CN112017533A - Display panel, display device and bonding method of display panel and circuit board - Google Patents
Display panel, display device and bonding method of display panel and circuit board Download PDFInfo
- Publication number
- CN112017533A CN112017533A CN201910451554.6A CN201910451554A CN112017533A CN 112017533 A CN112017533 A CN 112017533A CN 201910451554 A CN201910451554 A CN 201910451554A CN 112017533 A CN112017533 A CN 112017533A
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- Prior art keywords
- bonding
- display panel
- area
- display
- circuit board
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
Abstract
The application relates to a display panel, a display device and a bonding method of the display panel and a circuit board. Relates to the technical field of display. The display panel comprises a display area and a non-display area, wherein the non-display area comprises a bonding area, the bonding area is used for bonding a circuit board to the display panel in a bonding mode, and a buffer layer surrounds the periphery of the bonding area and is used for absorbing at least part of stress caused in a bonding process. This application can prevent that stress concentration from distinguishing at the nation's nation, and then prevents that nation's district rete from droing and leading to display panel inefficacy.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a display device, and a method for bonding a display panel and a circuit board.
Background
At present, an existing display device generally includes a display panel and an external circuit, when the display panel normally displays, the external circuit, such as a Flexible Printed Circuit (FPC), is required to be used, and the electrical connection between the external circuit and the display panel is completed through a Bonding process. In the existing bonding process of the display panel, the bonding process is completed by pressurizing and heating the bonding area of the display panel, which easily causes stress to be accumulated in the bonding area, possibly causes the film layer of the bonding area to fall off, and further causes the panel failure.
Therefore, there is a need to provide a new technical solution to improve the problem of stress accumulation in the bonding area in the above solution.
It is noted that this section is intended to provide a background or context to the embodiments of the application that are recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.
Disclosure of Invention
An object of the present application is to provide a display panel, a display device, and a bonding method for a display panel and a circuit board, which surround a buffer layer around a bonding area of the display panel, so as to overcome the problem that stress is accumulated in the bonding area of the display panel due to the limitation and defect of the related art in the bonding process, and the film layer of the bonding area drops.
According to a first aspect of embodiments of the present application, there is provided a display panel, the display panel including a display area and a non-display area, the non-display area including a bonding area, the bonding area being used to bond a circuit board to the display panel in a bonding manner; the periphery of the bonding area is surrounded by a buffer layer for absorbing at least part of stress caused in the bonding process.
In one embodiment, the buffer layer may be a layer of elastomeric material.
In one embodiment, the buffer layer may be an organic material layer.
More specifically, the organic material layer may be an organic photoresist layer.
In one embodiment, the heating temperature used in the bonding process may be 140-200 ℃.
According to a second aspect of embodiments of the present application, there is provided a display device, comprising a display panel including a display area and a non-display area, the non-display area including a bonding area, the bonding area being used to bond a circuit board to the display panel in a bonding manner; the periphery of the bonding area is surrounded by a buffer layer for absorbing at least part of stress caused in the bonding process.
In one embodiment, the buffer layer may be a layer of elastomeric material.
In one embodiment, the buffer layer may be an organic material layer.
More specifically, the organic material layer may be an organic photoresist layer.
In one embodiment, the heating temperature used in the bonding process may be 140-200 ℃.
According to a third aspect of embodiments of the present application, there is provided a method for bonding a display panel and a circuit board, where the method may include:
providing a display panel, wherein the display panel comprises a display area and a non-display area, and the non-display area comprises a bonding area;
arranging a buffer layer around the bonding area;
bonding a circuit board to the bonding area in a bonding manner; the buffer layer is used for absorbing at least part of stress caused in a bonding process.
In one embodiment, the buffer layer may be a layer of elastomeric material.
In one embodiment, the buffer layer may be an organic material layer.
More specifically, the organic material layer may be an organic photoresist layer.
In one embodiment, the heating temperature used in the bonding process may be 140-200 ℃.
The technical scheme provided by the embodiment of the invention can have the following beneficial effects:
in an embodiment of the invention, by the bonding method of the display panel, the display device, or the display panel and the circuit board, a soft buffer layer surrounds the bonding area to absorb at least part of stress generated in the bonding process under high temperature and high pressure, so as to prevent the stress from accumulating in the bonding area to cause the film layer of the bonding area to fall off and further cause the panel failure.
Drawings
Fig. 1 is a schematic view showing a stacked structure of a display panel in the related art;
FIG. 2 is a schematic diagram illustrating stress accumulation during a bonding process of a display panel in the prior art;
FIG. 3 is a schematic view showing a laminated structure of film layers of a display panel according to an embodiment of the present application;
FIG. 4 is a schematic diagram illustrating stress accumulation during a bonding process of a display panel according to an embodiment of the present application;
FIG. 5 illustrates a flow diagram of a bonding method according to one embodiment of the present application.
