CN209821566U

CN209821566U - Display module

Info

Publication number: CN209821566U
Application number: CN201920924905.6U
Authority: CN
Inventors: 黄思伟; 侯文波
Original assignee: Truly Semiconductors Ltd
Current assignee: Truly Semiconductors Ltd
Priority date: 2019-06-19
Filing date: 2019-06-19
Publication date: 2019-12-20
Anticipated expiration: 2029-06-19

Abstract

The utility model discloses a display module assembly, it includes last polaroid, upper substrate, infrabasal plate and the lower polaroid that sets up by stacking in proper order from the top down, the upper surface of upper substrate is equipped with the ITO individual layer, the upper surface of infrabasal plate is equipped with the ITO electrode, the ITO electrode is equipped with the ground wire, the ITO individual layer with the ground wire of ITO electrode switches on through silver thick liquid connection. The ITO single layer is conducted with the ground wire of the ITO electrode through the conductive silver paste, so that static electricity of the ITO single layer can be led out, and the LCD module and a display picture are prevented from being affected.

Description

Display module

Technical Field

The utility model relates to a liquid crystal display technology field, more specifically say, relate to a display module assembly.

Background

In a traditional liquid crystal display module, an ITO single layer is usually arranged on the upper surface of an upper substrate, but in actual use, the static electricity in the ITO single layer cannot be led out, the static electricity is applied to the ITO single layer through testing, the LCD module is restarted from +/-6 KV, and then the LCD module is automatically recovered; this phenomenon is more obvious and the picture is disordered when the voltage is +/-8 KV, so that the LCD module and the display picture are affected when the static electricity reaches a certain level.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a display module assembly is provided, switch on the ground wire of ITO individual layer and ITO electrode through electrically conductive silver thick liquid to make ITO individual layer's static can derive, thereby avoid causing the influence to LCD module assembly and display screen.

The utility model discloses the technical problem that will solve realizes through following technical scheme:

for solving the technical problem, the utility model provides a display module assembly, it includes last polaroid, upper substrate, infrabasal plate and the lower polaroid that sets up by stacking from the top down in proper order, the upper surface of upper substrate is equipped with the ITO individual layer, the upper surface of infrabasal plate is equipped with the ITO electrode, the ITO electrode is equipped with the ground wire, the ITO individual layer with the ground wire of ITO electrode switches on through silver thick liquid connection.

Furthermore, the upper surface of the lower substrate is connected with an FPC, and a ground wire of the ITO electrode is connected with the FPC.

Further, still including locating the iron stand of lower polaroid below, FPC through exposing copper with the iron stand switches on.

Further, the FPC includes the substrate layer, the upper surface of substrate layer is provided with the circuit layer, the lower surface of substrate layer is provided with the metal heat dissipation layer.

Further, FPC still includes that at least one runs through the substrate layer the circuit layer and the through-hole of metal heat dissipation layer, the inner wall of through-hole be provided with the circuit layer the heat-conducting layer that the metal heat dissipation layer contacted.

Further, a heat conductor connected with an external heat conduction structure is arranged in the through hole, and the heat conductor is in contact with the heat conduction layer.

Further, the structure of the metal heat dissipation layer is a net structure, a strip structure, a wavy structure or a honeycomb structure.

Further, FPC includes body, connecting portion and golden finger, connecting portion with this body coupling, the golden finger is located connecting portion are kept away from the one end of body, the both sides of connecting portion are equipped with two stiffening plates that stagger the setting each other.

Further, the width of the two reinforcing plates is different.

Furthermore, the outer surface of the reinforcing plate is provided with diamond knurls.

The utility model discloses following beneficial effect has:

the ITO single layer is conducted with the ground wire of the ITO electrode through the conductive silver paste, so that static electricity of the ITO single layer can be led out, and the LCD module and a display picture are prevented from being affected.

The upper surface of the lower substrate is connected with an FPC, and the ground wire of the ITO electrode is connected with the FPC. The static electricity is led out through the FPC by connecting the ground wire with the FPC, and the influence on the LCD module and a display picture is avoided.

The flexible printed circuit board further comprises an iron frame arranged below the lower polarizer, the iron frame is used for bearing the upper polarizer, the upper substrate, the lower substrate and the lower polarizer, the FPC is conducted with the iron frame through copper exposure and is conducted with the iron frame through the FPC, so that the ground wire of the ITO electrode is led out of the iron frame, and the LCD module and the display picture are prevented from being affected.

