CN218404024U - Multifunctional back glue film - Google Patents
Multifunctional back glue film Download PDFInfo
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- CN218404024U CN218404024U CN202123270774.0U CN202123270774U CN218404024U CN 218404024 U CN218404024 U CN 218404024U CN 202123270774 U CN202123270774 U CN 202123270774U CN 218404024 U CN218404024 U CN 218404024U
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- layer
- heat dissipation
- adhesive
- attached
- buffer
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Abstract
The utility model discloses a multifunctional back glue film, which comprises a shielding layer, an enhancement layer, a double-sided glue layer, a buffer layer and a heat dissipation layer, wherein the shielding layer is attached to the enhancement layer, the enhancement layer is attached to the double-sided glue layer, the double-sided glue layer is attached to the buffer layer, and the buffer layer is attached to the heat dissipation layer; the reinforced layer is a fiber line layer; the upper surface of buffer layer is inwards sunken to form the dashpot, the inside of dashpot is equipped with a plurality of radial backing sheets and a plurality of latitudinal direction backing sheets, radial backing sheet with latitudinal direction backing sheet mutually perpendicular sets up. The utility model provides the high toughness of back of the body glued membrane is convenient for peel off the back glued membrane from type paper and tears, and the electronic component of being convenient for dispels the heat in the setting of radiating groove and louvre.
Description
Technical Field
The utility model belongs to the technical field of the gum membrane, especially, relate to a multi-functional gum membrane.
Background
The back adhesive film is mainly used for a protective film of a flexible printed circuit board, an insulating protective film of an electronic component or a back adhesive insulating film of a lead frame, and can protect the printed circuit or the electronic component from being scratched, oxidized or polluted and the like. With the increasing demand for electronic components in the era of electronic information, the film is generally cut into a suitable size and attached to the electronic component to protect the electronic component.
However, when the worker peels off the release paper from the surface of the adhesive layer, the adhesive-backed film is broken due to the low toughness of the adhesive-backed film, and cannot be effectively peeled off, and after the adhesive film is attached to the electronic component, the heat dissipation effect of the electronic component is reduced, and the service life of the component is affected.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides a multi-functional gum membrane of carrying on the back, improves the toughness of gum membrane of carrying on the back, is convenient for peel off the gum membrane of carrying on the back from type paper and tears, and the electronic component of being convenient for dispels the heat in the setting of radiating groove and louvre.
In order to solve the technical problem, the utility model discloses a technical scheme be: a multifunctional back glue film comprises a shielding layer, a reinforcing layer, a double-sided glue layer, a buffer layer and a heat dissipation layer, wherein the shielding layer is attached to the reinforcing layer, the reinforcing layer is attached to the double-sided glue layer, the double-sided glue layer is attached to the buffer layer, and the buffer layer is attached to the heat dissipation layer;
the reinforcing layer is a fiber line layer, so that the toughness of the back adhesive film is effectively improved;
the upper surface of the buffer layer is recessed inwards to form a buffer groove, a plurality of radial supporting pieces and a plurality of latitudinal supporting pieces are arranged inside the buffer groove, and the radial supporting pieces and the latitudinal supporting pieces are perpendicular to each other, so that the buffer property of the back glue film is improved, and the electronic element is prevented from being damaged;
the lower surface of the buffer layer is provided with a plurality of convex strips which are arranged in parallel, and the upper surface of the heat dissipation layer is provided with grooves matched with the convex strips;
the heat dissipation layer extends downwards to form a plurality of heat dissipation strips, heat dissipation grooves are formed between every two adjacent heat dissipation strips, the back adhesive film is provided with heat dissipation holes, the heat dissipation holes penetrate through the upper surface and the lower surface of the back adhesive film, the heat dissipation holes are communicated with the heat dissipation grooves, and the heat dissipation grooves and the heat dissipation holes are arranged to facilitate heat dissipation of electronic elements;
the heat dissipation layer is attached to release paper.
Furthermore, the adhesive-backed film is provided with a plurality of fractures and a plurality of discontinuous strips, the fractures are positioned on the side wall of the adhesive-backed film and correspond to the discontinuous strips, each discontinuous strip is composed of a plurality of breaking grooves, and the breaking grooves penetrate through the upper surface and the lower surface of the adhesive-backed film, so that the adhesive-backed film can be conveniently torn into the required width.
