CN114613760A - Display panel - Google Patents
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- CN114613760A CN114613760A CN202210121232.7A CN202210121232A CN114613760A CN 114613760 A CN114613760 A CN 114613760A CN 202210121232 A CN202210121232 A CN 202210121232A CN 114613760 A CN114613760 A CN 114613760A
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- Prior art keywords
- thermally conductive
- display panel
- circuit board
- layer
- light emitting
- Prior art date
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Links
- 238000002955 isolation Methods 0.000 claims abstract description 38
- 239000004020 conductor Substances 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- 239000010410 layer Substances 0.000 description 85
- 230000017525 heat dissipation Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Abstract
The present invention provides a display panel including: a circuit board for outputting a driving signal; a plurality of light emitting elements disposed on the first surface of the circuit board at intervals, electrically connected to the circuit board, for emitting image light according to the driving signal to display an image; and a thermally conductive isolation layer on the first surface of the circuit board, the thermally conductive isolation layer filling gaps between the plurality of light emitting elements, the thermally conductive isolation layer comprising an opaque thermally conductive material. The display panel can avoid crosstalk of image light emitted by adjacent light-emitting elements and can dissipate heat of a plurality of light-emitting elements.
Description
Technical Field
The invention relates to the technical field of self-luminous display, in particular to a self-luminous display panel.
Background
A Mini-LED (Mini-LED) display is a self-luminous display. The traditional mini-LED display comprises a plurality of mini-LEDs arranged in an array, and the mini-LEDs emit light independently. Each mini-LED corresponds to a sub-pixel of the mini-LED display for emitting the light required by its corresponding pixel to display an image. The light emission brightness and/or the light emission color of each mini-LED may be different.
The sub-pixels in the mini-LED display are densely arranged, so the mini-LEDs are also densely arranged. This results in crosstalk of the light emitted by the neighboring mini-LED on the one hand and also does not contribute to heat dissipation of the mini-LED on the other hand.
Disclosure of Invention
The present invention provides a display panel including:
a circuit board for outputting a driving signal;
a plurality of light emitting elements disposed on the first surface of the circuit board at intervals, electrically connected to the circuit board, for emitting image light according to the driving signal to display an image; and
a thermally conductive isolation layer on the first surface of the circuit board, the thermally conductive isolation layer filling gaps between the plurality of light emitting elements, the thermally conductive isolation layer comprising an opaque thermally conductive material.
According to the display panel, the heat conduction isolation layer is arranged to fill gaps among the plurality of light emitting elements and is made of the opaque material, so that image light emitted by each light emitting element can be isolated, and mutual crosstalk of the image light emitted by different light emitting elements is avoided, and image display distortion is caused. The heat conduction isolation layer is also selected from heat conduction materials, and can conduct heat generated by the light-emitting elements which are densely arranged into the air, so that the heat conduction isolation layer is also beneficial to heat dissipation of the display panel, each light-emitting element in the display panel can normally work, and the service life of each light-emitting element is prolonged.
Drawings
Fig. 1 is a schematic plan view of a display panel according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of the display panel of fig. 1 along line ii-ii.
Fig. 3 is a schematic plan view of another viewing angle of the display panel in fig. 1.
Fig. 4 is a schematic plan view of a display panel according to another embodiment of the present application.
Fig. 5 is a schematic plan view of the display panel in fig. 1 from another viewing angle.
Description of the main elements
Through hole 13
Thermally conductive isolation layer 50
First heat conducting layer 60
Second thermally conductive layer 70
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
Referring to fig. 1, a display panel 1 of the present application is used for displaying an image, and is a self-luminous display panel including a plurality of light emitting elements. The application discloses display panel 1 can be an independent device that is used for showing the image, also can be integrated in an intelligent equipment, realizes the function of showing the image as a functional module. The specific shape of the display panel 1 is not limited in this application. The following embodiment exemplifies the case where the plane of the display panel 1 is substantially circular.
Referring to fig. 1 and fig. 2, in the present embodiment, the display panel 1 includes a circuit board 10. The circuit board 10 may be a single layer, a double layer, a triple layer or a multiple layer. The circuit board 10 may be rigid or flexible. The present application is not limited to the configuration or type of circuit board 10. A driving circuit (not shown) is integrated in the circuit board 10 for outputting a plurality of driving signals.
