CN217386079U

CN217386079U - Liquid crystal display module for improving FOG binding strength

Info

Publication number: CN217386079U
Application number: CN202221235372.9U
Authority: CN
Inventors: 林荣利; 陈宏桂; 阳耀启; 李刚
Original assignee: Xinli Photoelectric Renshou Co Ltd
Current assignee: Xinli Photoelectric Renshou Co Ltd
Priority date: 2022-05-20
Filing date: 2022-05-20
Publication date: 2022-09-06
Anticipated expiration: 2032-05-20

Abstract

The utility model discloses a promote FOG and bind liquid crystal display module assembly of bit intensity, because FPC's upper surface is provided with the PET gasket, and a part of PET gasket sets up in the edge of the upper surface of infrabasal plate, another part of PET gasket stretches out in the edge of the upper surface of infrabasal plate, make the PET gasket can fill up the FOG position, thereby make the atress even, dynamics obtains the dispersion when impacted, even this makes FPC receive buckling when the equipment, the golden finger also can not take place to buckle, effectively eliminate the golden finger and receive the stress of buckling the production, avoid the golden finger rupture, reduce the rupture risk of the golden finger of FOG position, also can reduce glass rupture risk, avoid causing the malfunction. And then make the probability that the defective products appear in the liquid crystal display module further reduce, the production and manufacturing cost of liquid crystal display module also can reduce by a wide margin to improve the product competitiveness of liquid crystal display module, satisfied enterprise's ever-increasing quality requirement with this.

Description

Liquid crystal display module for improving FOG binding strength

Technical Field

The utility model relates to a liquid crystal display technology field, more specifically say, relate to a promote FOG and bind liquid crystal display module assembly of bit intensity.

Background

The FPC in the display module of the mobile phone generally needs to be bent and then pass through the housing of the mobile phone host, and then be mounted on the host. When the FPC of the mobile phone display module is bent, the golden finger at the FOG position has certain stress, so that the golden finger at the FOG position has a breaking risk; also, since the FOG location is thinner than the IC location, it is easily stressed upon impact to risk glass breakage, thereby possibly causing malfunction. And then make the probability that the defective products appear in the liquid crystal display module further increase, the production and manufacturing cost of liquid crystal display module also can increase substantially to reduce the product competitiveness of liquid crystal display module, can't satisfy enterprise growing quality requirement.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that solve is how to promote FOG and bind bit intensity. Because FPC's upper surface is provided with the PET gasket, and a part of PET gasket sets up in the edge of the upper surface of infrabasal plate, another part of PET gasket stretches out in the edge of the upper surface of infrabasal plate, make the PET gasket can fill out the FOG position, thereby make the atress even, dynamics obtains the dispersion when being strikeed, even this FPC receives buckling when making the equipment, the golden finger also can not take place to buckle, effectively eliminate the golden finger and receive the stress of buckling the production, avoid the golden finger rupture, reduce the golden finger's of FOG position risk of breaking, also can reduce glass risk of breaking, avoid causing the malfunction. And then make the probability that the defective products appear in the liquid crystal display module further reduce, the production and manufacturing cost of liquid crystal display module also can reduce by a wide margin to improve the product competitiveness of liquid crystal display module, with this satisfying the ever-increasing quality requirement of enterprise.

The utility model discloses the technical problem that solve realizes through following technical scheme:

in order to solve the above technical problems, the utility model provides a liquid crystal display module for improving the FOG binding strength, which comprises a lower polarizer, a lower substrate, an upper polarizer and a cover plate which are sequentially overlapped from bottom to top, the lower substrate is longer than the upper substrate and extends outwards, an IC and an FPC are bound on the upper surface of the lower substrate positioned at the part extending outwards, the upper surface of the FPC is provided with a PET gasket, a part of the PET gasket is arranged at the edge of the upper surface of the lower substrate, the other part of the PET gasket extends out of the edge of the upper surface of the lower substrate, the upper surfaces of the PET gasket and the IC are coated with continuously arranged insulating glue, the upper surface of insulating glue is provided with the insulating shielding layer, the insulating shielding layer cover insulating glue with FPC, the upper surface of insulating shielding layer covers has black insulating tape.

As the utility model provides a promote FOG and bind an optimal implementation mode of liquid crystal display module assembly of bit intensity, the thickness of PET gasket is 0.1 mm.

As the utility model provides a promote FOG and bind an optimal implementation mode of liquid crystal display module assembly of bit intensity, the insulation shielding layer is the copper foil.

