CN210466352U

CN210466352U - Film structure touch screen

Info

Publication number: CN210466352U
Application number: CN201921957171.8U
Authority: CN
Inventors: 李裕民; 林汉良; 周娟
Original assignee: Truly Opto Electronics Ltd
Current assignee: Truly Opto Electronics Ltd
Priority date: 2019-11-13
Filing date: 2019-11-13
Publication date: 2020-05-05
Anticipated expiration: 2029-11-13

Abstract

The utility model discloses a film structure touch-sensitive screen, it includes from the top down glass apron and film touch-control layer that stacks gradually, the both sides of glass apron are crooked into the curved surface, the regional area of touch-control on film touch-control layer is greater than the visual regional area of glass apron, the film touch-control layer includes long limit and minor face, be equipped with FPC on the long limit. Because the area of the touch area of the film touch layer is larger than the area of the visible area of the glass cover plate, the film touch layer can be bent to the back, the laminating width is reduced, the line width is reduced, the touch functions can be obtained on two sides, the film touch layer is of a rectangular structure in the embodiment and comprises long edges and short edges, the FPC is arranged on the long edges, wiring of the film touch layer is short, a narrow frame and an edge touch scheme are easy to manufacture, and narrow frame and edge touch are achieved.

Description

Film structure touch screen

Technical Field

The utility model relates to a touch-control technical field, more specifically say, relate to a film structure touch-sensitive screen.

Background

The existing touch screens are classified into two types, one type is a glass structure touch screen, and the other type is a film structure touch screen. Through continuous development and research, the technology of the film structure touch screen is mature day by day. The manufacturing process of the film structure touch screen is screen printing, and is very simple and rapid; the thickness is thinner; the cost of the film structure touch screen is lower, so that the market share of the film structure touch screen is high.

The full-screen and narrow frame are trend schemes of the existing display touch module, how to use a film structure to achieve a smaller frame, and how to realize side touch becomes a new research trend.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a film structure touch-sensitive screen is provided, because the regional area of touch-control on film touch-control layer is greater than the visual area's of glass apron area, make film touch-control layer can buckle the back, reduce the laminating width and reduce the linewidth, make both sides can obtain the touch-control function, and film touch-control layer is the rectangle structure in this embodiment, including long limit and minor face, set up FPC on long limit, make the line of walking on film touch-control layer shorter, and make narrow frame and marginal touch-control scheme easily, thereby realize narrower frame and marginal touch-control.

The utility model discloses the technical problem that will solve realizes through following technical scheme:

in order to solve the technical problem, the utility model provides a film structure touch-sensitive screen, it includes from the top down glass apron and film touch-control layer that stacks gradually, the both sides of glass apron are crooked into the curved surface, the touch-control regional area on film touch-control layer is greater than the visual zone's of glass apron area, the film touch-control layer includes long limit and minor face, be equipped with FPC on the long limit.

Further, the material of the transparent conductive film of the film touch layer is preferably METAL MESH or ITO film.

Further, an ink layer is arranged on the periphery of the upper surface of the film touch layer, an optical adhesive layer is arranged between the glass cover plate and the film touch layer, and the optical adhesive layer covers the ink layer.

Further, the ink layer is of a multilayer structure, and the number of layers N > = 2.

Further, when the ink layer is black, the number of layers N = 2.

Further, when the ink layer is white, the number of layers N is more than 2.

Further, the FPC includes the substrate layer, the upper surface of substrate layer is provided with the circuit layer, the lower surface of substrate layer is provided with the metal heat dissipation layer.

Further, FPC still includes that at least one runs through the substrate layer the circuit layer and the through-hole of metal heat dissipation layer, the inner wall of through-hole be provided with the circuit layer the heat-conducting layer that the metal heat dissipation layer contacted.

Further, a heat conductor connected with an external heat conduction structure is arranged in the through hole, and the heat conductor is in contact with the heat conduction layer.

Further, the structure of the metal heat dissipation layer is a net structure, a strip structure, a wavy structure or a honeycomb structure.

