CN219016368U

CN219016368U - Clamp and test device for testing semiconductor device with multi-package structure

Info

Publication number: CN219016368U
Application number: CN202223011762.0U
Authority: CN
Inventors: 朱袁正; 钱迈华; 朱久桃; 胡伟
Original assignee: Wuxi Dianji Integrated Technology Co ltd
Current assignee: Wuxi Dianji Integrated Technology Co ltd
Priority date: 2022-11-11
Filing date: 2022-11-11
Publication date: 2023-05-12
Anticipated expiration: 2032-11-11

Abstract

The utility model relates to the technical field of semiconductor device testing, and discloses a clamp and a testing device for testing semiconductor devices with multiple packaging structures, wherein the clamp comprises a body, a PCB (printed circuit board) is mounted at the top of the body, and first to fourth clamp heads are arranged on the PCB and respectively comprise a first connecting terminal and a third connecting terminal; the body is also provided with at least one first connector, at least one second connector and at least one third connector, and the first connector, the second connector and the third connector are respectively and electrically connected with the first connector, the second connector and the third connector; when the test device is actually used, the first clamp head and the fourth clamp head corresponding to the material tube type package, the PDFN5X6 package, the T0252-2L package and the TOLL package are arranged on the PCB, and when the four different packaged transistors are required to be tested, the transistors are only required to be placed on the clamp heads corresponding to the packages, the clamp heads are not required to be replaced, the test time can be reduced, and the test efficiency is improved.

Description

Clamp and test device for testing semiconductor device with multi-package structure

Technical Field

The utility model relates to the technical field of semiconductor device testing, in particular to a clamp and a testing device for testing semiconductor devices with multiple packaging structures.

Background

After the manufacture of semiconductor devices such as transistors is completed, the semiconductor devices need to be placed on a test bench for testing. Since pins of the semiconductor device need to be connected to an external module when testing the semiconductor device, for the semiconductor device, since it is finally required to be sold to the market, most of the semiconductor devices are put on a fixture head when testing, so that pins of the semiconductor device are electrically connected with connection terminals on the fixture head, instead of fixedly connecting output pins of the semiconductor device with the external module.

However, for the application scenario where the same device may have different types of packages, for example, the semiconductor device is a tube type package, the bottom surfaces of pins of the devices of the type of package are coplanar, and some semiconductor devices are a PDFN5X6 package, a T0252-2L package, or a TOLL package, when the package types of the devices are different, a corresponding fixture head needs to be selected when the semiconductor device is tested, which results in that the fixture head needs to be replaced when the semiconductor devices of different packages are tested, resulting in lower test efficiency. In addition, when the semiconductor device packaged by the material pipe is placed on the corresponding fixture head, the poor contact condition of the pins of the semiconductor device and the connecting terminals of the fixture head can occur because the fixture head is not fixed, and the testing reliability can be affected.

Disclosure of Invention

In view of the shortcomings of the background art, the utility model provides a clamp and a testing device for testing semiconductor devices with multiple package structures, and aims to solve the technical problem that the test clamp is required to be replaced frequently according to different package structures of the semiconductor devices when the semiconductor devices are tested, so that the test efficiency is low.

In order to solve the technical problems, in a first aspect, the utility model provides a fixture for testing a semiconductor device with a multi-package structure, comprising a body, wherein a PCB (printed circuit board) is mounted on the top surface of the body, a first fixture head, a second fixture head, a third fixture head and a fourth fixture head are arranged on the PCB, and the first fixture head, the second fixture head, the third fixture head and the fourth fixture head respectively comprise a first connecting terminal, a second connecting terminal and a third connecting terminal;

the body is further provided with at least one first connector, at least one second connector and at least one third connector, the first connecting terminal is electrically connected with the first connector, the second connecting terminal is electrically connected with the second connector, and the third connecting terminal is electrically connected with the third connector.

In practical use, the first clamp head is used for placing transistors packaged in a material pipe, the second clamp head is used for placing transistors packaged in a PDFN5X6, the third clamp head is used for placing transistors packaged in a T0252-2L, and the fourth clamp head is used for placing transistors packaged in a TOLL.

In a certain embodiment of the first aspect, the present utility model further includes a second pressing plate, a third pressing plate, and a fourth pressing plate, wherein a top surface side of the second clamping head is hinged to a bottom surface side of the second pressing plate, a top surface side of the third clamping head is hinged to a bottom surface side of the third pressing plate, and a top surface side of the fourth clamping head is hinged to a bottom surface side of the fourth pressing plate.

