CN219876232U - Touch-sensitive screen PCB board anti-drop conductive structure - Google Patents
Touch-sensitive screen PCB board anti-drop conductive structure Download PDFInfo
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- CN219876232U CN219876232U CN202320251311.XU CN202320251311U CN219876232U CN 219876232 U CN219876232 U CN 219876232U CN 202320251311 U CN202320251311 U CN 202320251311U CN 219876232 U CN219876232 U CN 219876232U
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- 239000010410 layer Substances 0.000 claims abstract description 143
- 239000012790 adhesive layer Substances 0.000 claims abstract description 85
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 33
- 239000010949 copper Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000003365 glass fiber Substances 0.000 claims abstract description 23
- 238000002955 isolation Methods 0.000 claims description 16
- 239000002390 adhesive tape Substances 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 38
- 229910052742 iron Inorganic materials 0.000 abstract description 19
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Abstract
The utility model discloses an anti-falling conductive structure of a touch screen PCB (printed circuit board), which comprises a glass fiber substrate layer, wherein an upper copper wiring layer is arranged on the upper surface of the glass fiber substrate layer, an upper green oil layer is arranged on the upper surface of the upper copper wiring layer, a component layer is arranged on the upper surface of the upper green oil layer, a lower copper wiring layer is arranged at the lower part of the glass fiber substrate layer, a lower green oil layer and a conductive double-sided adhesive layer are arranged on the lower surface of the lower copper wiring layer, a white oil layer is arranged on the lower surface of the lower green oil layer, and a non-conductive double-sided adhesive layer is arranged on the lower surface of the white oil layer. The thickness of the conductive double-sided adhesive layer is larger than the sum of the thicknesses of the lower green oil layer, the white oil layer and the non-conductive double-sided adhesive layer. Because the thickness of the conductive double-sided adhesive layer is greater than the sum of the thicknesses of the lower green oil layer, the white oil layer and the non-conductive double-sided adhesive layer, the conductive double-sided adhesive layer can be guaranteed to be in contact with the backlight iron frame in a fitting way, and good grounding performance is guaranteed.
Description
Technical Field
The utility model relates to a touch screen assembly, in particular to an anti-falling conductive structure of a touch screen PCB.
Background
According to customer structure demand, some touch-sensitive screens need solitary PCB board control to if the component damages just change PCB board control, and need not change whole touch-sensitive display screen, can reduce follow-up maintenance cost, but this scheme has the copper sheet of PCB board ground and electrically conductive two-sided sticky contact unstable condition, and some PCB board ground is good with the iron in a poor light conduction, and is bad, leads to unable batch production, and even some circumstances that appear PCB board and iron frame in a poor light drop.
As shown in fig. 9 to 13, the conventional bonding structure of the touch screen PCB board is shown. The bonding structure of the touch screen PCB comprises a glass fiber substrate layer 1A, wherein an upper copper wiring layer 4A is arranged on the upper surface of the glass fiber substrate layer 1A, an upper green oil layer 3A is arranged on the upper surface of the upper copper wiring layer 4A, and a component layer 2A is arranged on the upper surface of the upper green oil layer 3A. A lower copper wiring layer 5A is arranged at the lower part of the glass fiber substrate layer 1A. Meanwhile, a lower green oil layer 6A, a white oil layer 7A and a full-spread conductive double-sided adhesive layer 8A are arranged on the lower surface of the lower copper wiring layer 5A. It can be seen that the full-spread conductive double-sided adhesive layer 8A covers almost the whole glass fiber substrate layer 1A, and the presence of the lower green oil layer 6A and the white oil layer 7A makes a height difference between the full-spread conductive double-sided adhesive layer 8A and the lower copper trace layer 5A, so that the conduction can be realized only by forming a bending structure by means of the end part of the full-spread conductive double-sided adhesive layer 8A.