In this embodiment, the display panel 1 further includes a driving chip 20 and a flexible board 30. The driving chip 20 is located on the flexible board 30 and electrically connected to the flexible board 30. The driving chip 20 is used to provide image data including, for example, a gray scale value for each pixel, and the like. The circuit board 10 may also be electrically connected to the driving chip 20 by electrically connecting the flexible board 30, thereby acquiring image data. The plurality of driving signals are generated from the image data.
In the present embodiment, the planar structure of the circuit board 10 is also substantially circular in the view of fig. 1, corresponding to the circular shape of the display panel 1.
In this embodiment, the circuit board 10 includes a first surface 11. The display panel 1 further includes a plurality of light emitting elements 40. The light emitting elements 40 are disposed on the first surface 11 of the circuit board 10 and spaced apart from each other. Each light emitting element 40 is electrically connected to a driving circuit on the circuit board 10. Each of the light emitting elements 40 is configured to receive a driving signal and emit image light according to the driving signal.
In this embodiment, the display panel 1 defines a plurality of sub-pixel regions. One light emitting element 40 is provided in each sub-pixel region. The adjacent three sub-pixel regions constitute one pixel. The light emitting elements 40 in the three sub-pixel regions in the same pixel are used to emit light of different colors, for example, red, green and blue, respectively. In this embodiment, the driving circuit includes at least a plurality of driving elements (e.g., thin film transistors). Each driving element is electrically connected to a light emitting element 40 to output one of the driving signals to drive the light emitting element 40 to emit light. The image to be displayed can be modulated by adjusting the light emission luminance of the light emitting elements 40 in the respective sub-pixels by the drive signals output from the respective drive elements.
In one display period, the circuit board 10 receives image data of one frame of image, generates a plurality of driving signals according to the image data to drive each light emitting element 40 respectively, and the light emitting elements 40 emit image light according to the driving signals received respectively, so that all the light emitting elements 40 display one frame of image in common.
In the present embodiment, each light emitting element 40 is a mini-LED (75-300 microns in size, inclusive). In other embodiments, each light emitting element 40 may also be a Micro light emitting diode (Micro-LED) (with a size less than 75 μm).
In this embodiment, the display panel 1 further includes a thermal isolation layer 50 on the first surface 11 of the circuit board 10. The thermally conductive isolation layer 50 fills the gaps between the individual light emitting elements 40. The thermally conductive, insulative layer 50 is in direct contact with the sides of the respective light emitting elements 40 to partially encapsulate each light emitting element 40. The surface of each light emitting element 40 remote from the circuit board 10 is exposed to the thermally conductive isolation layer 50 to emit image light. In this embodiment, after a plurality of light emitting elements 40 are formed on the circuit board 10, the gaps between the light emitting elements 40 are filled by dispensing to form the thermal conductive isolation layer 50 on the circuit board 10.
In this embodiment, the thermal isolation layer 50 covers all areas of the first surface 11 where the light emitting elements 40 are not disposed. In the present embodiment, the thermal isolation layer 50 is an insulating material, which is electrically insulated from each light emitting element 40 and the circuit board 10.
The thermally conductive isolation layer 50 is made of an opaque material to isolate the image light emitted by the adjacent light emitting elements 40, so as to prevent the image light emitted by different light emitting elements 40 from crosstalk and causing image distortion. The thermal isolation layer 50 is also made of a material with good thermal conductivity, so that heat generated by each light emitting element 40 is conducted out to the air, thereby facilitating heat dissipation of the display panel 1. In this embodiment, the thermally conductive isolation layer 50 may include black ink and a thermally conductive material doped in the ink. The heat conducting material is, for example, one or any combination of silicon, boron nitride, aluminum nitride and diamond. In other embodiments, the thermal isolation layer 50 may also be an opaque thermal conductive adhesive, so that the thermal conductivity is greater than or equal to 2W/mK, and the resistivity is greater than or equal to 108 Ω/m, so as to achieve a good heat dissipation effect.
