CN210607323U

CN210607323U - LED packaging module applying TOP packaging and display screen

Info

Publication number: CN210607323U
Application number: CN201921367322.4U
Authority: CN
Inventors: 谢博学; 石昌金; 徐梦梦
Original assignee: Shenzhen Absen Optoelectronic Co Ltd; Huizhou Absen Optoelectronic Co Ltd
Current assignee: Shenzhen Absen Optoelectronic Co Ltd; Huizhou Absen Optoelectronic Co Ltd
Priority date: 2019-08-20
Filing date: 2019-08-20
Publication date: 2020-05-22
Anticipated expiration: 2029-08-20

Abstract

The application discloses LED encapsulation module and display screen of using TOP encapsulation, LED encapsulation module include a plurality of LED units, encapsulate in an organic whole. Each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on the same die bonding frame; each LED chip comprises a first electrode and a second electrode; the first electrode of each LED chip is electrically connected with the same die bonding frame, the second electrode of each LED chip is correspondingly electrically connected with a non-die bonding frame, and the die bonding frames of at least two LED units are the same die bonding frame. Through the mode, the lead frame can be effectively reduced.

Description

LED packaging module applying TOP packaging and display screen

Technical Field

The application relates to the technical field of LED display, in particular to an LED packaging module and a display screen applying TOP packaging.

Background

The LED display screen has the advantages of wide display color gamut, high brightness, large visual angle, low power consumption, long service life and the like, and has wide market in the fields of inside and outside wall body display in public places such as markets, airports, railway stations and the like. To meet the higher performance requirements of people on display products, the development of LED display screens is moving towards high resolution, which requires LED units with smaller size and pitch.

At present, the LED display screen mostly adopts independent LED packaging form, a plurality of LED chips that represent a pixel are packaged into an independent LED packaging unit, and after the display screen is formed by a plurality of LED packaging units of the packaging mode, the number of lead frames or bonding pads of the display screen is too much, so that the manufacturing difficulty is improved, and the packaging cost is increased.

SUMMERY OF THE UTILITY MODEL

The technical problem that this application mainly solved provides LED encapsulation module assembly and display screen who uses TOP encapsulation, can effectively reduce the quantity of lead frame.

In order to solve the technical problem, the application adopts a technical scheme that: an LED package module using TOP package is provided, which includes a plurality of LED units packaged together. Each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on one die bonding frame; each LED chip comprises a first electrode and a second electrode; the first electrode of each LED chip is electrically connected with the same die bonding frame, the second electrode of each LED chip is correspondingly electrically connected with a non-die bonding frame, and the die bonding frames of at least two LED units are the same die bonding frame.

In order to solve the above technical problem, another technical solution adopted by the present application is: a display screen is provided, which comprises the LED packaging module applying TOP packaging provided by the application.

Compared with the prior art, the beneficial effects of this application are: through encapsulating a plurality of LED units in an organic whole, the solid brilliant frame of two at least LED units is same solid brilliant frame for the LED chip of these two at least LED units is fixed in same solid brilliant frame, and the first electrode of LED chip all is connected to this same solid brilliant frame, for LED unit individual packaging, effectively reduce the quantity of lead frames such as solid brilliant frame, simplify the structure, a plurality of LED units are encapsulated in an organic whole and are made the volume increase of encapsulation module, thereby reduce the welding degree of difficulty and the manufacturing degree of difficulty, improve the mechanical strength of LED encapsulation module.

Drawings

Fig. 1 is a schematic view of a first lead structure of an embodiment of an LED package module according to the present application;

FIG. 2 is a schematic diagram of a layout of an LED chip according to an embodiment of the present application;

fig. 3 is a schematic diagram of a second lead structure of an embodiment of an LED package module according to the present application;

fig. 4 is a schematic view of a third lead structure of an embodiment of an LED package module according to the present application;

FIG. 5 is another schematic view of a third lead structure of an embodiment of an LED package module according to the present application;

fig. 6 is a schematic diagram of a fourth lead structure of an embodiment of an LED package module according to the present application;

FIG. 7 is another schematic view of a fourth lead structure of an embodiment of an LED package module according to the present application;

