CN109378334B - OLED display device and preparation method thereof - Google Patents
OLED display device and preparation method thereof Download PDFInfo
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- CN109378334B CN109378334B CN201811280414.9A CN201811280414A CN109378334B CN 109378334 B CN109378334 B CN 109378334B CN 201811280414 A CN201811280414 A CN 201811280414A CN 109378334 B CN109378334 B CN 109378334B
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- oled display
- flexible circuit
- circuit board
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- Electroluminescent Light Sources (AREA)
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Abstract
The application discloses an OLED display device (1) and a preparation method thereof, the OLED display device (1) comprises: an OLED display panel (10), one side of the OLED display panel (10) being defined with a bonding portion (100); flexible circuit boards (12), one of the bonding portions (100) being connected to an end portion (120) of one of the flexible circuit boards (12); an adhesive member (14) covering a partial end portion (120) of the flexible circuit board (12) and a peripheral area of the bonding portion (100) of the OLED display panel (10). Through the mode, the drawing force between the flexible circuit board and the display panel can be improved.
Description
Technical Field
The application relates to the technical field of display, in particular to an OLED display device and a preparation method thereof.
Background
The full-screen has been one of the important development trends of display devices. In order to approach or achieve the display effect of the full-screen, the display device generally adopts a mode of frame narrowing, and therefore the width of the lower end bonding part of the display device generally needs to be reduced.
The inventor of the application discovers that after the width of the bonding part is reduced, the bonding drawing force is reduced, and the flexible circuit board is easy to fall off after being bonded.
Disclosure of Invention
The technical problem mainly solved by the application is to provide an OLED display device and a preparation method thereof, and the drawing force between a flexible circuit board and a display panel can be improved.
In order to solve the technical problem, the application adopts a technical scheme that: an OLED display device (1) is provided, the OLED display device (1) comprising: an OLED display panel (10), one side of the OLED display panel (10) being defined with a bonding portion (100); flexible circuit boards (12), one of the bonding portions (100) being connected to an end portion (120) of one of the flexible circuit boards (12); an adhesive member (14) covering a partial end portion (120) of the flexible circuit board (12) and a peripheral area of the bonding portion (100) of the OLED display panel (10).
Wherein the adhesive member (14) is an adhesive tape covering all or a part of the edge of the end portion (120) of the flexible circuit board (12) and a part of the OLED display panel (10) adjacent to the edge.
Wherein the adhesive member is (14) a glue having an adhesive property, the glue covering all or a part of the edge of the end portion (120) of the flexible circuit board (12) and a part of the OLED display panel (10) adjacent to the edge.
Wherein a gap is arranged between the edge of the end part (120) of the flexible circuit board (12) and the OLED display panel (10) covered by the edge, and the glue extends into the gap.
The glue is curable glue, and the curable glue is any one of photosensitive glue and silicone glue.
Wherein the OLED display panel (10) comprises: the array substrate (20) comprises a first side (200) and a second side (202) which are arranged in an opposite mode, a display area (AA) and a non-display area (BB) are arranged on the first side (200), a first bonding portion (204) is defined in the non-display area (BB), and a thin film transistor layer connecting end of the array substrate (20) is bonded to the first bonding portion (204); a first flexible circuit board (12a) including a first end (120a) and a second end (122a), the first end (120a) being bonded to the first bonding portion (204); the first adhesive member (14a) covers a portion of the first end portion (120a) and a portion of the array substrate (20).
Wherein the OLED display panel (10) further comprises: a touch substrate (22) located on the first side (200) of the array substrate (20), and a vertical projection of the touch substrate (22) on the array substrate (20) does not cover the first bonding portion (204); the touch substrate (22) comprises an effective touch area CC and an ineffective touch area DD, a second bonding part (206) is defined in the ineffective touch area DD, and a touch wiring layer connecting end of the touch substrate (22) is bonded to the second bonding part (206); the second flexible circuit board (12b) comprises a third end part (120b) and a fourth end part (122b), and the third end part (120b) is bonded with the second bonding part (206); the second adhesive member (14b) covers a portion of the third end portion (120b) and a portion of the touch substrate (22).