The utility model discloses following beneficial effect has:

because the area of the touch area of the film touch layer is larger than the area of the visible area of the glass cover plate, the film touch layer can be bent to the back, the laminating width is reduced, the line width is reduced, the touch functions can be obtained on two sides, the film touch layer is of a rectangular structure in the embodiment and comprises long edges and short edges, the FPC is arranged on the long edges, wiring of the film touch layer is short, a narrow frame and an edge touch scheme are easy to manufacture, and narrow frame and edge touch are achieved.

By arranging the ink frame on the surface, away from the ITO conductive pattern, of the film touch layer, the problem that the yield of products is influenced due to the fact that a net is damaged when the ink frame is silk-screened on the glass cover plate in the traditional mode can be avoided; and simultaneously, the touch-sensitive screen adopts the utility model discloses an improve the structure, can be silk screen printing ink frame on the film touch-control layer of large scale in the technology, cut into the piece again after silk screen printing accomplishes. The process of the product is simpler and more efficient, and the cost advantage is further realized.

Drawings

Fig. 1 is a top view of a glass cover plate of a film structure touch screen provided by the present invention.

Fig. 2 is a top view of a film touch layer of a film structure touch screen provided by the present invention.

Fig. 3 is a top view of the glass cover plate and the film touch layer after being attached.

Fig. 4 is a sectional view of the improved structure of fig. 3.

Fig. 5 is a schematic diagram of an improved structure of the FPC.

Fig. 6 is a schematic view of another modified structure of the FPC.

Detailed Description

The present invention will be described in detail with reference to the following examples, which are only preferred embodiments of the present invention and are not intended to limit the present invention.

Please refer to fig. 1 to 3, which is the present invention provides a film structure touch screen, which includes a glass cover plate 1 and a film touch layer 2 stacked in sequence from top to bottom, the two sides of the glass cover plate 1 are bent into a curved surface, the touch area of the film touch layer 2 is larger than the area of the visible area of the glass cover plate 1, the film touch layer 2 includes a long edge and a short edge, and the long edge is provided with a FPC 3. Because the area of the touch area of the film touch layer 2 is larger than the area of the visible area of the glass cover plate 1, the film touch layer 2 can be bent to the back, the fitting width is reduced, the line width is reduced, the touch functions can be obtained on two sides, the film touch layer 2 is of a rectangular structure in the embodiment and comprises a long edge and a short edge, the FPC3 is arranged on the long edge, the wiring of the film touch layer 2 is short, a narrow frame and an edge touch scheme are easy to manufacture, and the narrower frame and the edge touch are achieved.

Furthermore, the material of the transparent conductive film of the film touch layer 2 is preferably METAL MESH or ITO film, and a copper plating scheme is adopted to manufacture the metal grid pattern, so that the copper wiring of the plated grid is not easy to be damaged.

Further, an ink layer 4 is arranged on the periphery of the upper surface of the film touch layer 2, an optical adhesive layer 5 is arranged between the glass cover plate 1 and the film touch layer 2, the optical adhesive layer 5 covers the ink layer 4, and the FPC3 is arranged below the film touch layer 2. The film touch layer 2 is typically coated with a transparent conductive film, such as an ITO conductive pattern 22, on a substrate 21, such as PET or other organic sheet. The FILM touch layer 2 may also be referred to as ITO FILM. The film touch layer 2 further has AG metal traces. In the present embodiment, as shown in fig. 4, the film structure touch screen is a GF structure. In other embodiments, the film structure touch screen may also be a GFF structure, or a G1F structure. The bottom surface of the film touch layer 2 is provided with an ITO conductive pattern 22 and AG metal wiring, and the upper surface of the film touch layer 2 is provided with an ink layer 4. The ink layer 4 is located on the periphery of the film touch layer 2, and the ink layer 4 on the periphery forms an ink frame. The ink border visually divides the touch screen into a border area and a visible area located in the middle. An optical adhesive layer 5 is further arranged between the glass cover plate 1 and the film touch layer 2, and the optical adhesive layer 5 covers the ink layer 4 on the top surface of the film touch layer 2. The optical adhesive layer 5 covers the ink layer 4 to protect the ink layer 4, and the glass cover plate 1 further prevents the ink layer 4 from being exposed to scratch by a hard object or influence the stability. In this embodiment, the glass cover plate 1 and the film touch layer 2 are fully attached to each other, and the optical adhesive layer 5 also covers the visible area on the top surface of the film touch layer 2 except the ink layer 4. The utility model can avoid the problem that the net is damaged to affect the product yield when the ink frame is silk-screened on the glass cover plate 1 in the traditional way by arranging the ink frame on the surface of the film touch layer 2 which is far away from the ITO conductive pattern 22; and simultaneously, the touch-sensitive screen adopts the utility model discloses an improve the structure, can be silk screen printing ink frame on the film touch-control layer 2 of large scale in the technology, cut into the piece again after silk screen printing accomplishes. The process of the product is simpler and more efficient, and the cost advantage is further realized.