In a certain implementation manner of the first aspect, the second pressing plate is provided with a second operation block on a side opposite to a side where the second pressing plate is hinged to the second clamp head, the third pressing plate is provided with a third operation block on a side opposite to a side where the third pressing plate is hinged to the third clamp head, and the fourth pressing plate is provided with a fourth operation block on a side opposite to a side where the fourth pressing plate is hinged to the fourth clamp head.

In a certain implementation manner of the first aspect, four first mounting holes are formed in the PCB board, the four first mounting holes are distributed in a rectangular shape, four second mounting holes are formed in the body, and the four second mounting holes are distributed in a rectangular direction.

In a certain embodiment of the first aspect, the body is provided with two first connectors, two second connectors and two third connectors.

In a certain embodiment of the first aspect, two first connectors, two second connectors and two third connectors are provided on the front side of the body.

In a second aspect, the present utility model further provides a testing apparatus, including the fixture and the insulation test box for testing semiconductor devices with multiple package structures, where the insulation test box is provided with multiple connection terminals, and each first connection terminal, each second connection terminal, and each third connection terminal are electrically connected with one connection terminal through a connection wire.

Compared with the prior art, the utility model has the following beneficial effects: firstly, arranging a first clamp head and a fourth clamp head which correspond to a material tube type package, a PDFN5X6 package, a T0252-2L package and a TOLL package on a PCB, and when the four different packaged transistors are required to be tested, only the transistors are required to be placed on the clamp heads of the corresponding packages, so that the clamp heads are not required to be replaced, the test time can be reduced, and the test efficiency is improved;

in addition, for the transistor packaged by the material pipe, as the first clamp head is fixed on the PCB, when the transistor is placed, the situation that the pins of the transistor are in poor contact with the connecting terminals of the first clamp head due to easy shaking of the first clamp head is not worry.

Drawings

FIG. 1 is a schematic diagram of a test fixture according to the present utility model;

fig. 2 is a schematic structural diagram of a testing device in an embodiment.

Detailed Description

The utility model will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the utility model and therefore show only the structures which are relevant to the utility model.

As shown in fig. 1, a fixture and a testing device for testing a semiconductor device with a multi-package structure, which comprises a body 1, wherein a PCB 2 is mounted on the top of the body 1, a first fixture head 3, a second fixture head 4, a third fixture head 5 and a fourth fixture head 6 are arranged on the PCB 2, and the first fixture head 3, the second fixture head 4, the third fixture head 5 and the fourth fixture head 6 respectively comprise a first connection terminal, a second connection terminal and a third connection terminal;

the front side of the body 1 is further provided with two first connectors 20, two second connectors 21 and two third connectors 22, wherein the first connectors are electrically connected with the first connectors 20, the second connectors 21 are electrically connected with the second connectors 21, and the third connectors 22 are electrically connected with the third connectors.

In practical use, the first fixture head 3 is used for placing transistors packaged in a material pipe, the second fixture head 4 is used for placing transistors packaged in a PDFN5X6, the third fixture head 5 is used for placing transistors packaged in a T0252-2L, and the fourth fixture head 6 is used for placing transistors packaged in a TOLL. When the transistor is placed in one of the first to fourth clamp heads 3 to 6, three pins of the transistor are electrically connected to the first, second and third connection terminals of the clamp head, respectively. In addition, by providing two first connectors 20, two second connectors 21 and two third connectors 22 on the body, taking two first connectors 20 as an example, during actual testing, the two first connectors 20 are electrically connected with corresponding polarity interfaces of the connecting terminal 17 respectively. The Kelvin test structure inside the clamp head is matched to form a test loop, and whether the semiconductor device is in good contact with the inside of the clamp head or not can be intuitively judged during testing.

In this embodiment, the test fixture of the present utility model further includes a second pressing plate 7, a third pressing plate 8 and a fourth pressing plate 9, wherein a top surface side of the second fixture head 4 is hinged to a bottom surface side of the second pressing plate 7, a top surface side of the third fixture head 5 is hinged to a bottom surface side of the third pressing plate 5, and a top surface side of the fourth fixture head 6 is hinged to a bottom surface side of the fourth pressing plate 9.

In actual use, when a transistor is placed in one of the second clamp head 4 to the fourth clamp head 6, the corresponding pressing plate is rotated to press the transistor, so that the transistor is fixed.

In addition, to facilitate the operation of the worker, the second pressing plate 7 is mounted with a second operation block 10 on the opposite side of the second pressing plate 7 to the side where the second clamp head 4 is hinged, the third pressing plate 8 is mounted with a third operation block 11 on the opposite side of the third pressing plate 8 to the side where the third clamp head 5 is hinged, and the fourth pressing plate 9 is mounted with a fourth operation block 11 on the opposite side of the fourth pressing plate 9 to the side where the fourth clamp head 6 is hinged. In actual use, a worker may rotate the corresponding platen by operating the blocks.