In order to solve the above technical problem, another technical solution adopted by the present application is: provided is a method of manufacturing an OLED display device, the method including: providing an OLED display panel (10) and a flexible circuit board (12), wherein a bonding part (100) is defined on one side of the OLED display panel (10); connecting one of the bonding portions (100) to an end portion (120) of one of the flexible circuit boards (12); covering a portion of an end (120) of the flexible circuit board (12) and a peripheral area of the bonding portion (100) of the OLED display panel (10) with an adhesive member (14).
Wherein the covering of the adhesive member (14) over a portion of the end portion (120) of the flexible circuit board (12) and a peripheral region of the bonding portion (100) of the OLED display panel (10) includes: covering all or part of the edge of the end portion (120) of the flexible circuit board (12) and a part of the OLED display panel (10) adjacent to the edge with an adhesive tape.
Wherein the covering of the adhesive member (14) over a portion of the end portion (120) of the flexible circuit board (12) and a peripheral region of the bonding portion (100) of the OLED display panel (10) includes: covering all or part of the edge of the end portion (120) of the flexible circuit board (12) and a part of the OLED display panel (10) adjacent to the edge with a glue having a viscosity.
The beneficial effect of this application is: be different from prior art's condition, the OLED display device that this application provided in flexible circuit board and OLED display panel's nation decides to be connected the back, still adopts viscidity piece further to cover flexible circuit board's partial tip and partial OLED display panel, and then further improves the drawing force between flexible circuit board and the OLED display panel, reduces the probability that drops after the flexible circuit board nation, and then provides support for realizing the full face screen.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural diagram of an OLED display device according to an embodiment of the present invention;
FIG. 2 is a schematic top view of the OLED display device of FIG. 1;
FIG. 3 is a schematic top view of another embodiment of an OLED display device according to the present application;
FIG. 4 is a schematic structural diagram of an embodiment of the OLED display device in FIG. 1;
FIG. 5 is a schematic structural diagram of another embodiment of the OLED display device in FIG. 1;
FIG. 6 is a schematic structural diagram of another embodiment of the OLED display device in FIG. 1;
fig. 7 is a schematic flow chart illustrating a method for manufacturing an OLED display device according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an OLED display device according to an embodiment of the present disclosure. The OLED display device 1 includes an OLED display panel 10, a flexible circuit board 12, and an adhesive member 14. Specifically, one side of the OLED display panel 10 is defined with a plurality of bonding portions 100, and the number of the bonding portions 100 may be multiple, for example, 1, 2, 3, etc.; one bonding portion 100 is bonded to an end portion 120 of one flexible circuit board 12, and the flexible circuit board 12 itself has flexibility and can be bent to electrically connect electronic devices connected to both ends of the flexible circuit board 12. The adhesive member 14 covers a portion of the end 120 of the flexible circuit board 12 and a peripheral area of the bonding part 100 of the OLED display panel 10. Bonding portion 100 includes an edge, and the peripheral region may be a range of a predetermined distance from the edge of bonding portion 100, and the size of the predetermined distance may be set according to actual conditions.
In this embodiment, bonding portion 100 is provided with a conductive lead, for example, the conductive lead is a conductive silver paste formed by laser etching or chemical etching a silver paste layer, the conductive lead is conducted with a circuit in OLED display panel 10, bonding portion 100 and end portion 120 of flexible circuit board 12 may be electrically connected through Anisotropic Conductive Film (ACF)16, end portion 120 of flexible circuit board 12 may cover bonding portion 100, and an edge of end portion 120 of flexible circuit board 12 may overlap an edge of bonding portion 100 and may also exceed an edge of bonding portion 100. The other end of the flexible circuit board 12 may be connected to a motherboard or other device.
