CN209845441U

CN209845441U - Circuit board

Info

Publication number: CN209845441U
Application number: CN201920363992.2U
Authority: CN
Inventors: 吴伟佳; 黄英群
Original assignee: Truly Semiconductors Ltd
Current assignee: Truly Semiconductors Ltd
Priority date: 2019-03-21
Filing date: 2019-03-21
Publication date: 2019-12-24
Anticipated expiration: 2029-03-21

Abstract

The utility model discloses a circuit board, it includes circuit board body, PET membrane and the shielding film that sets up by stacking in proper order from bottom to top, be equipped with at least one connector on the circuit board body, PET membrane and shielding film in connector department is equipped with keeps away the vacancy, is close to the connector the edge of PET membrane surpasss the edge of shielding film. Through the edge extension of PET membrane on will being close to the position of connector, make the edge of PET membrane and the edge of shielding film pull open certain distance for even there is certain operating error when the staff is attached, also can guarantee on the connector is not touched at the edge of shielding film, thereby make the edge of shielding film insulating, prevent that the shielding film from touching the emergence of the short circuit problem that the connector caused, improved attached efficiency and production yield.

Description

Circuit board

Technical Field

The utility model relates to a printed circuit board technical field, more specifically say, relate to a circuit board.

Background

At present, electromagnetic shielding films are often used on some large-sized displays instead of electromagnetic shielding cases, and compared with the shielding cases, the shielding films have the advantages of low cost and light weight. Because the adhesive surface and the side edge of the shielding film have conductive performance, when the shielding film is used, special attention needs to be paid to the problem of short circuit, particularly to the side edge of the shielding film, and because the shielding film is a hand-pasted piece, the assembly precision is low, and a worker carelessly touches the edge of the shielding film against a component to cause short circuit.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a circuit board is provided, through the edge extension of PET membrane on the position that will be close to the connector, make the edge of PET membrane and the edge of shielding film pull open certain distance, even there is certain operating error when the staff is attached, also can guarantee on the connector is not touched at the edge of shielding film, thereby make the edge insulation of shielding film, prevent that the shielding film from touching the emergence of the short circuit problem that the connector caused, attached efficiency and production yield have been improved.

The utility model discloses the technical problem that will solve realizes through following technical scheme:

in order to solve the technical problem, the utility model provides a circuit board, it includes circuit board body, PET membrane and the shielding film that sets up by stacking in proper order from bottom to top, be equipped with at least one connector on the circuit board body, PET membrane and shielding film in connector department is equipped with keeps away the vacancy, is close to the connector the edge of PET membrane surpasss the edge of shielding film.

Further, the edge of the PET film near the connector exceeds the edge of the shielding film by 0.5mm or more.

Further, the bottom of the PET film is provided with a double-sided adhesive.

Further, the circuit board body includes the substrate layer, the upper surface of substrate layer is provided with the circuit layer, the lower surface of substrate layer is provided with the metal heat dissipation layer.

Further, the circuit board body still includes at least one and runs through the substrate layer the circuit layer and the through-hole of metal heat dissipation layer, the inner wall of through-hole be provided with the circuit layer the heat-conducting layer that the metal heat dissipation layer contacted.

Further, a heat conductor connected with an external heat conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat conducting layer.

Further, the structure of the metal heat dissipation layer is a net structure, a strip structure, a wavy structure or a honeycomb structure.

Furthermore, the circuit board body is also provided with a two-dimensional code laser area, the upper surface of the circuit board body positioned on the two-dimensional code laser area is provided with a black ink layer and a white ink layer arranged on the black ink layer, and the white ink layer is laser-formed with a two-dimensional code.

Further, the thickness of the black ink layer is 30 to 40 μm.

Further, the thickness of the white ink layer is 10 to 20 μm.

The utility model discloses following beneficial effect has:

through the edge extension of PET membrane on will being close to the position of connector, make the edge of PET membrane and the edge of shielding film pull open certain distance for even there is certain operating error when the staff is attached, also can guarantee on the connector is not touched at the edge of shielding film, thereby make the edge of shielding film insulating, prevent that the shielding film from touching the emergence of the short circuit problem that the connector caused, improved attached efficiency and production yield.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board according to the present invention.

