CN108847145B - Double-heat-conducting-sheet clamping plate type LED display unit module - Google Patents
Double-heat-conducting-sheet clamping plate type LED display unit module Download PDFInfo
- Publication number
- CN108847145B CN108847145B CN201810997075.XA CN201810997075A CN108847145B CN 108847145 B CN108847145 B CN 108847145B CN 201810997075 A CN201810997075 A CN 201810997075A CN 108847145 B CN108847145 B CN 108847145B
- Authority
- CN
- China
- Prior art keywords
- heat conducting
- heat
- panel
- backboard
- led display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007789 sealing Methods 0.000 claims abstract description 81
- 239000000084 colloidal system Substances 0.000 claims abstract description 65
- 239000003292 glue Substances 0.000 claims description 47
- 230000002093 peripheral effect Effects 0.000 claims description 28
- 238000002347 injection Methods 0.000 claims description 22
- 239000007924 injection Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 230000009977 dual effect Effects 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 241000276425 Xiphophorus maculatus Species 0.000 claims 2
- 230000000694 effects Effects 0.000 description 13
- 239000007788 liquid Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000005855 radiation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000004146 energy storage Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 238000009957 hemming Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The invention relates to the technical field of LED display screens, in particular to a double-heat-conducting-sheet clamping plate type LED display unit module. The LED display lamp panel comprises a sealing colloid, a heat conducting panel, a heat conducting backboard, a heat conducting column and an LED display lamp panel which is composed of a circuit board, an IC chip and an LED luminous tube; the circuit board is overlapped and clamped between the heat conduction panel and the heat conduction backboard, the lamp body through hole is formed in the position, corresponding to the LED luminous tube, on the heat conduction panel, the heat conduction column penetrates through the heat conduction backboard and the circuit board and then is locked on the heat conduction panel, and the sealing colloid covers the heat conduction panel and at least covers the heat conduction panel and the LED display lamp board into a whole. According to the invention, the heat conduction panel and the heat conduction backboard form a double-layer heat conduction sheet for clamping the LED display lamp panel, and heat generated by direct sunlight and heat generated by the LED display lamp panel can be rapidly conducted and dissipated outwards under the cooperation of the heat conduction columns; meanwhile, the sealing colloid can be utilized to enhance the structural tightness of the whole module, and can also carry out secondary locking on the heat conduction panel, the LED display lamp panel and the heat conduction backboard, so that the stability of the module structure is ensured.
Description
Technical Field
The invention relates to the technical field of LED display screens, in particular to a double-heat-conducting-sheet clamping plate type LED display unit module.
Background
As is well known, the general process structure of the conventional LED display unit module is as follows: after the LED display lamp panel is arranged in the rubber shell, liquid sealant is filled into the rubber shell to encapsulate the LED display lamp panel in the rubber shell, and after the liquid sealant is solidified, the mask is arranged on the light-emitting side of the LED display lamp panel and is locked with the rubber shell into a whole, so that the finished LED display unit module is formed.
However, when the conventional LED display unit module is used in an outdoor environment (especially in an environment under sunlight), heat generated by solar insolation is accumulated in the sealing colloid on the front surface of the LED display panel because the sealing colloid and the plastic colloid forming the mask are poor heat conductors; meanwhile, the circuit board positioned at the back side of the LED is made of fiber materials and also belongs to a poor heat conductor, and heat generated by the lighted LED lamp (namely, the LED in a working state) is accumulated in the sealing glue body at the same time; based on this, the heat that sunshine insolated produced can overlap each other with the produced heat of LED lamp, and because whole module lacks the heat transfer and the structural channel that gives off, can make the inside temperature of sealed colloid rise sharply and with ambient temperature, show that the lamp plate luminance changes and lead to temperature change sharply, rise continuously under the continuous sunshine insolated and the continuous work of unit module, lead to unit module even outdoor LED display screen ubiquitous such as lamp body temperature is too high, the temperature rise is uncontrollable by high temperature, then bring dead lamp rate increase, the light decay phenomenon is serious, the display module deformation, a great deal of problem such as trouble frequently of trouble, this is the outdoor display screen trade of LED many years existence of the inequality.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a double-heat-conducting-sheet clamping plate type LED display unit module.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the double-heat-conducting-sheet clamping plate type LED display unit module comprises an LED display lamp panel, wherein the LED display lamp panel comprises a circuit board, an IC chip and a plurality of LED luminous tubes, wherein the IC chip is attached to the rear surface of the circuit board, and the LED luminous tubes are attached to the front surface of the circuit board and distributed in an array manner;
the LED display lamp panel comprises a circuit board, a heat conducting panel, a heat conducting backboard and a plurality of heat conducting columns, wherein the circuit board is overlapped and clamped between the heat conducting panel and the heat conducting backboard, a lamp body through hole for the LED to penetrate through is formed in the heat conducting panel and at the position corresponding to each LED, the front end part of each heat conducting column penetrates through the heat conducting backboard and the circuit board sequentially and is then locked on the heat conducting panel, and the heat conducting panel is covered by the heat conducting colloid and at least covered with the heat conducting panel and the LED display lamp panel into a whole.
Preferably, a first protruding rib is arranged on the heat conducting panel and at a position corresponding to each heat conducting column, a protruding surface of the first protruding rib is located on the front surface side of the circuit board, and the front end part of each heat conducting column is locked on the first protruding rib.
Preferably, the heat conducting column comprises a nut part abutting against the rear surface side of the heat conducting backboard, a guide post part axially extending from the central area of the nut part and then forming and simultaneously penetrating through the heat conducting backboard and the circuit board, and a thread part axially extending from the front end of the guide post part and then forming and locking on the first raised rib position; the length of the guide post part is not smaller than the sum of the thickness of the circuit board and the thickness of the heat conducting backboard, the front end surface of the guide post part is propped against the convex surface of the first convex rib, and the diameter of the thread part is smaller than the diameter of the guide post part.
