to avoid static electricity from damaging the connector, the mobile phone display module is grounded by reinforcing a steel sheet on the back of the connector. At present, the grounding treatment of steel sheet reinforcement is performed through conductive thermosetting adhesive and FPC grounding treatment. However, the grounding window is generally smaller (generally smaller than 1 mm), or the temperature and the pressure of the conductive thermosetting adhesive are insufficient during hot pressing lamination, or the subsequent reliability is invalid, so that the thermosetting adhesive is not well adhered to the copper surface of the grounding window, and the grounding failure or the larger resistance is caused, thereby influencing the electrostatic discharge. Moreover, the conductive thermosetting adhesive has high technical threshold and high cost.
The Chinese patent document CN208369949U discloses a high-density flexible contact high-reliability circuit board, which comprises a flexible circuit board main body, golden fingers and reinforcing sheets, wherein the flexible circuit board main body comprises a PI substrate, an upper copper foil layer, a lower copper foil layer, an upper cover film and a lower cover film, the upper copper foil layer and the lower copper foil layer are respectively arranged on the front side and the back side of the PI substrate, the upper cover film is arranged above the upper copper foil layer, the lower cover film is arranged below the lower copper foil layer, the upper copper foil layer and the lower copper foil layer both comprise circuit copper foil and grounding copper foil, PTH holes are formed in the circuit copper foils of the upper copper foil layer and the lower copper foil, the golden fingers are connected with other layers through the PTH holes, the golden fingers are exposed outside the upper cover film, a cover film window is arranged below the position, corresponding to the golden fingers, of the lower cover film is exposed in the middle of the cover film window, and the back side of the PI substrate is exposed in the middle of the cover film window; the upper covering film is provided with 2 grounding windows, part of the grounding copper foil is exposed in the middle of the grounding windows, and the reinforcing sheet is fixed on the grounding windows on the upper copper foil layer through conductive adhesive. The tail end of the golden finger is provided with a chamfer or a round angle, and a gap is arranged between the golden finger and the edge of the flexible circuit board main body.
Obviously, the high-density flexible contact high-reliability circuit board is characterized in that the contact area between the steel sheet and the grounding copper foil is increased by arranging two grounding windows at the grounding copper foil, and the connection structure of the steel sheet reinforcement and the FPC is not involved.
Disclosure of Invention
Based on the above technical problem, it is necessary to provide an FPC module for avoiding the ground failure of the steel sheet reinforcement, comprising an FPC motherboard, wherein a connector is disposed on the front side of the FPC motherboard, a steel sheet reinforcement is disposed on the back side of the FPC motherboard, the steel sheet reinforcement is bonded and connected with the FPC motherboard through a non-conductive adhesive, a plurality of exposed copper ground windows are disposed on the FPC motherboard, a pair of preset steel sheet openings are disposed on the steel sheet reinforcement, a pair of preset adhesive openings are disposed on the non-conductive adhesive, and the positions of the steel sheet openings and the adhesive openings are adapted to the exposed copper ground windows. Because the steel sheet reinforcement is bonded and connected with the FPC main board by adopting the non-conductive adhesive, electrostatic damage caused by grounding failure of the steel sheet reinforcement is effectively avoided, and thus, the functional failure of the connector is avoided. Moreover, the conductive performance of the conductive silver paste is superior to that of the conductive thermosetting adhesive, so that the conductive silver paste is favorable for quick electrostatic dispersion.
In order to solve the technical problems, the utility model adopts the following technical scheme:
the FPC module capable of avoiding steel sheet reinforcement ground connection failure is characterized by comprising an FPC main board, wherein a connector is arranged on the front face of the FPC main board, a steel sheet reinforcement is arranged on the back face of the FPC main board, the steel sheet reinforcement is bonded and connected with the FPC main board through a non-conductive adhesive, a plurality of copper-exposed ground opening windows are formed in the FPC main board, a pair of preset steel sheet openings are formed in the steel sheet reinforcement, a pair of preset adhesive openings are formed in the non-conductive adhesive, and the positions of the steel sheet openings and the adhesive openings are matched with those of the copper-exposed ground opening windows.
As a preferred implementation mode of the FPC module for avoiding steel sheet reinforced grounding failure, the copper exposure grounding windowing, the steel sheet open pore and the glue open pore are all round.
As a preferred implementation mode of the FPC module for avoiding steel sheet reinforcement grounding failure, the copper exposure grounding window is filled with conductive silver paste.
As a preferable implementation mode of the FPC module for avoiding the grounding failure of the steel sheet reinforcement, the height of the conductive silver paste is lower than the thickness of the steel sheet reinforcement.
As a preferred implementation mode of the FPC module for avoiding the steel sheet reinforced grounding failure, the adhesive force of the conductive silver paste is larger than 5B.