Fig. 2 is a top view of fig. 1.

Fig. 3 is a schematic view of an improved structure of the circuit board body in fig. 1.

Fig. 4 is a schematic view of another improved structure of the circuit board body in fig. 1.

Detailed Description

The present invention will be described in detail with reference to the following examples, which are only preferred embodiments of the present invention and are not intended to limit the present invention.

Please refer to fig. 1 and fig. 2, for the utility model provides a pair of circuit board, it includes circuit board body 1, PET membrane 2 and shielding film 3 that stack in proper order from bottom to top, because PET membrane 2 all has viscidity generally, so need not to set up two-sided gluing and can paste, shielding film 3 generally includes aluminium foil mylar, conducting resin and the type membrane that stacks in proper order from bottom to top, shielding film 3's bottom and side all can electrically conduct, circuit board body 1's upper surface is equipped with at least one connector 4, and connector 4's interface is connected with the filter usually, PET membrane 2 and shielding film 3 in connector 4 department is equipped with keeps away the vacancy to prevent that PET membrane 2 and shielding film 3 from interfering with connector 4, be close to connector 4 the edge of PET membrane 2 surpasss the edge of shielding film 3. Through the edge extension that will be close to PET membrane 2 in the position of connector 4, make the edge of PET membrane 2 and shielding film 3's edge pull open certain distance, even there is certain operating error when the staff is attached, also can guarantee shielding film 3's edge not touch on connector 4, thereby make shielding film 3's edge insulating, prevent that shielding film 3 from touching the emergence of the short circuit problem that connector 4 caused, improved attached efficiency and production yield.

Further, the edge of the PET film 2 near the connector 4 exceeds the edge of the shielding film 3 by 0.5mm or more. On not touch connector 4 with the edge of guaranteeing shielding film 3 to make shielding film 3's edge insulating, prevent shielding film 3 and touch the emergence of the short circuit problem that connector 4 caused, improved attached efficiency and production yield.

Further, since there is also a portion of the PET film 2 having no or insufficient tackiness, the bottom of the PET film 2 is provided with a double-sided tackiness. So that the PET film 2 can be adhered to the wiring board body 1.

Referring to fig. 3, the circuit board body 1 further includes a substrate layer 11, a circuit layer 12 is disposed on an upper surface of the substrate layer 11, and a metal heat dissipation layer 13 is disposed on a lower surface of the substrate layer 11, and the circuit layer 12 and the metal heat dissipation layer 13 may be respectively adhered to the substrate layer 11 through a double-sided tape. Because the thickness of substrate layer 11 is thin, the heat on circuit board body 1 can diffuse to metal heat dissipation layer 13 through substrate layer 11, and this metal heat dissipation layer 13 can effectively increase circuit board body 1's heat radiating area, plays even radiating effect to the radiating efficiency of circuit board body 1 has been improved. The substrate layer 11 may be any one of polyimide, polyester, polysulfone, or polytetrafluoroethylene, the double-sided tape may be any one of an acrylic adhesive layer or an epoxy adhesive layer, and the metal heat dissipation layer 13 may be a copper foil layer.

Further, the circuit board body 1 further includes at least one through hole 14 penetrating through the substrate layer 11, the circuit layer 12 and the metal heat dissipation layer 13, a heat conduction layer contacting with the circuit layer 12 and the metal heat dissipation layer 13 is arranged on the inner wall of the through hole 14, the circuit layer 12 and the metal heat dissipation layer 13 on the two sides of the substrate layer 11 can be electrically connected by utilizing good heat conduction performance of the through hole 14, a good heat conduction function is exerted, and the heat conduction layer can provide a heat conduction function so as to achieve a good heat dissipation effect. The heat conducting layer can be a copper adhesive conductive ink layer.

