CN212571003U

CN212571003U - Display panel and electronic equipment

Info

Publication number: CN212571003U
Application number: CN202021834148.2U
Authority: CN
Inventors: 付剑波; 赵攀; 袁山富
Original assignee: Chongqing Kangjia Photoelectric Technology Research Institute Co Ltd
Current assignee: Chongqing Kangjia Photoelectric Technology Research Institute Co Ltd
Priority date: 2020-08-27
Filing date: 2020-08-27
Publication date: 2021-02-19
Anticipated expiration: 2030-08-27

Abstract

The utility model relates to a display panel and electronic equipment, display panel includes: the first substrate is provided with a driving array; the plurality of light emitting unit arrays are arranged on one side of the first substrate, which is provided with the driving array, and the driving array is electrically connected with the light emitting units; and at least part of the heat conduction assembly is arranged between the adjacent light emitting units. Through setting up heat conduction assembly, at least partial heat conduction assembly sets up between adjacent luminescence unit, and heat conduction assembly can absorb the heat that luminescence unit produced to release to the external world, thereby avoid the heat accumulation that luminescence unit produced, lead to the temperature to rise and make display panel's formation of image quality reduce.

Description

Display panel and electronic equipment

Technical Field

The utility model relates to a show technical field, especially relate to a display panel and electronic equipment.

Background

With the development of display technology, Micro LEDs, as a new generation of display technology, have higher brightness, better luminous efficiency, and lower power consumption than the existing OLED technology. However, since the number of the light emitting units in the Micro LED technology is large and the arrangement is dense, the temperature of the display panel is too high due to the accumulation of heat generated by the light emitting units, thereby affecting the imaging quality of the display panel.

Therefore, how to avoid the degradation of the imaging quality caused by the accumulation of heat generated by the light emitting unit is a problem to be solved.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, the present application aims to provide a display panel and an electronic device, which aim to solve the problem of how to avoid the heat generated by the light-emitting unit from accumulating to cause the reduction of the imaging quality.

In a first aspect, the present application provides a display panel comprising: the first substrate is provided with a driving array; the light emitting units are arranged on one side of the first substrate, which is provided with a driving array, and the driving array is electrically connected with the light emitting units; and at least part of the heat conduction assembly is arranged between the adjacent light emitting units.

Through setting up heat conduction assembly, at least partial heat conduction assembly sets up between adjacent luminescence unit, and heat conduction assembly can absorb the heat that luminescence unit produced to release to the external world, thereby avoid the heat accumulation that luminescence unit produced, lead to the temperature to rise and make display panel's formation of image quality reduce.

In one embodiment, the display panel further includes a second substrate disposed opposite to the first substrate, and a light conversion unit is disposed on a side of the second substrate facing the first substrate, and the light conversion unit is disposed on a light emitting side of the light emitting unit. It is understood that the light conversion unit has poor thermal stability and low luminous efficiency at high temperature. Due to the arrangement of the heat conduction assembly, the heat conduction assembly can reduce the heat accumulation of the light emitting unit, and the light conversion unit is facilitated to obtain higher luminous efficiency.

In one embodiment, the first substrate is provided with a first through hole; the heat conduction assembly comprises a first heat conduction layer and a first heat conduction piece, the first heat conduction layer is arranged on the other side, away from the light emitting units, of the first substrate, and the first heat conduction piece is arranged between the adjacent light emitting units; the first heat conducting piece is connected with the first heat conducting layer through the first through hole. By arranging the first heat conducting piece and the first heat conducting layer, the first heat conducting piece is positioned between the two adjacent light emitting units, so that most of heat generated by the light emitting units is absorbed by the first heat conducting piece before reaching the light conversion unit, is conducted to the first heat conducting layer and is released to the outside from the first heat conducting layer. Moreover, the contact area of the first heat conduction layer and the outside is large, and the heat dissipation efficiency of the first heat conduction piece is accelerated.