After the full-spread type conductive double-sided adhesive layer 8A is bonded due to the height difference, the full-spread type conductive double-sided adhesive layer 8A is in good contact with the lower copper wiring layer 5A, and the contact is poor, so that the product is unstable and is not produced in a large batch.
The Chinese patent publication CN215526303U discloses a backlight module for improving the ESD of a mobile phone display module, which comprises a backlight iron frame and an FPC bent to the back of the backlight iron frame, wherein the back of the backlight iron frame is fixedly adhered to the FPC through a conductive double-sided adhesive, the adhesion surface of the FPC is provided with a copper leakage position, the conductive double-sided adhesive comprises a conductive area and a non-conductive area, the conductive area is corresponding to the copper leakage position of the FPC, and the area of the conductive double-sided adhesive except the conductive area is the non-conductive area.
The backlight iron frame comprises a bottom plate and side walls extending upwards from the edges of the bottom plate, LED lamps are arranged on the side walls, and TVS tubes are respectively arranged on the positive electrodes and the negative electrodes of the LED lamps.
Obviously, the conductive double-sided adhesive tape in the patent still adopts a large-area integral structure, and the bonding force between the conductive double-sided adhesive tape and the backlight iron frame is yet to be verified.
Disclosure of Invention
Based on the above, it is necessary to provide a touch screen PCB board anti-falling conductive structure, which can effectively solve the problem that the PCB board and the backlight iron frame fall off.
In order to solve the technical problems, the utility model adopts the following technical scheme:
the anti-falling conductive structure of the touch screen PCB comprises a glass fiber substrate layer, wherein an upper copper wiring layer is arranged on the upper surface of the glass fiber substrate layer, an upper green oil layer is arranged on the upper surface of the upper copper wiring layer, a component layer is arranged on the upper surface of the upper green oil layer,
a lower copper wiring layer is arranged at the lower part of the glass fiber substrate layer, which is characterized in that,
the lower surface of the lower copper wiring layer is provided with a lower green oil layer and a conductive double-sided adhesive layer, the lower surface of the lower green oil layer is provided with a white oil layer, and the lower surface of the white oil layer is provided with a non-conductive double-sided adhesive layer.
As a preferred implementation mode of the anti-falling conductive structure of the touch screen PCB, the thickness of the conductive double-sided adhesive layer is larger than the sum of the thicknesses of the lower green oil layer, the white oil layer and the non-conductive double-sided adhesive layer.
As a preferred implementation mode of the anti-falling conductive structure of the touch screen PCB, the conductive double-sided adhesive layer is in a strip shape and is positioned at the edge of the lower copper wiring layer.
As a preferred implementation mode of the anti-falling conductive structure of the touch screen PCB provided by the utility model, a preset edge distance is arranged between the outer edge of the conductive double-sided adhesive layer and the edge of the glass fiber substrate layer,
a preset first isolation distance is arranged between the inner side edge of the conductive double-sided adhesive layer and the inner side edge of the lower green oil layer,
a preset second isolation distance is arranged between the inner side edge of the white oil layer and the inner side edge of the lower green oil layer.
As a preferred implementation mode of the anti-falling conductive structure of the touch screen PCB provided by the utility model, the thickness of the upper green oil layer is 0.02MM, the thickness of the lower green oil layer is 0.02MM, the thickness of the white oil layer is 0.02MM, the thickness of the non-conductive double-sided adhesive layer is 0.05MM, and the thickness of the conductive double-sided adhesive layer is 0.1MM.
As a preferred implementation mode of the touch screen PCB anti-falling conductive structure, the edge distance is 0.5MM, the first isolation distance is 0.8MM, and the second isolation distance is 0.35MM.
As a preferred implementation mode of the anti-falling conductive structure of the touch screen PCB, the surfaces of the non-conductive double-sided adhesive layer and the conductive double-sided adhesive layer are provided with release films.
As a preferred implementation mode of the anti-falling conductive structure of the touch screen PCB, the conductive double-sided adhesive layer is provided with a plurality of heat dissipation grooves.
