CN218445604U - Positioning device for verification and analysis of micro chip packaging module - Google Patents
Positioning device for verification and analysis of micro chip packaging module Download PDFInfo
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- CN218445604U CN218445604U CN202222276658.8U CN202222276658U CN218445604U CN 218445604 U CN218445604 U CN 218445604U CN 202222276658 U CN202222276658 U CN 202222276658U CN 218445604 U CN218445604 U CN 218445604U
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Abstract
The utility model discloses a positioning device for verifying and analyzing a microchip packaging module, which comprises a base, wherein the base is provided with at least one limiting groove for bearing and limiting the position of a test product, a plurality of connecting units are arranged around the limiting groove, and a pressing piece inserted into the limiting groove and used for pressing the test product to be tested is horizontally and movably arranged on the base; the connecting unit comprises at least one pair of probes, and a first connecting end A and a second connecting end B are respectively formed at two ends of each probe; the first connecting end A is connected with a first connecting wire in welding connection with a test point of a product to be tested, and the second connecting end B is connected with a second connecting wire in electrical connection with a test equipment end. The utility model discloses fixed microchip encapsulation module that can be stable, and be convenient for carry out quick line connection in order to carry out relevant test at each different test equipment end, convenient operation, output signal is stable during the verification, has ensured the reliability of verifying the analysis result.
Description
[ technical field ] A method for producing a semiconductor device
The utility model belongs to the technical field of earphone SIP test positioning, especially, relate to a positioner that miniature chip package module verification analysis was used.
[ background of the invention ]
At present, a product is an earphone SIP module (a chip packaging module formed by packaging a PCB and electronic components together), and various performances of the earphone SIP module need to be verified and analyzed before mass production after the earphone SIP module is designed, so that a sample needs to be taken to each testing equipment end for testing.
At present, a verification and analysis person pastes a sampling adhesive tape of an earphone SIP module on a workbench surface, then connects a test device with a test point on the earphone SIP module by using a connecting wire, one end of the connecting wire is welded with the test point on the earphone SIP module, the other end of the connecting wire is inserted with the test device, when the test device needs to be replaced on another test device for testing, the connecting wire and one end connected with the earphone SIP module are all unwelded, the earphone SIP module is taken out, then the test device is taken to another test device, and the test device is reconnected again and tested again according to the original connecting mode, so that the operation is troublesome, and the efficiency is low; the SIP module is very small in size, and the sampling adhesive tape is fixed on the module to be tested, so that the stability of output during verification is influenced, and the SIP module is unsafe.
Therefore, it is necessary to provide a new positioning device for verification and analysis of microchip packaging module to solve the above problems.
[ Utility model ] content
A primary object of the utility model is to provide a positioner that microchip encapsulation module verification analysis used, fixed microchip encapsulation module that can be stable, and be convenient for carry out quick line connection in order to carry out relevant test at each different test equipment end, convenient operation, output signal is stable when verifying, has ensured the reliability of verifying the analysis result.
The utility model discloses a following technical scheme realizes above-mentioned purpose: a positioning device for verifying and analyzing a microchip packaging module comprises a base, wherein at least one limiting groove for bearing and limiting the position of a test product is arranged on the base, a plurality of connecting units are arranged around the limiting groove, and a pressing piece inserted into the limiting groove and used for pressing the test product to be tested is horizontally and movably arranged on the base; the connecting unit comprises at least one pair of probes, and a first connecting end A and a second connecting end B are formed at two ends of each probe respectively; the first connecting end A is connected with a first connecting wire in welding connection with a test point of a product to be tested, and the second connecting end B is connected with a second connecting wire in electric connection with a test equipment end.
Furthermore, a containing groove for containing the connecting unit is formed in the base, the connecting unit comprises an insulating seat fixedly arranged in the containing groove, the probe is arranged on the insulating seat, two ends of the probe respectively extend out of the upper surface and the lower surface of the insulating seat, and the first connecting end A and the second connecting end B are respectively formed.
Furthermore, one end of the first connecting wire is provided with a first electric connection chuck, and the first electric connection chuck is clamped on the upper part of the probe to realize connection with the first connecting end A.
Further, one end of the first connecting wire is welded with the probe to realize electric connection.
Furthermore, one end of the second connecting wire is provided with a second electric connection chuck, and the second electric connection chuck is clamped at the lower part of the probe to realize the connection with the second connecting end B.
Furthermore, the other end of the second connecting line is provided with a connecting plug, and the connecting plug is inserted into a corresponding jack of the test equipment to realize connection with the test equipment.
Further, the bottom of one opposite side of the base is formed with an avoidance operation notch for facilitating the wiring operation at the second connection end B.
Furthermore, a step surface is formed on the upper part of the opposite side of the other side of the base, a pair of positioning columns protruding out of the lower surface of the base are arranged on the step surface, and the positioning columns are matched with positioning holes in the test workbench to realize stable positioning of the positions.
Furthermore, the base is provided with label information in one-to-one correspondence with the connecting unit, and the label information represents the name of a specific test point on a product to be tested, which is connected with the connecting unit.
Compared with the prior art, the utility model relates to a positioner that microchip package module verification analysis used's beneficial effect lies in: the whole structure is small and exquisite, the transfer is convenient, the micro chip packaging module can be effectively fixed, the test points of the chip packaging module are firstly connected with the fixed probes on the positioning device at one time, when different test equipment ends are tested, the connection between the fixed probes and the test equipment is realized only by sampling, clamping and unclamping, repeated welding and unsoldering operations between the sampling connection lines and the test points and repeated positioning and disassembling actions on products to be tested are omitted, and the test convenience and efficiency of the micro products to be tested at different test equipment ends are greatly improved; and the stable test result output during verification and analysis is also ensured.
[ description of the drawings ]
Fig. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a schematic view of a three-dimensional cross-sectional structure after a product is installed in the embodiment of the present invention;
the figures in the drawings represent:
100 a positioning device for verifying and analyzing a microchip packaging module; 101-a product to be tested;
1-a base, 11-a containing groove, 12-an avoiding operation notch, 13-a step surface and 14-a positioning column; 2-a limit groove; 3-connecting unit, 31-insulating base, 32-probe; 4-a holding member; 5-a first connection line; 6-second connecting line.
[ detailed description ] embodiments
The first embodiment is as follows:
referring to fig. 1-2, the present embodiment is a positioning device 100 for verification and analysis of a microchip package module, which is used for positioning an electronic product module during verification and analysis of a system-in-package electronic product module. The positioning device 100 comprises a base 1, at least one limiting groove 2 for bearing and limiting the position of a test product is arranged on the base 1, a plurality of connecting units 3 are arranged around the limiting groove 2, a pressing and holding piece 4 inserted into the limiting groove 2 and used for pressing and holding the test product is horizontally and movably arranged on the base 1, and the pressing and holding piece 4 is a plug pin or a plug board.
The base 1 is provided with a containing groove 11 for containing the connecting unit 3, the connecting unit 3 comprises an insulating seat 31 fixedly arranged in the containing groove 11 and at least one pair of probes 32 arranged on the insulating seat 31, and two ends of each probe 32 respectively extend out of the upper surface and the lower surface of the insulating seat 31 and respectively form a first connecting end A and a second connecting end B. The first connecting end A is connected with a first connecting wire 5, the second connecting end B is connected with a second connecting wire 6, the other end of the first connecting wire 5 is welded with a test point on a test product, and the other end of the second connecting wire 6 is provided with a connecting plug for being connected with a corresponding jack of test equipment in an inserting mode to achieve electric signal connection.
One end of the first connecting wire 5 is provided with a first electric connection chuck, and the first electric connection chuck is clamped on the upper part of the probe 32 to realize connection with the first connecting end a. One end of the second connecting wire 6 is provided with a second electrical connection chuck, and the second electrical connection chuck is clamped at the lower part of the probe 32 to realize the connection with the second connecting end B.
The electric connection chuck is arranged at one end of the first connecting line 5 and one end of the second connecting line 6, so that the connection relation between the connecting lines and the probes can be quickly established or disconnected, the products to be tested are replaced, or the second connecting line 6 with the corresponding plug is replaced according to the requirements of the testing equipment at different testing equipment ends, and the convenience of the verification analysis operation of the products to be tested at each testing equipment end is improved.
In other embodiments, the first connecting line 5 and the probe 32 are soldered.
An avoidance operation notch 12 facilitating the wiring operation at the second connection end B is formed at the bottom of one opposite side of the base 1, a step surface 13 is formed at the upper part of the other opposite side of the base 1, a pair of positioning columns 14 protruding out of the lower surface of the base 1 are arranged on the step surface 13, and the positioning columns 14 can be of a cylindrical structure or a screw structure. Four positioning columns 14 are arranged on the two step surfaces 13 in total, and the four positioning columns 14 are matched with positioning holes in the test workbench, so that the position stability of the positioning device 100 can be guaranteed.
The base 1 is provided with label information in one-to-one correspondence with the connecting units 3, and the label information represents specific test point names on a product to be tested, which is connected with the corresponding connecting units 3, so that the subsequent connection with test equipment is facilitated.
The positioning device 100 for verification and analysis of the microchip packaging module in the embodiment can be used for positioning the microchip packaging module such as a bluetooth headset, an intelligent watch, an intelligent bracelet, and intelligent glasses during verification and analysis, so that an engineer can conveniently analyze and operate the microchip packaging module, and the operation time is saved; the test equipment to which the test is performed may be a power amplifier, an oscilloscope, a temperature box, or the like.
In the present embodiment, when the positioning device 100 for verifying and analyzing a microchip packaging module is used, a product to be tested is placed in the limiting groove 2, and then the pressing member 4 is pushed into the limiting groove 2 to press and hold the product to be tested; welding the end part of the first connecting wire 5 and a test point on a product to be tested together, and clamping the other end of the first connecting wire on the upper part of the probe 32 of one connecting unit 3 through a first electric connecting chuck; labeling the name of the connected test point in the label information area on the base 1 to complete the installation of the product on the positioning device; when specific verification analysis is needed, the positioning device provided with the product is taken to a test equipment end, the probe 32 on the corresponding connection unit 3 is connected with the jack of the test equipment through the second connection line 6 according to the test requirement at the test equipment end, one end of the second connection line 6 is clamped at the lower part of the probe 32 through the second electric connection chuck, the other end of the second connection line is inserted into the jack of the test equipment through the connection plug, and the test equipment is started to carry out related tests; when other performance tests are required to be performed on the product, the second connecting line 6 is taken down from the probe 32, then the whole body is taken to the corresponding test equipment end, and then the second connecting line 6 matched with the test equipment end is used for repeating the connection operation to perform the corresponding performance tests.
The embodiment is a positioning device 100 for verifying and analyzing a microchip packaging module, which has a small and exquisite integral structure, is convenient to transfer, can effectively fix the microchip packaging module, and firstly connects a test point of the microchip packaging module with a fixed probe on the positioning device at one time; and the stable test result output during verification and analysis is also ensured.
What has been described above is merely some embodiments of the present invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are within the scope of the invention.
Claims (9)
1. The utility model provides a positioner that microchip encapsulation module verification analysis used, its includes the base, be provided with at least one spacing recess that bears and injects test product position on the base, its characterized in that: a plurality of connecting units are arranged around the limiting groove, and a pressing piece which is inserted into the limiting groove and presses a product to be tested is horizontally and movably arranged on the base; the connecting unit comprises at least one pair of probes, and a first connecting end A and a second connecting end B are formed at two ends of each probe respectively; the first connecting end A is connected with a first connecting wire in welding connection with a test point of a product to be tested, and the second connecting end B is connected with a second connecting wire in electrical connection with a test equipment end.
2. The positioning device for verification and analysis of microchip packaging modules according to claim 1, wherein: the base is provided with a containing groove for containing the connecting unit, the connecting unit comprises an insulating seat fixedly arranged in the containing groove, the probe is arranged on the insulating seat, two ends of the probe respectively extend out of the upper surface and the lower surface of the insulating seat, and the first connecting end A and the second connecting end B are respectively formed.
3. The positioning device for verification and analysis of microchip packaging modules according to claim 1, wherein: and a first electric connection chuck is arranged at one end of the first connecting line, and is clamped at the upper part of the probe through the first electric connection chuck to realize the connection with the first connecting end A.
4. The positioning device for verification and analysis of microchip packaging modules according to claim 1, wherein: one end of the first connecting wire is welded with the probe to realize electric connection.
5. The positioning device for verification and analysis of microchip packaging modules according to claim 1, wherein: and a second electric connection chuck is arranged at one end of the second connecting wire, and the second electric connection chuck is clamped at the lower part of the probe to realize the connection with the second connecting end B.
6. The positioning device for verification and analysis of microchip packaging module according to claim 5, wherein: and the other end of the second connecting wire is provided with a connecting plug, and the connecting plug is inserted into a corresponding jack of the test equipment to realize the connection with the test equipment.
7. The positioning apparatus for microchip package module verification analysis according to claim 1, wherein: the bottom of one opposite side of the base is formed with an avoidance operation notch for facilitating the wiring operation at the second connection end B.
8. The positioning apparatus for microchip module verification analysis according to claim 7, wherein: the upper part of the opposite side of the other side of the base is provided with a step surface, the step surface is provided with a pair of positioning columns protruding out of the lower surface of the base, and the positioning columns are matched with positioning holes in the test workbench to realize stable positioning of the position.
9. The positioning device for verification and analysis of microchip packaging modules according to claim 1, wherein: the base is provided with label information which corresponds to the connecting units one by one, and the label information represents the names of specific test points on the products to be tested, which are connected with the connecting units.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222276658.8U CN218445604U (en) | 2022-08-29 | 2022-08-29 | Positioning device for verification and analysis of micro chip packaging module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222276658.8U CN218445604U (en) | 2022-08-29 | 2022-08-29 | Positioning device for verification and analysis of micro chip packaging module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218445604U true CN218445604U (en) | 2023-02-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222276658.8U Active CN218445604U (en) | 2022-08-29 | 2022-08-29 | Positioning device for verification and analysis of micro chip packaging module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218445604U (en) |
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2022
- 2022-08-29 CN CN202222276658.8U patent/CN218445604U/en active Active
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