As a preferred implementation mode of the FPC module for avoiding steel sheet reinforced grounding failure, tin is filled in the copper-exposed grounding window.
As a preferred embodiment of the FPC module for avoiding the grounding failure of the steel sheet reinforcement, the height of tin is lower than the thickness of the steel sheet reinforcement.
As a preferred embodiment of the FPC module for avoiding the steel sheet reinforced grounding failure, the adhesion force of tin is larger than 5B.
As a preferred implementation mode of the FPC module for avoiding the steel sheet reinforced grounding failure, the area of the rubber opening is larger than that of the copper exposure grounding opening, and the area of the steel sheet opening is the same as that of the rubber opening.
As a preferred implementation mode of the FPC module for avoiding the grounding failure of the steel sheet reinforcement, the inner side of the steel sheet opening is provided with a round overflow-preventing hole, and the area of the overflow-preventing hole is larger than that of the steel sheet opening.
Compared with the prior art, the utility model has the following beneficial effects:
according to the FPC module capable of avoiding grounding failure of the steel sheet reinforcement, as the steel sheet reinforcement is bonded and connected with the FPC main board by the non-conductive adhesive, electrostatic damage caused by the grounding failure of the steel sheet reinforcement is effectively avoided, and therefore functional failure of a connector is avoided. Moreover, the conductive performance of the conductive silver paste is superior to that of the conductive thermosetting adhesive, so that the conductive silver paste is favorable for quick electrostatic dispersion.
In addition, tin can be filled in the exposed copper grounding window, and the tin is lower than the reinforced thickness of the steel sheet, so that structural interference is avoided. In addition, the adhesion force of the tin is larger than 5B, so that the tin is prevented from falling off from the exposed copper grounding window. The cost of tin is lower than that of conductive silver paste, so that the production cost is further reduced.
In addition, a round anti-overflow hole can be arranged on the inner side of the steel sheet open hole, and the area of the anti-overflow hole is larger than that of the steel sheet open hole. When the conductive silver paste is filled into the exposed copper grounding window through the steel sheet opening and the glue opening, the conductive silver paste fills the overflow-preventing hole, and cannot overflow the steel sheet opening, so that structural interference is effectively avoided.
Drawings
In order to more clearly illustrate the solution of the present utility model, a brief description will be given below of the drawings required for the description of the embodiments, it being obvious that the drawings in the following description are some embodiments of the present utility model, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a part of a FPC module for avoiding a steel sheet reinforced grounding failure, which is a plane view angle;
FIG. 2 is a schematic view of a part of the FPC module for avoiding the ground failure of the steel reinforcement in FIG. 1, which is a side view;
FIG. 3 is an enlarged detail view of area A of the schematic view of the partial structure of the FPC module of FIG. 2 to avoid the steel reinforcement ground failure;
FIG. 4 is a schematic view of a non-conductive adhesive of the FPC module of FIG. 1 for avoiding steel reinforcement ground failure;
FIG. 5 is a schematic view of the steel reinforcement of the FPC module of FIG. 1 to avoid ground failure of the steel reinforcement;
FIG. 6 is a schematic perspective view of a further embodiment of a steel reinforcement of the FPC module of FIG. 5 that avoids ground failure of the steel reinforcement;
FIG. 7 is a schematic view of a steel reinforcement of the FPC module of FIG. 6, which is a planar view;
FIG. 8 is a cross-sectional view of the steel reinforcement of the FPC module along line B-B of FIG. 6 avoiding a steel reinforcement ground failure;
FIG. 9 is an enlarged detail view of region C of a schematic steel sheet reinforcement of the FPC module of FIG. 8, which is free from steel sheet reinforcement ground failure;
FIG. 10 is a schematic illustration of the filling of the steel reinforcement of the FPC module of FIG. 8 to avoid ground failure of the steel reinforcement;
the labels in the figures are illustrated below: 1. an FPC motherboard; 2. copper exposure grounding window opening; 3. reinforcing a steel sheet; 31. punching a steel sheet; 311. an overflow preventing hole; 4. conducting silver paste; 5. a non-conductive adhesive; 51. opening a hole in the adhesive; 6. a connector; s, FPC module.
Detailed Description
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
As described in the background art, in the prior art, in order to avoid static electricity from damaging the connector, the steel sheet reinforcement on the back of the connector is grounded. At present, the grounding treatment of steel sheet reinforcement is performed through conductive thermosetting adhesive and FPC grounding treatment. However, the grounding window is generally smaller, or the temperature and pressure of the conductive thermosetting adhesive are insufficient during hot pressing lamination, or the subsequent reliability failure causes that the thermosetting adhesive is not well adhered to the copper surface of the grounding window, so that the grounding failure or the resistance value is larger, and the electrostatic discharge is influenced.