Preferably, a lamp point convex rib is arranged on the heat conduction panel and located on the side of each lamp body via hole.
Preferably, the front surface of the sealing colloid is a pitted surface and/or the front surface of the sealing colloid is provided with anti-reflection lines for covering the lamp point convex ribs distributed in rows or lines into a whole.
Preferably, the circuit board is further provided with a plurality of heat conduction copper columns penetrating through the circuit board, and the rear end faces of the heat conduction copper columns are propped against the heat conduction backboard.
Preferably, a second protruding rib position for accommodating the IC chip is arranged on the heat conducting backboard, a protruding surface of the second protruding rib position is located at the rear surface side of the heat conducting backboard, and a plurality of external fixing nuts which are distributed in an array manner are arranged on the protruding surface of the second protruding rib position.
Preferably, a first colloid sealing line which is coated on the peripheral surface of the external fixing nut and distributed along an annular path formed by connecting a plurality of external fixing nuts end to end is arranged on the rear surface of the heat conducting backboard.
Preferably, a plurality of opposite internal fixation nuts which are distributed in an array manner are arranged on the rear surface of the heat conduction backboard and are positioned in the surrounding area of the first colloid sealing line, and a second colloid sealing line which is used for coating the peripheral surface of the opposite internal fixation nuts and is distributed along an annular path formed by connecting the opposite internal fixation nuts end to end is arranged on the rear surface of the heat conduction backboard;
the heat conducting backboard is characterized by further comprising a wiring terminal box which is locked on the heat conducting backboard through an internal fixing nut, wherein the wiring terminal box at least comprises a heat conducting bottom plate which is overlapped on the heat conducting backboard and a box body which is assembled with the heat conducting bottom plate into a whole, and a radiating fin is arranged on the front surface of the box body.
Preferably, the sealing glue further comprises a plurality of glue injection tenons which penetrate through the side of the heat conducting panel and the side of the circuit board at the same time, the sealing glue comprises a main body area part covered on the heat conducting panel and a peripheral wall part formed on the periphery of the main body area part and at least covering the side of the heat conducting panel and the side of the circuit board at the same time, and the peripheral wall part is provided with a glue tenon protrusion filled in the glue injection tenons.
Preferably, the glue injection rabbet also penetrates through the side of the heat conducting backboard, the peripheral wall part simultaneously covers the side of the heat conducting panel, the side of the circuit board and the side of the heat conducting backboard, and the sealing colloid also comprises a back side edge covering part which is formed on the back side of the peripheral wall part and covers the edge of the back surface of the heat conducting backboard;
preferably, the heat conducting post structure further comprises glue injection through holes which penetrate through the heat conducting panel, the circuit board and the heat conducting backboard at the same time and are distributed around each heat conducting post, and a heat conducting post end surface coating part which is connected with the sealing glue body through the glue injection through holes into a whole and coats the back ends of the heat conducting posts.
Preferably, the heat conducting panel and/or the heat conducting backboard is a plate-shaped structure body formed by stamping an aluminum plate and the surface of which is treated by an anodic oxidation process and a blackening process; the heat conducting column is a copper structure body.
By adopting the scheme, the double-layer heat conducting fin for clamping the LED display lamp panel is formed by the heat conducting panel and the heat conducting backboard, and the heat generated by direct sunlight and the heat generated by the LED display lamp panel can be rapidly conducted and radiated under the cooperation of the heat conducting columns, so that a series of problems caused by poor radiation or incapability of radiating the display unit module under the traditional process structure are effectively avoided; meanwhile, the structural tightness of the whole module can be enhanced by utilizing the sealing colloid, and the heat conduction panel, the LED display lamp panel and the heat conduction backboard can be secondarily locked in a riveting mode equivalent to an adhesive tape, so that the stability of the module structure is ensured.
Drawings
FIG. 1 is a schematic plan view of an embodiment of the present invention;
FIG. 2 is a schematic rear plan view of an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of the structure of FIG. 2 in the direction A-A;
FIG. 4 is a schematic cross-sectional view of the B-B direction of FIG. 2;
FIG. 5 is an enlarged schematic view of a partial structure of an embodiment of the present invention in an exploded state;
FIG. 6 is an enlarged schematic view of a part of the sealing gel of FIG. 5;
FIG. 7 is an exploded view of an embodiment of the present invention;
FIG. 8 is an enlarged schematic view of the partial structure of the area A in FIG. 7;
FIG. 9 is an exploded view of the seal assembly according to the present invention after simplified treatment;
in the figure:
a. a lamp body via hole; b1, guide post via holes; b2, guide post via holes; c. injecting glue tenon;
10. LED display lamp panel; 11. a circuit board; 12. an IC chip; 13. an LED luminous tube; 20. sealing colloid; 21. a main body surface area portion; 22. a peripheral wall portion; 23. a colloid tenon protrusion; 24. a backside hemming portion; 25. a heat conduction column end surface coating part; 26. a cambered surface bulge; 27. anti-reflection lines; 28. stripe lines; 30. a thermally conductive panel; 31. the first raised rib position; 32. convex rib positions of the lamp points; 40. a thermally conductive backplate; 41. the second raised rib position; 42. an external fixing nut; 43. a first colloid sealing line; 44. an internal fixing nut; 45. a second colloid sealing line; 50. a heat conducting column; 51. a nut portion; 52. a guide post section; 53. a thread part; 60. a terminal block; 61. a thermally conductive base plate; 62. a case body; 63. a heat radiation fin; 64. energy storage battery + super capacitor.