In one embodiment, the heat conducting assembly further includes a second heat conducting member and a second heat conducting layer, and the second substrate defines a second through hole; the second heat conducting layer is stacked on one side, back to the light conversion unit, of the second substrate, one end of the second heat conducting piece is connected with the second heat conducting layer, and the other end of the second heat conducting piece is connected with the first heat conducting piece through the second through hole. Through setting up second heat-conducting piece and second heat-conducting layer, the heat in the first heat-conducting piece and the heat of light conversion unit can be absorbed to the second heat-conducting layer makes the heat release to the external world at the second heat-conducting layer, further improves the radiating efficiency. Moreover, the contact area of the second heat conduction layer and the outside is large, and the heat dissipation efficiency of the second heat conduction piece is accelerated. In addition, the first heat-conducting piece and the second heat-conducting piece support each layer of the display panel, and the structural strength of the display panel is improved.

In one embodiment, the heat conducting assembly further comprises a third heat conducting layer, the third heat conducting layer is disposed between the light emitting unit and the light conversion unit, and the first heat conducting member and/or the second heat conducting member are connected to the third heat conducting layer. Through setting up the third heat-conducting layer, the heat of luminescence unit can be absorbed to the third heat-conducting layer to conduct the heat to first heat-conducting layer and conduct the heat to the second heat-conducting layer through the second heat-conducting piece through first heat-conducting piece, release the heat to the external world from first heat-conducting layer and second heat-conducting layer, be favorable to further exhausting the heat that the luminescence unit produced.

In one embodiment, the display panel further includes a thermal barrier layer disposed between the third thermal conductive layer and the light conversion unit. The heat-resistant layer is arranged between the third heat-conducting layer and the light conversion unit and can isolate heat of the third heat-conducting layer, so that the problem that the light conversion unit is low in luminous efficiency due to the fact that the light conversion unit is heated by the heat of the third heat-conducting layer is avoided.

In one embodiment, a surface of the first heat conduction layer facing away from the light emitting unit is provided with a heat dissipation texture. The surface of the first heat conduction layer, which faces away from the light emitting unit, is provided with the heat dissipation textures, so that the contact area of the first heat conduction layer and the outside is increased, and the heat dissipation efficiency of the first heat conduction layer is further improved.

In one embodiment, the first heat-conducting members are multiple, the multiple first heat-conducting members surround to form multiple cavities, and the light-emitting units are in one-to-one correspondence with the cavities and accommodated in the cavities. The cavity is formed by enclosing a plurality of first heat-conducting pieces, the light-emitting units are respectively accommodated in the corresponding cavities, the heat exchange area of the light-emitting units and the heat-conducting pieces is large, the absorption rate of the first heat-conducting pieces to heat generated by the light-emitting units can be improved, meanwhile, the first heat-conducting pieces can converge light emitted by the light-emitting units, and therefore the utilization rate of the light is improved.

In one embodiment, the second heat conducting member includes a heat absorbing portion and a heat dissipating portion connected to each other, the heat absorbing portion is at least partially connected to the light conversion unit, the heat absorbing portion has a trapezoidal cross section, an upper base of the trapezoid is connected to the first heat conducting member, a lower base of the trapezoid is connected to the heat dissipating portion, and the heat dissipating portion is connected to the second heat conducting member. The section of the heat absorption part is trapezoidal, so that the heat exchange area between the heat absorption part and the light conversion unit is large, and the absorption rate of the second heat conduction piece to heat generated by the light emitting unit is improved. Moreover, the heat absorption part with the trapezoidal section has a light guide effect, and can guide the light emitted by the light emitting unit to the light conversion unit, so that the utilization rate of the light is further improved.

In one embodiment, the second heat conducting layer is provided with a connecting groove, and one end of the heat dissipating portion, which is far away from the heat absorbing portion, is accommodated in the connecting groove. Through seting up the spread groove at the second heat-conducting layer, the one end holding of radiating part can increase the heat exchange area of second heat-conducting piece and second heat-conducting layer in the spread groove to improve its heat exchange efficiency, be favorable to improving the radiating effect.

An electronic device comprising the display panel of any of the embodiments of the first aspect. Through adding in electronic equipment the utility model provides a display panel, electronic equipment has higher image quality and radiating effect.