FIG. 8 is a schematic top view of an LED package module according to an embodiment of the present invention;

FIG. 9 is a schematic view of the cross-sectional structure A-A of FIG. 8;

FIG. 10 is a schematic diagram of another top view structure of an embodiment of an LED package module according to the present application;

FIG. 11 is a schematic view of section B-B of FIG. 10;

FIG. 12 is a schematic view of an alternative configuration of section B-B of FIG. 10;

fig. 13 is a schematic structural diagram of an embodiment of a display screen of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1 to 7, an embodiment of an LED package module of the present application includes a plurality of LED units 10. When the LED package module is assembled in a display screen, each LED unit 10 becomes a pixel of the display screen. Furthermore, each LED packaging module in the display screen comprises a plurality of pixels. Meanwhile, each pixel may include a plurality of sub-pixels. The plurality of LED units 10 are packaged together to form the LED package module of the present embodiment. For the light emitting manner of the LED package module, the LED package module of the present embodiment can be packaged by using TOP packaging technology, so that the LED package module of the present embodiment realizes TOP light emission. For a specific chip packaging manner, the LED package module of this embodiment may package the LED chip by using QFN packaging technology and/or PLCC packaging technology, and certainly may also package other packaging technologies, or may package the LED package module by comprehensively using multiple packaging technologies at the same time.

As shown in fig. 1, each LED unit 10 includes a plurality of LED chips 11, a die bond frame 12, and a plurality of non-die bond frames 13. The LED chip 11 can emit light after being energized. The plurality of LED chips 11 in each LED unit 10 may be the same type of LED chip, or may be different types of LED chips, for example, one or more of a red LED chip, a green LED chip, a blue LED chip, and the like. Of course, other parameters of the LED chip 11 in each LED unit 10, such as power, size, etc., may be the same or different. The LED chips 11 of different LED units 10 may be the same or different.

Each LED chip 11 includes a first electrode (not labeled) and a second electrode (not labeled). The first electrode and the second electrode are positive and negative electrodes, for example. The first electrode is, for example, a positive electrode, and the second electrode is a negative electrode. In this embodiment, the corresponding positive and negative electrodes of the first electrode and the second electrode of different LED chips 11 may be the same or different. For the same situation, for example, the first electrodes of all the LED chips 11 of the LED package module are positive electrodes, and the second electrodes are negative electrodes. For different cases, for example, in one LED unit 10, the first electrode of one LED chip 11 is a positive electrode, the second electrode is a negative electrode, the first electrode of another LED chip 11 can be a negative electrode, and the second electrode can be a positive electrode. The arrangement of the positive and negative electrodes of the first and second electrodes of the LED chip 11 can be adjusted and determined according to the requirements of the LED module in the specific design process.

The die bond frame 12 and the non-die bond frame 13 may be used as lead frames for electrically connecting to the first electrode and the second electrode of the LED chip 11, respectively. The plurality of non-die bonding frames 13 of each LED unit 10 are spaced from each other, and the die bonding frames 12 and the non-die bonding frames 13 are spaced from each other.

The die bond frame 12 and the non-die bond frame 13 may be of unitary construction. As shown in fig. 1, the die bond frame 12 and the non-die bond frame 13 may be integral parts of a support 40 of unitary construction. As an example, the die bonding frame 12 and the non die bonding frame 13 may be formed by performing corresponding processes on a single metal substrate, such as a stamping process, and then injection molding may be performed to perform processes such as spacing and insulation on the die bonding frame 12 and the non die bonding frame 13, or electroplating may be performed to form the integrated bracket 40. As another example, a mounting process is performed on an insulating substrate, and the die bonding frame 12 and the non-die bonding frame 13 are attached to the insulating substrate and spaced apart from each other, so that the die bonding frame 12, the non-die bonding frame 13, and the insulating substrate may form the support 40 of an integrated structure. Each LED unit 10 may have a respective one of the legs 40 of the unitary structure, including all of the die bond frames 12 and the non-die bond frames 13 of the unit. The whole LED package module may also have a support 40 of an integrated structure, including the die bond frames 12 and the non-die bond frames 13 of all the LED units 10.

