CN214381894U

CN214381894U - Controller

Info

Publication number: CN214381894U
Application number: CN202022540026.9U
Authority: CN
Inventors: 郑晓红; 唐衍柱; 李文杰
Original assignee: Hangzhou Shiteng Technology Co ltd
Current assignee: Hangzhou Shiteng Technology Co ltd
Priority date: 2020-11-05
Filing date: 2020-11-05
Publication date: 2021-10-08
Anticipated expiration: 2030-11-05

Abstract

The application discloses controller, this controller includes: a housing; a circuit board disposed in the housing; the radiating fin is positioned on the circuit board and connected with the shell; a heat conductive substrate disposed between the heat sink and the circuit board; wherein the heat sink is in contact with at least a partial region of the circuit board through the heat conductive substrate. The controller can be used for an on-vehicle refrigerator, and through the design of the shell and the radiating fins, the radiating fins have the functions of radiating and an upper cover of the shell in the prior art, the number of parts of the controller is reduced, the connection among all the parts is simplified, the long-term stable operation of the controller is ensured, the manufacture of products and the later maintenance work are facilitated, and the manufacturing cost and the maintenance cost of the products are obviously reduced.

Description

Controller

Technical Field

The utility model relates to a refrigeration plant technical field, concretely relates to compressor controller of refrigerator.

Background

With the increase of the number of automobiles throughout the year, automobiles have gradually merged into the daily life of modern people, and due to increasing demands of people, vehicle-mounted equipment such as a vehicle-mounted refrigerator is born, the vehicle-mounted refrigerator is generally composed of a box body, a compressor and a compressor controller, the vehicle-mounted refrigerator has higher requirements on volume, weight, portability and the like compared with the traditional refrigerator, the performance and power consumption of the vehicle-mounted refrigerator can be directly influenced by the compressor and the compressor controller, and the long-term stable operation of the compressor and the compressor controller is very important to be ensured.

In the design scheme of the existing compressor controller, the compressor controller generally comprises a plastic shell consisting of an upper shell cover and a lower shell cover, a circuit board inside the plastic shell and a radiating fin connected with the circuit board; the main power device on the circuit board is a power tube, the power tube is provided with an insulating plastic package, the radiating fins are connected with the insulating plastic package surface of the power tube to radiate the circuit board, but the area of the insulating plastic package surface of the power tube is limited, so that the radiating effect cannot be effectively achieved. Furthermore, the compressor controller in the scheme is formed by assembling the upper cover of the shell, the circuit board, the radiating fins and the lower cover of the shell, the assembling and connecting relations are more, the radiating effect is poor, the requirements for positioning design and interference avoidance are complex, and the production, installation and subsequent maintenance work of the compressor controller are complex and tedious.

Therefore, in order to solve the above technical problems, it is an urgent need to design a compressor controller with good heat dissipation and simple and reliable structure.

SUMMERY OF THE UTILITY MODEL

In view of the above problem, an object of the utility model is to provide a compressor controller of refrigerator, through the design to casing and fin, make the fin have the function of heat dissipation and casing upper cover among the prior art concurrently, and through pasting the heat conduction base plate on the circuit board, the setting of insulating gasket has been removed from, the quantity that has reduced compressor controller spare part has simplified the connection between each part, make compressor controller steady operation for a long time, also do benefit to the preparation of product and the maintenance work in later stage.

In order to achieve the above object, the present invention provides a controller, comprising:

a housing;

a circuit board disposed in the housing;

the radiating fin is positioned on the circuit board and connected with the shell;

a heat conductive substrate disposed between the heat sink and the circuit board;

the heat conducting substrate is connected with at least partial area of the circuit board, and the circuit board provides support for the heat radiating fins.

Preferably, the inner surface of the heat sink is provided with a support structure on two opposite sides.

Preferably, the support structure is in contact with both ends of the circuit board.

Preferably, the outer surface of the heat sink is provided with heat dissipation ribs for increasing the heat dissipation area.

Preferably, the height of the support structure is the same as the thickness of the thermally conductive substrate.

Preferably, at least one of the support structure and the thermally conductive substrate provides support for the heat sink.

Preferably, the heat-conducting substrate is connected with the circuit board through heat-conducting silicone grease.

Preferably, the front side of the circuit board is provided with a power device, the heat conducting substrate is arranged on the back side of the circuit board, and the heat conducting substrate and the power device are arranged oppositely.