Drawings

FIG. 1 is a schematic diagram illustrating an internal top view of a display panel according to an embodiment;

FIG. 2a is a schematic cross-sectional view taken along line A-A of FIG. 1;

FIG. 2b is a schematic cross-sectional view of a display panel according to another embodiment;

FIG. 2c is a schematic cross-sectional view of a display panel according to another embodiment;

FIG. 2d is a schematic cross-sectional view of a display panel according to another embodiment;

FIG. 2e is a schematic cross-sectional view of a display panel according to another embodiment;

fig. 3 is a schematic bottom view of the second heat conductive layer of fig. 2 a;

FIG. 4 is a schematic structural diagram illustrating step S1 in the manufacturing process of the display panel according to one embodiment when the second substrate is made of glass;

FIG. 5 is a schematic structural diagram illustrating step S2 in the manufacturing process of the display panel according to one embodiment when the second substrate is made of glass;

FIG. 6 is a schematic structural diagram illustrating step S3 in the manufacturing process of the display panel according to one embodiment when the second substrate is made of glass;

FIG. 7 is a schematic structural diagram illustrating step S4 in the manufacturing process of the display panel according to one embodiment when the second substrate is made of glass;

FIG. 8 is a schematic structural diagram illustrating a step S5 in the manufacturing process of the display panel according to an embodiment when the second substrate is made of glass;

FIG. 9 is a schematic structural diagram illustrating a step S6 in the manufacturing process of the display panel according to an embodiment when the second substrate is made of glass;

FIG. 10 is a schematic structural diagram illustrating a step S7 in the manufacturing process of the display panel according to an embodiment when the second substrate is made of glass;

FIG. 11 is a schematic structural diagram illustrating step S8 in the manufacturing process of the display panel according to one embodiment when the second substrate is made of glass;

FIG. 12 is a schematic structural diagram illustrating step S9 in the manufacturing process of the display panel according to one embodiment when the second substrate is made of glass;

FIG. 13 is a schematic structural diagram illustrating the step S10 in the manufacturing process of the display panel according to the embodiment when the second substrate is made of glass;

fig. 14 is a schematic structural diagram corresponding to step S11 in the manufacturing process of the display panel according to the embodiment when the second substrate is made of glass;

FIG. 15 is a schematic structural diagram illustrating a step S1 in the process of manufacturing a display panel according to an embodiment when the second substrate is made of colorless polyimide;

fig. 16 is a schematic structural diagram corresponding to step S8 in the manufacturing process of the display panel according to the embodiment when the second substrate is made of colorless polyimide.

Description of reference numerals:

10-a second substrate; 101-a second through hole; a 20-conversion layer; 21-red quantum dots; 22-green quantum dots; 23-red color resistance; 24-green color resistance; 25-a blue light planarization layer; 30-a light-emitting layer; 31-a light emitting unit; 40-a first substrate; 401-a first through-going hole; 50-a thermally conductive assembly; 51-a first thermally conductive member; 510-a first chamber; 52-a second thermally conductive member; 520-a second chamber; 60-a first thermally conductive layer; 61-a third surface; 70-a second thermally conductive layer; 71-a first surface; 72-connecting grooves; 80-a third thermally conductive layer; 81-a second surface; 90-a thermal barrier; 91-a glass substrate; 92-sacrificial layer.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

The number of light LEDs of the traditional Micro LED display equipment is large and the arrangement is dense, the generated heat is easy to accumulate to cause temperature rise, and the imaging quality is easy to reduce due to overhigh temperature. Therefore, how to avoid the heat accumulation of the light emitting unit is an urgent problem to be solved.

Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.

