CN105897150A - Low-junction-temperature photovoltaic junction box and chip assembly therefor - Google Patents
Low-junction-temperature photovoltaic junction box and chip assembly therefor Download PDFInfo
- Publication number
- CN105897150A CN105897150A CN201610284804.8A CN201610284804A CN105897150A CN 105897150 A CN105897150 A CN 105897150A CN 201610284804 A CN201610284804 A CN 201610284804A CN 105897150 A CN105897150 A CN 105897150A
- Authority
- CN
- China
- Prior art keywords
- junction box
- chip assembly
- aluminium base
- shell
- junction temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 48
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 47
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000741 silica gel Substances 0.000 claims abstract description 7
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 7
- 239000004411 aluminium Substances 0.000 claims description 43
- 230000000994 depressogenic effect Effects 0.000 claims description 12
- 238000005516 engineering process Methods 0.000 claims description 8
- 239000011258 core-shell material Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract 4
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
- H02S40/345—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a low-junction-temperature photovoltaic junction box and a chip assembly therefor. The junction box comprises a chip module and a housing covering the chip module. The chip module comprises a chip assembly, and the chip assembly is provided with a circuit surface with a circuit, and a heat dissipation surface opposite to the circuit surface. The heat dissipation surface directly contacts with the housing. The chip assembly for the junction box comprises an aluminum substrate, a plurality of diodes, and a plurality of binding posts, wherein the diodes and the binding posts are connected to the aluminum substrate. One surface, connected with the diodes and the binding posts, of the aluminum substrate is the circuit surface, and the other surface, opposite to the circuit surface, of the aluminum substrate is the heat dissipation surface. A conventional junction box is formed by the jointing of a box body and a heat dissipation copper piece. However, the housing of the junction box directly contacts with the heat dissipation surface of the chip assembly, thereby forming a body, and enabling the heat dissipation capability of the body to be stronger. The junction box removes an air (hollow junction box) or silica gel (gluing junction box) heat conducting layer, reduces the thermal resistance, and enables the heat dissipation capability to be stronger than the conventional junction box by several times.
Description
Technical field
The present invention relates to a kind of low junction temperature photovoltaic junction box and the chip assembly for low junction temperature photovoltaic junction box.
Background technology
Photovoltaic junction box is automatically controlled between solar cell array and the solar charging of solar module composition
Adapter between device processed, its Main Function is that the electric power produced by solaode connects with outside line
Connect, simultaneously in the case of mismatch occurs in photovoltaic cell, play the effect of shunting, it is ensured that will not be due to difference
(wooden pail effect) is also obstructed in the cell piece output that cell piece has caused.Photovoltaic junction box typically has box body, line
Cable and adapter are constituted, and wherein box body is main portions, including box body, interior metal copper sheet, diode,
Lids etc., wherein box body is connected with lid and collectively forms the shell of rosette.Existing photovoltaic junction box master
Encapsulating to be divided into and the rosette of two kinds of structures of hollow.Wherein, hollow rosette is by the sealing rubber on lid
Cushion rubber plays lid and the effect (being similar to the sealing means of insulating cup) of box body sealing.
Weigh rosette quality it is important that heat radiation and seal two big indexs.Due to the requirement sealed, thus lead
Causing junction box and external environment, without cross-ventilation, this just influences whether the another one index of rosette
Heat radiation.Dispelling the heat the diode junction temperature in bad rosette can be higher, when exceeding certain threshold value, and meeting
Occur that diode leakage current is excessive and affect the situation of generated energy, there will be because diode is overheated time serious
The rosette caused is burnt.Therefore, rosette design needs acquirement in terms of sealing and heat radiation two indices flat
Weighing apparatus.Prior art be limited in that diode junction temperature is higher, be difficult to further decline, thus cause connecing
It is the shortest or be easiest to out of order parts that line box becomes the photovoltaic module life-span.
Summary of the invention
For solving above-mentioned technical problem, it is an object of the invention to provide a kind of good airproof performance, heat dispersion simultaneously
Good low junction temperature photovoltaic junction box and the chip assembly for low junction temperature photovoltaic junction box, it compares existing tradition
The rosette diode operating temperature when bypass protection duty is lower, and reliability is higher.