Further, a heat conductor connected with an external heat conducting structure is arranged in the through hole 14, the heat conductor is connected with the external heat conducting structure from one side of the circuit layer 12 and is also in contact with the heat conducting layer in the through hole 14, so that the circuit layer 12 and the metal heat dissipation layer 13 can be connected with the external heat conducting structure through the through hole 14, heat in the circuit board body 1 is diffused to the external heat conducting structure through the heat conductor in the through hole 14, and the heat dissipation efficiency of the circuit board body 1 is further improved. Preferably, in order to enable the through hole 14 to be connected with the external heat conducting structure, the through hole 14 is disposed at an edge position of the circuit board body 1.

Further, the metal heat dissipation layer 13 is an even heat dissipation structure, and the structure thereof may be any one of a mesh structure, a strip structure, a wave structure or a honeycomb structure.

Referring to fig. 4, further, a two-dimensional code laser area 5 is further arranged on the circuit board body 1, a black ink layer 6 and a white ink layer 7 arranged on the black ink layer 6 are arranged on the upper surface of the circuit board body 1 located on the two-dimensional code laser area 5, and the white ink layer 7 is formed into a two-dimensional code through laser. Owing to set up two-layer printing ink on black ink layer 6 and white ink layer 7, carry out radium-shine to top layer white ink layer 7 through laser and fall, expose the black ink layer 6 of bottom, the radium-shine local demonstration of crossing of laser is the black, and the two-dimensional code contrast that generates through this kind of mode is effectual, sweeps the sign indicating number easily, and the damage also can not dropped to the two-dimensional code simultaneously, prevents that the two-dimensional code from becoming invalid, has reduced labour cost by a wide margin.

Further, the thickness of the black ink layer 6 is 30 to 40 μm. The thickness of the white ink layer 7 is 10 to 20 μm. The thickness is the thickness that commonly used ultraviolet laser just can radium penetrate, and laser back is dustless moreover around, has beat and efficient advantage. The reason why the thickness of the black ink layer 6 at the lower layer is thicker than that of the white ink layer 7 at the upper layer is to avoid laser power energy fluctuation and prevent the black ink layer 6 from being penetrated by laser to damage the inner layer of the circuit board body 1.

The above embodiments only express the embodiments of the present invention, and the description thereof is specific and detailed, but the invention can not be understood as the limitation of the patent scope of the present invention, but all the technical solutions obtained by adopting the equivalent substitution or equivalent transformation should fall within the protection scope of the present invention.

Claims

1. The utility model provides a circuit board, its characterized in that, it includes circuit board body, PET membrane and the shielding film that sets up by stacking in proper order from bottom to top, be equipped with at least one connector on the circuit board body, PET membrane and shielding film in connector department is equipped with keeps away the vacancy, is close to the connector the edge of PET membrane surpasss the edge of shielding film.

2. The wiring board of claim 1, wherein the edge of the PET film near the connector exceeds the edge of the shielding film by more than 0.5 mm.

3. The wiring board of claim 1, wherein the bottom of the PET film is provided with a double-sided adhesive.

4. The circuit board according to claim 1, wherein the circuit board body comprises a substrate layer, a circuit layer is arranged on an upper surface of the substrate layer, and a metal heat dissipation layer is arranged on a lower surface of the substrate layer.

5. The circuit board according to claim 4, wherein the circuit board body further comprises at least one through hole penetrating through the substrate layer, the circuit layer and the metal heat dissipation layer, and a heat conduction layer contacting with the circuit layer and the metal heat dissipation layer is disposed on an inner wall of the through hole.

6. The wiring board of claim 5, wherein a thermal conductor is disposed within the through hole and coupled to an external thermally conductive structure, the thermal conductor contacting the thermally conductive layer.

7. The wiring board of claim 4, wherein the structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wave structure or a honeycomb structure.

8. The circuit board of claim 1, wherein the circuit board body further comprises a two-dimensional code laser area, and the upper surface of the circuit board body on the two-dimensional code laser area is provided with a black ink layer and a white ink layer on the black ink layer, and the white ink layer is laser-formed with a two-dimensional code.

9. The wiring board of claim 8, wherein the thickness of the black ink layer is 30 μm to 40 μm.

10. The wiring board of claim 8, wherein the thickness of the white ink layer is 10 μm to 20 μm.