Referring to fig. 1 to fig. 2e, an embodiment of the present disclosure provides a display panel, which can be applied to electronic devices such as a smart phone, a tablet computer, a personal digital assistant, and a display screen. The display panel includes a first substrate 40, a light emitting layer 30, a conversion layer 20, and a second substrate 10 sequentially stacked, wherein the first substrate 40 is provided with a driving array (not shown). The light emitting layer 30 has a plurality of light emitting units 31, and a plurality of light emitting units 31 are arranged in an array on a side of the first substrate 40 where the driving array is disposed, and the driving array is electrically connected to the light emitting units 40. The side of the conversion layer 20 facing the light emitting layer 30 is provided with light conversion units (21, 22), in particular optionally red quantum dots 21 and green quantum dots 22, the red quantum dots 21 and the green quantum dots 22 each being opposite one light emitting unit 31. The light emitting unit 31 may be selected as a blue LED. The display panel further includes a heat conduction member 50, at least a portion of the heat conduction member 50 is disposed between the adjacent light emitting units 31, and the heat conduction member 50 is configured to absorb heat generated by the light emitting units 31 and release the heat from a side of the second substrate 40 facing away from the light emitting layer 30 and/or a side of the first substrate 10 facing away from the conversion layer 20.

Specifically, the material of the second substrate 10 may be an inorganic material such as glass, or an organic material such as colorless polyimide, wherein the second substrate 10 made of polyimide may be applied to a flexible display panel. The light emitting unit 31 is disposed on a side of the second substrate 40 facing the conversion layer 20, and is driven by the driving array to emit blue light. The light emitting layer 30 may include air or may include an organic photosensitive material. The drive array may optionally be a thin-film transistor layer. The red quantum dots 21 and the green quantum dots 22 are made of cadmium selenide. The red quantum dots 21 and the green quantum dots 22 are both located on the light emitting side of the light emitting unit 31. The conversion layer 20 further includes a red color resistor 23 and a green color resistor 24, the red color resistor 23 is disposed between the red quantum dots 21 and the second substrate 10, and the green color resistor 24 is disposed between the green quantum dots 22 and the second substrate 10. It can be understood that, in various quantum dot materials, for example, the red quantum dot 21 is used to convert the blue light emitted by the light emitting unit 31 into red light and then emit the red light, during the conversion process, a part of the blue light is emitted without conversion, and the red color resistor 23 is used to absorb the part of the unconverted blue light and only allow the red light to pass through, so as to avoid light crosstalk. Similarly, the green resistor 24 in this embodiment can be referred to as the red resistor 23. The red color resistor 23 and the green color resistor 24 can be filters. The conversion layer 20 further includes a blue light planarization layer 25, the blue light planarization layer 25 is disposed around the red quantum dots 21 and the green quantum dots 22, and the blue light planarization layer 25 can serve as a blue color filter. It is understood that the light emitting unit 31 of blue light corresponding to a portion of the region where blue light is to be displayed does not need to convert the color, and thus, a quantum dot material does not need to be provided. Of course, the light conversion unit is not limited to the red and

green quantum dots

21 and 22, and the light emitting unit 31 is not limited to emit only blue light. The following description will take as an example the case where the photoconversion units are the red quantum dots 21 and the green quantum dots 22.

It can be understood that, by disposing the heat conductive member 50, at least a portion of the heat conductive member 50 is disposed between the adjacent light emitting units 31, the heat conductive member 50 can absorb heat generated by the light emitting units 31 and release the heat from the first substrate 40 side and/or the second substrate 10 side to the outside, thereby preventing heat generated by the light emitting units 31 from accumulating, resulting in a temperature rise and thus reducing the imaging quality of the display panel. Especially, when the display panel adopts a scheme that the light emitting unit 31 of blue light is matched with the light conversion unit (the red quantum dot 21 and the green quantum dot 22) to realize full-color display, because the thermal stability of the quantum dot material is poor, when the temperature is too high, the light emitting efficiency of the red quantum dot 21 and the green quantum dot 22 is greatly reduced, and it is particularly important to timely release the heat generated by the light emitting unit 31 to the outside through the heat conduction assembly 50.

Of course, the display panel may adopt another full-color display scheme, in which some of the light emitting units 31 are red light emitting units, some are green light emitting units, and some are blue light emitting units, and the second substrate 10 and the conversion layer 20 are omitted. Regardless of the display scheme, the display panel provided by the present application can better release the heat generated by the light emitting unit 31 to the outside through the heat conducting assembly 50, so as to improve the imaging quality of the display panel.