The one low junction temperature photovoltaic junction box that the present invention proposes: it includes chip module, is coated on chip module
Outer shell, chip module includes chip assembly, and this chip assembly has the circuit surface with circuit and is somebody's turn to do
The radiating surface that circuit surface is relative, radiating surface directly contacts with shell.
Further, chip assembly include aluminium base, multiple diodes of being connected on aluminium base and multiple connect
Terminal, the connection of aluminium base has the circuit surface that one side is chip assembly of diode and binding post, aluminium base
The another side relative with described one side is the radiating surface of chip assembly.
Further, circuit surface is towards the photovoltaic component back plate being connected with described shell.
Further, the outer surface of shell has depressed part, the position of this depressed part and aluminium base connect
The position of the multiple diodes connect is corresponding.
Further, having groove inside shell, the circuit surface of chip assembly is towards groove and embeds in groove.
Further, diode is Schottky diode, and binding post is electroplating surfaces with tin copper sheet, and at least one
Individual binding post stretches out cover plate and shell.
Further, shell has protrusion and for fixing the fixture of cable.
Further, case surface is for limiting the thickness of noted silica gel between shell and photovoltaic component back plate
Salient point.
Further, diode is connected on aluminium base by surface mounting technology.
The invention allows for a kind of chip assembly for low junction temperature photovoltaic junction box, it include aluminium base,
The multiple diodes being connected on described aluminium base and multiple binding post, the connection of aluminium base has diode and connects
The one side of terminal is circuit surface, and the another side relative with circuit surface of aluminium base is radiating surface.
Further, the circuit surface of aluminium base is towards the photovoltaic module back of the body being connected with low junction temperature photovoltaic junction box
Plate.
By such scheme, the present invention at least has the advantage that
1) existing rosette is all box body+radiating copper sheet splicing form, and the present invention low junction temperature photovoltaic junction box
Shell directly contact with the radiating surface of chip assembly, form an entirety, make integral heat sink ability higher；
2) radiating surface of the chip assembly of this low junction temperature photovoltaic junction box directly contacts with shell, and traditional wired
Box internal structure is compared, and eliminates air (hollow rosette) or silica gel (potting compound junction box) heat-conducting layer,
Reduce thermal resistance, make the heat-sinking capability of this low junction temperature photovoltaic junction box improve several times than conventional electrical connectors；
3) this is one side radiator structure for the chip assembly of low junction temperature photovoltaic junction box, and this structure can make core
The unidirectional conduction of heat produced by chip module is to air, and does not conducts to photovoltaic component back plate, this chip assembly
Heat-sinking capability to compare radiating copper sheet higher, and when the radiating surface of chip assembly directly contacts with shell, its
Radiating effect is more preferable；
4) depressed part in the case surface of this low junction temperature photovoltaic junction box, makes rosette be connected with photovoltaic module
Time, junction box structure heating position (position of i.e. corresponding diode, wherein diode is pyrotoxin) and light
In the middle of photovoltaic assembly backboard, there is air layer, it is ensured that outside unidirectional rosette of dispelling the heat, thus substantially reduce wiring
The impact on photovoltaic module of the heat of box；
5) having cable bayonet socket on the shell of this low junction temperature photovoltaic junction box, its structure is installed at photovoltaic plant
Time as cable fixing structure, thus when saving installation, can also need artificially to use elastic cord to bind cable
Work, improve the safety of system.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technology of the present invention
Means, and can being practiced according to the content of description, below with presently preferred embodiments of the present invention and coordinate attached
After figure describes in detail such as.
Accompanying drawing explanation
Fig. 1 is the Facad structure schematic diagram of the low junction temperature photovoltaic junction box in the embodiment of the present invention one；
Fig. 2 is that the back side of the low junction temperature photovoltaic junction box in the embodiment of the present invention one (is connected with photovoltaic module
One side) structural representation；
Fig. 3 is the cross-sectional view of the low junction temperature photovoltaic junction box in the embodiment of the present invention one, Qi Zhongjie
Terminal is not drawn into；
Fig. 4 is the chip assembly in the low junction temperature photovoltaic junction box in the embodiment of the present invention one and for low junction temperature
The structural representation of the chip assembly of photovoltaic junction box；
Fig. 5 is the structural representation of the low junction temperature photovoltaic junction box chips module in the embodiment of the present invention two；
Wherein: 1-shell；11-depressed part；12-fixture；13-salient point；14-groove；2-chip module；21-
Cover plate；22-aluminium base；221-insulating barrier；222-conduction region；23-diode；24-binding post；25-bis-pole
Pipe cross structure.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment, the detailed description of the invention of the present invention is described in further detail.With
Lower embodiment is used for illustrating the present invention, but is not limited to the scope of the present invention.
Embodiment one:
With reference to figures 1 through accompanying drawing 4, a kind of low junction temperature photovoltaic junction box, it includes chip module 2, is coated on
The shell 1 of chip module outer 2.
Chip module 2 includes chip assembly, and this chip assembly has the circuit surface with circuit and this circuit
The radiating surface that face is relative, described radiating surface directly contacts with above-mentioned shell 1.
Above-mentioned circuit surface is towards the photovoltaic component back plate being connected with shell.Described photovoltaic component back plate can
To use macromolecule backboard, it would however also be possible to employ glass back plate.
Attachment structure between shell 1 and chip assembly has various ways, the present embodiment as shown in Figure 3
In, give the attachment structure between a kind of shell 1 and chip assembly: the inner side of shell 1 has groove 14,
The circuit surface of chip assembly is towards groove 14 and embeds in groove 14 so that the circuit surface of chip assembly with
Shell 1 directly contacts, will aluminium base 22 be not connected with diode 23 and binding post 24 one facing to
Aluminium base 22 is also embedded in groove 14 by groove 14 so that aluminium base 22 not with diode 23 and connecing
The one side that terminal 24 connects directly contacts with shell 1.
Chip assembly includes aluminium base 22, the multiple diodes 23 being connected on aluminium base 22 and multiple wiring
Post 24.The connection of aluminium base 22 has the circuit surface that one side is chip assembly of diode 23 and binding post 24,
The radiating surface that the another side relative with described one side is chip assembly of aluminium base 22.
In the present embodiment as shown in Figure 4, aluminium base 22 has insulating barrier 221, and insulating barrier 221 has
There is multiple conduction region 222 being arranged in order, between adjacent two conduction regions 222, there is space so that insulating barrier
221 expose, and each diode 23 is connected on each conduction region 222, and each diode 23 passes through respectively
Another conduction region 222 that one diode cross structure 25 is adjacent with this conduction region 222, diode 23 place is connected
Connect.Specifically, used by the present embodiment, diode 23 is Schottky diode, owing to chip assembly uses aluminum base
Plate & Schottky diode chip, compares prior art, eliminates epoxy resin, enhance moment heat-sinking capability,
Utilizing aluminium base to expand cooling surface area, the epoxy resin saved decreases heat dissipation channel path simultaneously；Connect
Terminal 24 is electroplating surfaces with tin copper sheet.
In a kind of highly preferred embodiment, diode 23 is by surface mounting technology (surface mount
Technology) it is connected on described aluminium base 22, so that the production capacity of chip assembly and reliability
It is obtained for the biggest raising.Above-mentioned diode 23 can also use other to be applicable to surface mounting technology
The diode of packaged type, such as: TO encapsulates.
Having depressed part 11 on the outer surface of shell 1, the position of this depressed part 11 is connected on aluminium base 22
The position of multiple diodes 23 corresponding, depressed part 11 one side at place on shell 1 is shell 1
The back side, i.e. shell 1 are when mounted towards the one side of photovoltaic component back plate, and this back side is positioned at the close of shell 1
The side of chip assembly circuit surface.In the present embodiment, depressed part 11 is rectangle, the degree of depth about 1mm, this structure
Design guarantees that heating position (position of i.e. corresponding diode 23) is not directly contacted with photovoltaic component back plate, by
The intermediate air layer that depressed part 11 is formed is alleviated heat to a certain extent and is directly transmitted to photovoltaic module.With
Time owing to the heat conductivility of aluminium base 22 is far above plastics, most of heat that diode 23 sends will pass through
Aluminium base 22 is outwards derived, and therefore compares with conventional electrical connectors, and the heat guiding backboard direction reduces in a large number,
In addition the air layer between rosette shell 1 and photovoltaic component back plate, generates heat diode 23 to photovoltaic module
Impact be preferably minimized.
Shell 1 has protrusion and for fixing the fixture 12 of cable.Fixture 12 is positioned at the dual-side of shell 1,
And protrude, as shown in Figures 1 and 2 to the another side (front) that depressed part 11 place one side is contrary.
Between shell 1 and photovoltaic component back plate by note silica gel (accompanying drawing is not drawn into) mutually bonding.Silica gel is noted
One side (back side) at above-mentioned depressed part 11 place of shell 1.This face has the circular salient point of protrusion
13, as shown in Figure 2, by the effect of salient point 13, to guarantee that silica gel has in bonding bonding processes
Certain thickness, is unlikely to the thinnest, and thickness is uniform.
Referring to the drawings 4, the present embodiment additionally provides a kind of chip assembly for low junction temperature photovoltaic junction box, should
Chip assembly includes aluminium base 22, the multiple diodes 23 being connected on aluminium base 22 and multiple binding post 24.
The connection of aluminium base 22 has diode 23 and binding post 24 one side for circuit surface, aluminium base with described one side
Relative another side is radiating surface.
This chip assembly is after being connected with the shell of photovoltaic junction box, and radiating surface directly contacts with shell, photovoltaic
Rosette is when installing with photovoltaic component back plate, and the circuit surface of aluminium base is towards the photovoltaic being connected with institute shell
Assembly backboard.Described photovoltaic component back plate can use macromolecule backboard, it would however also be possible to employ glass back plate.
About aluminium base 22, diode 23, the concrete structure of binding post 24, use material and connect shape
Formula and advantage, have described that above, is not repeated herein.
Embodiment two:
With reference to accompanying drawing 5, the low junction temperature photovoltaic junction box in the present embodiment differs only in embodiment one: this
In embodiment, shell 1 integrated injection molding is on chip module 2 and coating chip module 2.
In order to, in shell 1 injection molding process, the circuit surface of protection chip assembly will not be damaged, this
Chip module 2 in embodiment also includes being connected with chip assembly and cover the circuit surface at chip assembly
Cover plate 21.
As shown in Figure 5, cover plate 21 covers the circuit surface at chip assembly.One end of binding post 24 is all stretched
Go out cover plate 21.Can be carried by an epoxy glue between cover plate 21 and chip assembly (preferably at diode)
High reliability.Due to the modularized design of chip, when integrated injection molding, chip module 2 can be made direct
It is embedded in cabinet 1, and the radiating surface of chip assembly is directly contacted with shell 1.
In the present embodiment, it is interlockingly connected between chip assembly and cover plate 21, binding post 24 or aluminium base 22 and lid
Between plate 21, phase interference fit connects, so that cover plate 21 blocks fixing mutually with chip assembly, it should be noted that
It is that cover plate 21 is not limited to interference fit with chip assembly and is connected, it would however also be possible to employ snap fit connects, screw is fixed
Connected mode of the prior art Deng other.
The above is only the preferred embodiment of the present invention, is not limited to the present invention, it is noted that
For those skilled in the art, on the premise of without departing from the technology of the present invention principle, also
Can make some improvement and modification, these improve and modification also should be regarded as protection scope of the present invention.
Claims (10)
1. one kind low junction temperature photovoltaic junction box, it is characterised in that: it includes chip module, is coated on described core
Shell outside sheet module, described chip module includes chip assembly, and this chip assembly has with circuit
The radiating surface that circuit surface is relative with this circuit surface, described radiating surface directly contacts with described shell.
Low junction temperature photovoltaic junction box the most according to claim 1, it is characterised in that: described chipset
Part includes aluminium base, the multiple diodes being connected on described aluminium base and multiple binding post, described aluminium base
Connection have the circuit surface that one side is described chip assembly of diode and binding post, aluminium base with described
Simultaneously relative to the radiating surface that another side is described chip assembly.
Low junction temperature photovoltaic junction box the most according to claim 1, it is characterised in that: described circuit surface
Towards the photovoltaic component back plate being connected with described shell.
Low junction temperature photovoltaic junction box the most according to claim 2, it is characterised in that: outside described shell
There is depressed part, the position of the position of this depressed part and the multiple diodes being connected on described aluminium base on surface
Corresponding.
Low junction temperature photovoltaic junction box the most according to claim 1, it is characterised in that: in described shell
Side has groove, and the circuit surface of described chip assembly is towards described groove and embeds in groove.
Low junction temperature photovoltaic junction box the most according to claim 1, it is characterised in that: described shell tool
There is protrusion and for fixing the fixture of cable.
Low junction temperature photovoltaic junction box the most according to claim 1, it is characterised in that: described shell table
Face is for limiting the salient point of the thickness of noted silica gel between shell and photovoltaic component back plate.
Low junction temperature photovoltaic junction box the most according to claim 2, it is characterised in that: described diode
It is connected on described aluminium base by surface mounting technology.
9. the chip assembly for low junction temperature photovoltaic junction box, it is characterised in that: it include aluminium base,
The multiple diodes being connected on described aluminium base and multiple binding post, the connection of described aluminium base has diode
Being circuit surface with the one side of binding post, the another side relative with described circuit surface of aluminium base is radiating surface.
Chip assembly the most according to claim 9, it is characterised in that: the circuit surface of described aluminium base
Towards the photovoltaic component back plate being connected with low junction temperature photovoltaic junction box.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610284804.8A CN105897150A (en) | 2016-04-29 | 2016-04-29 | Low-junction-temperature photovoltaic junction box and chip assembly therefor |
| PCT/CN2016/113567 WO2017185803A1 (en) | 2016-04-29 | 2016-12-30 | Photovoltaic junction box with low junction temperature and chip assembly for photovoltaic junction box with low junction temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610284804.8A CN105897150A (en) | 2016-04-29 | 2016-04-29 | Low-junction-temperature photovoltaic junction box and chip assembly therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105897150A true CN105897150A (en) | 2016-08-24 |
Family
ID=56702520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610284804.8A Pending CN105897150A (en) | 2016-04-29 | 2016-04-29 | Low-junction-temperature photovoltaic junction box and chip assembly therefor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105897150A (en) |
| WO (1) | WO2017185803A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106452348A (en) * | 2016-10-17 | 2017-02-22 | 江阴市顺意科技开发有限公司 | Solar photovoltaic conjunction box with good heat dissipation |
| WO2017185803A1 (en) * | 2016-04-29 | 2017-11-02 | 苏州元昱新能源有限公司 | Photovoltaic junction box with low junction temperature and chip assembly for photovoltaic junction box with low junction temperature |
| CN108173515A (en) * | 2017-12-25 | 2018-06-15 | 苏州元昱新能源有限公司 | low temperature photovoltaic junction box |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108988779B (en) * | 2018-06-14 | 2023-07-07 | 四川特克利电气有限公司 | Liquid-cooled photovoltaic cell junction box and working method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202549867U (en) * | 2011-11-29 | 2012-11-21 | 余姚市金烨光伏科技有限公司 | Photovoltaic junction box |
| JP2014007265A (en) * | 2012-06-23 | 2014-01-16 | Angel Kogyo Kk | Terminal box for crystal silicon based solar cell module, and crystal silicon based solar cell module with terminal box |
| CN103944505A (en) * | 2014-04-25 | 2014-07-23 | 江苏九鼎光伏系统有限公司 | Photovoltaic cell module terminal box of wiring window free of bus bars on surface |
| US20140307408A1 (en) * | 2013-04-12 | 2014-10-16 | Hosiden Corporation | Terminal Box |
| JP2015026699A (en) * | 2013-07-25 | 2015-02-05 | 三菱電機株式会社 | Terminal box |
| CN204392166U (en) * | 2015-02-10 | 2015-06-10 | 扬州朗日新能源科技有限公司 | Can quick heat radiating terminal box |
| CN204559498U (en) * | 2015-04-29 | 2015-08-12 | 江苏云之尚节能科技有限公司 | Diode (led) module plug-in type photovoltaic cell junction box |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201436750U (en) * | 2009-06-05 | 2010-04-07 | 上海晶龙光电科技有限公司 | Junction box structure of solar photovoltaic assembly |
| CN201435569Y (en) * | 2009-07-04 | 2010-03-31 | 边刚 | Solar energy photovoltaic terminal box |