As the utility model provides a promote FOG and bind an optimal implementation mode of liquid crystal display module assembly of bit intensity, be located outside extension the edge of the upper surface of infrabasal plate is provided with the arch, the upper surface of infrabasal plate in the arch with it glues to be provided with the buffering between the upper substrate, the buffering glue with the apron butt.

As the utility model provides a promote FOG and bind an optimal implementation mode of liquid crystal display module assembly of bit intensity, protruding with the top base plate parallel and level.

As the utility model provides a promote FOG and bind an optimal implementation mode of liquid crystal display module assembly of bit intensity, the cushion gum is the silicone adhesive.

As the utility model provides a promote FOG and bind an optimal implementation mode of liquid crystal display module assembly of bit intensity, protruding with be provided with the radius angle between the infrabasal plate.

As the utility model provides a promote FOG and bind an optimal implementation mode of liquid crystal display module assembly of position intensity, FPC includes the substrate layer, the upper surface of substrate layer is provided with the circuit layer, the lower surface of substrate layer is provided with the metal heat dissipation layer.

As the utility model provides a promote FOG and bind a preferred embodiment of liquid crystal display module assembly of position intensity, FPC still includes that at least one runs through the substrate layer the circuit layer and the perforation of metal heat dissipation layer, the fenestrate inner wall be provided with the circuit layer the heat-conducting layer that the metal heat dissipation layer contacted.

As the utility model provides a promote FOG and bind an optimal implementation mode of liquid crystal display module assembly of bit intensity, be provided with the heat conductor of being connected with outside heat conduction structure in the perforation, the heat conductor with the heat-conducting layer contacts.

The utility model discloses following beneficial effect has:

because FPC's upper surface is provided with the PET gasket, and a part of PET gasket sets up in the edge of the upper surface of infrabasal plate, another part of PET gasket stretches out in the edge of the upper surface of infrabasal plate, make the PET gasket can fill up the FOG position, thereby make the atress even, dynamics obtains the dispersion when strikeing, even this makes FPC receive buckling when the equipment, the golden finger also can not take place to buckle, effectively eliminated the golden finger and received the stress of buckling the production, avoid the golden finger rupture, reduce the rupture risk of the golden finger of FOG position, also can reduce glass fracture risk, avoid causing the malfunction. And then make the probability that the defective products appear in the liquid crystal display module further reduce, the production and manufacturing cost of liquid crystal display module also can reduce by a wide margin to improve the product competitiveness of liquid crystal display module, with this satisfying the ever-increasing quality requirement of enterprise.

Drawings

In order to illustrate the solution of the present application more clearly, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.

Fig. 1 is the utility model provides a pair of promote FOG and bind a structural schematic diagram of liquid crystal display module assembly of bit intensity.

Fig. 2 is a schematic structural view of embodiment 2.

Fig. 3 is a schematic structural view of embodiment 3.

Detailed Description

In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

The utility model provides a promote FOG and bind liquid crystal display module of bit intensity, it includes from bottom to top superpose the lower polaroid 1 that sets up in proper order, infrabasal plate 2, upper substrate 3, go up polaroid 4 and apron 5, infrabasal plate 2 is longer than the upper substrate 3 and outwards stretch out, is located the part that outwards stretches out IC6 and FPC7 are bound to the upper surface of infrabasal plate 2, FPC 7's upper surface is provided with PET gasket 8, a part of PET gasket 8 sets up in the edge of the upper surface of infrabasal plate 2, another part of PET gasket 8 stretches out in the edge of the upper surface of infrabasal plate 2, the upper surface of PET gasket 8 and the upper surface of IC6 all coat with the insulating cement 9 of continuous setting, the upper surface of insulating cement 9 is provided with insulating shield 10, insulating shield 10 covers insulating cement 9 with FPC7, the upper surface of the insulation shielding layer 10 is covered with a black insulation tape 11.

Because FPC 7's upper surface is provided with PET gasket 8, and a part of PET gasket 8 sets up in the edge of the upper surface of infrabasal plate 2, another part of PET gasket 8 stretches out in the edge of the upper surface of infrabasal plate 2, make PET gasket 8 can fill up the FOG position, thereby make the atress even, dynamics obtains the dispersion when being strikeed, even this makes FPC7 receive and buckles when the equipment, the golden finger also can not take place to buckle, effectively eliminate the golden finger and receive the stress of buckling the production, avoid the golden finger rupture, reduce the golden finger's of FOG position risk of breaking, also can reduce the glass risk of breaking, avoid causing the malfunction. And then make the probability that the defective products appear in the liquid crystal display module further reduce, the production and manufacturing cost of liquid crystal display module also can reduce by a wide margin to improve the product competitiveness of liquid crystal display module, with this satisfying the ever-increasing quality requirement of enterprise.