Further, the length of the fiber thread layer is 250-300 micrometers, and the diameter of the fiber thread layer is 6-8 micrometers.
Furthermore, the shielding layer is a conductive adhesive tape, which plays a role in shielding and prevents electromagnetic wave interference between electronic components.
Furthermore, the cross sections of the convex strips and the grooves are triangular.
Further, the buffer layer is a polyethylene terephthalate layer.
Further, the heat dissipation layer is a polyvinyl chloride layer.
The beneficial effects of the utility model are that following several points have at least:
the reinforced layer of the back adhesive film of the utility model is a fiber line layer, which improves the toughness of the back adhesive film, facilitates tearing the back adhesive film from the release paper, the heat dissipation layer extends downwards to form a plurality of heat dissipation strips, heat dissipation grooves are formed between adjacent heat dissipation strips, the heat dissipation grooves are communicated with the heat dissipation holes, and the arrangement of the heat dissipation grooves and the heat dissipation holes facilitates the heat dissipation of the electronic element;
the upper surface of the buffer layer of the utility model is concave inwards to form a buffer groove, and a plurality of radial supporting sheets and a plurality of latitudinal supporting sheets are arranged inside the buffer groove, thereby improving the buffer performance of the back glue film and ensuring that the electronic element is not damaged;
the lower surface of the buffer layer of the utility model is provided with a plurality of raised bars which are arranged in parallel, and the upper surface of the heat dissipation layer is provided with grooves which are matched with the raised bars, thereby improving the contact area between the buffer layer and the heat dissipation layer and improving the firmness of combination between the two layers;
the back adhesive film of the utility model is provided with the conductive adhesive tape, which plays a role of shielding and prevents the electromagnetic wave interference between electronic components;
the utility model discloses a gum membrane is equipped with a plurality of fracture and a plurality of disconnected strip to be convenient for will be torn into the width that needs by the glued membrane.
Drawings
Fig. 1 is a cross-sectional view of a back adhesive film of the present invention;
fig. 2 is a schematic structural diagram of the present invention;
fig. 3 is a schematic structural diagram of a buffer layer according to the present invention;
fig. 4 is an enlarged view of fig. 1 at a of the present invention;
the parts in the drawings are marked as follows:
the heat dissipation structure comprises a shielding layer 1, a reinforcing layer 2, a double-faced adhesive tape layer 3, a buffer layer 4, a buffer groove 41, a radial supporting sheet 42, a latitudinal supporting sheet 43, a convex strip 44, a heat dissipation layer 5, a groove 51, a heat dissipation strip 52, a heat dissipation groove 53, a heat dissipation hole 54, release paper 6, a fracture 7 and a snapping groove 8.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
Example (b): a multifunctional back glue film is shown in figure 1 and comprises a shielding layer 1, a reinforcing layer 2, a double-faced adhesive tape 3, a buffer layer 4 and a heat dissipation layer 5, wherein the shielding layer 1 is attached to the reinforcing layer 2, the reinforcing layer 2 is attached to the double-faced adhesive tape 3, the double-faced adhesive tape 3 is attached to the buffer layer 4, and the buffer layer 4 is attached to the heat dissipation layer 5;
the reinforced layer 2 is a fiber wire layer;
as shown in fig. 3, the upper surface of the buffer layer 4 is recessed inward to form a buffer slot 41, a plurality of radial support pieces 42 and a plurality of latitudinal support pieces 43 are arranged inside the buffer slot 41, and the radial support pieces 42 and the latitudinal support pieces 43 are arranged perpendicularly to each other;
as shown in fig. 4, the lower surface of the buffer layer 4 is provided with a plurality of protruding strips 44 arranged in parallel, and the upper surface of the heat dissipation layer 5 is provided with grooves 51 matched with the protruding strips 44;
the heat dissipation layer 5 extends downwards to form a plurality of heat dissipation strips 52, heat dissipation grooves 53 are formed between every two adjacent heat dissipation strips 52, the back adhesive film is provided with heat dissipation holes 54, the heat dissipation holes 54 penetrate through the upper surface and the lower surface of the back adhesive film, and the heat dissipation holes 54 are communicated with the heat dissipation grooves 53;
as shown in fig. 2, the heat dissipation layer 5 is attached to a release paper 6.