In this embodiment, the display panel 1 further includes a first heat conductive layer 60 on the first surface 11 of the circuit board 10. The first thermally conductive layer 60 is completely covered by the thermally conductive isolation layer 50. That is, the first thermally conductive layer 60 is located between the circuit board 10 and the thermally conductive isolation layer 50. And the first thermally conductive layer 60 is also in direct contact with the first surface 11 and the thermally conductive, insulating layer 50, respectively. The first heat conductive layer 60 is electrically insulated from the circuit board 10 and each light emitting element 40. The thermally conductive isolation layer 50 conducts heat from the individual light emitting elements 40 and into the first thermally conductive layer 60. The first heat conducting layer 60 is used in conjunction with the heat conducting isolation layer 50 to conduct heat generated by the respective light emitting elements 40 out to the air.
Referring to fig. 2 and 3, in the present embodiment, the first heat conduction layer 60 has a circular ring shape in accordance with the circular shape of the circuit board 10. Since the traces of the driving circuit integrated on the circuit board 10 are generally located at the center of the first surface 11 to be electrically connected to each light emitting element 40, the first heat conductive layer 60 in this embodiment is located at the peripheral region of the first surface 11 to avoid the traces of the driving circuit. That is, the first heat conductive layer 60 in the present embodiment surrounds each light emitting element 40.
When the layout of the traces of the driving circuit is changed, the shape and structure of the first heat conductive layer 60 are also changed accordingly. Referring to fig. 4, in other embodiments, for convenience of routing layout, the first heat conduction layer 60 may further include a plurality of heat conduction blocks 61 disposed at intervals. Each of the heat-conducting blocks 61 is completely covered by the heat-conducting isolating layer 50, that is, each of the heat-conducting blocks 61 is located between the circuit board 10 and the heat-conducting isolating layer 50 and directly contacts the first surface 11 and the heat-conducting isolating layer 50, respectively. Each of the heat conductive blocks 61 is electrically insulated from the circuit board 10 and each of the light emitting elements 40, and is used together with the heat conductive isolation layer 50 to conduct heat generated by the respective light emitting elements 40 to the air. The shape and structure of each heat-conducting block 61 may be the same or different. In this embodiment, the respective heat-conducting blocks 61 are also located at the periphery of the first surface 11, i.e., the periphery of the respective light-emitting elements.
By splitting the first heat conduction layer 60 into the plurality of separated heat conduction blocks 61, the distribution of the first heat conduction layer 60 is more flexible, which is beneficial to avoiding the wiring on the circuit board 10 under the condition of complex wiring and is beneficial to more fully utilizing the space on the first surface 11 of the circuit board 10.
The larger the surface area of the first conductive layer 60, the better the heat dissipation. In other embodiments, the first heat conducting layer 60 may be located at the center of the first surface 11 without interfering with the normal operation of the light emitting element 40.
Referring to fig. 2, in the present embodiment, the circuit board 10 further includes a second surface 12 disposed opposite to the first surface 11. The circuit board 10 further has a plurality of through holes 13 disposed at intervals, and each through hole 13 penetrates through the first surface 11 and the second surface 12. The number of the through holes 13 is not limited in the present application. In the present embodiment, each through hole 13 is also opened on the periphery of the circuit board 10, depending on the position of the first heat conduction layer 60. In the present embodiment, each through hole 13 is a circular through hole, that is, each through hole 13 penetrates through the first surface 11 and the second surface 12 to form a circular opening on the first surface 11 and the second surface 12, respectively. In other embodiments, each through hole 13 may also be a rectangular through hole (i.e., each through hole 13 forms a rectangular opening on the first surface 11 and the second surface 12 when penetrating through the first surface 11 and the second surface 12), a ring-shaped through hole (i.e., each through hole 13 forms a ring-shaped opening on the first surface 11 and the second surface 12 when penetrating through the first surface 11 and the second surface 12), and so on. The shape of the through-hole 13 is not limited in the present application.