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. The invention is described in detail below with reference to the drawings, wherein examples of the embodiments are shown in the drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

Example 1

Referring to fig. 1, the present invention provides a liquid crystal display module for improving the FOG bonding strength, which includes a lower polarizer 1, a lower substrate 2, an upper substrate 3, an upper polarizer 4 and a cover plate 5 sequentially stacked from bottom to top, wherein the lower substrate 2 is longer than the upper substrate 3 and extends outward, an IC6 and an FPC7 are bonded to the upper surface of the lower substrate 2 at the portion extending outward, a PET gasket 8 is disposed on the upper surface of the FPC7, a portion of the PET gasket 8 is disposed on the edge of the upper surface of the lower substrate 2, another portion of the PET gasket 8 extends out of the edge of the upper surface of the lower substrate 2, the upper surfaces of the PET gasket 8 and the IC6 are coated with a continuously disposed insulating paste 9, an insulating shielding layer 10 is disposed on the upper surface of the insulating paste 9, and the insulating paste 9 and the FPC7 are covered by the insulating shielding layer 10, the upper surface of the insulation shielding layer 10 is covered with a black insulation tape 11. Because FPC 7's upper surface is provided with PET gasket 8, and a part of PET gasket 8 sets up in the edge of the upper surface of infrabasal plate 2, another part of PET gasket 8 stretches out in the edge of the upper surface of infrabasal plate 2, make PET gasket 8 can fill up the FOG position, thereby make the atress even, dynamics obtains the dispersion when strikeing, this makes even FPC7 receives buckling when the equipment, the golden finger also can not take place to buckle, effectively eliminate the golden finger and receive the stress of buckling the production, avoid the golden finger rupture, reduce the golden finger's of FOG position rupture risk, also can reduce glass fracture risk, avoid causing the malfunction. And then make the probability that the defective products appear in the liquid crystal display module further reduce, the production and manufacturing cost of liquid crystal display module also can reduce by a wide margin to improve the product competitiveness of liquid crystal display module, with this satisfying the ever-increasing quality requirement of enterprise.

As a preferred embodiment provided by the present invention, the thickness of the PET gasket 8 is 0.1 mm.

As a preferred embodiment provided by the present invention, the insulation shielding layer 10 is a copper foil.

Example 2

Referring to fig. 2, as a further optimized solution of embodiment 1, in this embodiment, a protrusion 21 is disposed on an edge of an upper surface of the lower substrate 2 located at an outward extending portion, a buffer glue 22 is disposed between the protrusion 21 and the upper substrate 3 on the upper surface of the lower substrate 2, and the buffer glue 22 abuts against the cover plate 5. The edge of the lower substrate 2 is provided with the bulge 21 to limit the flow of the buffer glue 22, so that the form of the buffer glue 22 is easy to control, and the phenomena of glue overflow or insufficient glue dispensing can not occur. Thereby preventing the liquid crystal display module from being assembled with the casing. Thereby avoiding the problems of poor buffer effect and easy breakage of the lower substrate 2 caused by insufficient dispensing and preventing abnormal display of the liquid crystal display module.

As a preferred embodiment provided by the utility model, protruding 21 with 3 parallel and level of upper substrate to further restrict the flow that the buffering glued 22, thereby make the form of buffering glued 22 control easily, the phenomenon that can not appear overflowing gluey or the point is glued unsatisfactorily.

As a preferred embodiment provided by the present invention, the cushion adhesive 22 is silicone adhesive.

As a preferred embodiment provided by the present invention, the protrusion 21 and the lower substrate 2 are provided with a fillet therebetween, so that the cushion rubber 22 is filled with bubbles more easily and is not easy to appear.