Detailed Description
Embodiments of the invention are described in detail below with reference to the attached drawings, but the invention can be implemented in a number of different ways, which are defined and covered by the claims.
As shown in fig. 1 to 9, the dual heat conducting fin clamping plate type LED display unit module provided in this embodiment includes an LED display lamp panel 10, a sealing gel 20 (which may be made of colored transparent liquid silica gel according to specific situations and molded by a glue injection mold of a glue injection machine), a heat conducting panel 30, a heat conducting back plate 40 and a plurality of heat conducting columns 50; the LED display lamp panel 10 comprises a circuit board 11, an IC chip 12 attached to the rear surface of the circuit board 11 and a plurality of LED luminous tubes 13 attached to the front surface of the circuit board 11 and distributed in an array; the circuit board 11 is overlapped and clamped between the heat conducting panel 30 and the heat conducting backboard 40, a lamp body via hole a for the LED 13 to penetrate and distribute is formed in the heat conducting panel 30 at a position corresponding to each LED 13, the front end part of the heat conducting column 50 penetrates through the heat conducting backboard 40 and the circuit board 11 sequentially and then is locked on the heat conducting panel 30, and meanwhile, the sealing colloid 20 covers the heat conducting panel 30 and at least covers the heat conducting panel 30 and the LED display lamp board 10 into a whole; the heat conductive panel 30 and the heat conductive back plate 40 of the present embodiment may be formed by machining a material plate with good heat conductive properties, such as a metal plate of aluminum or the like, according to practical situations.
The LED display unit module of the embodiment uses the heat conduction panel 30 and the heat conduction backboard 40 to clamp the LED display lamp panel 10 in a stacked manner, and locks and fixes the LED display lamp panel 10, the heat conduction panel 30 and the heat conduction backboard 40 through the connection relationship between the heat conduction post 50 and the heat conduction panel 30, so that the whole module forms a combined sandwich structure with the LED display lamp panel 10 in the middle and the heat conduction panel 30 and the heat conduction backboard 40 positioned at the front side and the rear side of the LED display lamp panel 10; meanwhile, the front surface area of the heat conduction panel 30, the peripheral surface area of the LED display lamp panel 10, the peripheral surface area of the heat conduction panel 30 and even the peripheral surface area of the heat conduction backboard 40 are covered and coated by the sealing colloid 20; from this for whole module has following beneficial effect, specifically:
1. in practical application (especially in outdoor environment), the heat conducting panel 30, the heat conducting backboard 40 and the heat conducting column 50 form a carrier for conducting heat and dissipating heat generated by direct solar radiation and heat generated by the LED display lamp panel 10 during operation; the heat conducting panel 30 is wrapped in the sealing colloid 20, so that the heat absorbed and accumulated by the heat conducting panel 30 is conducted on the heat conducting panel 30 in a balanced manner, and then conducted to the heat conducting backboard 40 through the heat conducting post 50, and finally emitted to the outside of the module by utilizing the structural characteristics that the large area surface area of the heat conducting backboard 40 is exposed to the sealing colloid 20; the heat conducting backboard 40 is tightly attached to the back side of the circuit board 11 and the IC chip 12, so that the heat generated by the LED display lamp panel 10 can be directly emitted to the outside of the module by the heat conducting backboard 40 synchronously; therefore, the module has good internal heat conduction capacity and external heat dissipation capacity, and conditions are created for reducing the dead lamp rate, light attenuation and failure frequency of the module and enhancing the controllability of the temperature rise of the module.
2. After the LED display lamp panel 10 is locked between the heat conduction panel 30 and the heat conduction backboard 40, the flatness and rigidity of the structure of the heat conduction panel 30 and the heat conduction backboard 40 can be greatly enhanced due to the mutually overlapped structural characteristics of the three, and the flatness and rigidity of the whole module can be greatly enhanced.
3. The sealing colloid 20 can be formed by injecting, cooling and solidifying colored transparent liquid silica gel, and by utilizing the structural characteristics of the sealing colloid 20 for covering or cladding related parts and areas, not only can the waterproof, dustproof and other sealing performances of the module be effectively enhanced, but also the solidified sealing colloid 20 can carry out secondary locking on the LED display lamp panel 10, the heat conduction panel 30 and the heat conduction backboard 40, thereby being matched with the heat conduction column 50 to complete the reinforcement of the structural stability of the whole module.
In order to ensure structural stability of the heat-conducting columns 50 and the heat-conducting panel 30 after connection, a first protruding rib 31 is disposed on the heat-conducting panel 30 at a position corresponding to each heat-conducting column 50 (when the heat-conducting panel 30 is made of a material plate with a certain rigidity, such as a metal plate, the first protruding rib 31 can be formed by stamping in the direction of the circuit board 11 by using a stamping process), the protruding surface of the first protruding rib 31 is located on the front surface side of the circuit board 11, and the front end of the heat-conducting column 50 is locked on the central area of the first protruding rib 31. Thus, the first protruding rib 31 provides a structural space for the heat conducting post 50 to be locked on the heat conducting panel 30.