In one embodiment, as shown in fig. 2 and 3, fig. 2 is a schematic top view of an embodiment of the OLED display device in fig. 1, and fig. 3 is a schematic top view of another embodiment of the OLED display device of the present application. The adhesive member 14 is an adhesive tape, such as a single-sided tape, a double-sided tape, or the like, which covers all or a portion of the edge of the end portion 120 of the flexible circuit board 12 and a portion of the OLED display panel 10 adjacent to the edge. The end portion 120 of the flexible circuit board 12 includes three edges a, b, and c, and the adhesive tape 14 may cover a partial edge b (e.g., the edge b in fig. 2) of the end portion 120 of the flexible circuit board 12 and a portion of the OLED display panel 10 adjacent to the edge b, where the pulling force of the end portion 120 of the flexible circuit board 12 is the smallest, that is, where the end portion 120 of the flexible circuit board 12 is most likely to fall off. Of course, in other embodiments, the adhesive tape 14' may also cover all edges a, b, c (e.g., as shown in fig. 3) of the end portion 120 of the flexible circuit board 12 and portions of the OLED display panel 10 adjacent to the edges a, b, c.
In another embodiment, with continued reference to fig. 2-3, the adhesive member 14 may be a glue having adhesive properties, such as a curable glue, wherein the curable glue is at least one of a UV glue and a silicone glue, but in other embodiments, the type of glue may be other. The glue covers all or part of the edge of the end portion 120 of the flexible circuit board 12 and the part of the display panel 10 adjacent to the edge. In addition, since the glue has a certain fluidity, when there is a gap (as shown in fig. 1) between the edge of the end portion 120 of the flexible circuit board 12 and the OLED display panel 10 covered by the flexible circuit board, the glue may extend into the gap. Of course, in other embodiments, when the above-mentioned gap is formed between the edge of the end portion 120 of the flexible circuit board 12 and the OLED display panel 10 covered by the flexible circuit board, the glue may only fill the gap, and does not overflow to other positions.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of the OLED display device in fig. 1. In the present embodiment, the OLED display panel 10 includes:
the array substrate 20 is provided with a Thin Film Transistor (TFT) layer arranged in an array, and the thin film transistor layer may be a Low Temperature Polysilicon (LTPS) thin film transistor layer, etc. The array substrate 20 includes a first side 200 and a second side 202 opposite to each other, the first side 200 is provided with a display area AA and a non-display area BB, the non-display area BB is defined with a first bonding portion 204, and a thin film transistor layer connecting end of the array substrate 20 is bonded to the first bonding portion 204. Specifically, thin-film-transistor layer connection terminals may be electrically connected with conductive leads provided by first bonding portion 204. First flexible circuit board 12a includes a first end 120a and a second end 122a, with first end 120a bonded to first bonding portion 204. The first adhesive member 14a covers a portion of the first end 120a of the first flexible circuit board 12a and a portion of the array substrate 20. The second end 122a of the first flexible circuit board 12a may be electrically connected to a main board (not shown), so that the main board controls the display function of the OLED display device 1 through the first flexible circuit board 12 a.
In this embodiment, with continuing reference to fig. 4, the OLED display panel 10 provided in the present application further includes: the touch substrate 22 is located on the first side 200 of the array substrate 20, and a projection of the touch substrate 22 on the array substrate 20 does not cover the first bonding portion 204. The touch substrate 22 is generally a transparent panel, the touch substrate 22 realizes touch kinetic energy through stacked driving electrodes and sensing electrodes, and the touch substrate 22 may be self-capacitive or mutual capacitive. The touch substrate 22 includes an effective touch region CC and an ineffective touch region DD, and the effective touch region CC may coincide with the display region AA of the array substrate 20. The inactive touch area DD of the touch substrate 22 defines a second bonding portion 206, and a touch trace layer connection terminal of the touch substrate 22 is bonded to the second bonding portion 206, for example, a driving electrode or a sensing electrode connection terminal of the touch trace layer of the touch substrate 22 may be connected to a conductive lead wire disposed at the second bonding portion 102. The second flexible circuit board 12b includes a third end portion 120b and a fourth end portion 122b, the third end portion 120b is bonded to the second bonding portion 206, and the second adhesive member 14b covers a portion of the third end portion 120b and a portion of the touch substrate 22. In this embodiment, the fourth end portion 122b of the second flexible circuit board 12b may be directly electrically connected to the motherboard, so that the motherboard controls the touch function of the OLED display device 1 through the second flexible circuit board 12 b.