Preferably, the projection of the heat conducting substrate on the front surface of the circuit board covers the power devices, and the size, the number and the position of the heat conducting substrate are matched with the positions of the power devices.

Preferably, the housing includes an opening, the circuit board is located in the opening of the housing, and the heat sink is at least partially embedded in the opening.

Preferably, the heat sink is matched to the size of the opening of the housing.

Preferably, the opening of the housing includes a first step surface therein, and the first step surface provides support for the circuit board.

Preferably, the opening further comprises a second step surface, and the height difference between the two step surfaces is not greater than the sum of the thickness of the heat conducting substrate and the thickness of the circuit board.

Preferably, the heat conductive substrate is made of metal.

Preferably, the housing, the circuit board and the heat sink are connected by a fixing device.

Preferably, a connecting column is arranged in the opening, and a first connecting hole is formed in the connecting column.

Preferably, a rib is arranged in the opening, the rib is arranged on the inner side wall of the periphery of the shell, and the rib and the connecting column provide the first step surface for supporting the circuit board.

Preferably, the connecting column is located at an open corner within the housing.

Preferably, the circuit board and the heat sink are both provided with second connecting holes, the positions of the second connecting holes are matched with the connecting columns,

preferably, the fixing device is a self-tapping screw, and the self-tapping screw passes through the connecting hole of the heat sink and the connecting hole of the circuit board and is connected with the first connecting hole of the connecting column.

Preferably, the controller is a compressor controller.

The utility model provides a controller through the design to casing and fin, makes the fin have the function of heat dissipation and casing upper cover among the prior art concurrently, has reduced the quantity of controller spare part and has simplified the connection between each part, is showing the cost of manufacture and the assemble duration that have reduced the product, also is favorable to the maintenance work in product later stage. Through setting up power device in a side of circuit board to set up the heat conduction base plate at the opposite circuit board's of side, rethread heat conduction base plate links to each other with the fin, thereby on the fin that the heat guide area is bigger heat-sinking capability is stronger, because heat conduction base plate self just has certain heat-sinking capability, even the fin fails to paste tightly with heat conduction base plate, partial heat can also be given off to the heat conduction base plate, reduce the risk that power device burns out, and the heat conduction base plate subsides in this scheme adorn on the circuit and have certain thickness, need not to set up insulating gasket again, the controller assembly of this scheme is more convenient and more reliable.

The supporting structure at the edge of the radiating fin enables the radiating fin to be U-shaped, the height of the supporting structure is the same as the thickness of the heat conducting substrate, when the radiating fin is assembled, the supporting structure is partially contacted with two ends of the circuit board, the circuit board can be better compressed and simultaneously supports the radiating fin, and therefore the radiating fin which is possibly caused by inconsistent torsion of screws of four hole positions during installation is prevented from being inclined, the accuracy of the installing positions of the radiating fin, the heat conducting substrate and the circuit board is ensured, the reliability of connection is ensured, and the product quality is improved.

The utility model discloses a controller simple structure is reliable, and spare part quantity is less, low in manufacturing cost is honest and clean, and it is convenient to assemble, also is favorable to the maintenance and the spare part replacement in later stage, can popularize and apply on a large scale.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

fig. 1 is a perspective view of a controller according to an embodiment of the present invention;

fig. 2 is an exploded schematic view of a controller according to an embodiment of the present invention;

fig. 3 is a schematic view of a heat sink according to an embodiment of the present invention;

fig. 4 is a schematic diagram of a circuit board according to an embodiment of the present invention;

fig. 5 is a schematic view of a housing according to an embodiment of the present invention;

fig. 6 is a schematic cross-sectional view of a controller according to an embodiment of the present invention;

Detailed Description

Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by the same or similar reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale.

The present invention is not limited to these embodiments. In the following detailed description of the present invention, certain specific details are set forth in detail. It will be apparent to those skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, and procedures have not been described in detail so as not to obscure the present invention.

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples.