The FILM touch layer 2 in this embodiment is a single-sided ITO FILM, and the ITO conductive pattern 22 is disposed on only one side. Alternatively, in other embodiments, the FILM touch layer 2 may also be a double-sided ITO FILM.

Preferably, the ink layer 4 has a multilayer structure, and the number of layers N > = 2.

When the ink layer 4 is black, the number of layers N = 2. If only the first layer of ink is present, pinholes will generally be present. The second layer can cover the pinholes of the first layer of ink poorly, and the two layers of ink can be cured twice, so that the adhesion of the ink layer 4 is better. When the ink layer 4 is white, the number of layers N > 2. Color inks are not as light blocking as black inks, requiring some more layers than black inks. The number of layers of the white ink is preferably 3 or 4. Preferably, the thickness of the ink layer 4 is 8-24 um, and the thickness of each layer of ink is 4-6 um.

Further, the FPC3 includes a substrate layer 31, a circuit layer 32 is disposed on the upper surface of the substrate layer 31, and a metal heat dissipation layer 33 is disposed on the lower surface of the substrate layer 31, and the circuit layer 32 and the metal heat dissipation layer 33 may be respectively attached to the substrate layer 31 by double-sided tapes. Because the thickness of substrate layer 31 is thin, the heat on FPC3 can diffuse to metal heat dissipation layer 33 through substrate layer 31, and this metal heat dissipation layer 33 can effectively increase FPC 3's heat radiating area, plays even radiating effect to FPC 3's radiating efficiency has been improved. The substrate layer 31 may be any one of polyimide, polyester, polysulfone, and polytetrafluoroethylene, the double-sided tape may be any one of an acrylic adhesive layer or an epoxy adhesive layer, and the metal heat dissipation layer 33 may be a copper foil layer.

Referring to fig. 5, the FPC3 further includes at least one through hole 34 penetrating through the substrate layer 31, the circuit layer 32 and the metal heat dissipation layer 33, a heat conduction layer contacting the circuit layer 32 and the metal heat dissipation layer 33 is disposed on an inner wall of the through hole 34, the circuit layer 32 and the metal heat dissipation layer 33 on two sides of the substrate layer 31 can be electrically connected by using a good heat conduction performance at the through hole 34, so as to perform a good heat conduction function, and the heat conduction layer can provide a heat conduction function, so as to achieve a good heat dissipation effect. Wherein, the heat conduction layer can be a copper glue conductive ink layer 4.

Further, a heat conductor connected to an external heat conducting structure is disposed in the through hole 34, and the heat conductor is connected to the external heat conducting structure from one side of the circuit layer 32 and is also in contact with the heat conducting layer in the through hole 34, so that the circuit layer 32 and the metal heat dissipation layer 33 can be connected to the external heat conducting structure through the through hole 34, and heat in the FPC3 is diffused to the external heat conducting structure through the heat conductor in the through hole 34, thereby further improving the heat dissipation efficiency of the FPC 3. Preferably, the vias 34 are disposed at the edge of the FPC3 in order that the vias 34 may be connected to an external thermally conductive structure.

Further, the metal heat dissipation layer 33 is an even heat dissipation structure, and the structure thereof may be any one of a mesh structure, a strip structure, a wave structure or a honeycomb structure.