Drawings

Fig. 1 is a schematic structural view of a display module according to the present invention.

Fig. 2 is a schematic view of an improved structure of the FPC in fig. 1.

Fig. 3 is a schematic view of another modified structure of the FPC in fig. 1.

Detailed Description

The present invention will be described in detail with reference to the following examples, which are only preferred embodiments of the present invention and are not intended to limit the present invention.

Please refer to fig. 1, which is a schematic diagram of the present invention, the display module includes an upper polarizer 1, an upper substrate 2, a lower substrate 3 and a lower polarizer 4 sequentially stacked from top to bottom, the upper surface of the upper substrate 2 is provided with an ITO single layer 5, the upper surface of the lower substrate 3 is provided with an ITO electrode 6, the ITO electrode 6 is provided with a ground wire, the ITO single layer 5 is connected and conducted with the ground wire of the ITO electrode 6 through a silver paste 7. The ITO single layer 5 is conducted with the ground wire of the ITO electrode 6 through the conductive silver paste 7, so that static electricity of the ITO single layer 5 can be led out, and the LCD module and a display picture are prevented from being affected.

Further, the upper surface of the lower substrate 3 is connected with an FPC8, and the ground line of the ITO electrode 6 is connected with the FPC 8. The static electricity is led out through the FPC8 by connecting the ground wire with the FPC8, so that the influence on the LCD module and the display picture is avoided.

Further, the display device further comprises an iron frame arranged below the lower polarizer 4, wherein the iron frame is used for bearing the upper polarizer 1, the upper substrate 2, the lower substrate 3 and the lower polarizer 4, the FPC8 is conducted with the iron frame through exposed copper and is conducted with the iron frame through the FPC8, so that the ground wire of the ITO electrode 6 is led out of the iron frame, and the LCD module and the display picture are prevented from being affected.

Referring to fig. 2, the FPC8 further includes a substrate layer 81, a circuit layer 82 is disposed on the upper surface of the substrate layer 81, and a metal heat dissipation layer 83 is disposed on the lower surface of the substrate layer 81, and the circuit layer 82 and the metal heat dissipation layer 83 are respectively adhered to the substrate layer 81 through a double-sided tape. Because the thickness of substrate layer 81 is thin, the heat on FPC8 can diffuse to metal heat dissipation layer 83 through substrate layer 81, and this metal heat dissipation layer 83 can effectively increase FPC 8's heat radiating area, plays even radiating effect to FPC 8's radiating efficiency has been improved. The substrate layer 81 may be any one of polyimide, polyester, polysulfone, or polytetrafluoroethylene, the double-sided tape may be any one of an acrylic adhesive layer or an epoxy adhesive layer, and the metal heat dissipation layer 83 may be a copper foil layer.

Further, the FPC8 further includes at least one through hole 84 penetrating through the substrate layer 81, the circuit layer 82 and the metal heat dissipation layer 83, and a heat conduction layer contacting the circuit layer 82 and the metal heat dissipation layer 83 is disposed on an inner wall of the through hole 84, so that the circuit layer 82 and the metal heat dissipation layer 83 on both sides of the substrate layer 81 can be electrically connected by using good heat conduction performance of the through hole 84, thereby exerting a good heat conduction function, and the heat conduction layer can provide a heat conduction function to achieve a good heat dissipation effect. The heat conducting layer can be a copper adhesive conductive ink layer.

Further, a heat conductor connected to an external heat conducting structure is provided in the through hole 84, and the heat conductor is connected to the external heat conducting structure from one side of the circuit layer 82 and is also in contact with the heat conducting layer in the through hole 84, so that the circuit layer 82 and the metal heat dissipation layer 83 can be connected to the external heat conducting structure through the through hole 84, and heat in the FPC8 is diffused to the external heat conducting structure through the heat conductor in the through hole 84, thereby further improving the heat dissipation efficiency of the FPC 8. Preferably, the vias 84 are disposed at the edge of the FPC8 in order that the vias 84 may be connected to an external thermally conductive structure.

Further, the metal heat dissipation layer 83 is an even heat dissipation structure, and the structure thereof may be any one of a mesh structure, a strip structure, a wave structure or a honeycomb structure.