In one embodiment, referring to fig. 2a, the heat conducting assembly 50 includes a first heat conducting member 51 and a first heat conducting layer 60, and the first heat conducting layer 60 is stacked on a side of the second substrate 40 facing away from the light emitting layer 30. The second substrate 40 has a first through hole 401, the first heat conducting member 51 is disposed between two adjacent light emitting units 31, and the first heat conducting member 51 is connected to the first heat conducting layer 60 through the first through hole 401. By arranging the first heat conduction member 51 and the first heat conduction layer 60, the first heat conduction member 51 is located between two adjacent light emitting units 31, so that most of the heat generated by the light emitting units 31 is absorbed by the first heat conduction member 51 before reaching the green quantum dots 22 and the red quantum dots 21, is conducted to the first heat conduction layer 60, and is released from the first heat conduction layer 60 to the outside. Moreover, the first heat conduction layer 60 has a large contact area with the outside, which is beneficial to increase the heat dissipation efficiency of the first heat conduction member 51.

In one embodiment, referring to fig. 2a, the heat conducting assembly 50 further includes a second heat conducting member 52 and a second heat conducting layer 70, and the second substrate 10 has a second through hole 101. The second thermally conductive layer 70 is laminated on the side of the second substrate 10 facing away from the conversion layer 20. The second heat conduction member 52 has one end connected to the second heat conduction layer 70 and the other end connected to the first heat conduction member 51 through the second through hole 101. By providing the second heat conduction member 52 and the second heat conduction layer 70, the second heat conduction member 52 can absorb the heat in the first heat conduction member 51 and the heat reaching the red quantum dots 21 and the green quantum dots 22, and conduct the heat to the second heat conduction layer 70, so that the heat can be released to the outside in the second heat conduction layer 70, and the heat dissipation efficiency is further improved. Moreover, the contact area of the second heat conduction layer 70 with the outside is large, which is beneficial to increase the heat dissipation efficiency of the second heat conduction member 52. In addition, the first heat conducting member 51 and the second heat conducting member 52 support each layer of the display panel, which is beneficial to improving the structural strength of the display panel.

Specifically, the first heat conduction member 51, the second heat conduction member 52 and the first heat conduction layer 60 may be made of metal or ceramic with good heat conduction performance and without light transmission. The material of the second heat conduction layer 70 can be selected from a transparent graphene material, and the thermal conductivity of the second heat conduction layer 70 can reach 5300W/m · K, so that the second heat conduction layer 70 has a high heat dissipation rate.

In one embodiment, referring to fig. 2a, the heat conducting element 50 passes through the light emitting layer 30 and the conversion layer 20 through the first through hole 401 and the second through hole 101. The heat conductive member 50 absorbs heat of the light emitting unit 31 and releases heat from a side of the second substrate 40 facing away from the light emitting layer 30 and a side of the second substrate 10 facing away from the conversion layer 20.

In another embodiment, referring to fig. 2b, the heat conducting element 50 is disposed through the light emitting layer 30 through the first through hole 401. The heat conductive member 50 absorbs heat of the light emitting unit 31 and releases heat from a side of the second substrate 40 facing away from the light emitting layer 30.

In another embodiment, referring to fig. 2c, the heat conducting element 50 is disposed through the conversion layer 20 via the second through hole 101. The heat conductive member 50 absorbs heat of the light emitting unit 31 and releases heat from a side of the second substrate 10 facing away from the conversion layer 20. In this embodiment, the light emitting layer 30 may optionally include a photosensitive material at least partially surrounding the light emitting unit 31, and has the function of supporting the connection film layer.

In another embodiment, referring to fig. 2d, the heat conducting element 50 is disposed through the light emitting layer 30 and the conversion layer 20 via the second through hole 101. The heat conductive member 50 absorbs heat of the light emitting unit 31 and releases heat from a side of the second substrate 10 facing away from the conversion layer 20.

In another embodiment, referring to fig. 2e, the heat conducting element 50 is disposed through the light emitting layer 30 and the conversion layer 20 through the first through hole 401. The heat conductive member 50 absorbs heat of the light emitting unit 31 and releases heat from a side of the second substrate 40 facing away from the light emitting layer 30.