Fig. 1 and fig. 2 respectively show a perspective view and an explosion schematic view of a controller according to an embodiment of the present invention, in which it can be seen that the controller includes a housing 100, a circuit board 200 and a heat sink 300, wherein the housing 100 is formed by an integral plastic shell and is a hollow structure with a bottom surface opened, one side of the housing 100 has an opening 110, the circuit board 200 is disposed in the opening 110, and the outer surface of the circuit board 200 is provided with the heat sink 300 matched with the opening 110. The circuit board 200 includes a plurality of components, wherein power devices (e.g., power transistors) are collectively disposed on an inner surface (a surface facing the opening 110) of the circuit board 200, a heat conductive substrate 400 is disposed on an outer surface of the circuit board 200, the heat conductive substrate 400 is disposed opposite to the power devices, the outer surface of the heat conductive substrate 400 contacts an inner surface of the heat sink 300, and further, a heat conductive silicone grease is coated on the outer surface of the heat conductive substrate 400 to better adhere the heat conductive substrate 400 to the heat sink 300 and conduct heat to the heat sink 300, since the heat sink 300 is generally made of a metal material, and the direct contact with the outer surface of the circuit board 200 may cause short circuit of the circuit board 200, the heat sink 300 and a majority of the area of the circuit board 200 are spaced apart from each other by a support structure disposed on both side edges of the inner surface of the heat conductive substrate 400 and the heat sink 300 having a certain thickness, thereby, a gap is formed between at least a partial region of the outer surface of the circuit board 200 and the heat sink 300, thereby preventing a short circuit problem which may be caused by a pin protrusion of a component inserted into the circuit board 200, and increasing the heat dissipation of the heat sink 300. Further, the heat conducting substrate 400 may be made of a metal material, such as aluminum or copper, and is attached to the position of the outer surface of the circuit board 200 opposite to the power device before the heat sink 300 and the housing 100 are assembled (an additional related design for preventing short circuit is required when the heat conducting substrate 400 is disposed in this area), so as to better conduct heat away from the power device, and reduce the number of parts and assembly complexity during the assembly process.

Fig. 3 is a schematic view of a heat sink according to an embodiment of the present invention, where the heat sink 300 is, for example, rectangular, the shape and size of the heat sink 300 are matched with the opening of the housing 100, heat dissipation ribs 310 for increasing heat dissipation area are disposed on the outer surface of the heat sink 300, the heat dissipation ribs 310 include, for example, a plurality of aluminum flat bar structures, the heat dissipation ribs 310 are perpendicular to the outer surface of the heat sink 300, the heat sink 300 is further provided with connection holes 330, for example, four connection holes 330 are disposed at four corners of the heat sink 300, respectively, so as to facilitate installation of self-tapping screws, or other connectors at a later stage, the inner surface of the heat sink 300 is provided with support structures 320, the support structures 320 are disposed on, for example, the upper and lower two sides of the heat sink 300, and provide support for the heat sink 300, and can also better cooperate with the circuit board 200 to press the edge of the circuit board 200.

The supporting structure 320 of the heat sink 300 makes the heat sink 300 in a U shape, the height of the supporting structure 320 is the same as the thickness of the heat conducting substrate 400, when assembling, the supporting structure 320 is partially contacted with the two ends of the circuit board 200, so as to better compress the circuit board 200 and provide support for the heat sink 300, thereby preventing the heat sink 300 from being inclined, ensuring the accuracy of the mounting positions of the heat sink 300, the heat conducting substrate 400 and the circuit board 200, ensuring the reliability of connection, and improving the product quality.

Fig. 4 is the schematic diagram of the circuit board of the embodiment of the present invention, the circuit board 200 is a rectangle, for example, and its inner surface is provided with multiple components (including power devices), the outer surface of the circuit board 200 is provided with a heat conducting substrate 400, the heat conducting substrate 400 is arranged relatively to the power devices of its inner surface, specifically, the heat conducting substrate 400 is, for example, two strip-shaped structures made of metal aluminum in this diagram, the heat conducting substrate 400 is attached to the outer surface of the circuit board 200, the power devices of this embodiment are attached into two rows, and the heat conducting substrate 400 is also divided into two blocks correspondingly, without being limited thereto, the size, the number, and the position of the heat conducting substrate 400 can be set according to the position of the power devices. As long as the projection of the heat conductive substrate 400 on the front surface of the circuit board 200 is ensured to cover the power device. A side edge of the circuit board 200 is provided with a connection terminal 210 for connection with the outside.