In the present embodiment, at least one surface of each die bond frame 12 of the LED package module is exposed to the side and/or bottom surface of the LED package module. At least one surface of each of the non-die bond frames 13 is exposed to the side and/or bottom surface of the LED package module. The packaging structure is convenient for subsequent welding of the LED packaging module or connection with other components. As shown in fig. 1, the surface of one side of each die attach frame 12 and each non die attach frame 13 is located at the edge of the support 40, after the LED chip 11 is packaged with the support 40, at least one surface of each die attach frame 12 and each non die attach frame 13 located at the edge of the support 40 may be exposed on the side surface and/or the bottom surface of the LED package module, which may facilitate the subsequent wire bonding to the surface of the die attach frame 12 and the non die attach frame 13 exposed on the side surface and/or the bottom surface of the LED package module, thereby implementing the driving of the LED chip 11.

In the present embodiment, the plurality of LED chips 11 of each LED unit 10 are fixed to the same die bond frame 12. For example, the die bond frame 12 of each LED unit 10 may be one, and all the LED chips 11 of the LED unit 10 are fixed on the die bond frame 12. In some embodiments, each LED unit 10 may include two or more die attach frames 12 but all the LED chips 11 of the LED unit 10 are attached to the same die attach frame 12.

Each LED chip 11 may be fixed on the die attach frame 12 by a conductive adhesive or a die attach adhesive. For the fixing manner of the conductive adhesive, the first electrode of the corresponding LED chip 11 can be directly electrically connected to the die attach frame 12 through the conductive adhesive, i.e. the vertical electrode structure. For the die attach adhesive method, the corresponding LED chip 11 is fixed to the die attach frame 12 through the die attach adhesive, and the first electrode and the second electrode are respectively electrically connected to the die attach frame 12 and the non-die attach frame 13 through the leads. As shown in fig. 1, the first electrode of at least one LED chip 11 in each LED unit 10 may be a vertical electrode structure, that is, the first electrode is fixed on the die attach frame 12 through a conductive adhesive, and can be electrically connected to the die attach frame 12 through the conductive adhesive.

As an example, the plurality of LED chips 11 of each LED unit 10 includes at least one red LED chip, at least one green LED chip, and at least one blue LED chip.

Optionally, at least one red LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame 12 by die attach adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 by a lead.

Optionally, at least one blue LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame 12 by die attach adhesive, and the corresponding first electrodes are electrically connected to the die attach frame 12 by leads.

Optionally, at least one green LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame by die attach adhesive, and the corresponding first electrodes are electrically connected to the die attach frame 12 by leads.

Through setting up at least one LED chip 11 and fixing and the solid brilliant frame 12 of electric connection through the conducting resin, can effectively promote LED chip 11's luminous efficacy and improve luminance, reduce the thermal resistance of LED encapsulation module, the other LED chips of cooperation are fixed in solid brilliant frame 12 through solid brilliant glue simultaneously, can reduce the encapsulation degree of difficulty of LED encapsulation module.

As shown in fig. 2, the LED chips 11 of each LED unit 10 include a red LED chip 11a, a green LED chip 11b and a blue LED chip 11c, and the LED chips 11 may be arranged in a triangular shape or a linear shape on the die bonding frame 12. The arrangement of the LED chips of different LED units 10 may be the same or different.

As for the connection relationship between the LED chip 11 and the die bond frame 12 and the non-die bond frame 13, the present embodiment can provide a plurality of embodiments as follows.

As shown in fig. 1, this example provides a first embodiment described below:

the plurality of LED chips 11 of each LED unit 10 are fixed to the same die bonding frame 12. The first electrode of each LED chip 11 is electrically connected to the same die bonding frame 12. The second electrode of each LED chip 11 is electrically connected to a different non-die bond frame 13.