As a preferred implementation mode of the anti-falling conductive structure of the touch screen PCB, the two side edges of the conductive double-sided adhesive layer are provided with a tearing edge.
As a preferred embodiment of the touch screen PCB anti-falling conductive structure provided by the utility model, the tearing edge is blue.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model provides an anti-falling conductive structure of a touch screen PCB, which can ensure that the conductive double-sided adhesive layer can be in contact with a backlight iron frame and ensure good grounding performance because the thickness of the conductive double-sided adhesive layer is larger than the sum of the thicknesses of a lower green oil layer, a white oil layer and a non-conductive double-sided adhesive layer. In the process of pasting the conductive double-sided adhesive layer, the conductive double-sided adhesive layer is subjected to outward expansion extrusion, and meanwhile, the non-conductive double-sided adhesive layer is bonded with the backlight iron frame, so that the touch screen PCB is firmly attached to the backlight iron frame and is not easy to fall off due to the fact that the adhesive force of the non-conductive double-sided adhesive layer is better than that of the conductive double-sided adhesive layer.
In addition, a release film can be arranged on the surfaces of the non-conductive double-sided adhesive layer and the conductive double-sided adhesive layer, so that the adhesive tape is convenient for a user to paste.
In addition, a plurality of penetrating heat dissipation grooves can be formed in the upper surface of the conductive double-sided adhesive layer, heat accumulated on the lower copper wiring layer can be effectively discharged through the heat dissipation grooves, and the heat is taken away by means of air flow, so that the temperature of the PCB is reduced.
In addition, a tearing edge can be arranged at the two side edges of the conductive double-sided adhesive layer. These tear the limit and appear blue, the person of facilitating the use discerns and pinch, avoids the finger to contact with the colloid on the electrically conductive double-sided adhesive layer.
Drawings
In order to more clearly illustrate the solution of the present utility model, a brief description will be given below of the drawings required for the description of the embodiments, it being obvious that the drawings in the following description are some embodiments of the present utility model, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of an anti-falling conductive structure of a touch screen PCB board of the present utility model, which is a front view angle;
fig. 2 is a schematic perspective view of the anti-falling conductive structure of the touch screen PCB in fig. 1, which is a back view angle;
fig. 3 is a schematic exploded view of the anti-falling conductive structure of the touch screen PCB in fig. 2;
fig. 4 is a schematic stacking diagram of a hierarchical structure of the anti-falling conductive structure of the touch screen PCB in fig. 2;
fig. 5 is an enlarged detailed schematic diagram of a region a of a hierarchical structure stacking schematic diagram of the anti-drop conductive structure of the touch screen PCB in fig. 4;
fig. 6 is a schematic perspective view of another embodiment of a conductive double-sided adhesive layer of the anti-falling conductive structure of the touch screen PCB in fig. 2;
fig. 7 is a schematic perspective view of a conductive double-sided adhesive layer of the anti-falling conductive structure of the touch screen PCB in fig. 6, which is a side view;
fig. 8 is an enlarged detail schematic view of a region B of a schematic view of a three-dimensional structure of a conductive double-sided adhesive layer of the anti-falling conductive structure of the touch screen PCB in fig. 6;
fig. 9 is a schematic diagram of a three-dimensional structure of a conventional conductive structure of a PCB of a touch screen, which is a front view angle;
fig. 10 is a schematic perspective view of the conductive structure of the PCB of the touch screen in fig. 9, which is a back view angle;
FIG. 11 is an exploded view of the conductive structure of the touch screen PCB of FIG. 10;
FIG. 12 is a schematic diagram of a hierarchical stacking of conductive structures of the touch screen PCB of FIG. 10;
fig. 13 is an enlarged detail schematic view of region C of the hierarchical structure stacking schematic view of the conductive structure of the touch screen PCB in fig. 12;
the labels in the figures are illustrated below:
1. a glass fiber substrate layer; 10. a conductive double-sided adhesive layer; 101. a heat dissipation groove; 102. tearing edges; 2. a component layer; 3. a green oil layer is formed; 4. a copper wiring layer is arranged; 5. a lower copper wiring layer; 6. a lower green oil layer; 7. bai Youceng; 8. full-paving type conductive double-sided adhesive layer; 9. a non-conductive double-sided adhesive layer; d0, edge distance; d1, a first isolation distance; d2, a second isolation distance.