In one embodiment, referring to fig. 2a, the heat conducting assembly 50 further includes a third heat conducting layer 80, the third heat conducting layer 80 is disposed between the light emitting layer 30 and the conversion layer 20, and the first heat conducting member 51 and/or the second heat conducting member 52 are connected to the third heat conducting layer 80. By providing the third heat conduction layer 80, the third heat conduction layer 80 can absorb the heat of the light emitting unit 31, and conduct the heat to the first heat conduction layer 60 through the first heat conduction member 51 and conduct the heat to the second heat conduction layer 70 through the second heat conduction member 52, so as to release the heat to the outside from the first heat conduction layer 60 and the second heat conduction layer 70, which is beneficial to further dissipating the heat generated by the light emitting unit 31.

In one embodiment, referring to fig. 2a, the display panel further includes a thermal barrier layer 90, and the thermal barrier layer 90 is disposed between the third heat conductive layer 80 and the conversion layer 20. By arranging the heat resistance layer 90 between the third heat conduction layer 80 and the conversion layer 20, the heat resistance layer 90 can isolate the heat of the third heat conduction layer 80, and prevent the heat of the third heat conduction layer 80 from increasing the temperature of the red quantum dots 21 and the green quantum dots 22, which leads to the reduction of the light emitting efficiency of the red quantum dots 21 and the green quantum dots 22.

Specifically, the material of the third heat conduction layer 80 may be a transparent graphene material, and the material of the heat resistance layer 90 may be a transparent resin. The surface of the third heat conduction layer 80, which faces away from the heat resistance layer 90, is a first surface 71, the surface of the second heat conduction layer 70, which faces away from the second substrate 10, is a second surface 81, and the first surface 71 and the second surface 81 are both rough surfaces, which is beneficial to increasing the heat exchange area, so that the heat radiation efficiency of the second heat conduction layer 70 and the heat absorption efficiency of the third heat conduction layer 80 are improved. Meanwhile, the light efficiency of the light emitting unit 31 may also be increased.

In one embodiment, referring to fig. 2a and fig. 3, a third surface 61 of the first heat conducting layer 60 facing away from the light emitting layer 30 is provided with heat dissipation textures. By arranging the heat dissipation texture on the surface of the first heat conduction layer 60 opposite to the light emitting layer 30, the contact area of the first heat conduction layer 60 and the outside is increased, and the heat dissipation efficiency of the first heat conduction layer 60 is further improved.

Specifically, the third surface 61 is provided with a plurality of grooves 611, which divide the third surface 61 into a plurality of irregular blocks, thereby forming a mosaic structure. This structure is advantageous to increase the surface of the third surface 61, i.e., the heat exchange area between the first heat conduction layer 60 and the outside, thereby improving the heat dissipation efficiency of the first heat conduction layer 60.

In one embodiment, referring to fig. 1 and fig. 2a, the number of the first heat-conducting members 51 is multiple, the multiple first heat-conducting members 51 surround to form multiple first cavities 510, and the light-emitting units 31 are in one-to-one correspondence with the first cavities 510 and are accommodated in the first cavities 510. The first cavity 510 is formed by enclosing the plurality of first heat-conducting pieces 51, the light-emitting units 31 are respectively accommodated in the corresponding first cavities 510, the heat exchange area between the light-emitting units 31 and the first heat-conducting pieces 51 is large, the absorption rate of heat generated by the first heat-conducting pieces 51 to the light-emitting units 31 can be improved, meanwhile, the light emitted by the light-emitting units 31 can be converged by the first heat-conducting pieces 51, and therefore the utilization rate of the light is improved.

Specifically, the number of the second heat conduction members 52 is also plural, and the second heat conduction members 52 and the red and

green quantum dots

21 and 22 are arranged in the same manner as the first heat conduction members 51 and the light emitting units 31. The first chamber 510 enclosed by the first heat-conducting member 51 communicates with the second chamber 520 enclosed by the second heat-conducting member 52. The light can be converged further, and the light utilization rate can be improved.