As shown in fig. 1, the LED units 10 may be spaced apart from each other. For example, one LED package module may include four LED units 10, and the four LED units 10 may be arranged in an array. Each LED unit 10 may include three LED chips 11, one die bond frame 12, and three non-die bond frames 13. The three LED chips 11 are fixed to one side surface of the die bonding frame 12 at intervals. The first electrode of each LED chip 11 is electrically connected to the die bonding frame 12. The second electrode of each LED chip 11 is electrically connected to different non-die bond frames 13. The four die attach frames 12 are arranged in an array, and the three non-die attach frames 13 of each LED unit 10 can be adjacent to one side of the die attach frame 12 and arranged at intervals along the direction of the one side, that is, the three non-die attach frames 13 are arranged opposite to one side of the die attach frame 12.

In the present embodiment, the die bond frames 12 and any one of the non-die bond frames 13 may not be shared between the LED units 10.

By fixing the plurality of LED chips 11 of each LED unit 10 to a die attach frame 12 and electrically connecting the first electrode of each LED chip 11 to the die attach frame 12, the number of die attach frames 12 can be effectively reduced compared to the prior art in which each LED chip 11 corresponds to one die attach frame 12 and one non-die attach frame 13, if the LED package module is packaged in the form of pins, the number of pins can be effectively reduced, and the plurality of LED chips 11 are fixed to one die attach frame 12, each LED chip 11 corresponds to one non-die attach frame 13, the structural stability is improved while the electrical stability of the LED chips 11 is effectively improved, and in addition, the volume of the LED package module can be increased by integrally packaging the plurality of LED units 10, thereby reducing the welding difficulty and the manufacturing difficulty, the mechanical strength of the LED packaging module is improved.

As shown in fig. 3 to 7, the second embodiment provided in this example is described as follows:

the plurality of LED chips 11 of each LED unit 10 are fixed to the same die bond frame 12 of the LED unit 10. The first electrode of each LED chip 11 is electrically connected to the die bond frame 12. The second electrode of each LED chip 11 is electrically connected to a different non-die bond frame 13. As shown in fig. 3 and 4, in the present embodiment, the die bond frames 12 of at least two LED units 10 are the same die bond frame 12. That is, at least two LED units 10 share the same die bonding frame 12, and the first electrodes of the LED chips 11 of the at least two LED units 10 are all connected to the same die bonding frame 12.

As shown in fig. 3 and 4, for example, the LED package module includes four LED units 10, and each LED unit 10 includes three LED chips 11, one die bond frame 12, and three non-die bond frames 13. The three LED chips 11 are fixed to one side surface of the die bonding frame 12 at intervals. The first electrode of each LED chip 11 is electrically connected to the die bonding frame 12. The second electrode of each LED chip 11 is electrically connected to a different non-die bond frame 13. Two LED units 10 share one die bond frame 12, and the number of die bond frames 12 in this embodiment is reduced by one compared to that each LED unit 10 corresponds to one independent die bond frame 12. That is, as shown in fig. 1, each of the four LED units 10 corresponds to an independent die bonding frame 12, and the LED package module includes four independent die bonding frames 12, since two LED units 10 share the same die bonding frame 12, the number of the die bonding frames 12 in the LED package module is actually three.

On the basis of the first embodiment, the plurality of LED units 10 are packaged into a whole, and the die attach frames 12 of at least two LED units 10 are the same die attach frame 12, so that the LED chips 11 of the at least two LED units 10 are fixed to the same die attach frame 12, and the first electrodes of the LED chips 11 are connected to the same die attach frame 12, which reduces at least one die attach frame 12 compared with the first embodiment, thereby further effectively reducing the number of the die attach frames 12, and if the LED package module is packaged in a pin form, further effectively reducing the number of pins.

In the present embodiment, the plurality of LED units 10 of the LED package module may be arranged in an array.

As shown in fig. 3, the die bond frames 12 of the LED units 10 arranged at intervals in the row direction may be the same die bond frame 12. That is, at least two LED units 10 spaced apart on the same row share the same die attach frame 12. As in the example shown in fig. 3, the first row comprises two LED units 10 and the second row also comprises two LED units 10, as seen in the row direction. One die bonding frame 12 can be shared between two LED units 10 in the first row, one die bonding frame 12 can be shared between two LED units 10 in the second row, and the number of the die bonding frames 12 of the LED package module is two. Of course, only the LED units 10 in the first row or the second row may share the same die bonding frame 12.