In order to realize the fixed of PCB board 2, offered four first mounting holes 13 on the PCB board 2, four first mounting holes 13 are rectangle and distribute, and when in actual use, first mounting hole 13 can be the screw, uses the bolt can install PCB board 2 on body 1.

In order to realize the fixation of the body 1, four second mounting holes 14 are formed in the body 1, the four second mounting holes 14 are distributed in a long direction, the second mounting holes 14 can be screw holes, and the body 1 can be mounted on peripheral components by using bolts.

In actual use, the first clamp head 3-the fourth clamp head 6 corresponding to the material tube type package, the PDFN5X6 package, the T0252-2L package and the TOLL package are arranged on the PCB 2, and when the four different packaged transistors are required to be tested, the transistors are only required to be placed on the clamp heads corresponding to the packages, so that the clamp heads are not required to be replaced, the test time can be reduced, and the test efficiency is improved;

in addition, for the transistor packaged by the material pipe, since the first clamp head 3 is fixed on the PCB 2, when the transistor is placed, the situation that the pins of the transistor are in poor contact with the connecting terminals of the first clamp head due to easy shaking of the first clamp head 3 is not worry.

As shown in fig. 2, the present utility model further provides a testing apparatus, which includes the fixture for testing semiconductor devices with multiple package structures and an insulation test box 16, where a plurality of connection terminals 17 are disposed on the insulation test box 16, and each first connection terminal, each second connection terminal, and each third connection terminal are individually electrically connected to one connection terminal 17 through a connection wire 15. In actual use, the wiring terminal 17 is used for connecting an external upper computer, and a test medal is arranged in the upper computer. During testing, the semiconductor device is placed in one of the clamp heads in the corresponding packaging mode, the clamp heads are covered by the pressing plate, the testing upper computer connected with the wiring terminal 17 is opened, a testing program consistent with the requirements of the semiconductor device is called, and a test button is clicked, so that whether the device has good Kelvin contact and whether the numerical value of each electric parameter is normal can be checked.

The present utility model has been made in view of the above-described circumstances, and it is an object of the present utility model to provide a portable electronic device capable of performing various changes and modifications without departing from the scope of the technical spirit of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.

Claims

1. The clamp for testing the semiconductor device with the multi-packaging structure is characterized by comprising a body, wherein a PCB (printed circuit board) is mounted on the top surface of the body, a first clamp head, a second clamp head, a third clamp head and a fourth clamp head are arranged on the PCB, the first clamp head is used for placing transistors packaged by a material pipe, the second clamp head is used for placing transistors packaged by a PDFN5X6, the third clamp head is used for placing transistors packaged by T0252-2L, the fourth clamp head is used for placing transistors packaged by TOLL, and the first clamp head, the second clamp head, the third clamp head and the fourth clamp head respectively comprise a first connecting terminal, a second connecting terminal and a third connecting terminal;

2. The fixture for testing a semiconductor device of a multiple package structure according to claim 1, further comprising a second platen, a third platen, and a fourth platen, wherein a top surface side of the second fixture head is hinged to a bottom surface side of the second platen, a top surface side of the third fixture head is hinged to a bottom surface side of the third platen, and a top surface side of the fourth fixture head is hinged to a bottom surface side of the fourth platen.

3. The jig for testing a semiconductor device of a multiple package structure according to claim 2, wherein the second pressing plate is mounted with a second operation block on a side opposite to a side of the second pressing plate hinged to the second jig head, the third pressing plate is mounted with a third operation block on a side opposite to a side of the third pressing plate hinged to the third jig head, and the fourth pressing plate is mounted with a fourth operation block on a side opposite to a side of the fourth pressing plate hinged to the fourth jig head.

4. The fixture for testing semiconductor devices with multiple package structures according to claim 1, wherein four first mounting holes are formed in the PCB, the four first mounting holes are distributed in a rectangular shape, four second mounting holes are formed in the body, and the four second mounting holes are distributed in a rectangular direction.

5. The fixture for testing semiconductor devices of multiple package structure according to claim 1, wherein the body is provided with two first connectors, two second connectors and two third connectors.

6. The fixture for testing semiconductor devices of multiple package structure according to claim 5, wherein two first connectors, two second connectors, and two third connectors are provided on the front side of the body.

7. A testing device, comprising the fixture for testing semiconductor devices of multi-package structure according to any one of claims 1 to 6 and an insulation test box, wherein the insulation test box is provided with a plurality of connection terminals, and each first connection head, each second connection head and each third connection head are electrically connected with one connection terminal through a connection wire.