In one embodiment, referring to fig. 2a, the second heat conducting member 52 includes a heat absorbing part 521 and a heat dissipating part 522 connected to each other, the heat absorbing part 521 is at least partially disposed in the conversion layer 20 and connected to the red quantum dots 21 and/or the green quantum dots 22, the cross section of the heat absorbing part 521 is trapezoid, an upper bottom of the trapezoid is connected to the first heat conducting member 51, a lower bottom of the trapezoid is connected to the heat dissipating part 522, and the heat dissipating part 522 is connected to the second heat conducting layer 70. By providing the heat absorbing part 521 with a trapezoidal cross section, the heat exchange area between the heat absorbing part 521 and the red and

green quantum dots

21 and 22 is large, which is beneficial to improving the absorption rate of the second heat conducting member 52 to the heat generated by the light emitting unit 31. Moreover, the heat absorbing part 521 with a trapezoidal cross section has a light guiding function, and can guide the light emitted by the light emitting unit 31 to the red quantum dots 21 and the green quantum dots 22, which is beneficial to further improving the utilization rate of the light.

Specifically, the heat dissipation portion 522 has a rectangular cross section. It can be understood that the heat sink 521 has a trapezoidal cross section, and compared with the rectangular cross section, the contact area between the trapezoid waist and the red and

green quantum dots

21 and 22 is larger, and the heat conduction effect and the heat dissipation effect are better. And the upper base of the trapezoid is connected to the first heat-conducting member 51, and the lower base is connected to the heat-dissipating part 522, which helps to guide the blue light emitted from the light-emitting unit 31 to the red quantum dots 21 or the green quantum dots 22.

In one embodiment, referring to fig. 2a, the second heat conductive layer 70 is provided with a connecting groove 72, and one end of the heat dissipating portion 522 away from the heat sink portion 521 is received in the connecting groove 72. By forming the connection groove 72 in the second heat conduction layer 70, one end of the heat dissipation portion 522 is accommodated in the connection groove 72, so that the heat exchange area between the second heat conduction member 52 and the second heat conduction layer 70 can be increased, thereby improving the heat exchange efficiency and facilitating the improvement of the heat dissipation effect.

The embodiment of the application also provides electronic equipment, and the electronic equipment comprises the display panel provided by the application. The electronic device can be a smart phone, a tablet computer, a personal digital assistant, a display screen and the like. Through adding in electronic equipment the utility model provides a display panel, electronic equipment has higher image quality and radiating effect.

The following explains a manufacturing process of the display panel provided in the embodiment of the present application.

When the second substrate 10 is made of glass, the steps of the manufacturing process of the display panel (S1-S12) are as follows:

referring to fig. 4, S1: a layer of transparent graphene material is manufactured on the second substrate 10 by a vapor deposition method to form a second heat conduction layer 70;

referring to fig. 5, S2: manufacturing a second through hole 101 on the second substrate 10 by laser ablation or etching, so that the second through hole 101 penetrates through the second substrate 10 and a part of the second heat conduction layer 70;

referring to fig. 6, S3: depositing a metal heat conduction material in the second through hole 101 by using a metal sputtering process and a photolithography process to form a second heat conduction member 52;

referring to fig. 7, S4: forming a blue light flat layer 25 at a corresponding position on the second substrate 10 by using an evaporation or coating process;

referring to fig. 8, S5: forming a red color resistor 23 and a green color resistor 24 at corresponding positions on the second substrate 10 by using evaporation, coating or photolithography processes;

referring to fig. 9, S6: forming red quantum dots 21 on the red color resists 23 and green quantum dots 22 on the green color resists 24 by adopting an evaporation process;

referring to fig. 10, S7: manufacturing a transparent resin material film layer on the blue light flat layer 25, the red quantum dots 21 and the green quantum dots 22 by adopting a vapor deposition method or a coating process to form a heat resistance layer 90;

referring to fig. 11, S8: a layer of transparent graphene material is manufactured on the heat resistance layer 90 by adopting a vapor deposition method to form a third heat conduction layer 80;

referring to fig. 12, S9: slightly etching the first surface 71 of the second heat conduction layer 70 and the second surface 81 of the third heat conduction layer 80 by adopting a dry etching process to roughen the first surface 71 and the third surface 61;

the above-mentioned S1 to S9 form a quantum dot substrate structure.

