CN209821550U

CN209821550U - Display module

Info

Publication number: CN209821550U
Application number: CN201920973076.0U
Authority: CN
Inventors: 黄思伟
Original assignee: Truly Semiconductors Ltd
Current assignee: Truly Semiconductors Ltd
Priority date: 2019-06-26
Filing date: 2019-06-26
Publication date: 2019-12-20
Anticipated expiration: 2029-06-26

Abstract

The utility model discloses a display module assembly, it includes by infrabasal plate, liquid crystal and the upper substrate that superposes in proper order and set up from bottom to top, the infrabasal plate with the infrabasal plate staggers to set up and is formed with and binds the district, the infrabasal plate in it is provided with ITO beer position to bind the district, be connected with FPC on the ITO beer position, FPC bind the end of location with 0.1mm-0.2mm staggers on the top of ITO beer position. The tail end of the binding position of the FPC is staggered from the top end of the ITO beer position by 0.1mm-0.2mm, so that the FPC is prevented from being lapped on other wires at the upper end point of the ITO beer position, and abnormal display is avoided. The recommended design value for TFT is 0.1mm staggered, and the recommended design value for non-TFT is 0.2mm staggered to avoid false overlap.

Description

Display module

Technical Field

The utility model relates to a liquid crystal display technology field, more specifically say, relate to a display module assembly.

Background

An ITO (indium tin oxide) beer position is usually arranged on a binding area of a lower substrate in the display module, an FPC (flexible printed circuit) is overlapped on the ITO beer position, ITO wiring of a TFT (thin film transistor) is arranged at the upper end point of the ITO beer position, and the FPC is possibly overlapped on the ITO wiring to cause the display module to be abnormal.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a display module assembly is provided, tie up the end of location through making FPC and stagger 0.1mm-0.2mm with the top of ITO beer position to prevent that FPC from lapping other of ITO beer position up end department and walk the line, avoid showing unusually. The recommended design value for TFT is 0.1mm staggered, and the recommended design value for non-TFT is 0.2mm staggered to avoid false overlap.

The utility model discloses the technical problem that will solve realizes through following technical scheme:

for solving the technical problem, the utility model provides a display module assembly, it includes by infrabasal plate, liquid crystal and the upper substrate that superposes in proper order and set up on going, the infrabasal plate with the infrabasal plate staggers to set up and is formed with and binds the district, the infrabasal plate in it is provided with ITO beer position to bind the district, be connected with FPC on the ITO beer position, FPC bind the location end with the top of ITO beer position staggers 0.1mm-0.2 mm.

Furthermore, the tail end of the FPC is provided with a gold finger, and the lower end of the gold finger is 0.2mm longer than the edge of the lower substrate.

Further, the effective attaching length of the golden finger and the ITO beer position is larger than 0.5 mm.

Furthermore, a reinforcing plate is arranged at the tail end of the FPC and on the back surface of the golden finger, and the reinforcing plate is 0.5mm-0.8mm longer than the golden finger.

Further, the beer length of the FPC is 0.5mm-1mm longer than the gold finger at the outermost layer of the FPC.

Further, be equipped with the alignment mark on the infrabasal plate, the alignment mark with the distance of FPC's outmost golden finger is greater than 0.7mm, FPC's long limit exceedes the alignment mark is 0.3mm at least, FPC ties up the end of location and surpasss the alignment mark is 0.2mm at least.

Further, the FPC includes the substrate layer, the upper surface of substrate layer is provided with the circuit layer, the lower surface of substrate layer is provided with the metal heat dissipation layer.

Further, FPC still includes that at least one runs through the substrate layer the circuit layer and the through-hole of metal heat dissipation layer, the inner wall of through-hole be provided with the circuit layer the heat-conducting layer that the metal heat dissipation layer contacted.

Further, a heat conductor connected with an external heat conduction structure is arranged in the through hole, and the heat conductor is in contact with the heat conduction layer.

Further, the structure of the metal heat dissipation layer is a net structure, a strip structure, a wavy structure or a honeycomb structure.

The utility model discloses following beneficial effect has:

the tail end of the binding position of the FPC is staggered from the top end of the ITO beer position by 0.1mm-0.2mm, so that the FPC is prevented from being lapped on other wires at the upper end point of the ITO beer position, and abnormal display is avoided. The recommended design value for TFT is 0.1mm staggered, and the recommended design value for non-TFT is 0.2mm staggered to avoid false overlap.