In view of the material characteristics of the circuit board 11, such as fiber materials, and the specificity of the circuit board 11 in the whole module, in order to prevent the circuit board 11 from being damaged due to the pressing force generated after the heat-conducting post 50 is locked, the heat-conducting post 50 of the present embodiment may be configured with reference to the structure of the hardware connection member, such as a screw, a bolt or a screw rod, that is: the heat conducting post comprises a nut part 51, a guide post part 52 and a thread part 53, wherein the nut part 51 is used for carrying out rotary operation on the whole heat conducting post 50 and is abutted against the rear surface side of the heat conducting back plate 40, the guide post part 52 is axially extended from the central area of the nut part 51 and then formed and simultaneously penetrates through the heat conducting back plate 40 and the circuit board 11, and the thread part 53 is axially extended from the front end of the guide post part 52 and then formed and locked on the first raised rib position 31; the length of the guide post 52 is not less than the sum of the thickness of the circuit board 11 and the thickness of the heat-conducting back plate 40 (of course, preferably, the length of the guide post 52 is equal to the sum of the thicknesses of the circuit board 11 and the heat-conducting back plate 40), and the diameter of the wire teeth 53 is smaller than the diameter of the guide post 52, so that the whole heat-conducting post 50 forms a cylindrical structure similar to that of which the front end has a wire tooth structure and the main body part presents a smooth circumferential surface and an integral positive step. When the LED display lamp panel 10, the heat-conducting panel 30 and the heat-conducting back plate 40 are assembled in a locking manner, the circuit board 11 and the heat-conducting back plate 40 may be provided with guide post vias b1 and b2 (preferably, the guide post via b1 and the guide post via b2 have the same inner diameters) for the guide post portion 52 to pass through, and the center of the first raised rib 31 is provided with a guide post via b3 for locking the wire tooth portion 53. Therefore, after the wire tooth portion 53 is locked on the first protruding rib portion 31, the front end surface of the guide pillar portion 52 (i.e. the transition surface between the guide pillar portion 52 and the wire tooth portion 53) will be abutted against the protruding surface of the first protruding rib portion 31, the nut portion 51 will be abutted against the back surface of the heat conducting back plate 40, the front-to-back pulling force generated by the heat conducting post 50 will act on the guide pillar portion 52 through the first protruding rib portion 31, and the back-to-front pulling force will directly act on the heat conducting back plate 40 through the nut portion 51, so that the point-to-point force applied by the heat conducting post 50 is converted into the area force applied to the circuit board 11 (i.e. the area clamping force) by the heat conducting back plate 40, thereby avoiding the problem that the circuit board 11 is easily damaged due to the direct local force applied to the circuit board 11 by the heat conducting post 50.
In order to enhance the display effect of the module, a lamp point convex rib position 32 is arranged on the front surface of the heat conduction panel 30 and positioned at the side of each lamp body via hole a, and the lamp point convex rib position 32 can be directly formed in the process of opening the lamp body via holes a of the heat conduction panel 30 (such as in the process of stamping forming); therefore, the lamp point convex rib 32 can not only form a sunshade bulge at the side of each LED 13 to improve the contrast of the whole module by shielding sunlight, but also perform glue injection coating and form the sealing colloid 20, and the lamp point convex rib 32 can play a role of reinforcing ribs in the sealing colloid 20, so that damage to the LED 13 caused by frontal impact is effectively slowed down.
In order to further enhance the display effect of the module, the front surface of the sealing colloid 20 of the present embodiment may adopt an arc-shaped pitted surface structure formed by raised particles (such as forming arc-shaped protrusions 26 in the corresponding regions of each LED light emitting tube 13 and/or providing stripe lines 28 on the front surface thereof) and/or an anti-reflection line 27 (the arrangement form thereof may adopt continuously covering the lamp point raised rib positions 32 distributed in rows or columns so as to form a plurality of lines), so that the light incident from the outside can be diffusely reflected by the arc-shaped protrusions 26, the stripe lines 28 and/or the anti-reflection line 27 to prevent the reflection of the module surface, thereby enhancing the display effect of the module.
In order to ensure that the heat generated by the LED light emitting tube 13 can be rapidly dissipated outwards through the heat conducting backboard 40, a plurality of heat conducting copper posts (not shown in the figure, the positions and the number of the heat conducting copper posts can be distributed according to the number and the arrangement relation of the LED light emitting tubes 13, for example, the heat conducting copper posts are arranged in the central area of the array area formed by the plurality of LED light emitting tubes 13) penetrating through the circuit board 11 are further arranged on the circuit board 11, the rear end face of each heat conducting copper post is propped against the heat conducting backboard 40, and the front end face of each heat conducting copper post can be propped against the bottom face of one LED light emitting tube 13 in a certain array area. Therefore, the heat collected by the circuit board 11, and even the heat generated by the LED 13, can be quickly conducted to the heat conducting backboard 40 by the heat conducting copper column, so that the heat conducting backboard 40 is utilized to quickly dissipate heat.
The IC chip 12 is used as one of the main heat sources in the LED display lamp panel 10, in order to further enhance the heat conduction and heat dissipation effect on the LED display lamp panel 10, a second protruding rib 41 for accommodating the IC chip 12 is arranged on the heat conduction backboard 40, which can be formed by punching the heat conduction backboard 40 such as a metal plate), so that the protruding surface of the second protruding rib 41 is located at the rear surface side of the heat conduction backboard 40, thereby providing a structural space for placing the IC chip 12 by using the second protruding rib 41 and enabling the IC chip 12 to cling to the front surface of the second protruding rib 41, and further achieving the purpose of rapid heat conduction and heat dissipation by using the direct contact between the IC chip 12 and the heat conduction backboard 40; meanwhile, a plurality of external fixing nuts 42 which are distributed in an array manner are arranged on the convex surface of the second convex rib position 41, so that the whole module and the display screen box body can be locked by using the external locking nuts 42; of course, it should be noted that: the second protruding rib positions 41 in the present embodiment do not need to be in one-to-one correspondence with the IC chips 12, and may be arranged according to a certain annular path, for example, in a shape similar to a "back" shape, and at this time, the IC chips 12 may be distributed on the circuit board 11 according to a rectangular regular array and embedded in the second protruding rib positions 41, so as to provide conditions for setting the external fixing nuts 42 and assembling the whole module in the display screen box.
