CN214068570U - Capacitor radiating assembly - Google Patents
Capacitor radiating assembly Download PDFInfo
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- CN214068570U CN214068570U CN202022989282.6U CN202022989282U CN214068570U CN 214068570 U CN214068570 U CN 214068570U CN 202022989282 U CN202022989282 U CN 202022989282U CN 214068570 U CN214068570 U CN 214068570U
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Abstract
The utility model provides a capacitor heat dissipation assembly, which comprises a radiator, a heat conduction component and at least one capacitor; the heat conducting member is made of heat conducting material and comprises a heat conducting surface and at least one mounting groove, and the heat conducting member is fixed to the radiator in a mode that the heat conducting surface is attached to the radiating surface of the radiator; the capacitor is fixed in the mounting groove, a heat conducting medium is filled in a gap between the outer surface of the capacitor and the inner wall of the mounting groove, and heat generated by the capacitor is conducted to the radiator through the heat conducting medium and the heat conducting component and then radiated through the radiator. The utility model discloses a set up the heat conduction component, can be by the heat conduction component with the heat direct conduction to the radiator of electric capacity, realize the high-efficient heat dissipation cooling to electric capacity, and can improve the radiating efficiency greatly with the mode cooling of heat conduction component heat conduction, effectively solve the problem that electric capacity utensil high calorific capacity ensured that electric capacity keeps lower temperature, prevent to age with higher speed, guarantee stability and the reliability that electric capacity used simultaneously.
Description
Technical Field
The embodiment of the utility model provides a relate to power electronic equipment field, more specifically say, relate to an electric capacity radiator unit.
Background
The metal film capacitor is a capacitor formed by winding or laminating a double-sided metallized polypropylene film and a non-metallized polypropylene film, and is generally used for filtering at a direct current terminal of an IGBT (Insulated Gate Bipolar Transistor) inverter. And two pins of the metal film capacitor are arranged on the positive and negative input ends of the IGBT module so as to ensure that the circuit distance between the absorption capacitor and the positive and negative ends is as short as possible.
At present, the metal film capacitor in the power electronic device generally adopts a natural air cooling mode to dissipate heat. Because the metal film capacitor has high heat productivity (heat sources include body heating, current conduction heating and inversion heating of copper bars and the like), and the cooling through natural air cooling is slow, the heat dissipation problem of the existing metal film capacitor can not be solved by adopting a natural air cooling heat dissipation mode, and a more efficient heat dissipation mode is needed.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a cooling to above-mentioned current metal film capacitor adopts the cooling of the forced air cooling radiating mode of nature is slow, can't realize high-efficient radiating problem, provides an electric capacity radiator unit.
The embodiment of the utility model provides a solve above-mentioned technical problem's technical scheme is, provide an electric capacity radiator unit, include:
a heat sink;
a heat conductive member; the heat conducting member is made of heat conducting material and comprises a heat conducting surface and at least one mounting groove, and the heat conducting member is fixed to the radiator in a mode that the heat conducting surface is attached to a radiating surface of the radiator;
at least one capacitor; the capacitor is fixed in the mounting groove, a heat-conducting medium is filled in a gap between the outer surface of the capacitor and the inner wall of the mounting groove, and heat generated by the capacitor is conducted to the radiator through the heat-conducting medium and the heat-conducting member and then radiated through the radiator.
Preferably, the inner wall of the mounting groove is provided with a protruding limiting member, and the outer surface of the capacitor mounted in the mounting groove abuts against the limiting member, so that a gap is formed between the outer surface of the capacitor and the inner wall of the mounting groove.
Preferably, the limiting member comprises a first boss arranged on the bottom wall of the mounting groove, the free end of the first boss is abutted to the bottom surface of the capacitor mounted in the mounting groove to support the capacitor, and the bottom surface of the capacitor and the bottom wall of the mounting groove are separated by a first preset distance.
Preferably, the cross section of the mounting groove is square or rectangular; the limiting member comprises four second bosses which are arranged on four side walls of the mounting groove respectively, and the free ends of the four second bosses are abutted to four side faces of the capacitor in the mounting groove respectively, so that the capacitor is limited, and the four side faces of the capacitor and the four side walls of the mounting groove are spaced by a second preset distance respectively.
Preferably, the cross section of the mounting groove is circular; the limiting member comprises three third bosses which are arranged on the side wall of the mounting groove and are circumferentially distributed around the mounting groove, and the free ends of the three third bosses are respectively abutted to the side face of the capacitor in the mounting groove to limit the capacitor, so that the side face of the capacitor and the side wall of the mounting groove are separated by a third preset distance.