| US20150003021A1 (en) * | 2013-06-29 | 2015-01-01 | Chicony Power Technology Co., Ltd. | Inverter module |
| CN204906312U (en) * | 2015-09-11 | 2015-12-23 | 上海艾力克新能源有限公司 | Photovoltaic junction box |
| CN105897150A (en) * | 2016-04-29 | 2016-08-24 | 黄子健 | Low-junction-temperature photovoltaic junction box and chip assembly therefor |
| CN205754206U (en) * | 2016-04-29 | 2016-11-30 | 黄子健 | Low junction temperature photovoltaic junction box and the chip assembly for low junction temperature photovoltaic junction box |
-
2016
- 2016-04-29 CN CN201610284804.8A patent/CN105897150A/en active Pending
- 2016-12-30 WO PCT/CN2016/113567 patent/WO2017185803A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202549867U (en) * | 2011-11-29 | 2012-11-21 | 余姚市金烨光伏科技有限公司 | Photovoltaic junction box |
| JP2014007265A (en) * | 2012-06-23 | 2014-01-16 | Angel Kogyo Kk | Terminal box for crystal silicon based solar cell module, and crystal silicon based solar cell module with terminal box |
| US20140307408A1 (en) * | 2013-04-12 | 2014-10-16 | Hosiden Corporation | Terminal Box |
| JP2015026699A (en) * | 2013-07-25 | 2015-02-05 | 三菱電機株式会社 | Terminal box |
| CN103944505A (en) * | 2014-04-25 | 2014-07-23 | 江苏九鼎光伏系统有限公司 | Photovoltaic cell module terminal box of wiring window free of bus bars on surface |
| CN204392166U (en) * | 2015-02-10 | 2015-06-10 | 扬州朗日新能源科技有限公司 | Can quick heat radiating terminal box |
| CN204559498U (en) * | 2015-04-29 | 2015-08-12 | 江苏云之尚节能科技有限公司 | Diode (led) module plug-in type photovoltaic cell junction box |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017185803A1 (en) * | 2016-04-29 | 2017-11-02 | 苏州元昱新能源有限公司 | Photovoltaic junction box with low junction temperature and chip assembly for photovoltaic junction box with low junction temperature |
| CN106452348A (en) * | 2016-10-17 | 2017-02-22 | 江阴市顺意科技开发有限公司 | Solar photovoltaic conjunction box with good heat dissipation |
| CN108173515A (en) * | 2017-12-25 | 2018-06-15 | 苏州元昱新能源有限公司 | low temperature photovoltaic junction box |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017185803A1 (en) | 2017-11-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20080110490A1 (en) | Photovoltaic connection system | |
| CN105897150A (en) | Low-junction-temperature photovoltaic junction box and chip assembly therefor | |
| KR20100134030A (en) | Junction box for solar modules | |
| CN102420266A (en) | Solar terminal box | |
| CN206042603U (en) | Waterproof anti -corrosion structure of electronic governor circuit board | |
| CN104579158A (en) | Junction box for solar power generating assembly and machining method of junction box | |
| CN106206459A (en) | Package assembling | |
| CN205754206U (en) | Low junction temperature photovoltaic junction box and the chip assembly for low junction temperature photovoltaic junction box | |
| JP2007311714A (en) | Diode module, connector for solar cell module, and its manufacturing method | |
| CN202065737U (en) | Light-emitting diode lamp | |
| CN105141246A (en) | Waterproof and heat-resistant solar junction box | |
| CN212510550U (en) | LED light source module with good waterproof effect | |
| CN207938645U (en) | Ceramic white light sticking type LED light source | |
| CN207869062U (en) | low temperature photovoltaic junction box | |
| CN106287261B (en) | High-power LED outdoor waterproof module lamp | |
| CN205453629U (en) | Solar energy terminal block | |
| CN218348449U (en) | LED lamp heat radiation structure | |
| CN203482156U (en) | Photovoltaic conjunction box and photovoltaic power generation system having same | |
| CN203036306U (en) | LED lamp module | |
| CN211265445U (en) | Integrated power module of PFC circuit and air conditioner | |
| KR20110042018A (en) | Chip lead frame and photoelectric energy transducing module | |
| CN203522631U (en) | Photovoltaic bypass diode module, photovoltaic conjunction box and photovoltaic power generation system | |
| CN220874509U (en) | Solar photovoltaic junction box | |
| CN214172084U (en) | LED electronic components packaging structure | |
| CN102983194A (en) | Solar connecting box |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160824 |