Detailed Description
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
As described in the background art, the prior art cannot effectively and reliably bond the touch screen PCB board with the backlight iron frame.
In order to solve the technical problem, the utility model provides an anti-falling conductive structure of a touch screen PCB, which comprises a glass fiber substrate layer 1, wherein an upper copper wiring layer 4 is arranged on the upper surface of the glass fiber substrate layer 1, an upper green oil layer 3 is arranged on the upper surface of the upper copper wiring layer 4, and a component layer 2 is arranged on the upper surface of the upper green oil layer 3. A lower copper wiring layer 5 is arranged at the lower part of the glass fiber substrate layer 1. Meanwhile, a lower green oil layer 6 and a conductive double-sided adhesive layer 10 are arranged on the lower surface of the lower copper wiring layer 5, a white oil layer 7 is arranged on the lower surface of the lower green oil layer 6, and a non-conductive double-sided adhesive layer 9 is arranged on the lower surface of the white oil layer 7. The thickness of the conductive double-sided adhesive layer 10 is greater than the sum of the thicknesses of the lower green oil layer 6, white oil layer 7 and non-conductive double-sided adhesive layer 9.
Through the above-mentioned structural design, because the thickness of this electrically conductive double faced adhesive tape is greater than green oil layer down, white oil layer and the sum of the thickness of non-electrically conductive double faced adhesive tape, can guarantee like this that this electrically conductive double faced adhesive tape 10 can with the laminating of back light iron stand contact, guarantee the good performance of ground connection. In the process of pasting the conductive double-sided adhesive layer 10, the conductive double-sided adhesive layer 10 is subjected to outward expansion extrusion, meanwhile, the non-conductive double-sided adhesive layer 9 is bonded with the backlight iron frame, and the touch screen PCB is firmly attached to the backlight iron frame and is not easy to fall off due to the fact that the adhesive force of the non-conductive double-sided adhesive layer is better than that of the conductive double-sided adhesive layer.
In order to better understand the solution of the present utility model, the following detailed description will describe the solution of the embodiment of the present utility model with reference to the accompanying drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, and thus the protection scope of the present utility model is more clearly and definitely defined.
It should be noted that, under the condition of no conflict, the embodiments of the present utility model and the features and technical solutions in the embodiments may be combined with each other.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
Example 1
As shown in fig. 1 to 5, the anti-falling conductive structure of the touch screen PCB board comprises a glass fiber substrate layer 1, an upper copper wiring layer 4 is disposed on the upper surface of the glass fiber substrate layer 1, an upper green oil layer 3 is disposed on the upper surface of the upper copper wiring layer 4, and a component layer 2 is disposed on the upper surface of the upper green oil layer 3.
Meanwhile, a lower copper wiring layer 5 is arranged at the lower part of the glass fiber substrate layer 1,
meanwhile, a lower green oil layer 6 and a conductive double-sided adhesive layer 10 are arranged on the lower surface of the lower copper wiring layer 5, a white oil layer 7 is arranged on the lower surface of the lower green oil layer 6, and a non-conductive double-sided adhesive layer 9 is arranged on the lower surface of the white oil layer 7.
The thickness of the conductive double-sided tape 10 is larger than the sum of the thicknesses of the lower green oil layer 6, the white oil layer 7 and the non-conductive double-sided tape 9.
In addition, the conductive double-sided tape 10 is in a strip shape, and the conductive double-sided tape 10 is located at the edge of the lower copper trace layer 5.