In order to enhance the compactness of the assembled structure of the whole module and the display screen box and achieve the sealing effect of the connecting gap between the two, a first colloid sealing wire 43 which is coated on the peripheral surface of the external fixing nut 42 and distributed along an annular path formed by connecting a plurality of external fixing nuts 42 end to end (can also be understood as being distributed along the outline shape of the first raised rib position 41) is arranged on the rear surface of the heat conducting backboard 40, and the first colloid sealing wire 43 can be synchronously molded through the selection of related molds or the arrangement of the structures of the module itself (such as setting corresponding glue injecting via hole structures on the heat conducting panel 30, the circuit board 11 and the heat conducting backboard 40). Therefore, the first glue sealing wire 43 not only can wrap the external fixing nut 42 to prevent the external fixing nut 42 from being corroded by external factors, but also can squeeze the first glue sealing wire 43 after the external fixing nut 42 and the display screen box body are fixed, so that the first glue sealing wire 43 has sealing effects such as water resistance and dust resistance.
In order to further provide an assembly space for relevant components (such as components playing a role of terminal connection or control, etc.), a plurality of opposite internal fixing nuts 44 (which can be arranged in a rectangular array manner) distributed in an array manner are further arranged on the rear surface of the heat conducting backboard 40 and located in the enclosing surface of the first colloid sealing line 43, and meanwhile, a second colloid sealing line 45 which is used for wrapping the peripheral surface of the opposite internal fixing nuts 44 and is distributed along an annular path formed by connecting the opposite internal fixing nuts 44 end to end is arranged on the rear surface of the heat conducting backboard 40; meanwhile, the module of the embodiment further includes a terminal box 60 locked on the heat-conducting back plate 40 by the internal fixing nut 44, and the terminal box 60 includes at least a heat-conducting bottom plate 61 stacked on the heat-conducting back plate 40 and a box body 62 assembled with the heat-conducting bottom plate 61 into a whole, and a heat dissipation fin 63 is disposed on the outer front surface of the box body 62 (of course, components such as an energy storage battery+super capacitor 64 and a connection terminal can be disposed in the terminal box 60 according to practical situations); the second glue sealing line 45 may be formed by referring to the first glue sealing line 43. In this way, the inner fixing nut 44 is effectively prevented from being corroded by external factors by wrapping the inner fixing nut 44 with the second colloid sealing wire 45, and meanwhile, the sealing effect on the structural gap between the terminal box 60 and the heat conducting backboard 40 can be achieved by the extrusion effect of the terminal box 60 (especially the box body 62) on the second colloid sealing wire 45, so that water, dust and the like are prevented from entering the terminal box 60; in addition, through the contact relation between the heat conducting bottom plate 61 and the heat conducting back plate 40 and the connection relation between the internal fixing nut 44 and the heat conducting back plate 40, the heat accumulated on the heat conducting back plate 40 can be quickly conducted to the box body 62, and further, the heat dissipation fins 63 are utilized to effectively conduct air convection, so that the rapid heat dissipation of the module is realized.
In order to optimize the structure of the whole module to the maximum extent, the display module of the present embodiment further includes a plurality of glue injection tenons c (which may be inverted V-shaped or dovetail-shaped according to practical situations) that penetrate through the side of the heat conducting panel 30 and the side of the circuit board 11 at the same time, and the sealing glue 20 includes a main body area portion 21 covering the heat conducting panel 30 and a peripheral wall portion 22 formed on the periphery of the main body area portion 21 and covering at least the side of the heat conducting panel 30 and the side of the circuit board 11 at the same time, and a glue tenon protrusion 23 filled in the glue injection tenons c is formed on the peripheral wall portion 22. Therefore, in the process of forming the sealing colloid 20 by injecting the raw materials such as liquid silica gel, the liquid raw materials are synchronously filled in the glue injection rabbet c to form the colloid rabbet convex part 23 and the peripheral surrounding wall part 22 in the process of filling and covering the heat conduction panel 30 and the LED luminous tube 13, so that the sealing colloid 20 is utilized to cover and cover the front surface and the peripheral side surface of the module, the sealing effect is achieved, and the heat conduction panel 30, the LED display lamp panel 10 and the heat conduction backboard 40 can be effectively reinforced.
The heat-conducting back plate 40 of the present embodiment may take different structural forms according to practical situations, such as a plate-like structure without peripheral walls or a shell-like structure with peripheral walls; preferably, the heat-conducting back plate 40 of the present embodiment adopts a plate-shaped structure without peripheral walls, at this time, the glue injection rabbet c is required to penetrate through the side of the heat-conducting back plate 40, and the peripheral wall 22 covers the side of the heat-conducting panel 30, the side of the circuit board 11 and the side of the heat-conducting back plate 40 at the same time, and in the process of forming the sealing glue 20 by glue injection, the back-side edge-covering portion 24 can be formed at the edge of the back surface of the heat-conducting back plate 40 at the same time by using the glue injection rabbet c (i.e. the sealing glue 20 includes the back-side edge-covering portion 24), and the back-side edge-covering portion 24 is connected with the back side of the peripheral wall 22 as a whole. Therefore, the sealing colloid 20 can form a covering and cladding structure on the edges of the front surface, the peripheral wall surface and the rear surface of the module, so that the rear surface of the heat conducting backboard 40 has enough exposed surface area while ensuring the structural stability and the tightness of the whole module, and conditions are provided for good heat dissipation of the module.