Referring to fig. 3, further, the FPC8 includes a body 85, a connection portion 86 and a gold finger 87, the connection portion 86 is connected to the body 85, the gold finger 87 is disposed at one end of the connection portion 86 away from the body 85, and two reinforcing plates 88 are disposed at two sides of the connection portion 86 and staggered with each other. In the conventional FPC8 design, the stiffener 88 is usually not provided or the stiffener 88 is provided at the same position and the width of the stiffener 88 is the same, so that when the FPC8 is pulled out, the applied pressure is concentrated on the same straight line, which causes the circuit of the FPC8 to be slightly broken. The utility model provides a FPC8 is because two stiffening plates 88 are located the both sides of connecting portion 86 respectively and stagger the setting each other, and when extracting FPC8, the pressure that FPC8 was given to both sides stiffening plate 88 is not on same line segment, and stress can not concentrate on same straight line when buckling yet, avoids stress concentration from this, and the easy disconnected problem of circuit a little of golden finger 87 department improves the product yield.

Furthermore, the two reinforcing plates 88 staggered with each other in the present invention may be respectively disposed at two different positions; the positions of the central points can be the same, but the widths of the two reinforcing plates 88 are different, and the stress generated when the two reinforcing plates 88 are bent is not concentrated on the same straight line, so that the problems that the stress is concentrated and the circuit at the golden finger 87 is easily broken slightly can be solved, and the product yield is improved. In this embodiment, the reinforcing plates 88 include first reinforcing plates and second reinforcing plates, the width of each reinforcing plate 88 is different, and the center points of the reinforcing plates 88 are located on the same horizontal line, so that the edges of the reinforcing plates 88 are staggered from each other, and are not concentrated on the same straight line.

Further, the material of the reinforcing plate 88 is FR4, PI or stainless steel, and in other embodiments, if the heat generation amount of the FPC8 is large, a heat dissipation material with better heat dissipation effect, such as an aluminum foil reinforcing plate 88, may also be used.

Furthermore, the outer surface of the reinforcing plate 88 is provided with a diamond knurl, so that the FPC8 can be pulled out more easily, and the risk of breaking the FPC8 circuit is reduced.

The above embodiments only express the embodiments of the present invention, and the description thereof is specific and detailed, but the invention can not be understood as the limitation of the patent scope of the present invention, but all the technical solutions obtained by adopting the equivalent substitution or equivalent transformation should fall within the protection scope of the present invention.

Claims

1. The utility model provides a display module assembly, its characterized in that, it includes by last polaroid, upper substrate, infrabasal plate and the lower polaroid of stack setting in proper order under to, the upper surface of upper substrate is equipped with the ITO individual layer, the upper surface of infrabasal plate is equipped with the ITO electrode, the ITO electrode is equipped with the ground wire, the ITO individual layer with the ground wire of ITO electrode switches on through silver thick liquid connection.

2. The display module assembly according to claim 1, wherein an FPC is connected to an upper surface of the lower substrate, and a ground line of the ITO electrode is connected to the FPC.

3. The display module assembly of claim 2, further comprising an iron frame disposed below the lower polarizer, wherein the FPC is electrically connected to the iron frame through copper exposure.

4. The display module assembly according to claim 2, wherein the FPC comprises a substrate layer, a circuit layer is arranged on the upper surface of the substrate layer, and a metal heat dissipation layer is arranged on the lower surface of the substrate layer.

5. The display module according to claim 4, wherein the FPC further comprises at least one through hole penetrating through the substrate layer, the circuit layer and the metal heat dissipation layer, and a heat conduction layer contacting the circuit layer and the metal heat dissipation layer is arranged on an inner wall of the through hole.

6. The display module of claim 5, wherein the through hole has a thermal conductor disposed therein for connection to an external thermally conductive structure, the thermal conductor contacting the thermally conductive layer.

7. The display module according to claim 4, wherein the metal heat dissipation layer has a mesh structure, a stripe structure, a wave structure or a honeycomb structure.

8. The display module according to claim 2, wherein the FPC includes a main body, a connecting portion and a gold finger, the connecting portion is connected to the main body, the gold finger is disposed at an end of the connecting portion away from the main body, and two reinforcing plates are disposed at two sides of the connecting portion and staggered from each other.

9. The display module of claim 8, wherein the two stiffening plates have different widths.

10. The display module assembly of claim 8, wherein the outer surface of the stiffener is provided with diamond knurls.