Preferably, the capacitor heat dissipation assembly further comprises a water-cooling heat dissipation plate, the water-cooling heat dissipation plate comprises a heat dissipation surface and a cooling liquid channel, and the heat dissipation surface is cooled by cooling liquid flowing through the cooling liquid channel;
the heat conducting component further comprises a fixing part, the heat conducting component is detachably fixed on the water-cooling heat dissipation plate through the fixing part, and the heat conducting surface of the heat conducting component is attached to the heat dissipation surface of the water-cooling heat dissipation plate.
Preferably, a gap between the heat conduction surface of the heat conduction member and the heat dissipation surface of the water-cooled heat dissipation plate is filled with a heat conduction medium.
Preferably, the heat conducting member includes an installation portion located at a side of the fixing portion opposite to the heat conducting surface, a surface of the installation portion opposite to the side of the fixing portion has three installation grooves distributed along a straight line, and two adjacent installation grooves are respectively provided with a heat blocking groove therebetween.
Preferably, the heat radiating surface of the water-cooling heat radiating plate is provided with a plurality of threaded holes, and the fixing portion of the heat conducting member includes: and the heat conducting member is locked and fixed on the heat radiating surface of the water-cooling heat radiating plate through a fastener which penetrates through the through hole and is in threaded connection with the threaded hole.
Preferably, the three third bosses are located in the same plane, the plane is perpendicular to the opening of the mounting groove, and the centers of the three third bosses are located at three vertexes of an equilateral triangle.
The utility model discloses electric capacity radiator unit has following beneficial effect: through setting up the heat conduction component to can be by the heat direct conduction of the heat of the electric capacity of heat conduction component in with the mounting groove to the radiator, realize the high-efficient heat dissipation cooling to electric capacity, and can improve the radiating efficiency greatly with the mode cooling of heat conduction component heat conduction, avoid the heat dissipation of natural air cooling, effectively solve the problem that electric capacity has high calorific capacity, ensure that electric capacity keeps lower temperature, prevent to accelerate electric capacity ageing, guarantee stability and the reliability that electric capacity used simultaneously.
Drawings
Fig. 1 is a schematic structural diagram of a capacitor heat dissipation assembly according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a partial cross section of a capacitor heat dissipation assembly according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heat conducting member according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, the embodiment of the present invention provides a schematic structural diagram of a capacitor heat dissipation assembly, which can be applied to the field of power electronic devices, especially in a variable frequency driver of a central air conditioner. The capacitor heat dissipation assembly in the present embodiment includes a heat sink (e.g., a water-cooled heat dissipation plate, a chassis, etc.), a heat conducting member 1, and at least one capacitor 2 (e.g., a metal film capacitor), wherein the number of the capacitors 2 is specifically determined according to actual conditions.
The heat conducting member 1 of the present embodiment is made of a heat conducting material (e.g., aluminum alloy), and ensures that the heat conducting member 1 has heat conductivity to realize heat conduction and dissipation. Specifically, the heat conducting member 1 includes a heat conducting surface 11, a fixing portion 12, and at least one mounting groove 13, and the heat conducting member 1 is fixed to the heat sink through the fixing portion 12 in such a manner that the heat conducting surface 11 is attached to a heat radiating surface of the heat sink, thereby conducting heat to the heat sink to reduce temperature. In practical applications, the number of the mounting grooves 13 on the heat conducting member 1 can be adjusted according to practical situations, and specifically can be determined according to the number of the capacitors 2 required by the device.
The heat conducting component 1 can be integrally processed and manufactured by an aluminum alloy material, the material cost is low, the processing and the manufacturing are convenient, and the aluminum alloy fitting has high heat conductivity, so that the heat radiating capacity of the heat conducting component 1 can be effectively improved, heat can be efficiently conducted to a radiator, the lower temperature is kept, and the heat radiating effect is better.
Further, each mounting groove 13 of the heat conductive member 1 is adapted to the capacitor 2, so that the capacitor 2 can be assembled and connected to the heat conductive member 1 by being fixed into the mounting groove 13. And, the clearance between the inner wall of the surface of electric capacity 2 and mounting groove 13 is filled with heat-conducting medium (for example heat-conducting silica gel, etc.), and conduct the heat of electric capacity 2 to the radiator by heat-conducting medium and heat-conducting member 1 and dispel the heat, and then realize the heat dissipation cooling to electric capacity 2.
Because the space between the surface of electric capacity 2 and mounting groove 13 is filled with heat-conducting medium, consequently can ensure the reliable heat-conduction between the surface of electric capacity 2 and the inner wall of mounting groove 13 and be connected, avoid having the space between electric capacity 2 and the mounting groove 13 and reduce heat transfer efficiency, guarantee the radiating effect.
Above-mentioned electric capacity radiator unit is through setting up heat conduction component 1 to can be directly conducted the heat of electric capacity 2 in the mounting groove 13 to radiator 3 by heat conduction component 1, realize the high-efficient heat dissipation cooling to electric capacity 2. The difference has the radiating mode of adopting natural air cooling now to be the electric capacity cooling, and the electric capacity radiator unit of this embodiment implements the cooling to electric capacity 2 with the direct heat conduction's of heat conduction component 1, can improve the radiating efficiency greatly, effectively solves electric capacity 2 and has the problem of high calorific capacity, ensures that electric capacity 2 keeps lower temperature, prevents to age with higher speed, prolongs its life, guarantees stability and the reliability that electric capacity 2 used simultaneously.
The inner wall of each mounting groove 13 of the heat conducting member 1 of the present embodiment is provided with a protruding limiting member 131 (for example, a protrusion structure, i.e., the limiting member and the heat conducting member are integrally formed; of course, the limiting member can be independently arranged, and the limiting member is fixed to the inner wall of the mounting groove 13 by means of bonding, welding, or the like), and the outer surface of the capacitor 2 mounted in the mounting groove 13 abuts against the stopper member 131, and a gap is formed between the outer surface of the capacitor 2 and the inner wall of the mounting groove 13, the outer surface of the capacitor 2 and the inner wall of the mounting groove 13 are spaced, so that the filling operation of the heat-conducting medium is convenient, the operability is improved, make simultaneously the heat-conducting medium can be full of the space between the surface of electric capacity 2 and the inner wall of mounting groove 13, prevent to produce the space and influence heat transfer efficiency because of the operation is limited between the surface that leads to electric capacity 2 and the inner wall of mounting groove 13.
In practical application, the height of the limiting member 131 protruding from the inner wall of the mounting groove 13 can be specifically adjusted according to practical situations; in particular, in order to prevent the heat resistance from increasing due to the large thickness of the heat transfer medium, thereby affecting the heat transfer efficiency, the height of the stopper member 131 protruding from the inner wall of the installation groove 13 is preferably set such that the gap between the outer surface of the capacitor 2 and the inner wall of the installation groove 13 is less than or equal to 1.5 mm.
As shown in fig. 3, the limiting member 131 includes a first boss 132 disposed on the bottom wall of the mounting groove 13, and when the capacitor 2 is assembled in the mounting groove 13, the free end of the first boss 132 abuts against the bottom surface of the capacitor 2 to support the capacitor 2, and the bottom surface of the capacitor 2 and the bottom wall of the mounting groove 13 are separated by a first preset distance, so that the heat-conducting medium can enter and be cured, and the heat on the bottom surface of the capacitor 2 is conducted to the heat-conducting member 1 through the bottom wall of the mounting groove 13.
In practical application, the first preset distance between the bottom surface of the capacitor 2 and the bottom wall of the mounting groove 13 can be specifically determined according to practical situations; for example, the first preset distance is 1.5mm, which not only avoids increasing the thermal resistance of the heat-conducting medium, but also does not affect the filling and sealing operation of the heat-conducting medium.
In an embodiment of the present invention, the cross section of the mounting groove 13 is square or rectangular, and the shape and size of the capacitor 2 are matched with the shape and size of the mounting groove 13.
Specifically, the limiting member 131 includes four second bosses 133, and four sidewalls of the mounting groove 13 are respectively located by the four second bosses 133, and when the capacitor 2 is assembled to the mounting groove 13, the free ends of the four second bosses 133 abut against four sides of the capacitor 2 respectively, so as to limit the radial direction of the capacitor 2, and the four sides of the capacitor 2 and the four sidewalls of the mounting groove 13 are spaced by a second preset distance respectively, which facilitates the potting of the heat-conducting medium, so as to realize that the heat on the four sides of the capacitor 2 is conducted to the heat-conducting member 1 through the four sidewalls of the mounting groove 13 respectively. The second preset distance can be equal to the first preset distance, the structure is unified, the structure is more reasonable and simpler, and the first preset distance and the second preset distance are preferably set to be 1.5 mm.
The end surface areas of the free ends of the first bosses 132 and the second bosses 133 are as small as possible, so that a large gap caused by a large contact area between the first bosses 132 and the second bosses 133 and the outer surface of the capacitor 2 is avoided. For example, the end surface area of the free ends of the first and second bosses 132 and 133 is forty-times the area of the cross section of the mounting groove 13.
In another embodiment of the present invention, the cross section of the mounting groove 13 is circular, and the shape and size of the capacitor 2 are matched with the shape and size of the mounting groove 13.
Specifically, the stop member 131 includes at least three third bosses. This embodiment is taken to set up three third boss as an example, these three third boss set up in the lateral wall of mounting groove 13, and three third boss distributes around the circumference of mounting groove 13 respectively, when electric capacity 2 assembles mounting groove 13 like this, the free end of three third boss can butt the side of electric capacity 2 respectively, thereby spacing electric capacity 2, make interval third preset distance between the lateral surface of electric capacity 2 and the lateral wall of mounting groove 13, make things convenient for the embedment of heat-conducting medium, in order to realize conducting the heat on four sides with electric capacity 2 to heat-conducting member 1 through the lateral wall of mounting groove 13. The third preset distance can be equal to the first preset distance, the structure is unified, the structure is more reasonable and simpler, and the first preset distance and the third preset distance are preferably set to be 1.5 mm.
Preferably, three third bosss are located the coplanar, and the opening orientation of this plane perpendicular to mounting groove 13 to carry on spacingly to electric capacity 2's three position in the coplanar, ensure to be able to effective spacing electric capacity 2, guarantee electric capacity 2's installation stability. In practical applications, the centers of the three third bosses can be located at three vertexes of an equilateral triangle, i.e., distributed at the positions of the three vertexes of the equilateral triangle.
In addition, the capacitor heat dissipation assembly of the present embodiment further includes a water-cooling heat dissipation plate 3, the water-cooling heat dissipation plate 3 includes a heat dissipation surface 31 and a coolant channel, and the water-cooling heat dissipation plate 3 can cool the heat dissipation surface 31 by the coolant flowing through the coolant channel.
Specifically, the heat conducting member 1 is detachably fixed on the water-cooled heat sink 3 through the fixing portion 12, and the heat conducting surface 11 of the heat conducting member 1 is attached to the heat dissipating surface 31 of the water-cooled heat sink 3, so that the heat conducting member 1 can conduct heat to the water-cooled heat sink 3 through the heat conducting surface 11 via the heat dissipating surface 31, and then the heat is transferred by the coolant in the coolant channel, thereby cooling the heat conducting member 1 and the capacitor 2.
Above-mentioned electric capacity radiator unit adopts the water-cooled mode to cool down for electric capacity 2 heat dissipation, and the radiating effect is good, has higher radiating efficiency to can effectively solve electric capacity 2 and have the high problem of calorific capacity, need not worry the higher influence function of electric capacity 2's temperature.
Particularly, the gap between the heat conducting surface 11 of the heat conducting member 1 and the heat dissipating surface 31 of the water-cooled heat dissipating plate 3 is filled with a heat conducting medium (e.g., heat conducting silicone grease), so as to ensure that the heat conducting surface 11 of the heat conducting member 1 and the heat dissipating surface 31 can be tightly connected, improve the heat dissipating effect, and avoid the gap between the heat conducting surface 11 and the heat dissipating surface 31 from affecting the heat conduction.
The utility model discloses an in an embodiment, heat conducting member 1 is including being located the installation department 14 of one side of fixed part 12 heat conduction face 11 dorsad, the surface of one side of this installation department 14 fixed part 12 dorsad has along the three mounting groove 13 of straight line distribution, and be equipped with one between two adjacent mounting grooves 13 respectively and hinder hot recess 15, prevent that the produced heat of electric capacity 2 in two adjacent mounting grooves 13 from influencing each other, ensure that the heat of each electric capacity 2 can high-efficiently shift to heat conduction face 11 of heat conducting member 1 to realize high-efficient cooling.
The heat radiating surface 31 of the water-cooled heat radiating plate 3 is provided with a plurality of screw holes, and the fixing portion 12 of the heat conducting member 1 includes at least: the through holes 16 are formed in the bottom of each heat resisting groove 15 and matched with the threaded holes, so that the heat conducting member 1 can penetrate through the through holes 16 through fasteners and then is locked and fixed on the heat radiating surface 31 of the water-cooling heat radiating plate 3 in a threaded connection mode, the detachable connection of the capacitor heat radiating assembly is achieved, and the disassembly, assembly and maintenance are convenient.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A capacitive heat sink assembly, comprising:
a heat sink;
a heat conductive member; the heat conducting member is made of heat conducting material and comprises a heat conducting surface and at least one mounting groove, and the heat conducting member is fixed to the radiator in a mode that the heat conducting surface is attached to a radiating surface of the radiator;
at least one capacitor; the capacitor is fixed in the mounting groove, a heat-conducting medium is filled in a gap between the outer surface of the capacitor and the inner wall of the mounting groove, and heat generated by the capacitor is conducted to the radiator through the heat-conducting medium and the heat-conducting member and then radiated through the radiator.
2. The capacitive heat sink assembly according to claim 1, wherein the inner wall of the mounting groove has a protruding stop member, and an outer surface of the capacitor mounted in the mounting groove abuts against the stop member with a gap formed between the outer surface of the capacitor and the inner wall of the mounting groove.
3. The capacitor heat dissipation assembly according to claim 2, wherein the limiting member includes a first boss disposed on the bottom wall of the mounting groove, and a free end of the first boss abuts against a bottom surface of the capacitor mounted in the mounting groove to support the capacitor, so that the bottom surface of the capacitor is spaced from the bottom wall of the mounting groove by a first predetermined distance.
4. The capacitive heat sink assembly of claim 3, wherein the mounting groove has a square or rectangular cross-section; the limiting member comprises four second bosses which are arranged on four side walls of the mounting groove respectively, and the free ends of the four second bosses are abutted to four side faces of the capacitor in the mounting groove respectively, so that the capacitor is limited, and the four side faces of the capacitor and the four side walls of the mounting groove are spaced by a second preset distance respectively.
5. The capacitive heat sink assembly of claim 3, wherein the mounting groove is circular in cross-section; the limiting member comprises three third bosses which are arranged on the side wall of the mounting groove and are circumferentially distributed around the mounting groove, and the free ends of the three third bosses are respectively abutted to the side face of the capacitor in the mounting groove to limit the capacitor, so that the side face of the capacitor and the side wall of the mounting groove are separated by a third preset distance.
6. The capacitive heat sink assembly according to any one of claims 1-5, further comprising a water-cooled heat sink plate, wherein the water-cooled heat sink plate comprises a heat sink surface and a coolant channel, and the heat sink surface is cooled by coolant flowing through the coolant channel;
the heat conducting component further comprises a fixing part, the heat conducting component is detachably fixed on the water-cooling heat dissipation plate through the fixing part, and the heat conducting surface of the heat conducting component is attached to the heat dissipation surface of the water-cooling heat dissipation plate.
7. The capacitive heat sink assembly according to claim 6, wherein a gap between the heat conducting surface of the heat conducting member and the heat dissipating surface of the water-cooled heat sink plate is filled with a heat conducting medium.
8. The capacitive heat dissipating assembly according to claim 6, wherein the heat conducting member includes a mounting portion disposed on a side of the fixing portion opposite to the heat conducting surface, a surface of the mounting portion opposite to the side of the fixing portion has three mounting grooves arranged along a straight line, and a heat blocking groove is disposed between two adjacent mounting grooves.
9. The capacitive heat sink assembly as claimed in claim 8, wherein the heat dissipating surface of the water-cooled heat dissipating plate has a plurality of threaded holes, and the fixing portion of the heat conducting member comprises: and the heat conducting member is locked and fixed on the heat radiating surface of the water-cooling heat radiating plate through a fastener which penetrates through the through hole and is in threaded connection with the threaded hole.
10. A capacitive heat sink assembly according to claim 5, wherein three of the third bosses are located in the same plane, said plane being oriented perpendicular to the opening of the mounting slot, and the centers of the three third bosses are located at the three vertices of an equilateral triangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022989282.6U CN214068570U (en) | 2020-12-11 | 2020-12-11 | Capacitor radiating assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022989282.6U CN214068570U (en) | 2020-12-11 | 2020-12-11 | Capacitor radiating assembly |
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| Publication Number | Publication Date |
|---|---|
| CN214068570U true CN214068570U (en) | 2021-08-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022989282.6U Active CN214068570U (en) | 2020-12-11 | 2020-12-11 | Capacitor radiating assembly |
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| CN (1) | CN214068570U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114566379A (en) * | 2022-03-22 | 2022-05-31 | 天津市云驱科技有限公司 | Capacitor multichannel water-cooling quick heat dissipation device |
-
2020
- 2020-12-11 CN CN202022989282.6U patent/CN214068570U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114566379A (en) * | 2022-03-22 | 2022-05-31 | 天津市云驱科技有限公司 | Capacitor multichannel water-cooling quick heat dissipation device |
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