Referring to fig. 6, further, the FPC3 includes a body 301 and a connecting portion 302 connected to the body 301, wherein a gold finger 303 is disposed at an end of the connecting portion 302 away from the body 301, and two reinforcing plates 304 are disposed at two sides of the connecting portion 302 and are staggered from each other. In the conventional FPC3 design, the stiffener 304 is usually not provided or the stiffener 304 is provided at the same position and the width of the stiffener 304 is the same, so that when the FPC3 is pulled out, the applied pressure is concentrated on the same straight line, which results in slight disconnection of the FPC3 line. The utility model provides a FPC3 is because two stiffening plates 304 are located the both sides of connecting portion 302 respectively and stagger the setting each other, and when extracting FPC3, the pressure that FPC3 was given to both sides stiffening plate 304 is not on same line segment, and stress can not concentrate on same straight line when buckling yet, avoids stress concentration from this, and the easy disconnected problem of circuit of golden finger 303 department improves the product yield a little.

Furthermore, the two reinforcing plates 304 staggered with each other in the present invention may be respectively disposed at two different positions; the positions of the central points may be the same, but the widths of the two reinforcing plates 304 are different, and the stress generated when the two reinforcing plates 304 are bent is not concentrated on the same straight line, so that the problems that the stress is concentrated and the circuit at the golden finger 303 is easily broken slightly can be solved, and the product yield is improved. In this embodiment, the reinforcing plates 304 include a first reinforcing plate and a second reinforcing plate, each of the reinforcing plates 304 has a different width, and the center points thereof are located on the same horizontal line, so that the edges of the reinforcing plates 304 are staggered from each other and are not concentrated on the same straight line.

Further, the material of the reinforcing plate 304 is FR4, PI or stainless steel, and in other embodiments, if the heat generation amount of the FPC3 is large, a heat dissipation material with better heat dissipation effect, such as an aluminum foil reinforcing plate 304, may also be used.

Further, the outer surface of the reinforcing plate 304 is provided with a diamond-shaped knurl, so that the FPC3 can be pulled out more easily, and the risk of breaking the FPC3 circuit is reduced.

The above embodiments only express the embodiments of the present invention, and the description thereof is specific and detailed, but the invention can not be understood as the limitation of the patent scope of the present invention, but all the technical solutions obtained by adopting the equivalent substitution or equivalent transformation should fall within the protection scope of the present invention.

Claims

1. The utility model provides a film structure touch-sensitive screen, its characterized in that, it includes from the top down glass apron and film touch-control layer that stacks gradually, the both sides of glass apron are crooked to the curved surface, the regional area of touch-control on film touch-control layer is greater than the visual regional area of glass apron, film touch-control layer includes long limit and minor face, be equipped with FPC on the long limit.

2. The film structure touch screen of claim 1, wherein the material of the transparent conductive film of the film touch layer is preferably METAL MESH or ITO film.

3. The film structure touch screen according to claim 1, wherein an ink layer is disposed on the periphery of the upper surface of the film touch layer, and an optical adhesive layer is disposed between the glass cover plate and the film touch layer and covers the ink layer.

4. The film-structured touch screen according to claim 3, wherein the ink layer is a multilayer structure, and the number of layers N > = 2.

5. The film structure touch screen of claim 4, wherein when the ink layer is black, the number of layers N = 2.

6. The film structure touch screen of claim 4, wherein when the ink layer is white, the number of layers N > 2.

7. The film structure touch screen of claim 1, wherein the FPC comprises a substrate layer, a circuit layer is disposed on an upper surface of the substrate layer, and a metal heat dissipation layer is disposed on a lower surface of the substrate layer.

8. The film structure touch screen of claim 7, wherein the FPC further comprises at least one through hole penetrating through the substrate layer, the circuit layer and the metal heat dissipation layer, and a heat conduction layer contacting the circuit layer and the metal heat dissipation layer is arranged on an inner wall of the through hole.

9. The film structure touch screen of claim 8, wherein a heat conductor connected to an external heat conducting structure is disposed in the through hole, and the heat conductor is in contact with the heat conducting layer.

10. The film structure touch screen of claim 7, wherein the structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wave structure or a honeycomb structure.