In this embodiment, the OLED display device 1 provided in the present application further includes, between the array substrate 20 and the touch substrate 22: a light emitting layer 24 covering the display area AA of the array substrate 20; the encapsulation layer 26 covers the light emitting layer 22, the encapsulation layer 26 is made of a transparent material, and any encapsulation method in the prior art can be adopted for the encapsulation layer 26, which is not described in the present application. Of course, in other embodiments, the encapsulation layer 26 may be replaced by an optical adhesive (OCA), or the encapsulation layer 26 and the touch substrate 22 are fixedly connected by an optical adhesive (OCA). In addition, the OLED display device 1 provided in the present application further includes a cover plate 28, the cover plate 28 is disposed on one side of the touch substrate 22 away from the array substrate 20, and a projection of the cover plate 28 on the touch substrate 22 covers the effective touch area CC on the touch substrate 22 and exposes the non-effective touch area. The cover plate 28 protects the touch substrate 22, and a finger of a user directly contacts the cover plate 28, thereby preventing the touch substrate 22 from being damaged due to the direct contact of the finger of the user with the touch substrate 22. In addition, in the present embodiment, the cover plate 28 may be a polarizer structure for screening the light emitted from the light-emitting layer 24 to obtain light with a certain polarization direction.
In another embodiment, please refer to fig. 5, wherein fig. 5 is a schematic structural diagram of another embodiment of the OLED display device in fig. 1. The present embodiment is different from the embodiment in fig. 4 in that the fourth end portion 122c of the second flexible circuit board 12c can be directly electrically connected to the first end portion 120a of the first flexible circuit board 12a, and the touch substrate 22 is electrically connected to the main board through the second flexible circuit board 12c and the first flexible circuit board 12a in sequence.
In another embodiment, please refer to fig. 6, fig. 6 is a schematic structural diagram of another embodiment of the OLED display device in fig. 1. The present embodiment is different from the embodiment in fig. 4 in that the non-display area BB of the array substrate 20 further includes a third bonding portion 208; fourth end 122d of second flexible circuit board 12d is bonded to third bonding portion 208; the third adhesive member 14c covers a portion of the fourth end 122b and a portion of the array substrate 20. Third bond 208 is electrically connected to first bond 204 by a first wire. The touch substrate 22 is electrically connected to the main board sequentially through the second flexible circuit board 12d, the first lead, and the first flexible circuit board 12 a. The first conductive line may be a silver paste line.
Referring to fig. 7, fig. 7 is a schematic flow chart illustrating a method for manufacturing an OLED display device according to an embodiment of the present disclosure. The preparation method comprises the following steps:
s101: an OLED display panel 10 and a flexible circuit board 12 are provided, wherein a bonding part 100 is defined at one side of the OLED display panel 10.
Specifically, the method of forming the OLED display panel 10 may be any one of the prior art, and will not be described in detail herein.
The method of forming bonding portion 100 may be: firstly, carrying out plasma cleaning and grinding treatment on a bonding surface of the OLED display panel 10; then, conductive silver paste is formed on the bonding surface, and the conductive silver paste is conducted with an internal circuit of the OLED display panel 10, so that the bonding portion 100 is formed.
S102: one bonding portion 100 is connected to end 120 of one flexible circuit board 12.
Specifically, in an embodiment, the step S102 specifically includes: attaching an Anisotropic Conductive Film (ACF) to the bonding portion 100; an Anisotropic Conductive Film (ACF) is bonded to the end 120 of the flexible circuit board 12.