Reference numerals:
1-a circuit board; 2-an interface part; 3-a bonding area; 4-a metal layer; 5-a second layer of cover film; 6-a first layer of cover film; 7-a substrate; 8-pressurizing and heating; 9-internal stress; 10-buffer layer.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Furthermore, the drawings are merely schematic illustrations of the invention and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted. Some of the block diagrams shown in the figures are functional entities and do not necessarily correspond to physically or logically separate entities.
Referring to fig. 1, in the prior art, a display panel may include a substrate 7, and a first cover film 6 and a metal layer 4 sequentially stacked on the substrate 7, where the area of the metal layer 4 is a bonding area 3, and a projection area of the bonding area 3 on the first cover film 6 is a part of the first cover film 6. The metal layer 4 of the bonding region 3 is used for bonding with the external circuit board 1 to realize electrical connection. Wherein the first cover film 6 is used to prevent impurities on the substrate 7 from diffusing to other film layers of the display panel. The periphery of the bonding area 3 surrounds a second layer of cover film 5, and the second layer of cover film 5 is formed on the surface of the first layer of cover film 6. Further, the thickness of the second cover film 5 may be larger than the thickness of the metal layer 4, and the second cover film 5 is used to protect the metal layer 4 from oxygen oxidation and water vapor corrosion.
In the bonding process, a layer of anisotropic conductive adhesive is sandwiched between the interface part 2 of the circuit board 1 and the bonding area 3, and then the interface part 2 of the circuit board 1 and the bonding area 3 are butted and then pressed in a pressing and heating manner, so that the circuit board 1 is electrically connected with the display panel.
However, the inventor found that, when the display panel in the prior art is subjected to the bonding process shown in fig. 2, because the materials of the stacked films in the panel region where the bonding region 3 is located are different, the thermal expansion coefficient and the internal stress of each film are different, which easily causes the internal stress 9 to be accumulated in the bonding region 3, and further easily causes the films in the bonding region 3 to fall off, so that the panel is easily failed. The internal stress refers to the stress remaining in the object after the external load is removed, which is generated by the non-uniform volume change of the macro or micro structure in the material.
In order to solve the above problems, as shown in fig. 3 to 4, in the present exemplary embodiment, a display panel is first provided, where the display panel includes a display area and a non-display area, the non-display area includes a bonding area 3, and the bonding area 3 is used to bond a circuit board 1 to the display panel in a bonding manner; the bonding region 3 is surrounded by a buffer layer 10 for absorbing at least a portion of the stress caused by the bonding process.
Specifically, as shown in fig. 3, the display panel may include a substrate 7, and a first cover film 6 and a metal layer 4 sequentially stacked on the substrate 7, where the area to which the metal layer 4 belongs is a bonding area 3, and a projection area of the bonding area 3 on the first cover film 6 is a part of the first cover film 6. The metal layer 4 of the bonding region 3 is used for bonding with the external circuit board 1 to realize electrical connection. The substrate may be a flexible substrate. More specifically, the flexible substrate may be made of a polyimide material, or may be one of polymer materials such as polyethylene terephthalate, polystyrene, polyethylene naphthalate, polyethersulfone resin, high polymer polypropylene, and polycarbonate.
The metal layer 4 of the bonding region 3 may surround the buffer layer 10, and the buffer layer 10 is formed on the surface of the first cover film 6. And the second cover film 5 is formed on the surface of the buffer layer 10. The total thickness of the buffer layer 10 and the second cover film 5 may be greater than the thickness of the metal layer 4. The thickness of the buffer layer 10 may be smaller than the thickness of the metal layer 4, but is not limited thereto, and may also be slightly larger than or equal to the thickness of the metal layer 4. The arrangement is such that the buffer layer 10 can be arranged at a position closer to the bonding region 3, the effect of absorbing stress being more pronounced the closer the buffer layer is to the bonding region.
Specifically, the metal layer 4 of the bonding area 3 may be a metal wiring, and in the bonding process, a layer of anisotropic conductive adhesive is sandwiched between the interface part 2 of the circuit board 1 and the bonding area 3, and then the interface part 2 of the circuit board 1 and the bonding area 3 are butted and pressed in a heating manner, and electrical connection is achieved through the anisotropic conductive adhesive, so that electrical connection between the circuit board 1 and the display panel is achieved.
In one embodiment, the heating temperature used in the bonding process may be 140-200 ℃. When the temperature bonding is adopted, the generated internal stress is relatively small, and the connection between the circuit board 1 and the display panel can be better realized. Further, the temperature may be, for example, 150 to 180 ℃. Furthermore, the temperature can be, for example, 160-170 ℃. This can further reduce internal stress and achieve good connection of the circuit board 1 and the display panel. For other contents of the bonding process, reference may be made to the prior art, and details thereof are not described herein.