The back glue film is provided with a plurality of fractures 7 and a plurality of discontinuous strips, the fractures 7 are located on the side wall of the back glue film, the fractures 7 correspond to the discontinuous strips, each discontinuous strip is composed of a plurality of breaking grooves 8, and the breaking grooves 8 penetrate through the upper surface and the lower surface of the back glue film.
The length of the fiber thread layer is 250-300 microns, and the diameter of the fiber thread layer is 6-8 microns.
The shielding layer 1 is a conductive adhesive tape.
The cross-sections of the ribs 44 and the grooves 51 are triangular.
The buffer layer 4 is a polyethylene terephthalate layer.
The heat dissipation layer 5 is a polyvinyl chloride layer.
In specific implementation, a colloid is arranged between the buffer layer 4 and the heat dissipation layer 5.
The working principle of the utility model is as follows: paste the heat dissipation strip in electronic components, the enhancement layer of back of the body glued membrane is the fibre line layer to improve the toughness of back of the body glued membrane, be convenient for tear back of the body glued membrane from releasing paper, heat dissipation layer downwardly extending forms a plurality of heat dissipation strips, forms the radiating groove between the adjacent heat dissipation strip, radiating groove and louvre intercommunication, the setting of radiating groove and louvre, the electronic components of being convenient for dispel the heat.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the same principle as the present invention.
Claims (7)
1. A multifunctional back glue film is characterized in that: the heat dissipation structure comprises a shielding layer (1), a reinforcing layer (2), a double-sided adhesive layer (3), a buffer layer (4) and a heat dissipation layer (5), wherein the shielding layer is attached to the reinforcing layer, the reinforcing layer is attached to the double-sided adhesive layer, the double-sided adhesive layer is attached to the buffer layer, and the buffer layer is attached to the heat dissipation layer;
the reinforced layer is a fiber line layer;
the upper surface of the buffer layer is sunken inwards to form a buffer groove (41), a plurality of radial support sheets (42) and a plurality of latitudinal support sheets (43) are arranged inside the buffer groove, and the radial support sheets and the latitudinal support sheets are perpendicular to each other;
the lower surface of the buffer layer is provided with a plurality of convex strips (44) which are arranged in parallel, and the upper surface of the heat dissipation layer is provided with grooves (51) matched with the convex strips;
the heat dissipation layer extends downwards to form a plurality of heat dissipation strips (52), heat dissipation grooves (53) are formed between every two adjacent heat dissipation strips, the adhesive-backed film is provided with heat dissipation holes (54), the heat dissipation holes penetrate through the upper surface and the lower surface of the adhesive-backed film, and the heat dissipation holes are communicated with the heat dissipation grooves;
the heat dissipation layer is attached to release paper (6).
2. The multifunctional adhesive-backed film according to claim 1, wherein: the back glue film is provided with a plurality of fractures (7) and a plurality of discontinuous strips, the fractures are located on the side wall of the back glue film and correspond to the discontinuous strips, each discontinuous strip is composed of a plurality of breaking grooves (8), and the breaking grooves penetrate through the upper surface and the lower surface of the back glue film.
3. The multifunctional adhesive-backed film of claim 1, wherein: the length of the fiber thread layer is 250-300 microns, and the diameter of the fiber thread layer is 6-8 microns.
4. The multifunctional adhesive-backed film of claim 1, wherein: the shielding layer is a conductive adhesive tape.
5. The multifunctional adhesive-backed film of claim 1, wherein: the cross sections of the convex strips and the grooves are triangular.
6. The multifunctional adhesive-backed film according to claim 1, wherein: the buffer layer is a polyethylene terephthalate layer.
7. The multifunctional adhesive-backed film of claim 1, wherein: the heat dissipation layer is a polyvinyl chloride layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202123270774.0U CN218404024U (en) | 2021-12-23 | 2021-12-23 | Multifunctional back glue film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202123270774.0U CN218404024U (en) | 2021-12-23 | 2021-12-23 | Multifunctional back glue film |
Publications (1)
Publication Number | Publication Date |
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CN218404024U true CN218404024U (en) | 2023-01-31 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202123270774.0U Active CN218404024U (en) | 2021-12-23 | 2021-12-23 | Multifunctional back glue film |
Country Status (1)
Country | Link |
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CN (1) | CN218404024U (en) |
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2021
- 2021-12-23 CN CN202123270774.0U patent/CN218404024U/en active Active
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