S103: the adhesive member 14 covers a portion of the end 120 of the flexible circuit board 12 and a peripheral area of the bonding part 100 of the OLED display panel 10.
Specifically, in an embodiment, the step S103 specifically includes: the entire or partial edge of the end portion 120 of the flexible circuit board 12 and at least a portion of the OLED display panel 10 adjacent to the edge are covered with an adhesive tape. In this embodiment, the adhesive tape may be a single-sided tape, a double-sided tape, or the like.
In another embodiment, the step S103 specifically includes: the whole or part of the edge of the end portion 120 of the flexible circuit board 12 and at least a part of the OLED display panel 10 adjacent to the edge are covered with a glue having a viscosity. When there is a gap between the edge of the end portion 120 of the flexible circuit board 12 and the OLED display panel 10 covered by the edge, the glue may further extend into the gap due to capillary action, thereby further enhancing the drawing force between the end portion 120 of the flexible circuit board 12 and the OLED display panel 10. The glue used in the present embodiment is a curable glue, and the curable glue is any one of a photosensitive glue (e.g., a UV glue) and a silicone glue. Of course, in other embodiments, other glues may be used, and the application is not limited thereto.
It should be noted that the step S103 may be applied to any situation in the OLED display device 1 where the pulling force for reinforcing the flexible circuit board 12 and the OLED display panel 10 needs to be performed, for example, a first flexible circuit board connected to a first bonding portion of the array substrate, or a second flexible circuit board connected to a second bonding portion of the touch substrate. Of course, the step S103 may also be applied to the case where the first flexible circuit board and/or the second flexible circuit board is connected to the motherboard.
In summary, be different from the situation in the prior art, after the flexible circuit board is bonded to the bonding portion of the OLED display panel in the OLED display device provided by the present application, a part of the end portion of the flexible circuit board and a part of the OLED display panel are further covered by the adhesive member, so as to further improve the pull force between the flexible circuit board and the OLED display panel, reduce the probability that the flexible circuit board falls off after being bonded, and further provide support for realizing a full-screen.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (5)
1. An OLED display device, characterized in that the OLED display device (1) comprises:
the OLED display panel (10) comprises an array substrate (20) and a touch substrate (22), wherein the array substrate (20) comprises a first side (200) and a second side (202) which are arranged in a reverse mode, a display area (AA) and a non-display area (BB) are arranged on the first side (200), a first bonding portion (204) is defined in the non-display area (BB), and a thin film transistor layer connecting end of the array substrate (20) is bonded to the first bonding portion (204); the touch substrate (22) is located on the first side (200) of the array substrate (20), and a vertical projection of the touch substrate (22) on the array substrate (20) does not cover the first bonding portion (204);
a first flexible circuit board (12a) including a first end (120a) and a second end (122a), the first end (120a) being bonded to the first bonding portion (204);
a first adhesive member (14a), the first adhesive member (14a) being an adhesive tape having an adhesive property, covering a first end portion (120a) of the first flexible circuit board (12a) and a peripheral area of the first bonding portion (204) of the OLED display panel (10).
2. The OLED display device of claim 1,
the tape covers all or a part of an edge of the first end portion (120a) of the first flexible circuit board (12a) and a part of the OLED display panel (10) adjacent to the edge.
3. The OLED display device according to claim 1, wherein the touch substrate (22) includes an active touch area CC and an inactive touch area DD, the inactive touch area DD is defined with a second bonding portion (206), and the touch routing layer connection end of the touch substrate (22) is bonded to the second bonding portion (206); the second flexible circuit board (12b) comprises a third end part (120b) and a fourth end part (122b), and the third end part (120b) is bonded with the second bonding part (206); the second adhesive member (14b) covers a portion of the third end portion (120b) and a portion of the touch substrate (22).