Fig. 5 the utility model discloses the schematic diagram of the casing, it is visible to be designed with two-layer step face in the opening 110 of this casing 100 in the drawing, be used for supporting circuit board 200 and dodge fin 300 respectively, specifically, be provided with spliced pole 140 and rib 120 in the opening 110 of casing 100, the terminal surface of rib 120 and the terminal surface parallel and level of spliced pole 140, first step face is constituteed for example to terminal surface between them, a support is provided for circuit board 200, spliced pole 140 is for example 4, set up respectively at four angles of opening 110, rib 120 can be a plurality of, be located opening 110, rib 120 sets up on casing 100 inside wall all around, with better provide the support for circuit board 200. Since the width of heat sink 300 (the dimension in the extending direction of heat dissipating ribs 310) is slightly larger than the width of circuit board 200, in order to avoid heat sink 300; in the opening 110, the two side edges of the housing 100 further have second steps 130, the size of the second steps 130 is matched with the size of the heat sink 300, for example, so that the heat sink 300 is at least partially inserted into the opening 110, further, the size of the circuit board 200 is slightly smaller than the size of the heat sink 300, the size of the circuit board 200 is also smaller than the size of the opening 110, so that the circuit board 200 can be disposed in the opening 110, and then the heat sink 300 connected with the outer surface of the circuit board 200 is inserted into the opening 110, so as to realize the plugging of the opening 110, and the circuit board 200 in the opening 110 can be better protected while the aesthetic appearance is increased. The heat dissipation capability of the circuit board 200 is further enhanced, the right side wall of the housing 100 is provided with a rectangular groove 150 communicating with the outside, and the connection terminal 210 of the circuit board 200 can pass through the rectangular groove 150 so as to be electrically connected with the outside.

Fig. 6 is a schematic cross-sectional view of a controller according to an embodiment of the present invention, in order to show the connection of components more clearly, so that the controller is shown in an exploded view, a side surface of the housing 100 has an opening 110, the circuit board 200 and the heat sink 300 are sequentially placed from the opening 110, wherein the opening 110 has two layers of supporting surfaces, a first step surface formed by an end surface of the rib 120 (a surface facing the opening 110) and an end surface of the connecting column 140 is used for supporting the circuit board 200, the supporting structure 320 and the heat conducting substrate 400 on an inner surface of the heat sink 300 provide support for the heat sink 300, so that the heat sink 300 can be just embedded into the opening 110, the opening 110 is sealed, the external environment is prevented from affecting the internal circuit board 200, and the outer surface of the heat sink 300 is further provided with heat dissipating ribs 310 to increase a heat dissipating area. Specifically, the heat sink 300 and the circuit board 200 are both provided with a connecting hole, the connecting post 140 in the housing 100 corresponds to the connecting holes on the heat sink 300 and the circuit board 200, the connecting post 140 is provided with a connecting hole, and after the components are placed in place, the components are fixed by sequentially penetrating the connecting holes of the components and screwing into the connecting post by using self-tapping screws. Of course, the above-mentioned components may be connected by using an adhesive such as glue, but for the convenience of later maintenance inspection and component replacement, it is preferable to use a connection method such as a screw that can be repeatedly fixed and connected.

Further, because many components are disposed on the circuit board 200, the surface of the circuit board cannot be completely flat, so that power devices and the like need to be intensively and flatly designed in a partial area of the inner surface of the circuit board 200, the outer surface of the circuit board 200 is provided with the heat conducting substrate 400, the circuit board 200 is in contact with the inner surface of the heat sink 300 through the heat conducting substrate 400, the heat conducting substrate 400 can be made of metal with good heat conducting performance, such as aluminum or copper, and the heat conducting substrate 400 has a certain thickness, so that a certain distance is reserved between the area of the inner surface of the heat sink 300, which is not in contact with the heat conducting substrate 400, and the circuit board 200, thereby avoiding possible interference between the components on the circuit board 200 and the heat sink 300, facilitating increase of air circulation, enhancing of heat dissipation capacity, and preventing short circuit phenomenon.

The support structure 320 disposed on the inner surface of the heat sink 300 makes the inner surface of the heat sink 300 have a U-shaped structure, which enables the inner surface of the heat sink 300 to make good contact with the heat conductive substrate 400, thereby preventing the heat conductive substrate 400 and the heat sink 300 from generating a gap due to the skew caused by the inconsistent torsion of the screws at the four corners, which affects the heat dissipation.