The tail end of the FPC is provided with a gold finger, and the lower end of the gold finger is 0.2mm longer than the edge of the lower substrate. So as to ensure that the golden finger of the FPC can be effectively conducted with the ITO of the lower substrate.

The effective joint length of the golden finger and the ITO beer position is more than 0.5 mm. So as to ensure that the golden finger of the FPC can be effectively conducted with the ITO of the lower substrate.

The tail end of the FPC is provided with a reinforcing plate on the back of the golden finger, and the reinforcing plate is 0.5mm-0.8mm longer than the golden finger. The beer position end of the FPC has certain hardness and flatness, and beer position attaching operation is facilitated.

Drawings

Fig. 1 is a schematic structural view of a display module according to the present invention.

Fig. 2 is a schematic diagram of a modified structure of fig. 1.

Fig. 3 is a schematic diagram of an improved structure of the FPC.

Fig. 4 is a schematic view of another modified structure of fig. 1.

Fig. 5 is a schematic structural diagram of another display module according to the present invention.

Fig. 6 is a schematic view of another modified structure of the FPC.

Detailed Description

The present invention will be described in detail with reference to the following examples, which are only preferred embodiments of the present invention and are not intended to limit the present invention.

Please refer to fig. 1, for the utility model provides a pair of display module assembly, dotted line part is the segment that is sheltered from in the picture, and it includes infrabasal plate 1, liquid crystal and the upper substrate that superposes the setting in proper order from bottom to top, infrabasal plate 1 with the setting of staggering of infrabasal plate 1 is formed with and binds the district, infrabasal plate 1 in it is provided with ITO beer position 2 to bind the district, be connected with FPC3 on ITO beer position 2, FPC3 bind the end of location with the staggered distance in top of ITO beer position 2 is d₁Wherein d is₁Is 0.1mm-0.2 mm. The tail end of the binding position of the FPC3 is staggered from the top end of the ITO beer position 2 by 0.1mm-0.2mm, so that the FPC3 is prevented from being lapped on other wires at the upper end point of the ITO beer position 2, and abnormal display is avoided. The recommended design value for TFT is 0.1mm staggered, and the recommended design value for non-TFT is 0.2mm staggered to avoid false overlap.

Referring to fig. 1 and 2, a dotted line portion is a shielded line segment, a right side portion is a view of hiding the FPC3, and further, a gold finger 4 is disposed at a tail end of the FPC3, and a distance d between a lower end of the gold finger 4 and an edge of the lower substrate 1 is longer than that of the gold finger 4₂Wherein d is₂Is 0.2 mm. So as to ensure that the golden finger 4 of the FPC3 can be effectively conducted with the ITO of the lower substrate 1.

Furthermore, the effective attaching length of the golden finger 4 and the ITO beer position 2 is larger than d₃Wherein d is₃Is 0.5 mm. So as to ensure that the golden finger 4 of the FPC3 can be effectively conducted with the ITO of the lower substrate 1.

Referring to fig. 2 and 3, a reinforcing plate 5 is further disposed at the end of the FPC3 on the back surface of the gold finger 4, and the length of the reinforcing plate 5, which is longer than the exposed portion of the gold finger 4, is d₄Wherein d is₄Is 0.5mm-0.8 mm. So as to ensure that the beer position end of the FPC3 has certain hardness and flatness, and facilitate the beer position attaching operation.

Referring to fig. 4, the distance d between the metal finger 4 with a beer length of the FPC3 longer than the outermost layer of the FPC3 is further shown₅Wherein d is₅Is 0.5mm-1mm, normally designed according to 1.0mm, and the minimum special condition can not be less than 0.5 mm. To ensure that the FPC3 and the lower substrate 1 have enough adhesion forceNo ACF is wasted.

Referring to fig. 5, further, the lower substrate 1 is provided with a position indicator 6, and a distance d between the position indicator 6 and the gold finger 4 at the outermost layer of the FPC3₆Wherein d is₆Is greater than 0.7mm, the length of the long edge of the FPC3 exceeding the alignment mark 6 is d₇Wherein d is₇At least 0.3mm, the length d of the tail end of the FPC3 binding position exceeding the alignment mark 6₈Wherein d is₈At least 0.2 mm. So as to ensure that the ACF is not wasted under the condition that the FPC3 and the lower substrate 1 have enough attaching force.