4. A method for manufacturing an OLED display device, the method comprising:
providing an OLED display panel (10) and a flexible circuit board (12), wherein the OLED display panel comprises an array substrate (20) and a touch substrate (22), the array substrate (20) comprises a first side (200) and a second side (202) which are arranged oppositely, the first side (200) is provided with a display area (AA) and a non-display area (BB), the non-display area (BB) is defined with a first bonding part (204), and a thin film transistor layer connecting end of the array substrate (20) is bonded to the first bonding part (204); the touch substrate (22) is located on the first side (200) of the array substrate (20), and a vertical projection of the touch substrate (22) on the array substrate (20) does not cover the first bonding portion (204);
connecting the first bonding portion (204) to a first end portion (120a) of a first flexible circuit board (12 a);
covering a first adhesive member (14a) over a first end portion (120a) of the first flexible circuit board (12a) and a peripheral area of the first bonding portion (204) of the OLED display panel (10), wherein the first adhesive member (14a) is an adhesive tape having an adhesive property.
5. The method of manufacturing according to claim 4, wherein said covering a first adhesive member (14a) over a first end portion (120a) of the first flexible circuit board (12a) and a peripheral area of the first bonding portion (204) of the OLED display panel (10) includes:
covering all or a part of an edge of the first end portion (120a) of the first flexible circuit board (12a) and a part of the OLED display panel (10) adjacent to the edge with an adhesive tape.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811280414.9A CN109378334B (en) | 2018-10-30 | 2018-10-30 | OLED display device and preparation method thereof |
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| CN201811280414.9A CN109378334B (en) | 2018-10-30 | 2018-10-30 | OLED display device and preparation method thereof |
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| CN109378334B true CN109378334B (en) | 2020-11-10 |
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| CN112017533A (en) * | 2019-05-28 | 2020-12-01 | 陕西坤同半导体科技有限公司 | Display panel, display device and bonding method of display panel and circuit board |
| CN110262702B (en) * | 2019-07-30 | 2022-05-10 | 昆山国显光电有限公司 | Display panel and display device |
| US11812558B2 (en) * | 2019-08-01 | 2023-11-07 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display device and assembly method thereof |
| CN110619815B (en) * | 2019-09-26 | 2021-09-03 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN112416163B (en) * | 2020-10-26 | 2024-01-26 | 京东方科技集团股份有限公司 | Display panel, touch substrate and preparation method of touch substrate |
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| KR20120053601A (en) * | 2010-11-18 | 2012-05-29 | 엘지디스플레이 주식회사 | Method for manufacturing flexible display device |
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| JP2000187238A (en) * | 1998-12-24 | 2000-07-04 | Seiko Epson Corp | Liquid crystal device, its manufacture, the liquid crystal display device and electronic equipment provided with the device |
| JP6263337B2 (en) * | 2013-05-31 | 2018-01-17 | 株式会社ジャパンディスプレイ | Display device and manufacturing method thereof |
| CN107172825A (en) * | 2017-06-30 | 2017-09-15 | 世擎光电（东莞）有限公司 | The attached structure and method of a kind of flexible printed circuit board and fingerprint Identification sensor |
| CN107977115A (en) * | 2017-12-12 | 2018-05-01 | 业成科技（成都）有限公司 | Wearable wrist-watch and its touch display screen |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20120053601A (en) * | 2010-11-18 | 2012-05-29 | 엘지디스플레이 주식회사 | Method for manufacturing flexible display device |
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Application publication date: 20190222 Assignee: Yungu (Gu'an) Technology Co., Ltd.|Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd Assignor: Kunshan Guo Xian Photoelectric Co., Ltd. Contract record no.: X2019990000156 Denomination of invention: OLED display device and manufacturing method thereof License type: Common License Record date: 20191030 |
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Effective date of registration: 20191206 Address after: No. 2 Xiangshan Avenue, Yongning Street, Zengcheng District, Guangzhou, Guangdong province (the core of Zengcheng economic and Technological Development Zone) Applicant after: Guangzhou Guoxian Technology Co., Ltd Address before: 215300, No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, Suzhou, 4 Applicant before: Kunshan Guo Xian Photoelectric Co., Ltd. |
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