In order to solve the technical problem, the utility model provides an FPC module S for avoiding the grounding failure of a steel sheet reinforcement, which comprises an FPC main board 1, wherein a connector 6 is arranged on the front surface of the FPC main board 1, a steel sheet reinforcement 3 is arranged on the back surface of the FPC main board 1, and the steel sheet reinforcement 3 is in bonding connection with the FPC main board 1 through a non-conductive adhesive 5. The FPC motherboard 1 is provided with a plurality of copper-exposed grounding windows 2, the steel sheet reinforcement 3 is provided with a pair of preset steel sheet openings 31, and the non-conductive adhesive 5 is provided with a pair of preset adhesive openings 51.
Through the structural design, as the steel sheet reinforcement 3 is bonded and connected with the FPC main board 1 by the non-conductive adhesive 5, electrostatic damage caused by grounding failure of the steel sheet reinforcement 3 is effectively avoided, and thus functional failure of the connector 6 is avoided. Moreover, the conductive performance of the conductive silver paste is superior to that of the conductive thermosetting adhesive, so that the conductive silver paste is favorable for quick electrostatic dispersion.
In order to better understand the solution of the present utility model, the following detailed description will describe the solution of the embodiment of the present utility model with reference to the accompanying drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, and thus the protection scope of the present utility model is more clearly and definitely defined.
It should be noted that, under the condition of no conflict, the embodiments of the present utility model and the features and technical solutions in the embodiments may be combined with each other.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
Example 1
As shown in fig. 1 to 5, the FPC module S for preventing the ground failure of the steel reinforcement comprises an FPC board 1, a connector 6 is disposed on the front surface of the FPC board 1, a steel reinforcement 3 is disposed on the back surface of the FPC board 1, and the steel reinforcement 3 is bonded to the FPC board 1 through a non-conductive adhesive 5.
It should be noted that, the FPC board 1 is provided with a plurality of exposed copper grounding windows 2, the steel sheet reinforcement 3 is provided with a pair of preset steel sheet openings 31, and the non-conductive adhesive 5 is provided with a pair of preset adhesive openings 51.
The number of the exposed copper ground windows 2 is not limited to one.
In addition, the positions of the steel sheet opening 31 and the glue opening 51 are adapted to the exposed copper ground opening 2.
In addition, the copper-exposed grounding window 2, the steel sheet opening 31 and the glue opening 51 are all circular. Of course, the exposed copper grounding window 2, the steel sheet opening 31 and the glue opening 51 may have other shapes, such as a hexagon.
In addition, the copper-exposed grounding window 2 is filled with conductive silver paste 4. The height of the conductive silver paste 4 is lower than the thickness of the steel sheet reinforcement 3, so that structural interference is avoided.
In addition, the adhesive force of the conductive silver paste 4 is larger than 5B, so that the conductive silver paste 4 is prevented from falling off from the exposed copper grounding window 2.
In addition, the area of the glue hole 51 is larger than that of the exposed copper grounding window 2. The steel sheet opening 31 has the same area as the glue opening 51.
In addition, the non-conductive adhesive 5 may be non-conductive thermosetting adhesive, or common glue or double sided adhesive.
The following describes the working mode of the FPC module S for avoiding the steel sheet reinforcement grounding failure, comprising the following steps:
step S1, opening a copper exposure grounding window 2 on an FPC main board 1, wherein the copper exposure grounding window can be etched by polishing or liquid medicine;
step S2, attaching the non-conductive adhesive 5 on the surface of the exposed copper grounding window 2, so that the adhesive opening 51 is aligned with the corresponding exposed copper grounding window 2;
step S3, attaching the steel sheet reinforcement 3 to the non-conductive adhesive 5, so that the steel sheet opening 31 is aligned with the adhesive opening 51 of the non-conductive adhesive 5;
and S4, filling conductive silver paste 4 into the copper-exposed grounding window 2 through the steel sheet opening 31 and the glue opening 51, so that the height of the conductive silver paste 4 is lower than the thickness of the steel sheet reinforcement 3 by 0.1mm, and performing grounding treatment on the steel sheet reinforcement 3 and the FPC motherboard 1.
Because the steel sheet reinforcement 3 adopts the non-conductive adhesive 5 to bond and connect with the FPC motherboard 1, the electrostatic damage caused by the grounding failure of the steel sheet reinforcement 3 is effectively avoided, and the functional failure of the connector 6 is avoided. Moreover, the conductive performance of the conductive silver paste is superior to that of the conductive thermosetting adhesive, so that the conductive silver paste is favorable for quick electrostatic dispersion.
Example 2
Further optimizing the FPC module provided in example 1 to avoid the steel sheet reinforcement ground failure, specifically, as shown in fig. 1 to 5, the copper-exposed ground window 2 is filled with tin. These tin replaces the conductive silver paste in example 1.
The height of the tin is lower than the thickness of the steel sheet reinforcement 3, so that structural interference is avoided.
In addition, the adhesion force of the tin is larger than 5B, so that the tin is ensured not to fall off from the copper-exposed grounding window 2.
The cost of tin is lower than that of conductive silver paste, so that the production cost is further reduced.
Example 3
Further optimizing the FPC module for avoiding the ground failure of the steel sheet reinforcement provided in embodiment 1 or 2, specifically, as shown in fig. 6 to 9, a circular overflow preventing hole 311 is provided on the inner side of the steel sheet opening 31, and the area of the overflow preventing hole 311 is larger than that of the steel sheet opening 31.
The operation of this embodiment will be described below.
When the conductive silver paste 4 is filled into the exposed copper grounding window 2 through the steel sheet opening 31 and the glue opening 51, the conductive silver paste 4 fills the anti-overflow hole 311 without overflowing the steel sheet opening 31, as shown in fig. 10, so that structural interference is effectively avoided.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
It is apparent that the embodiments described above are only some embodiments of the present application, but not all embodiments, the preferred embodiments of the present application are given in the drawings, but not limiting the patent scope of the present application. This application may be embodied in many different forms, but rather, embodiments are provided in order to provide a more thorough understanding of the present disclosure. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing, or equivalents may be substituted for elements thereof. All equivalent structures made by the specification and the drawings of the application are directly or indirectly applied to other related technical fields, and are also within the protection scope of the application.
Claims (10)
1. The FPC module for avoiding the steel sheet reinforcement grounding failure is characterized in that the FPC module (S) for avoiding the steel sheet reinforcement grounding failure comprises an FPC main board (1), a connector (6) is arranged on the front surface of the FPC main board (1), a steel sheet reinforcement (3) is arranged on the back surface of the FPC main board (1), the steel sheet reinforcement (3) is in bonding connection with the FPC main board (1) through a non-conductive adhesive (5),
a plurality of copper-exposed grounding windows (2) are arranged on the FPC motherboard (1),
the steel sheet reinforcement (3) is provided with a pair of preset steel sheet openings (31),
the non-conductive adhesive (5) is provided with a pair of preset adhesive openings (51),
the positions of the steel sheet opening (31) and the glue opening (51) are matched with the copper exposure grounding opening (2).
2. The FPC module for avoiding steel sheet reinforcement ground faults according to claim 1, wherein the copper exposure ground window (2), the steel sheet opening (31) and the glue opening (51) are all circular.
3. The FPC module for avoiding steel reinforcement ground failure according to claim 1, wherein,
the copper-exposed grounding window (2) is filled with conductive silver paste (4).
4. The FPC module for avoiding steel reinforcement ground failure according to claim 3, wherein,
the height of the conductive silver paste (4) is lower than the thickness of the steel sheet reinforcement (3).
5. The FPC module for avoiding steel reinforcement ground failure according to claim 3, wherein,
the adhesive force of the conductive silver paste (4) is larger than 5B.
6. The FPC module for avoiding steel reinforcement ground failure according to claim 1, wherein,
tin is filled in the copper-exposed grounding window (2).
7. The FPC module for avoiding steel reinforcement ground failure according to claim 6, wherein,
the height of the tin is lower than the thickness of the steel sheet reinforcement (3).
8. The FPC module for avoiding steel reinforcement ground failure according to claim 6, wherein,
the adhesion force of the tin is more than 5B.
9. The FPC module for avoiding steel reinforcement ground failure according to claim 1, wherein,
the area of the adhesive opening (51) is larger than that of the copper exposure grounding opening (2), and the area of the steel sheet opening (31) is the same as that of the adhesive opening (51).
10. The FPC module for avoiding steel reinforcement ground failure according to claim 1, wherein,
the inner side of the steel sheet open hole (31) is provided with a round overflow preventing hole (311), and the area of the overflow preventing hole (311) is larger than that of the steel sheet open hole (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320584758.9U CN219421167U (en) | 2023-03-22 | 2023-03-22 | FPC module capable of avoiding steel sheet reinforcement grounding failure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320584758.9U CN219421167U (en) | 2023-03-22 | 2023-03-22 | FPC module capable of avoiding steel sheet reinforcement grounding failure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219421167U true CN219421167U (en) | 2023-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320584758.9U Active CN219421167U (en) | 2023-03-22 | 2023-03-22 | FPC module capable of avoiding steel sheet reinforcement grounding failure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219421167U (en) |
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- 2023-03-22 CN CN202320584758.9U patent/CN219421167U/en active Active
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