The display panel 1 further comprises a second thermally conductive layer 70 located on the second surface 12 of the circuit board 10 and in direct contact with the second surface 12. The second thermally conductive layer 70 also extends from the second surface of the circuit board 10 along each of the vias 13 to the first surface 11 for connection to the first thermally conductive layer 60. The thermally conductive isolation layer 50 conducts heat generated by each light emitting element 40 to the first thermally conductive layer 60, and the first thermally conductive layer 60 in turn conducts heat generated by each light emitting element 40 to the second thermally conductive layer 70. In this embodiment, therefore, the thermally conductive isolation layer 50, the first thermally conductive layer 60, and the second thermally conductive layer 70 are used to collectively conduct heat generated by the light emitting elements 40 out to the air.
The first conductive layer 60 and the second conductive layer 70 are preferably made of a material having good thermal conductivity. In this embodiment, the first thermally conductive layer 60 and the second thermally conductive layer 70 are made of the same material and are both made of metal, such as copper. In other embodiments, the first thermally conductive layer 60 and the second thermally conductive layer 70 may be formed of different materials.
The present application does not limit the shape or configuration of the second thermally conductive layer 70. The larger the surface area of the second thermally conductive layer 70, the better the heat dissipation. In this embodiment, in order to maximize the surface area of the second heat conducting layer 70 to facilitate heat dissipation, the second heat conducting layer 70 almost completely covers the second surface 12 (as shown in fig. 5). That is, the area of the second heat conductive layer 70 is slightly smaller than the area of the second surface 12.
In the display panel 1 of the embodiment, the heat conductive isolation layer 50 is arranged to fill the gaps between the light emitting elements 40 and is made of an opaque material, so that the image light emitted by each light emitting element 40 can be blocked, and the image light emitted by different light emitting elements can be prevented from crosstalk with each other, thereby causing image display distortion. The heat-conducting isolation layer 50 is also selected from heat-conducting materials with better heat-conducting performance, and can conduct heat generated by the light-emitting elements 40 arranged densely to the air, so that the heat-conducting isolation layer 50 is also beneficial to heat dissipation of the display panel 1, and therefore, each light-emitting element 40 in the display panel 1 can work normally, and the service life of each light-emitting element 40 is prolonged. And the display panel 1 further comprises a first heat conducting layer 60 and a second heat conducting layer 70, the first heat conducting layer 60 directly contacting the heat conducting isolating layer 50, the first heat conducting layer 60 being connected to the second heat conducting layer 70. The thermally conductive isolation layer 50 conducts heat generated by each light emitting element 40 to the first thermally conductive layer 60, and the first thermally conductive layer 60 in turn conducts heat generated by each light emitting element 40 to the second thermally conductive layer 70. Therefore, in the embodiment, the heat-conducting isolation layer 50, the first heat-conducting layer 60 and the second heat-conducting layer 70 can conduct the heat generated by each light-emitting element 40 to the air together, so as to facilitate better heat dissipation and further improve the heat dissipation effect of the display panel 1.
It will be appreciated by those skilled in the art that the above embodiments are illustrative only and not intended to be limiting, and that suitable modifications and variations may be made to the above embodiments without departing from the true spirit and scope of the invention.
Claims (10)
1. A display panel, comprising:
a circuit board for outputting a driving signal;
a plurality of light emitting elements disposed on the first surface of the circuit board at intervals, electrically connected to the circuit board, for emitting image light according to the driving signal to display an image; and
a thermally conductive isolation layer on the first surface of the circuit board, the thermally conductive isolation layer filling gaps between the plurality of light emitting elements, the thermally conductive isolation layer comprising an opaque thermally conductive material.
2. The display panel according to claim 1, further comprising:
a first thermally conductive layer on the first surface of the circuit board, the thermally conductive isolation layer covering the first thermally conductive layer, the first thermally conductive layer being electrically insulated from the circuit board and the plurality of light-emitting elements for conducting away heat generated by the plurality of light-emitting diodes.
3. The display panel of claim 2, wherein the first thermally conductive layer surrounds the plurality of light emitting elements.
4. The display panel of claim 2, wherein the first thermally conductive layer comprises a plurality of spaced apart thermally conductive blocks, and the thermally conductive spacer layer covers each of the thermally conductive blocks, each of the thermally conductive blocks being electrically isolated from the circuit board and the plurality of light emitting elements.