In order to further enhance the performance of the whole module, the display module of the present embodiment further includes glue injection vias (not shown in the figure) that penetrate through the heat conducting panel 30, the circuit board 11 and the heat conducting back plate 40 at the same time and are distributed around each heat conducting post 50, and during the process of glue injection molding of the sealing glue 20, the liquid glue flows to the back surface side of the heat conducting back plate 40 through the glue injection vias and finally forms the heat conducting post end surface coating portion 25 that fills in the glue injection vias and covers the back ends of the heat conducting posts 50. Thus, the heat conduction column 50 is encapsulated by molding the thickness and width of the heat conduction column end surface coating portion 25 by a mold and covering the heat conduction column 50, thereby preventing the heat conduction column 50 from being corroded by the outside air. Of course, when the heat-conducting columns 50 are actually arranged, they can be arranged along the contour side of the module, the contour path of the second colloid sealing line 45 and the contour path of the first colloid sealing line 43, so that the heat-conducting column end surface coating portion 25, the second colloid sealing line 45 and the first colloid sealing line 43 which are integrally connected with the sealing colloid 20 can be directly formed on the heat-conducting back plate 40 through the glue injection via hole in the process of glue injection molding of the sealing colloid 20, or the second colloid sealing line 45 or the first colloid sealing line 43 can be directly utilized as the heat-conducting column end surface coating portion 25.
In addition, to enhance the performance of the whole module to the greatest extent, the heat-conducting panel 30 and/or the heat-conducting back plate 40 of the present embodiment may be a plate-shaped structure formed by stamping an aluminum plate, and the surface of which is treated by an anodic oxidation process and a blackening process; and the heat conductive pillars 50 are preferably copper structures. Therefore, the heat conducting panel 30 and the heat conducting backboard 40 have heat conducting and non-conducting properties, and the copper heat conducting column 50 is beneficial to conducting heat between the heat conducting panel 30 and the heat conducting backboard 40.
In summary, the LED display unit module of this embodiment effectively solves the aeipathia existing in the LED outdoor display screen industry for many years through the improvement of the process structure, specifically:
1. the heat conducting panel 30 and the heat conducting backboard 40 which are manufactured by using metal materials such as aluminum are equivalent to the bimetal heat conducting sheet for clamping the LED display lamp panel 10, and the LED display lamp panel 10 and even the whole module have good flatness and enhanced rigidity due to the mutual superposition structural arrangement mode of the three materials; meanwhile, the bimetal heat conducting fins are locked through a certain number of regularly distributed heat conducting columns 50, so that the whole module has good internal heat conducting capacity, and also has enough heat radiating surface area to the outside, a structural channel is provided for heat radiation of the module, and a series of problems of poor heat radiation or incapability of heat radiation of the display unit module in the traditional process structure are effectively avoided.
2. Utilize the protruding muscle position 32 of lamp point that sets up on heat conduction panel 30, not only can play the effect that shelters from sunshine in order to promote the module and show contrast, because it is inside sealed colloid 20 that it encapsulates moreover, also played the effect of inside strengthening rib, can effectively slow down the damage of mechanical damage that front impact LED lamp point caused, eradicated the easy perk of current plastic display module plastic face guard and warp, fragile defect.
3. The structural characteristics of pitted surfaces, grains, ribs and the like of the sealing colloid 20 formed by injecting and curing the liquid sizing material such as the colored transparent silica gel and the like can be utilized, so that the light emitting and displaying effects of the module can be effectively improved; the end surface coating part 25 of the heat conducting column, the second colloid sealing line 45, the first colloid sealing line 43 and the like formed by glue filling or glue injection are equivalent to riveting the bimetallic strip and the LED display lamp panel 10 by a plurality of glue columns by using glue for the second time, so that the whole module has higher strength and better sealing performance, and especially, the second colloid sealing line 45 and the first colloid sealing line 43 are equivalent to forming a soft colloid sealing line on the heat conducting backboard 40, which can play a role in closing and sealing when the module is assembled, and the sealing waterproof effect of the module assembly is further improved.
4. The space enclosed by the second glue sealing wire 45 and the pair of internal fixing nuts 44 on the back side of the heat conducting back plate 40 provides a sealing space for external connection data wires, power wires and the like of the LED display unit module.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.
Claims (9)
1. The double-heat-conducting-sheet clamping plate type LED display unit module comprises an LED display lamp panel, wherein the LED display lamp panel comprises a circuit board, an IC chip and a plurality of LED luminous tubes, wherein the IC chip is attached to the rear surface of the circuit board, and the LED luminous tubes are attached to the front surface of the circuit board and distributed in an array manner; the method is characterized in that:
the LED display lamp panel comprises a circuit board, a heat conducting panel, a heat conducting backboard and a plurality of heat conducting columns, wherein the circuit board is overlapped and clamped between the heat conducting panel and the heat conducting backboard, a lamp body through hole for the LED to penetrate and distribute is formed in the heat conducting panel at a position corresponding to each LED, the front end part of each heat conducting column penetrates through the heat conducting backboard and the circuit board in sequence and is then locked on the heat conducting panel, and the heat conducting panel is covered by the heat conducting colloid and at least covered by the heat conducting colloid and the LED display lamp panel into a whole;
the heat conduction column comprises a nut part, a guide column part and a thread part, wherein the nut part is abutted against the rear surface side of the heat conduction backboard, the guide column part is axially extended from the central area of the nut part, is formed and simultaneously penetrates through the heat conduction backboard and the circuit board, and the thread part is axially extended from the front end of the guide column part, is formed and locked on the first raised rib; the length of the guide post part is not less than the sum of the thickness of the circuit board and the thickness of the heat conducting backboard, the front end surface of the guide post part is propped against the convex surface of the first convex rib, and the diameter of the wire tooth part is smaller than the diameter of the guide post part;
the heat conducting backboard is provided with a second protruding rib position for accommodating the IC chip, the protruding surface of the second protruding rib position is positioned on the rear surface side of the heat conducting backboard, and the protruding surface of the second protruding rib position is provided with a plurality of external fixing nuts which are distributed in an array manner;
the back surface of the heat conduction backboard is provided with a first colloid sealing line which is coated on the peripheral surface of the external fixing nut and distributed along an annular path formed by connecting a plurality of external fixing nuts end to end;
the back surface of the heat conduction backboard is also provided with a plurality of opposite internal fixing nuts which are distributed in an array manner and are positioned in the surrounding area of the first colloid sealing line, and the back surface of the heat conduction backboard is provided with a second colloid sealing line which is used for coating the peripheral surface of the opposite internal fixing nuts and is distributed along an annular path formed by connecting the opposite internal fixing nuts end to end;
the heat conducting backboard is characterized by further comprising a wiring terminal box which is locked on the heat conducting backboard through an internal fixing nut, wherein the wiring terminal box at least comprises a heat conducting bottom plate which is overlapped on the heat conducting backboard and a box body which is assembled with the heat conducting bottom plate into a whole, and a radiating fin is arranged on the front surface of the box body.