As shown in fig. 4, the die bonding frames 12 of the LED units 10 arranged at intervals in the column direction may be the same die bonding frame 12. That is, at least two LED units 10 spaced apart on the same row share the same die attach frame 12. As an example shown in fig. 4, the first column comprises two LED units 10 and the second column also comprises two LED units 10, as seen in the column direction. The die bond frame 12 is shared between two LED units 10 in the first row, and the die bond frame 12 may be shared between two LED units 10 in the second row. Of course, only the LED units 10 in the first row or the second row may share the same die bonding frame 12.

The die bonding frames 12 of the LED units 10 arranged at intervals in the row direction or the column direction are the same die bonding frame 12, so that the sharing of the die bonding frames 12 by different LED units 10 is facilitated, the arrangement and the arrangement of the non-die bonding frames 13 are also facilitated, the LED chips 11 can be conveniently mounted and packaged, and the number of the die bonding frames 12 can be effectively reduced.

As shown in fig. 6, the die bonding frames 12 of all the LED units 10 in the LED package module may be the same die bonding frame 12. That is, all the LED units 10 in the LED package module share the same die bonding frame 12. The die bonding frames 12 of all the LED units 10 are the same die bonding frame 12, so that the number of the die bonding frames 12 can be further reduced, the strength of packaging the LED units 10 into a whole is improved, and the mechanical performance is improved.

For the die attach frame 12 of at least two LED units 10 is the same die attach frame 12, since the shared die attach frame 12 carries all the LED chips 11 of at least two LED units 10, and the area is large, the exposed area of the die attach frame 12 on the side and/or bottom of the entire LED package module is large, which may affect the subsequent soldering process and reliability of the LED package module, as shown in fig. 5 and 7, the shape of the shared die attach frame 12 is further improved as follows:

for example, for each LED unit 10, the plurality of non-die bond frames 13 may be disposed opposite to one side of the die bond frame 12, and of course, the plurality of non-die bond frames 13 may also be arranged on at least two sides of the die bond frame 12. At least one side of the same die bond frame 12 shared by at least two LED units 10 is disposed opposite to the plurality of non-die bond frames 13, and the other side of the same die bond frame 12 exposed on the side surface and/or the bottom surface of the LED package module may have at least one surface, for example, at least two surfaces, and at least one notch 120, for example, 4 notches 120, is formed between the two surfaces in a concave manner. The other sides for exposing the side and/or bottom surfaces of the LED package module are not disposed opposite to the die bond frame 13.

As shown in fig. 7, for the die attach frame 12 of all LED units being the same die attach frame 12, the side of the die attach frame 12 exposed to the side and/or the bottom of the LED package module may have at least two surfaces, and at least one gap 120 may be formed between the two surfaces. Specifically, the LED package module includes, for example, four LED units 10 arranged in an array, the die bonding frames 12 of the four LED units 10 are the same die bonding frame 12, and each LED unit 10 includes three LED chips 11 arranged at intervals. Six non-die bond frames 13 of two LED units 10 are arranged at intervals along one side of the die bond frame 12. Six non-die bond frames 13 of the other two LED units 10 are arranged at intervals along the other side of the die bond frame 12 opposite to each other. At least one other side connected between the one side and the other side has at least two surfaces, and the indentation between the two surfaces can form at least one notch 120. The other side connected between the one side and the other side may not be disposed opposite to the die bond frame 13, so as to be exposed to the side and/or bottom of the LED package module, so as to solder the LED package module to other components (e.g., a circuit board, etc.), etc., or the other side may be exposed so as to make pins, etc.

At least one notch 120 is formed between at least two surfaces of the die bonding frame 12 shared by at least two LED units 10 and used for being exposed on the side surface and/or the bottom surface of the LED packaging module, so that the exposed area of the die bonding frame 12 on the side surface of the LED packaging module can be reduced, the influence on the welding process and the reliability can be reduced, and the structural stability of the LED packaging module can be improved.