Further, the FPC3 includes a substrate layer 31, a circuit layer 32 is disposed on the upper surface of the substrate layer 31, and a metal heat dissipation layer 33 is disposed on the lower surface of the substrate layer 31, and the circuit layer 32 and the metal heat dissipation layer 33 may be respectively attached to the substrate layer 31 by double-sided tapes. Because the thickness of substrate layer 31 is thin, the heat on FPC3 can diffuse to metal heat dissipation layer 33 through substrate layer 31, and this metal heat dissipation layer 33 can effectively increase FPC 3's heat radiating area, plays even radiating effect to FPC 3's radiating efficiency has been improved. The substrate layer 31 may be any one of polyimide, polyester, polysulfone, and polytetrafluoroethylene, the double-sided tape may be any one of an acrylic adhesive layer or an epoxy adhesive layer, and the metal heat dissipation layer 33 may be a copper foil layer.

Further, the FPC3 further includes at least one through hole 34 penetrating through the substrate layer 31, the circuit layer 32 and the metal heat dissipation layer 33, and a heat conduction layer contacting with the circuit layer 32 and the metal heat dissipation layer 33 is disposed on an inner wall of the through hole 34, and the circuit layer 32 and the metal heat dissipation layer 33 on both sides of the substrate layer 31 can be electrically connected by using good heat conduction performance of the through hole 34, so as to exert a good heat conduction function, and the heat conduction layer can provide a heat conduction function, so as to achieve a good heat dissipation effect. The heat conducting layer can be a copper adhesive conductive ink layer.

Further, a heat conductor connected to an external heat conducting structure is disposed in the through hole 34, and the heat conductor is connected to the external heat conducting structure from one side of the circuit layer 32 and is also in contact with the heat conducting layer in the through hole 34, so that the circuit layer 32 and the metal heat dissipation layer 33 can be connected to the external heat conducting structure through the through hole 34, and heat in the FPC3 is diffused to the external heat conducting structure through the heat conductor in the through hole 34, thereby further improving the heat dissipation efficiency of the FPC 3. Preferably, the vias 34 are disposed at the edge of the FPC3 in order that the vias 34 may be connected to an external thermally conductive structure.

Further, the metal heat dissipation layer 33 is an even heat dissipation structure, and the structure thereof may be any one of a mesh structure, a strip structure, a wave structure or a honeycomb structure.

The above embodiments only express the embodiments of the present invention, and the description thereof is specific and detailed, but the invention can not be understood as the limitation of the patent scope of the present invention, but all the technical solutions obtained by adopting the equivalent substitution or equivalent transformation should fall within the protection scope of the present invention.

Claims

1. The display module is characterized by comprising a lower substrate, liquid crystals and an upper substrate which are sequentially overlapped from bottom to top, wherein a binding region is formed by staggering the lower substrate and the lower substrate, an ITO (indium tin oxide) beer position is arranged on the binding region of the lower substrate, an FPC (flexible printed circuit) is connected to the ITO beer position, and the tail end of the binding position of the FPC is staggered from the top end of the ITO beer position by 0.1mm-0.2 mm.

2. The display module according to claim 1, wherein a gold finger is disposed at the end of the FPC, and the lower end of the gold finger is 0.2mm longer than the edge of the lower substrate.

3. The display module of claim 2, wherein the effective attachment length of the gold finger to the ITO beer site is greater than 0.5 mm.

4. The display module assembly according to claim 2, wherein a stiffener is disposed at a rear end of the FPC opposite to the gold finger, and the stiffener is 0.5mm-0.8mm longer than the gold finger.

5. The display module according to claim 2, wherein the beer length of the FPC is 0.5mm-1mm longer than the gold finger at the outermost layer of the FPC.

6. The display module assembly according to claim 2, wherein the lower substrate is provided with a registration mark, the distance between the registration mark and the gold finger on the outermost layer of the FPC is greater than 0.7mm, the long edge of the FPC exceeds the registration mark by at least 0.3mm, and the tail end of the FPC binding position exceeds the registration mark by at least 0.2 mm.

7. The display module assembly according to claim 1, wherein the FPC comprises a substrate layer, a circuit layer is arranged on the upper surface of the substrate layer, and a metal heat dissipation layer is arranged on the lower surface of the substrate layer.

8. The display module according to claim 7, wherein the FPC further comprises at least one through hole penetrating through the substrate layer, the circuit layer and the metal heat dissipation layer, and a heat conduction layer contacting the circuit layer and the metal heat dissipation layer is disposed on an inner wall of the through hole.

9. The display module of claim 8, wherein the through hole has a thermal conductor disposed therein for connection to an external thermally conductive structure, the thermal conductor contacting the thermally conductive layer.

10. The display module according to claim 7, wherein the metal heat dissipation layer has a mesh structure, a stripe structure, a wave structure, or a honeycomb structure.