2. The dual thermally conductive sheet clip type LED display unit module of claim 1, wherein: the heat conducting panel is provided with first protruding rib positions at positions corresponding to each heat conducting column, the protruding faces of the first protruding rib positions are located on the front surface side of the circuit board, and the front end parts of the heat conducting columns are locked on the first protruding rib positions.
3. The dual thermally conductive sheet clip type LED display unit module of claim 1, wherein: the side of each lamp body via hole is provided with a lamp point convex rib.
4. A dual thermally conductive sheet clip type LED display unit module as set forth in claim 3, wherein: the front surface of the sealing colloid is pitted surface and/or the front surface of the sealing colloid is provided with anti-reflection lines for covering the lamp point convex ribs distributed in rows or lines into a whole.
5. The dual thermally conductive sheet clip type LED display unit module of claim 1, wherein: the circuit board is also provided with a plurality of heat conduction copper columns which penetrate through the circuit board and are distributed, and the rear end surfaces of the heat conduction copper columns are propped against the heat conduction backboard.
6. The dual thermally conductive sheet clip type LED display unit module of claim 1, wherein: the sealing colloid comprises a main body area part covered on the heat-conducting panel and a peripheral wall part formed on the periphery of the main body area part and at least coating the side of the heat-conducting panel and the side of the circuit board, and colloid tenon convex parts filled in the colloid tenon openings are formed on the peripheral wall part.
7. The dual thermally conductive sheet clip type LED display unit module of claim 6, wherein: the glue injection rabbet also penetrates through the side distribution of the heat conduction backboard, the peripheral wall part simultaneously coats the side of the heat conduction panel, the side of the circuit board and the side of the heat conduction backboard, and the sealing colloid also comprises a back side edge coating part which is formed on the rear side of the peripheral wall part and coats the rear surface edge of the heat conduction backboard.
8. The dual thermally conductive sheet clip type LED display unit module of claim 1, wherein: the heat conducting column structure further comprises glue injection through holes which penetrate through the heat conducting panel, the circuit board and the heat conducting backboard at the same time and are distributed around each heat conducting column, and heat conducting column end face coating parts which are connected with the sealing glue body into a whole through the glue injection through holes and coat the back ends of the heat conducting columns.
9. The dual thermally conductive sheet clip-on LED display unit module of any one of claims 1-8, wherein: the heat conducting panel and/or the heat conducting backboard are/is a platy structure body formed after an aluminum plate is stamped, and the surface of the platy structure body is treated by an anodic oxidation process and a blackening process; the heat conducting column is a copper structure body.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810997075.XA CN108847145B (en) | 2018-08-29 | 2018-08-29 | Double-heat-conducting-sheet clamping plate type LED display unit module |
| PCT/CN2019/070245 WO2020042519A1 (en) | 2018-08-29 | 2019-01-03 | Dual-heat-conducting-strip splint type led display unit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810997075.XA CN108847145B (en) | 2018-08-29 | 2018-08-29 | Double-heat-conducting-sheet clamping plate type LED display unit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108847145A CN108847145A (en) | 2018-11-20 |
| CN108847145B true CN108847145B (en) | 2024-03-08 |
Family
ID=64188959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810997075.XA Active CN108847145B (en) | 2018-08-29 | 2018-08-29 | Double-heat-conducting-sheet clamping plate type LED display unit module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108847145B (en) |
| WO (1) | WO2020042519A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108847145B (en) * | 2018-08-29 | 2024-03-08 | 刘振亮 | Double-heat-conducting-sheet clamping plate type LED display unit module |
| CN109949712A (en) * | 2019-04-13 | 2019-06-28 | 深圳市奥拓电子股份有限公司 | A kind of LED display module and display screen |
| CN114333597B (en) * | 2022-01-07 | 2023-11-14 | 京东方科技集团股份有限公司 | Display module and display device |
| CN114613760A (en) * | 2022-02-09 | 2022-06-10 | 业成科技（成都）有限公司 | Display panel |
| CN114895491B (en) * | 2022-06-08 | 2023-11-21 | 厦门天马微电子有限公司 | Display panel and display device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060063179A (en) * | 2004-12-07 | 2006-06-12 | 주식회사 래도 | Exterior electric sign board having function of waterproof and heat radiation |
| CN201838274U (en) * | 2010-10-12 | 2011-05-18 | 深圳市洲明科技股份有限公司 | Led display screen module |