In the present embodiment, when a plurality of LED units 10 are packaged together, light beams between the LED units 10 may cross each other, thereby causing a problem of non-uniform color. Referring to fig. 8 to 12, in order to improve these problems, the LED unit 10 of the present embodiment further includes a housing 14 formed with a groove 140. The housings 14 of the LED units 10 may be integrally formed or may be independent from each other, and the light emitting directions are the same. The LED package module of the present embodiment can adopt a TOP package manner, that is, the TOP light can be emitted through the housing 14.

The side of the housing 14 forming the groove 140 is a light-emitting side, and the opposite side is a non-light-emitting side. The die bond frame 12 and the plurality of non-die bond frames 13 may be disposed on the non-light-emitting side of the housing 14. The corresponding positions of the die bonding frame 12 and the non-die bonding frame 13 can be exposed in the groove 140 to facilitate the mounting of the LED chip 11. At least a part of the surface of the groove 140 is configured as a reflective surface 141a, for example, specular reflection or diffuse reflection. Specifically, at least a part of the surface of the groove 140 is coated with a reflective material or provided with a reflective member for reflecting light emitted from the plurality of LED chips 11 out of the groove 140. By providing the housing 14 with the grooves 140 for reflecting the respective light of each LED unit 10, the problem of light crosstalk between the LED units 10 can be improved or avoided, and the uniformity of the light can be improved.

As shown in fig. 9, the surface of the recess 140 of the housing 14 may be parabolic, ellipsoid, spherical or other shape. The light exit side of the housing 14 is formed with an opening, i.e., a light exit port, due to the presence of the groove 140. The light-emitting side surface of the shell 14 between the adjacent grooves 140 can be set to be a black absorption surface, so that light irradiated to the light-emitting side surface from the outside or light emitted by the LED chip 11 is reflected to the light-emitting side surface, the problem of light crosstalk is further improved, the contrast of the LED packaging module which displays when the LED packaging module is assembled on a display screen is improved, and the display effect is improved.

Because each LED unit 10 is provided with the housing 14 to reflect light, the distance between the adjacent grooves 140 is large, the pixel ratio of the LED units 10 is low, and the LED units 10 are split, which may cause the display effect to have obvious granular sensation, thereby affecting the display effect when the display screen is assembled. In order to improve this problem, as shown in fig. 10 and 11, the LED package module of the present embodiment further includes a light homogenizing film 20. The light uniformizing film 20 is disposed on the light emitting side of the housing 14 to cover the grooves 140 of the plurality of LED units 10.

The light homogenizing film 20 can be silica gel, epoxy resin or other materials, and scattering particles such as titanium dioxide, aluminum oxide, silicon oxide and the like can be added into the light homogenizing film 20, and black light absorbing particles such as graphite or organic dyes and the like can also be added.

Through setting up the light-emitting side that even membrane 20 covers a plurality of LED units 10, can adjust the concentrated light-emitting of each original LED unit 10 to the dispersion light-emitting to the light-emitting of even whole LED encapsulation module effectively improves the graininess of LED encapsulation module when assembling the display screen and show. Moreover, the light-homogenizing film 20 can enlarge the light-emitting area of each LED unit 10 due to the function of dispersing light, so that the ratio of the light-emitting area of each LED unit 10 to the area of the light-emitting side surface is improved, the pixel proportion of the LED packaging module is improved, and the display effect is effectively improved. In addition, even light film 20 also can further even the light between each LED chip 11 in every LED unit 10, so can effectively promote the display effect of LED encapsulation module when assembling the display screen. Of course, the light homogenizing film 20 with a suitable thickness can further improve the pixel ratio of the LED package module, and can further improve the problem of light crosstalk between the LED units 10.

Since the LED chip 11 generates heat during the light emitting process, the light emitted from the light outlet of the groove 140 may cause thermal effect, such as thermal stress, on the light uniformizing film 20, which may affect the reliability of the LED package module. As shown in fig. 10 and 11, in order to improve this problem, the light uniformizing film 20 of the present embodiment is provided with a slit 201.

Specifically, the light unifying film 20 forms a slit 201 between two adjacent grooves 140, and the slit 201 extends along the periphery of the groove. For example four LED units 10 arranged in an array, the slits 201 extend between adjacent grooves 140, which may be in the form of a cross.