Specifically, the buffer layer 10 may be a soft elastic material layer or an organic material layer. Because the stress of the soft elastic material layer or the organic material layer is small, the stress generated in the bonding process can be better absorbed, the stress is prevented from being concentrated in the bonding area, and the metal layer 4, the first layer covering film 6 and the second layer covering film 5 are prevented from being broken or even falling off due to overlarge stress, so that the display panel is prevented from losing efficacy.
More specifically, the organic material layer may be an organic photoresist layer, which has a planarization effect and can better absorb the stress of the bonding region 3.
Specifically, the circuit board 1 may be a flexible circuit board, and the flexible circuit board may be a driving chip circuit, a fingerprint identification circuit, or other sensing device circuits.
In this embodiment, through around a soft buffer layer around the bonding region at display panel, can absorb at least part stress that produces in the bonding process under the high temperature high pressure, prevent the stress accumulation and then lead to the problem that the panel rete of bonding region position drops at the bonding region, improve the panel yield.
The present example embodiment also provides a display apparatus including a display panel including a display area and a non-display area, the non-display area including a bonding area to bond a circuit board to the display panel in a bonding manner; the periphery of the bonding area is surrounded by a buffer layer for absorbing at least part of stress caused in the bonding process.
In particular, the buffer layer may be an elastic material layer.
Specifically, the buffer layer may be an organic material layer.
More specifically, the organic material layer may be an organic photoresist layer.
Specifically, the heating temperature used in the bonding process may be 140-.
For a specific embodiment of the display device, reference may be made to the above-mentioned embodiment of the display panel, and details are not described herein.
Referring to fig. 5, the present example embodiment also provides a bonding method of a display panel and a circuit board, which may include the following steps:
step S101: providing a display panel, wherein the display panel comprises a display area and a non-display area, and the non-display area comprises a bonding area;
step S102: arranging a buffer layer around the bonding area;
step S103: bonding a circuit board to the bonding area in a bonding manner; the buffer layer is used for absorbing at least part of stress caused in a bonding process.
Specifically, the heating temperature used in the bonding process may be 140-.
Specifically, the buffer layer may be an elastic material layer or an organic material layer.
More specifically, the organic material layer may be an organic photoresist layer.
For a specific implementation of the bonding method, reference may be made to the above-mentioned implementation of the display panel, and details are not described here.
The display panel, the display device, the bonding method of the display panel and the circuit board, provided by the embodiment of the application, can absorb at least part of stress generated in the bonding process under high temperature and high pressure by surrounding the bonding area of the display panel with a soft buffer layer, and prevent stress accumulation from causing the film layer of the bonding area to fall off in the bonding area and further causing panel failure.
In the description of the present invention, it is to be understood that the terms "thickness", "upper", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
Claims (10)
1. A display panel comprising a display area and a non-display area, characterized in that:
the non-display area comprises a bonding area used for bonding a circuit board to the display panel;
the periphery of the bonding area is surrounded by a buffer layer for absorbing at least part of stress caused in the bonding process.
2. The display panel according to claim 1, characterized in that: the buffer layer is an elastic material layer.
3. The display panel according to claim 1, characterized in that: the buffer layer is an organic material layer.
4. The display panel according to claim 3, wherein: the organic material layer is an organic photoresist layer.
5. The display panel of claim 1, wherein the heating temperature used in the bonding process is 140-200 ℃.
6. A display device, characterized in that: comprising a display panel as claimed in any one of claims 1-5.
7. A bonding method of a display panel and a circuit board is characterized by comprising the following steps:
providing a display panel, wherein the display panel comprises a display area and a non-display area, and the non-display area comprises a bonding area;
arranging a buffer layer around the bonding area;
bonding a circuit board to the bonding area in a bonding manner; the buffer layer is used for absorbing at least part of stress caused in a bonding process.
8. The method of claim 7, further comprising: the buffer layer is an elastic material layer.
9. The method of claim 7, further comprising: the buffer layer is an organic material layer.
10. The method of claim 7, wherein the heating temperature used in the bonding process is 140-200 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910451554.6A CN112017533A (en) | 2019-05-28 | 2019-05-28 | Display panel, display device and bonding method of display panel and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910451554.6A CN112017533A (en) | 2019-05-28 | 2019-05-28 | Display panel, display device and bonding method of display panel and circuit board |
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| CN112017533A true CN112017533A (en) | 2020-12-01 |
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| CN201910451554.6A Pending CN112017533A (en) | 2019-05-28 | 2019-05-28 | Display panel, display device and bonding method of display panel and circuit board |
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| JP2006237466A (en) * | 2005-02-28 | 2006-09-07 | Optrex Corp | Apparatus for coating display panel with protective resin liquid |
| CN106997882A (en) * | 2016-01-26 | 2017-08-01 | 昆山工研院新型平板显示技术中心有限公司 | A kind of bonding structure, flexible screen body with the bonding structure and preparation method thereof |
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Application publication date: 20201201 |