In this embodiment, the thickness of the upper green oil layer 3 is 0.02MM, the thickness of the lower green oil layer 6 is 0.02MM, the thickness of the white oil layer 7 is 0.02MM, the thickness of the non-conductive double-sided adhesive layer 9 is 0.05MM, and the thickness of the conductive double-sided adhesive layer 10 is 0.1MM.
Thus, the sum of the thicknesses of the lower green oil layer 6, the white oil layer 7 and the nonconductive double-sided adhesive layer 9 is 0.09MM. Obviously, the thickness of the conductive double-sided adhesive layer 10 is 0.1MM, which is greater than the sum of the thicknesses of 0.09MM. Thus, the conductive double-sided tape 10 is 0.01MM thicker than the three-layer combined structure of the lower green oil layer 6, the white oil layer 7 and the non-conductive double-sided tape 9.
Because the thickness of the conductive double-sided adhesive layer is larger than the sum of the thicknesses of the lower green oil layer, the white oil layer and the non-conductive double-sided adhesive layer, the conductive double-sided adhesive layer 10 can be guaranteed to be in contact with the backlight iron frame in a fitting way, and good grounding performance is guaranteed. In the process of pasting the conductive double-sided adhesive layer 10, the conductive double-sided adhesive layer 10 is subjected to outward expansion extrusion, meanwhile, the non-conductive double-sided adhesive layer 9 is bonded with the backlight iron frame, and the touch screen PCB is firmly attached to the backlight iron frame and is not easy to fall off due to the fact that the adhesive force of the non-conductive double-sided adhesive layer is better than that of the conductive double-sided adhesive layer.
In addition, the surfaces of the non-conductive double-sided adhesive layer 9 and the conductive double-sided adhesive layer 10 are provided with release films, so that the user can paste conveniently.
Example 2
Further optimizing the anti-falling conductive structure of the touch screen PCB provided in embodiment 1, specifically, as shown in fig. 5,
as shown in fig. 5, a predetermined edge distance D0 is provided between the outer edge of the conductive double-sided tape 10 and the edge of the glass fiber substrate layer 1, a predetermined first isolation distance D1 is provided between the inner edge of the conductive double-sided tape 10 and the inner edge of the lower green oil layer 6, and a predetermined second isolation distance D2 is provided between the inner edge of the white oil layer 7 and the inner edge of the lower green oil layer 6.
The effect of the edge distance D0, the first isolation distance D1, and the second isolation distance D2 will be described below.
The effect of this edge distance D0 is to prevent the edge of the conductive double-sided tape 10 beyond the fiberglass substrate layer 1.
The first separation distance D1 functions to prevent green oil from adhering to the conductive double-sided adhesive layer 10.
The second separation distance D2 functions to prevent white oil from adhering to the conductive double-sided adhesive layer 10.
In this embodiment, the edge distance D0 is 0.5MM, the first isolation distance D1 is 0.8MM, and the second isolation distance D2 is 0.35MM.
Example 3
As shown in fig. 6 to 8, a plurality of through heat dissipation grooves 101 are formed on the upper surface of the conductive double-sided adhesive layer 10, and the heat dissipation grooves 101 can effectively discharge the heat accumulated on the lower copper trace layer 5, and take away the heat by using air flow, so as to reduce the temperature of the PCB.
Example 4
Further optimizing the anti-falling conductive structure of the touch screen PCB provided in embodiment 1, specifically, as shown in fig. 6 to 8, two tearing edges 102 are disposed on two side edges of the conductive double-sided adhesive layer 10. These tear edges 102 are blue in color, which is convenient for the user to identify and pinch, and avoid the contact between the finger and the glue on the conductive double-sided adhesive layer 10.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
It is apparent that the above-described embodiments are only some embodiments of the present utility model, but not all embodiments, and the preferred embodiments of the present utility model are shown in the drawings, which do not limit the scope of the patent claims. This utility model may be embodied in many different forms, but rather, embodiments are provided in order to provide a thorough and complete understanding of the present disclosure. Although the utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing description, or equivalents may be substituted for elements thereof. All equivalent structures made by the content of the specification and the drawings of the utility model are directly or indirectly applied to other related technical fields, and are also within the scope of the utility model.