5. The display panel according to claim 2, wherein the circuit board has a second surface disposed opposite to the first surface, and a through hole is formed in the circuit board and penetrates through the first surface and the second surface;
the display panel further comprises a second heat conduction layer, the second heat conduction layer is located on the second surface and extends to the first surface along the through holes to be connected with the first heat conduction layer, and the second heat conduction layer is used for guiding out heat generated by the plurality of light emitting diodes.
6. The display panel of claim 5, wherein the first thermally conductive layer and the second thermally conductive layer are metal.
7. The display panel of claim 6, wherein the first thermally conductive layer and the second thermally conductive layer are copper.
8. The display panel of claim 1, wherein the thermal isolation layer comprises ink and a thermal conductive material filled in the ink.
9. The display panel of claim 1, wherein the thermally conductive isolation layer comprises a heat-dissipating glue.
10. The display panel according to any one of claims 1 to 9, wherein each of the light emitting elements is a mini light emitting diode or a micro light emitting diode.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210121232.7A CN114613760A (en) | 2022-02-09 | 2022-02-09 | Display panel |
| TW111105309A TWI819489B (en) | 2022-02-09 | 2022-02-14 | Display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210121232.7A CN114613760A (en) | 2022-02-09 | 2022-02-09 | Display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114613760A true CN114613760A (en) | 2022-06-10 |
Family
ID=81858756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210121232.7A Pending CN114613760A (en) | 2022-02-09 | 2022-02-09 | Display panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114613760A (en) |
| TW (1) | TWI819489B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212571003U (en) * | 2020-08-27 | 2021-02-19 | 重庆康佳光电技术研究院有限公司 | Display panel and electronic equipment |
| CN113889496A (en) * | 2021-09-30 | 2022-01-04 | 厦门天马微电子有限公司 | Display panel and display device |
| US20220013507A1 (en) * | 2021-04-01 | 2022-01-13 | Xiamen Tianma Micro-Electronics Co., Ltd. | Display panel and display device with enhanced thermal conductivity |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002278481A (en) * | 2001-03-21 | 2002-09-27 | Nippon Signal Co Ltd:The | Led display unit and method for manufacturing the same |
| CN108847145B (en) * | 2018-08-29 | 2024-03-08 | 刘振亮 | Double-heat-conducting-sheet clamping plate type LED display unit module |
| CN213025163U (en) * | 2020-07-21 | 2021-04-20 | 深圳市大象视界科技有限公司 | Novel LED display screen |
| CN112185949B (en) * | 2020-12-03 | 2021-08-10 | 浙江清华柔性电子技术研究院 | Mini/Micro LED display panel, manufacturing method thereof and display device |
-
2022
- 2022-02-09 CN CN202210121232.7A patent/CN114613760A/en active Pending
- 2022-02-14 TW TW111105309A patent/TWI819489B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212571003U (en) * | 2020-08-27 | 2021-02-19 | 重庆康佳光电技术研究院有限公司 | Display panel and electronic equipment |
| US20220013507A1 (en) * | 2021-04-01 | 2022-01-13 | Xiamen Tianma Micro-Electronics Co., Ltd. | Display panel and display device with enhanced thermal conductivity |
| CN113889496A (en) * | 2021-09-30 | 2022-01-04 | 厦门天马微电子有限公司 | Display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI819489B (en) | 2023-10-21 |
| TW202333371A (en) | 2023-08-16 |
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Effective date of registration: 20240116 Address after: 518109, Building E4, 101, Foxconn Industrial Park, No. 2 East Ring 2nd Road, Fukang Community, Longhua Street, Longhua District, Shenzhen City, Guangdong Province (formerly Building 1, 1st Floor, G2 District), H3, H1, and H7 factories in K2 District, North Shenchao Optoelectronic Technology Park, Minqing Road, Guangdong Province Applicant after: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Applicant after: Interface Technology (Chengdu) Co., Ltd. Applicant after: GENERAL INTERFACE SOLUTION Ltd. Address before: No.689 Hezuo Road, West District, high tech Zone, Chengdu City, Sichuan Province Applicant before: Interface Technology (Chengdu) Co., Ltd. Applicant before: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Applicant before: Yicheng Photoelectric (Wuxi) Co.,Ltd. Applicant before: GENERAL INTERFACE SOLUTION Ltd. |