Further, the size of the heat conducting substrate 400 is not greater than the size of the circuit board 200, the thickness of the heat conducting substrate 400 is the same as the height of the supporting structure 320 on the inner surface of the heat sink 300, the length of the heat sink 300 is the same as the length of the circuit board 200, but the width of the heat sink 300 is slightly greater than the width of the circuit board 200, and the positions of the heat sink 300 and the connecting hole of the circuit board 200 correspond, so that the housing 100 is provided with a second step surface on the outer side of the first step surface to avoid the heat sink 300; the height difference between the first step surface and the second step surface is the sum of the thickness of the heat-conducting substrate 400 and the thickness of the circuit board 200, so that the heat sink 300, the heat-conducting substrate 400 and the circuit board 200 can be tightly attached, and the assembly compactness and the heat dissipation capability of the heat sink can be ensured.

To sum up, the utility model provides a controller through the design to casing and fin, makes the fin have the function of heat dissipation and casing upper cover among the prior art concurrently, has reduced the quantity of controller spare part and has simplified the connection between each part, is showing the cost of manufacture and the assemble duration that have reduced the product, also is favorable to the maintenance work in product later stage. Through setting up power device in a side of circuit board to set up the heat conduction base plate at the opposite circuit board's of side, rethread heat conduction base plate links to each other with the fin, thereby on the fin that the heat guide area is bigger heat-sinking capability is stronger, because heat conduction base plate self just has certain heat-sinking capability, even the fin fails to paste tightly with heat conduction base plate, partial heat can also be given off to the heat conduction base plate, reduce the risk that power device burns out, and the heat conduction base plate subsides in this scheme adorn on the circuit and have certain thickness, need not to set up insulating gasket again, the controller assembly of this scheme is more convenient and more reliable.

It should be noted that, in the description of the present invention, the terms "first" and "second" are only used for convenience in describing different components, and are not to be construed as indicating or implying a sequential relationship, relative importance or implicitly indicating the number of technical features indicated.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A controller, comprising:

a housing;

a circuit board disposed in the housing;

wherein the heat conducting substrate is connected with at least partial region of the circuit board.

2. A control as claimed in claim 1, wherein the opposite sides of the inner surface of the heat sink are provided with support formations.

3. The controller of claim 2, wherein the support structure contacts both ends of the circuit board, the circuit board providing support for the heat sink.

4. The controller of claim 2, wherein an outer surface of the heat sink is provided with heat dissipating ribs that increase a heat dissipating area.

5. The controller of claim 2, wherein the support structure has a height that is the same as a thickness of the thermally conductive substrate.

6. The controller of claim 2, wherein at least one of the support structure and the thermally conductive substrate provides support for the heat sink.

7. The controller of claim 1, wherein the thermally conductive substrate is coupled to the circuit board by thermally conductive silicone grease.

8. The controller of claim 1, wherein the front side of the circuit board is provided with power devices, and the heat conducting substrate is disposed on the back side of the circuit board, the heat conducting substrate being disposed opposite the power devices.

9. The controller of claim 8, wherein the projection of the heat conducting substrate on the front surface of the circuit board covers the power devices, and the size, number and position of the heat conducting substrate are matched with the positions of the power devices.

10. The controller of claim 1, wherein the housing includes an opening, the circuit board being located in the opening, the heat sink being at least partially embedded in the opening.

11. The controller of claim 10, wherein the heat sink matches a size of the opening of the housing.

12. The controller of claim 10, wherein the opening of the housing includes a first step surface therein, the first step surface providing support for the circuit board.

13. The controller of claim 12, further comprising a second step surface within the opening of the housing, wherein a difference in height between the first step surface and the second step surface is no greater than a sum of a thickness of the thermally conductive substrate and a thickness of the circuit board.

14. The controller of claim 1, wherein the thermally conductive substrate is made of metal.

15. The controller of claim 12, wherein the housing, circuit board and heat sink are connected by a fastening device.

16. A control as claimed in claim 15, wherein a connecting post is provided within the opening, the connecting post having a first connecting aperture provided thereon.

17. The controller of claim 16, wherein a rib is disposed within the opening, the rib being disposed on an inner sidewall of the housing, the rib and the connection post providing the first stepped surface for supporting the circuit board.

18. The controller of claim 16, wherein said connecting column is located at an open corner within said housing.

19. The controller according to claim 18, wherein the circuit board and the heat sink are provided with second connecting holes, and the positions of the second connecting holes are matched with the connecting columns.

20. The controller of claim 19, wherein the securing means is a self-tapping screw that passes through a second connection on the heat sink and a second connection hole on the circuit board to connect with the first connection hole of the connection post.

21. The controller of claim 1, wherein the controller is a compressor controller.