Claims (9)
1. The anti-falling conductive structure of the touch screen PCB comprises a glass fiber substrate layer (1), wherein an upper copper wiring layer (4) is arranged on the upper surface of the glass fiber substrate layer (1), an upper green oil layer (3) is arranged on the upper surface of the upper copper wiring layer (4), a component layer (2) is arranged on the upper surface of the upper green oil layer (3), a lower copper wiring layer (5) is arranged on the lower part of the glass fiber substrate layer (1), and the anti-falling conductive structure is characterized in that,
the lower copper wiring layer (5) lower surface on be equipped with green oil layer (6) and a conductive double faced adhesive tape (10) down, the lower surface on green oil layer (6) on be equipped with a white oil layer (7), the lower surface on white oil layer (7) on be equipped with a non-conductive double faced adhesive tape (9), the thickness of conductive double faced adhesive tape (10) be greater than the sum of the thickness of green oil layer (6), white oil layer (7) and non-conductive double faced adhesive tape (9) down.
2. The touch screen PCB board anti-falling conductive structure of claim 1, wherein,
the conductive double-sided adhesive layer (10) is in a strip shape, and the conductive double-sided adhesive layer (10) is positioned at the edge of the lower copper wiring layer (5).
3. The touch screen PCB board anti-falling conductive structure of claim 2, wherein,
a preset edge distance (D0) is arranged between the outer edge of the conductive double-sided adhesive layer (10) and the edge of the glass fiber substrate layer (1),
a preset first isolation distance (D1) is arranged between the inner side edge of the conductive double-sided adhesive layer (10) and the inner side edge of the lower green oil layer (6),
a preset second isolation distance (D2) is arranged between the inner side edge of the white oil layer (7) and the inner side edge of the lower green oil layer (6).
4. The touch screen PCB board anti-falling conductive structure according to claim 1, wherein the thickness of the upper green oil layer (3) is 0.02MM, the thickness of the lower green oil layer (6) is 0.02MM, the thickness of the white oil layer (7) is 0.02MM, the thickness of the non-conductive double-sided adhesive layer (9) is 0.05MM, and the thickness of the conductive double-sided adhesive layer (10) is 0.1MM.
5. The touch screen PCB of claim 3, wherein the edge distance (D0) is 0.5MM, the first isolation distance (D1) is 0.8MM, and the second isolation distance (D2) is 0.35MM.
6. The anti-falling conductive structure of the touch screen PCB according to claim 1, wherein release films are arranged on the surfaces of the non-conductive double-sided adhesive layer (9) and the conductive double-sided adhesive layer (10).
7. The anti-falling conductive structure of the touch screen PCB according to claim 1, wherein the conductive double-sided adhesive layer (10) is provided with a plurality of heat dissipation grooves (101).
8. The anti-falling conductive structure of the touch screen PCB of claim 1, wherein a tearing edge (102) is provided at both side edges of the conductive double-sided adhesive layer (10).
9. The touch screen PCB panel of claim 8, wherein the tear edge (102) is blue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320251311.XU CN219876232U (en) | 2023-02-16 | 2023-02-16 | Touch-sensitive screen PCB board anti-drop conductive structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320251311.XU CN219876232U (en) | 2023-02-16 | 2023-02-16 | Touch-sensitive screen PCB board anti-drop conductive structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876232U true CN219876232U (en) | 2023-10-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320251311.XU Active CN219876232U (en) | 2023-02-16 | 2023-02-16 | Touch-sensitive screen PCB board anti-drop conductive structure |
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| Country | Link |
|---|---|
| CN (1) | CN219876232U (en) |
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- 2023-02-16 CN CN202320251311.XU patent/CN219876232U/en active Active
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