| CN202523352U (en) * | 2012-04-28 | 2012-11-07 | 北京金立翔艺彩科技股份有限公司 | Surface mounted light-emitting diode (LED) display module |
| CN202523351U (en) * | 2012-04-28 | 2012-11-07 | 北京金立翔艺彩科技股份有限公司 | Light-emitting diode (LED) display module |
| CN202632674U (en) * | 2012-04-13 | 2012-12-26 | 成卓 | Splice screen module box structure |
| KR101400376B1 (en) * | 2013-05-14 | 2014-05-30 | (주)에스티씨네트웍스 | Led electric light module with waterproofing and heat dissipation |
| CN106340256A (en) * | 2016-10-25 | 2017-01-18 | 深圳市辉达投资有限公司 | Initiative heat dissipation type LED (Light-Emitting Diode) display screen panel |
| CN208796596U (en) * | 2018-08-29 | 2019-04-26 | 刘振亮 | A kind of double thermally conductive sheet clamping plate type LED display unit mould groups |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6789921B1 (en) * | 2003-03-25 | 2004-09-14 | Rockwell Collins | Method and apparatus for backlighting a dual mode liquid crystal display |
| CN201651984U (en) * | 2009-11-24 | 2010-11-24 | 康佳集团股份有限公司 | LED module with bottom case |
| CN103943038A (en) * | 2014-04-03 | 2014-07-23 | 吴光 | Outdoor display unit module based on integrated series unit board |
| CN105003868A (en) * | 2015-08-06 | 2015-10-28 | 桂林海威科技有限公司 | LED streetlamp module |
| CN106876554A (en) * | 2017-04-13 | 2017-06-20 | 成都飞航沛腾科技有限公司 | A kind of high-heat-dispersion LED surface-mounted integrated circuit |
| CN207729472U (en) * | 2018-01-04 | 2018-08-14 | 西安铁路职业技术学院 | A kind of insertion point type LED railway signal lamps |
| CN108847145B (en) * | 2018-08-29 | 2024-03-08 | 刘振亮 | Double-heat-conducting-sheet clamping plate type LED display unit module |
-
2018
- 2018-08-29 CN CN201810997075.XA patent/CN108847145B/en active Active
-
2019
- 2019-01-03 WO PCT/CN2019/070245 patent/WO2020042519A1/en active Application Filing
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060063179A (en) * | 2004-12-07 | 2006-06-12 | 주식회사 래도 | Exterior electric sign board having function of waterproof and heat radiation |
| CN201838274U (en) * | 2010-10-12 | 2011-05-18 | 深圳市洲明科技股份有限公司 | Led display screen module |
| CN202632674U (en) * | 2012-04-13 | 2012-12-26 | 成卓 | Splice screen module box structure |
| CN202523352U (en) * | 2012-04-28 | 2012-11-07 | 北京金立翔艺彩科技股份有限公司 | Surface mounted light-emitting diode (LED) display module |
| CN202523351U (en) * | 2012-04-28 | 2012-11-07 | 北京金立翔艺彩科技股份有限公司 | Light-emitting diode (LED) display module |
| KR101400376B1 (en) * | 2013-05-14 | 2014-05-30 | (주)에스티씨네트웍스 | Led electric light module with waterproofing and heat dissipation |
| CN106340256A (en) * | 2016-10-25 | 2017-01-18 | 深圳市辉达投资有限公司 | Initiative heat dissipation type LED (Light-Emitting Diode) display screen panel |
| CN208796596U (en) * | 2018-08-29 | 2019-04-26 | 刘振亮 | A kind of double thermally conductive sheet clamping plate type LED display unit mould groups |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020042519A1 (en) | 2020-03-05 |
| CN108847145A (en) | 2018-11-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108847145B (en) | Double-heat-conducting-sheet clamping plate type LED display unit module | |
| KR101858374B1 (en) | Photovoltaic cell module | |
| CN102682669B (en) | Light-emitting diode (LED) display screen and LED display device | |
| US6713956B2 (en) | Display module including a plate for heat dissipation and shielding | |
| CN206943825U (en) | Light emitting diode module and light fixture | |
| US10808912B2 (en) | Light-emitting diode lighting module | |
| KR101829354B1 (en) | Method for constructing universal led bulb and flange snap ring type led bulb and led lamp | |
| MX2010004924A (en) | Lighting apparatus with several light units arranged in a heatsink. | |
| CN103187409A (en) | Light-emitting diode (LED) array packaging light source module based on lead frame | |
| US20150192278A1 (en) | Led support, led and backlight module | |
| CN201149869Y (en) | LED encapsulation structure | |
| CN105897150A (en) | Low-junction-temperature photovoltaic junction box and chip assembly therefor | |
| CN208796596U (en) | A kind of double thermally conductive sheet clamping plate type LED display unit mould groups | |
| CN208348977U (en) | A kind of LED watertight optical integrated heat dissipation mould group | |
| KR20140121507A (en) | LED module for flash and method for fabricating the sme | |
| KR100726001B1 (en) | Light emitting diode package and manufacturing method therefore | |
| KR101748374B1 (en) | Assembled LED Device of DMP Type without PCB and Housing and Method thereof | |
| KR101401919B1 (en) | Lighting device of multi level type for integrated high-efficiency | |
| EP3907426A1 (en) | Lighting module and assembly method therefor, and lighting device | |
| CN210607322U (en) | LED encapsulation module and display screen | |
| CN210607323U (en) | LED packaging module applying TOP packaging and display screen | |
| CN210771613U (en) | High-brightness LED lamp strip | |
| CN218414614U (en) | High bright LED packaging structure | |
| KR20110001430A (en) | The lighting fixture that using led | |
| CN201655841U (en) | Heat-dissipating packaging optical strip of side entering-type LED backlight source |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |