CN218959328U

CN218959328U - Heat radiation structure and inverter

Info

Publication number: CN218959328U
Application number: CN202220722173.4U
Authority: CN
Inventors: 林川
Original assignee: Fuzhou Kangxin Lighting Co ltd
Current assignee: Fuzhou Kangxin Lighting Co ltd
Priority date: 2022-03-30
Filing date: 2022-03-30
Publication date: 2023-05-02
Anticipated expiration: 2032-03-30

Abstract

The application discloses heat radiation structure and dc-to-ac converter relates to the radiating technical field of electronic component, has improved the inhomogeneous problem of heat radiation structure radiating effect, a heat radiation structure for to electronic component heat dissipation, including the heat dissipation cover, the mounting groove that supplies electronic component to install has been seted up to the heat dissipation cover inside, the mounting groove runs through the one end formation opening of heat dissipation cover, the cover body thickness of heat dissipation cover equals and the cover body that the heat dissipation cover kept away from opening one side has bulge and depressed part, the cell wall that the opening one side was kept away from to the mounting groove and electronic component's shape and size looks adaptation. This application whole leakproofness is better, has waterproof shock-proof effect, and this application can reduce the quantity of heat conduction silicone grease and evenly dispel the heat to a plurality of electronic component simultaneously, makes a plurality of electronic component keep suitable temperature.

Description

Heat radiation structure and inverter

Technical Field

The present disclosure relates to heat dissipation technologies for electronic devices, and particularly to a heat dissipation structure and an inverter.

Background

With the continuous development of electronic technology, the power of electronic equipment is also increased, a great amount of heat is generated when the electronic equipment works, and if the heat generated by the electronic equipment cannot be timely emitted, the electronic equipment is failed or even completely damaged due to high temperature.

Most of the current electronic devices have a heat dissipation structure, such as an inverter shown in fig. 5, which mainly comprises a machine body 7 and a heat dissipation structure, wherein the machine body 7 has a function of realizing voltage inversion, and the heat dissipation structure is used for dissipating heat generated by the operation of the machine body 7. The heat radiation structure comprises a shell 9 for accommodating the machine body 7 and a cooling fan 8 for radiating heat, a cavity 93 for installing the machine body 7 is formed in the shell 9, a plurality of heat radiation openings 92 for radiating heat and an installation opening 91 for installing the cooling fan 8 are formed in the shell 9, and the heat radiation openings 92 and the installation opening 91 are communicated with the cavity 93.

When the inverter works, the refrigerating fan 8 is started to promote the air flow between the cavity 93 and the outside, so that the heat exchange between the machine body 7 and the outside is promoted, and the heat on the surface of the machine body 7 is reduced. However, since the wind source is located at one side of the body 7, the portion of the body 7 close to the wind source tends to dissipate heat better than the portion far from the wind source, so that the electronic component 2 at the end of the body 7 far from the cooling fan 8 is still prone to failure or damage due to high temperature.

Disclosure of Invention

In order to improve the problem that the radiating effect of the radiating structure is uneven, the application provides the radiating structure and the inverter.

In a first aspect, the present application provides a heat dissipation structure, which adopts the following technical scheme:

a heat radiation structure is used for radiating an electronic element and comprises a heat radiation cover, wherein an installation groove for installing the electronic element is formed in the heat radiation cover, an opening is formed at one end of the installation groove penetrating through the heat radiation cover, the thickness of a cover body of the heat radiation cover is equal, the cover body of the heat radiation cover far away from one side of the opening is provided with a protruding part and a recessed part, and the groove wall of the installation groove far away from one side of the opening is matched with the shape and the size of the electronic element.

Through adopting above-mentioned technical scheme, electronic component can give off the external world through the heat dissipation cover, and distance between electronic component and the heat dissipation cover body is even simultaneously, and the heat dissipation effect of heat dissipation cover to a plurality of electronic component is even promptly to can make a plurality of electronic component whole temperatures keep stable.

Optionally, the heat dissipation device further comprises a plurality of heat dissipation fins, wherein the heat dissipation fins are arranged on one side, far away from the opening, of the heat dissipation cover, the heat dissipation fins are connected with the heat dissipation cover, and the heat dissipation fins are mutually parallel and distributed at equal intervals.

Through adopting above-mentioned technical scheme, a plurality of fin can improve heat radiation structure's radiating effect, and a plurality of fin equidistant distribution can make heat radiation structure's radiating effect more even.

Optionally, the heat dissipation cover and a plurality of fin integrated into one piece, the fin perpendicular to heat dissipation cover opening place terminal surface, the distance between the opposite terminal surface of heat dissipation cover week side reduces towards the direction that is close to the fin, the thickness of fin reduces towards the direction that keeps away from the heat dissipation cover.

By adopting the technical scheme, the processing and forming of the heat dissipation structure can be facilitated.

Optionally, the ends of the plurality of cooling fins away from the cooling cover are flush, and the opening faces to a plane perpendicular to the ends of the plurality of cooling fins away from the cooling cover.

Through adopting above-mentioned technical scheme, can further make heat radiation structure's radiating effect even, make heat radiation structure's shape more regular simultaneously, make things convenient for the machine-shaping.

Optionally, the projection of the plurality of cooling fins along the opening direction corresponds to the plurality of electronic elements.

Through adopting above-mentioned technical scheme, can confirm the interval and the length of fin between the fin according to the distribution position of a plurality of electronic component, can practice thrift the materials of fin when guaranteeing the fin radiating effect, reduce the heat dissipation cost.

Optionally, the heat dissipation cover still is provided with a plurality of erection columns of being convenient for electronic component installation in the mounting groove, the one end of erection column is connected with the tank bottom of mounting groove, the week side of erection column is connected with the week side cell wall of mounting groove.

Through adopting above-mentioned technical scheme, can make things convenient for electronic component installation, can improve the structural strength of spliced pole simultaneously to can improve the joint strength between electronic component and the heat dissipation cover.

In a second aspect, the present application further provides an inverter, which adopts the following technical scheme:

the utility model provides an dc-to-ac converter, includes foretell a heat radiation structure, still includes a plurality of electronic component, supplies a plurality of electronic component to install the circuit board that forms circuit connection and is used for sealing the apron of mounting groove, the circuit board is connected with a plurality of erection columns, a plurality of electronic component is located between circuit board and the mounting groove tank bottom, the apron covers the opening of mounting groove with the heat dissipation cover connection, the heat dissipation cover still is filled with the filler that is used for waterproof shockproof in the mounting groove.

Through adopting above-mentioned technical scheme, can improve the radiating effect of dc-to-ac converter, make the inside heat that produces of dc-to-ac converter can be evenly distributed to the external world, extension dc-to-ac converter's life to make things convenient for the installation between a plurality of electronic component and circuit board and the heat radiation structure.

Optionally, the filler is heat-conducting silicone grease, and the electronic components and the circuit board are all located in the heat-conducting silicone grease.

Through adopting above-mentioned technical scheme, can make things convenient for the heat conduction that electronic component produced to the heat radiation structure on, improve thermal conduction efficiency between electronic component and the heat radiation structure to further improve the radiating effect of dc-to-ac converter self.

In summary, the present application includes at least one of the following beneficial effects:

1. the heat dissipation structure can uniformly absorb and dissipate heat generated by the operation of the electronic components, so that the temperature of a plurality of electronic components is kept at a lower level and stable;

2. the processing and production of the heat dissipation structure are facilitated, the production cost of the heat dissipation structure is saved, and meanwhile, the heat dissipation cost of the electronic element is reduced.

Drawings

Fig. 1 is an exploded view of an inverter in an embodiment of the present application;

FIG. 2 is an exploded view of another angle of the inverter in an embodiment of the present application;

FIG. 3 is a front view of an inverter in an embodiment of the present application, in half section;

FIG. 4 is an overall view of an inverter in an embodiment of the present application after half-cut;

fig. 5 is a sectional view of a conventional inverter.

Reference numerals illustrate: 1. a circuit board; 2. an electronic component; 3. a heat dissipation cover; 31. a mounting part; 32. a mounting column; 33. a mounting groove; 331. an opening; 4. a heat sink; 5. heat conductive silicone grease; 6. a cover plate; 7. a body; 8. a refrigerating fan; 9. a housing; 91. a mounting port; 92. a heat radiation port; 93. a cavity.

Detailed Description

The present application is described in further detail below in conjunction with figures 1-4.

The embodiment of the application discloses an inverter, which comprises a heat dissipation structure, a plurality of electronic elements 2 and a circuit board 1 for forming circuit connection after the electronic elements 2 are installed.

Referring to fig. 1 and 2, the heat dissipation structure includes a heat dissipation cover 3 and a plurality of heat dissipation fins 4, and the heat dissipation principle of the heat dissipation structure is as follows: firstly, the electronic component 2 conducts heat generated by operation to a heat dissipation structure, the heat dissipation structure absorbs heat and exchanges heat with the outside, and finally, the heat generated by the operation of the electronic component 2 is conducted to the outside, so that the electronic component 2 can keep a proper temperature for operation.

In this embodiment, the inverter is preferably a rectangular parallelepiped structure, and the heat dissipation structure is also a rectangular parallelepiped structure similar to the inverter, but in other embodiments, the inverter and the heat dissipation structure may have different shapes.

Referring to fig. 1 and 2, the heat dissipation cover 3 is also a rectangular cover body structure, and the heat dissipation cover 3 is provided with a mounting groove 33 for mounting a plurality of electronic components 2 on one end surface with the largest area. The circuit board 1 is a rectangular plate-shaped structure, and a plurality of electronic components 2 are all installed on the same end face of the circuit board 1, and due to different sizes and functional purposes of different electronic components 2, the electronic components 2 are provided with protrusions with different degrees and recesses opposite to the protrusions after being installed on the circuit board 1.

Referring to fig. 3 and 4, the mounting groove 33 penetrates through one end of the heat dissipation cover 3 to form an opening 331 for the circuit board 1 and the electronic components 2 to enter the mounting groove 33 for mounting, the groove bottom of the mounting groove 33 is rugged, a plurality of protruding portions and a plurality of recessed portions are correspondingly formed, and the protruding portions and the recessed portions are respectively opposite to the electronic components 2 on the circuit board 1, so that after the circuit board 1 is mounted in the mounting groove 33, the distances between the electronic components 2 and the corresponding positions of the groove bottom of the mounting groove 33 tend to be equal, and the time for heat generated by the electronic components 2 to be conducted to the heat dissipation cover 3 tends to be equal. In order to further make the heat dissipation cover 3 uniformly dissipate heat of a plurality of electronic components 2, the thicknesses of different positions of the cover body of the heat dissipation cover 3 tend to be equal.

Referring to fig. 2 and 3, the heat dissipation cover 3 has a plurality of mounting posts 32 in the mounting groove 33 for connecting the circuit board 1 and the heat dissipation cover 3, and the length directions of the plurality of mounting posts 32 are parallel to the opening 331. One end of the mounting post 32 in the longitudinal direction is connected to the bottom of the mounting groove 33, and the peripheral side of the mounting post 32 is connected to the groove wall on the peripheral side of the mounting groove 33. A circular hole is formed in an end face, away from the bottom of the mounting groove 33, of the mounting post 32 along the length direction of the mounting post, a plurality of circular holes are formed in the edge position of the circuit board 1, after the circuit board 1 is mounted in the mounting groove 33, the end face, provided with a plurality of electronic components 2, of the circuit board 1 is perpendicular to the mounting posts 32, the circuit board 1 is propped against the mounting posts 32 at the same time, the circular holes in the circuit board 1 correspond to the circular holes in the mounting posts 32, and a worker is fixedly connected with the circuit board 1 and the mounting posts 32 through a plurality of screws in a threaded mode. The screws are common connection parts, and in the drawings of the present embodiment, the screws are omitted.

Referring to fig. 1 and 4, the heat sink 4 has a rectangular sheet structure, and a plurality of heat sinks 4 are located on a side of the heat sink 3 facing away from the opening 331. The heat dissipation fins 4 are parallel to each other, the distances between the adjacent heat dissipation fins 4 are equal, the length direction of the heat dissipation fins 4 is parallel to the length direction of the heat dissipation cover 3, and the heat dissipation fins 4 are parallel to the opening 331 of the mounting groove 33. The ends of the cooling fins 4 away from the cooling cover 3 are all located on the same plane, and the cooling fins 4 are all perpendicular to the plane.

The plurality of cooling fins 4 and the cooling cover 3 are integrally formed, and are formed by a die, so that the cooling structure is convenient to be formed and then demoulded, the periphery side of the cooling cover 3 is an inclined surface, namely the peripheral side groove wall of the mounting groove 33 is also an inclined surface. The distance between the opposite sides of the heat dissipation cover 3 gradually increases toward the direction approaching the opening 331 of the mounting groove 33, i.e., the distance between the opposite groove walls of the mounting groove 33 gradually increases toward the opening 331 of the mounting groove 33. Further, the thickness of the heat sink 4 gradually decreases in a direction away from the heat sink 3.

Referring to fig. 1 and 2, the length dimensions of the plurality of heat sinks 4 are different, and the length dimensions of the heat sinks 4 are related to the distribution rule of the plurality of electronic components 2 on the circuit board 1. After the installation of the circuit board 1 and the electronic components 2 is completed, the projection of the cooling fins 4 on the circuit board 1 coincides with the positions of the electronic components 2, and the electronic components 2 are not installed on the circuit board 1 or the positions where the heat generated by the installed electronic components 2 is low correspond to the end face of the cooling cover 3, which is far away from the opening 331 of the installation groove 33, without the auxiliary cooling of the cooling fins 4.

Referring to fig. 3 and 4, after the circuit board 1 and the electronic components 2 are mounted in the mounting groove 33, there is still a space between the electronic components 2 and the groove wall of the mounting groove 33, so that heat generated by the operation of the electronic components 2 can be quickly conducted to the heat dissipation cover 3 and the heat dissipation fins 4, the heat dissipation cover 3 is further filled with the heat conduction silicone grease 5 in the mounting groove 33, and the heat conduction silicone grease 5 fills the space between the electronic components 2 and the groove wall of the mounting groove 33 and fills the mounting groove 33. After the circuit board 1 is mounted in the mounting groove 33, a space for filling the heat conductive silicone grease 5 exists between the peripheral side of the circuit board 1 and the peripheral side groove wall of the mounting groove 33.

Referring to fig. 4, to ensure the sealability of the entire inverter, the inverter further includes a cover plate 6 for covering the opening 331 of the mounting groove 33, the cover plate 6 is connected to the heat dissipation cover 3, and the cover plate 6 is located at a side of the heat dissipation cover 3 away from the heat sink 4. In this embodiment, for convenience of illustration, only the cover plate 6 is shown in fig. 4, and the cover plate 6 is preferably a rectangular plate-like structure adapted to the heat dissipation cover 3.

Referring to fig. 1 and 4, the periphery of the heat dissipation cover 3 further has a plurality of mounting portions 31 for assisting the connection of the heat dissipation cover 3 with the cover plate 6, the plurality of mounting portions 31 are all located at one end of the heat dissipation cover 3 close to the opening 331 of the mounting groove 33, the plurality of mounting portions 31 are distributed around the periphery of the heat dissipation cover 3, the plurality of mounting portions 31 are distributed on the same side of the heat dissipation cover 3 at equal intervals, and the plurality of mounting portions 31 on opposite sides of the heat dissipation cover 3 are symmetrical.

All run through along the direction that is on a parallel with mounting groove 33 opening 331 orientation on a plurality of installation department 31 has the round hole, also runs through a plurality of round holes on the apron 6, and a plurality of round holes on a plurality of installation department 31 correspond with a plurality of round holes on the apron 6, and after the heat conduction silicone grease 5 was filled, the staff was connected heat dissipation cover 3 and apron 6 through a plurality of screws, and the terminal surface that apron 6 was close to heat dissipation cover 3 was kept away from the terminal surface of fin 4 with heat conduction silicone grease 5 this moment flushes.

In order to improve the heat dissipation effect of the inverter, a heat dissipation fan should be further installed on one side of the inverter in practical application, and compared with the inverter with the refrigeration fan 8, the influence of vibration caused by rotation of the fan on a plurality of electronic elements 2 in the inverter can be reduced.

The implementation principle of the inverter in the embodiment of the application is as follows:

the heat generated by the operation of the electronic components 2 is firstly conducted to the heat dissipation cover 3 through the heat conduction silicone grease 5, then a part of the heat absorbed by the heat dissipation cover 3 exchanges heat with the outside, and meanwhile, another part of the heat is conducted to the heat dissipation fins 4, and then the heat dissipation fins 4 exchange the heat absorbed by the heat dissipation cover with the outside, so that the electronic components 2 keep a proper working temperature;

the distances between the electronic components 2 and the heat dissipation cover 3 tend to be equal, and the thickness of the heat conduction silicone grease 5 filled between the electronic components 2 and the heat dissipation cover 3 is smaller and tends to be equal, so that the heat dissipation structure can uniformly dissipate heat of the electronic components 2 and has higher heat dissipation efficiency.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims

1. A heat radiation structure is used for radiating an electronic element (2), and is characterized by comprising a heat radiation cover (3), wherein an installation groove (33) for installing the electronic element (2) is formed in the heat radiation cover (3), an opening (331) is formed at one end of the installation groove (33) penetrating through the heat radiation cover (3), the thickness of a cover body of the heat radiation cover (3) is equal, the cover body of the heat radiation cover (3) on one side far away from the opening (331) is provided with a protruding part and a concave part, and the groove wall of the installation groove (33) on one side far away from the opening (331) is matched with the shape and the size of the electronic element (2).

2. A heat dissipation structure according to claim 1, further comprising a plurality of heat dissipation fins (4), wherein the heat dissipation fins (4) are disposed on a side of the heat dissipation cover (3) away from the opening (331), the heat dissipation fins (4) are connected with the heat dissipation cover (3), and the plurality of heat dissipation fins (4) are parallel to each other and distributed at equal intervals.

3. A heat dissipation structure according to claim 2, wherein the heat dissipation cover (3) is integrally formed with a plurality of heat dissipation fins (4), the heat dissipation fins (4) are perpendicular to the end face where the openings (331) of the heat dissipation cover (3) are located, the distance between the opposite end faces on the periphery of the heat dissipation cover (3) decreases toward the direction approaching the heat dissipation fins (4), and the thickness of the heat dissipation fins (4) decreases toward the direction away from the heat dissipation cover (3).

4. A heat dissipating structure according to claim 2, wherein the end of the plurality of heat dissipating fins (4) remote from the heat dissipating cover (3) is flush, and the opening (331) is oriented perpendicularly to the plane of the end of the plurality of heat dissipating fins (4) remote from the heat dissipating cover (3).

5. A heat dissipating structure according to claim 2, wherein the projection of the plurality of heat sinks (4) in the direction of the opening (331) corresponds to the plurality of electronic components (2).

6. A heat radiation structure according to claim 1, characterized in that the heat radiation cover (3) is further provided with a plurality of mounting posts (32) in the mounting groove (33) for facilitating the mounting of the electronic component (2), one end of the mounting posts (32) is connected with the bottom of the mounting groove (33), and the peripheral side of the mounting posts (32) is connected with the peripheral side groove wall of the mounting groove (33).

7. An inverter is characterized by comprising the heat dissipation structure as claimed in any one of claims 1-6, a plurality of electronic components (2), a circuit board (1) for installing and forming circuit connection by the electronic components (2) and a cover plate (6) for sealing a mounting groove (33), wherein the circuit board (1) is connected with a plurality of mounting posts (32), the electronic components (2) are positioned between the circuit board (1) and the bottom of the mounting groove (33), the cover plate (6) is connected with a heat dissipation cover (3) to cover an opening of the mounting groove (33), and the heat dissipation cover (3) is filled with waterproof and shockproof filler in the mounting groove (33).

8. An inverter according to claim 7, characterized in that the filler is a heat conductive silicone grease (5), and that several of the electronic components (2) and the circuit board (1) are located inside the heat conductive silicone grease (5).