Referring to fig. 13, S10: forming an LED driving substrate structure with a first heat conduction layer 60, a second substrate 40 and a light emitting layer 30 by adopting methods of glass laser ablation, etching, metal film forming and metal etching;

referring to fig. 3 and 14, S11: processing the first surface 71 of the first heat conducting layer 60 by using a photoetching process and an etching process to form a mosaic structure;

the above S10 and S11 form an LED driving substrate structure.

Referring to fig. 2a, S12: the LED driving substrate structure and the quantum dot substrate structure are combined to connect the first heat conduction member 51 and the second heat conduction post, and the first heat conduction member 51 and the second heat conduction member 52 can form a supporting structure, so as to obtain the display panel having the second substrate 10 made of glass.

When the material of the second substrate 10 is colorless polyimide, the steps of the display panel manufacturing process (S1-S13) are as follows:

referring to fig. 15, S1: the sacrificial layer 92 (such as an optical release adhesive), the second thermal conductive layer 70 (such as a graphene material), and the second substrate 10 (colorless polyimide) are sequentially formed on the glass substrate 91, and the manufacturing method thereof can refer to the manufacturing process of the display panel when the second substrate 10 is made of a glass material.

Referring to fig. 16, S2 to S8 are the same as S2 to S8 of the manufacturing process of the display panel when the second substrate 10 is made of glass;

referring to fig. 12, S9: stripping the sacrificial layer 92 and the glass substrate 91 from the film layer thereon by adopting a laser stripping process;

referring to fig. 2a, S10 to S13 are the same as S9 to S12 of the above-mentioned manufacturing process of the display panel when the second substrate 10 is made of glass.

It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

Claims

1. A display panel, comprising:

the first substrate is provided with a driving array;

the light emitting units are arranged on one side of the first substrate, which is provided with a driving array, and the driving array is electrically connected with the light emitting units;

and at least part of the heat conduction assembly is arranged between the adjacent light emitting units.

2. The display panel according to claim 1, further comprising a second substrate disposed opposite to the first substrate, wherein a side of the second substrate facing the first substrate is provided with a light conversion unit disposed at a light exit side of the light emitting unit.

3. The display panel of claim 2, wherein the first substrate has a first through hole;

the heat conduction assembly comprises a first heat conduction layer and a first heat conduction piece, the first heat conduction layer is arranged on the other side, away from the light emitting units, of the first substrate, and the first heat conduction piece is arranged between the adjacent light emitting units;

the first heat conducting piece is connected with the first heat conducting layer through the first through hole.

4. The display panel of claim 3, wherein the heat conducting assembly further comprises a second heat conducting member and a second heat conducting layer, the second substrate defines a second through hole;

the second heat conducting layer is stacked on one side, back to the light conversion unit, of the second substrate, one end of the second heat conducting piece is connected with the second heat conducting layer, and the other end of the second heat conducting piece is connected with the first heat conducting piece through the second through hole.

5. The display panel of claim 4, wherein the heat conducting assembly further comprises a third heat conducting layer disposed between the light emitting unit and the light conversion unit, and the first heat conducting member and/or the second heat conducting member are connected to the third heat conducting layer.

6. The display panel of claim 5, further comprising a thermal barrier layer disposed between the third thermally conductive layer and the light conversion unit.

7. The display panel of claim 3, wherein a surface of the first thermally conductive layer facing away from the light emitting cells is provided with a heat dissipating texture.

8. The display panel of claim 3, wherein the first thermal conductive members are a plurality of first thermal conductive members, the first thermal conductive members surround to form a plurality of cavities, and the light emitting units are in one-to-one correspondence with the cavities and are accommodated in the cavities.

9. The display panel according to claim 4, wherein the second heat conductive member includes a heat absorbing portion and a heat dissipating portion connected to each other, the heat absorbing portion is at least partially connected to the light conversion unit, the heat absorbing portion has a trapezoidal cross section, an upper base of the trapezoid is connected to the first heat conductive member, a lower base of the trapezoid is connected to the heat dissipating portion, and the heat dissipating portion is connected to the second heat conductive member.

10. An electronic device characterized by comprising the display panel according to any one of claims 1 to 9.