Example 3

Referring to fig. 3, as a further optimized solution of embodiment 1, in this embodiment, the FPC7 includes a substrate layer 71, a circuit layer 72 is disposed on an upper surface of the substrate layer 71, and a metal heat dissipation layer 73 is disposed on a lower surface of the substrate layer 71, and the circuit layer 72 and the metal heat dissipation layer 73 are respectively adhered to the substrate layer 71 through a double-sided tape. Because the thickness of substrate layer 71 is thin, heat on FPC7 can diffuse to metal heat dissipation layer 73 through substrate layer 71, and this metal heat dissipation layer 73 can effectively increase the heat radiating area of FPC7, plays even radiating effect to the radiating efficiency of FPC7 has been improved. The substrate layer 71 may be any one of polyimide, polyester, polysulfone, and polytetrafluoroethylene, the double-sided tape may be any one of an acrylic adhesive layer or an epoxy adhesive layer, and the metal heat dissipation layer 73 may be a copper foil layer.

As a preferred embodiment provided by the present invention, FPC7 further includes at least one perforation 74 that runs through substrate layer 71, circuit layer 72 and metal heat dissipation layer 73, and the inner wall of this perforation 74 is provided with the heat conduction layer that contacts with circuit layer 72, metal heat dissipation layer 73, utilizes perforation 74 to locate good heat conductivity, but circuit layer 72 and metal heat dissipation layer 73 of electric connection substrate layer 71 both sides, and the good heat conduction function of performance, and the heat conduction layer can provide the heat conduction function to reach good radiating effect. The heat conducting layer can be a copper adhesive conductive ink layer.

As a preferred embodiment provided by the present invention, a heat conductor connected to an external heat conducting structure is disposed in the perforation 74, and the heat conductor is connected to the external heat conducting structure from one side of the circuit layer 72 and is also in contact with the heat conducting layer in the perforation 74, so that the circuit layer 72 and the metal heat dissipation layer 73 can be connected to the external heat conducting structure through the perforation 74, and the heat in the FPC7 is diffused to the external heat conducting structure through the heat conductor in the perforation 74, thereby further improving the heat dissipation efficiency of the FPC 7. Preferably, the perforations 74 are provided at the edge of the FPC7 in order that the perforations 74 may be connected to an external thermally conductive structure.

As a preferred embodiment provided by the utility model, this metal heat dissipation layer 73 is even heat radiation structure, and its structure can be any one of network structure, strip structure, wavy structure or cellular structure, through this even heat radiation structure, can improve the radiating effect better.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention and do not limit the scope of the invention. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.

Claims

1. A liquid crystal display module for improving the FOG binding strength is characterized in that the liquid crystal display module comprises a lower polarizer, a lower substrate, an upper polarizer and a cover plate which are sequentially overlapped from bottom to top, the lower substrate is longer than the upper substrate and extends outwards, an IC and an FPC are bound on the upper surface of the lower substrate positioned at the part extending outwards, the upper surface of the FPC is provided with a PET gasket, a part of the PET gasket is arranged at the edge of the upper surface of the lower substrate, the other part of the PET gasket extends out of the edge of the upper surface of the lower substrate, the upper surface of the PET gasket and the upper surface of the IC are coated with continuously arranged insulating glue, the upper surface of insulating glue is provided with the insulating shielding layer, the insulating shielding layer cover insulating glue with FPC, the upper surface of insulating shielding layer covers has black insulating tape.

2. The liquid crystal display module of claim 1, wherein the thickness of the PET gasket is 0.1 mm.

3. The liquid crystal display module of claim 1, wherein the insulating shielding layer is a copper foil.

4. The liquid crystal display module of claim 1, wherein a protrusion is disposed on an edge of the upper surface of the lower substrate, the protrusion being located at an outward extending portion, a buffer adhesive is disposed between the protrusion and the upper substrate on the upper surface of the lower substrate, and the buffer adhesive abuts against the cover plate.

5. The liquid crystal display module of claim 4, wherein the protrusions are flush with the upper substrate.

6. The liquid crystal display module of claim 4, wherein the buffer adhesive is a silicone adhesive.

7. The liquid crystal display module of claim 4, wherein a rounded corner is disposed between the protrusion and the lower substrate.

8. The liquid crystal display module of claim 1, wherein the FPC comprises a substrate layer, a circuit layer is disposed on an upper surface of the substrate layer, and a metal heat dissipation layer is disposed on a lower surface of the substrate layer.

9. The liquid crystal display module of claim 8, wherein the FPC further comprises at least one through hole penetrating through the substrate layer, the circuit layer and the metal heat dissipation layer, and a heat conduction layer contacting the circuit layer and the metal heat dissipation layer is disposed on an inner wall of the through hole.

10. The liquid crystal display module of claim 9, wherein the through hole has a heat conductor connected to an external heat conducting structure, and the heat conductor contacts the heat conducting layer.