Through set up gap 201 on even light membrane 20, gap 201 extends along recess 140 is peripheral, can improve even light membrane 20 because the LED module reliability problem that thermal stress arouses, alleviates thermal stress, avoids thermal stress to cause even light membrane 20 to appear shifting or the situation of damaging, effectively protects LED encapsulation module.

The configuration of the housing 14 may have a variety of configurations. As shown in fig. 9 and 11, the first case: the groove 140 may penetrate through the light emitting side and the non-light emitting side of the housing 14, the die bonding frame 12 and the non-die bonding frame 13 are disposed on the non-light emitting side of the housing 14, and when the LED chips 11 are fixed on the die bonding frame 12, the LED chips are located in the groove 140, and the light emitted by the LED chips 14 can be emitted from the light emitting side. For example, the LED package module includes a support 40 of an integrated structure, the support 40 may include all die bonding frames 12 and all non-die bonding frames 13, the support 40 is disposed on the non-light-emitting side of the plurality of housings 14 of the LED package module, and each housing 14 corresponds to each LED unit 10. As shown in fig. 11, at least one side of the support 40 may extend to an outer edge of the housing 14, so that at least one surface of each of the die bond frame 12 and the non-die bond frame 13 may be exposed to a side surface of the LED package module. This case may be a QFN package type or a similar package type.

For this situation, in the present embodiment, the die bonding frame 12 is used to fix the LED chip 11, and after the corresponding electrical connection is performed, the encapsulating material layer 30 can be used to cover one side of the bracket 40 where the LED chip 11 is disposed, and the other side of the bracket 40 opposite to the LED chip 11, so that the surface of at least one side of the bracket 14 is exposed at two sides of the LED package module. Therefore, the LED chip 11 can be effectively packaged and protected, and the problem of light crosstalk caused by light leakage in the prior art is solved.

As shown in fig. 12, the second case: the housing 14 includes a side wall 141 and a bottom wall 142. The side wall 141 and the bottom wall 142 enclose a recess 140. The die bonding frame 12 and the non-die bonding frame 13 are arranged on one side of the bottom wall 142 facing the groove 140. The support 40 of the LED package module comprises all the die bond frames 12 and all the non-die bond frames 13 of the whole LED package module. The stent 40 includes at least one bend 401. The bending section 401 extends from inside the groove 140 to a side of the bottom wall 142 opposite to the groove 140, and bends to cover a part of the bottom wall 142 of the housing 14. For example, a gap is formed at the joint of the bottom wall 142 and the side wall 141, so that the bending section 401 extends out of the groove 140 from the inside of the groove 140 through the gap, and then bends to the side of the bottom wall 142 opposite to the side wall 141, thereby covering a part of the bottom wall 142. At least one surface of each of the die bond frame 12 and the non-die bond frame 13 can be exposed to the side surface and the bottom surface of the package module. This case may be a PLCC package type or the like.

For this situation, in the present embodiment, the die bonding frame 12 is used to fix the LED chip 11, and after the corresponding electrical connection is performed, the encapsulating material layer 30 can be used to cover one side of the bracket 40 where the LED chip 11 is disposed and the other side of the bracket 40 opposite to the LED chip 11, so that the side surface and the bottom surface of the bending section 401 can be exposed on the surface of the LED package module. Therefore, the LED chip 11 can be effectively packaged and protected, and the problem of light crosstalk caused by light leakage in the prior art is solved.

As shown in fig. 13, an embodiment of the display screen of the present application provides a display screen 3, which includes a plurality of LED package modules 1 and a driving circuit 2, where the driving circuit 2 is configured to drive the plurality of LED package modules 1 to perform display. For example, the driving circuit 2 may drive the LED package module 1 to display through an active or passive manner. The drive circuit 2 may be driven by using an existing drive circuit 2.

To sum up, the LED encapsulation module that this application LED encapsulation module embodiment and this application display screen embodiment provided can reduce the quantity of lead frame effectively, simplifies the structure, collects a plurality of LED units moreover and can effectively increase the volume of LED encapsulation module in an organic whole to reduce the welding degree of difficulty and the manufacturing degree of difficulty, improve the mechanical strength who uses the LED encapsulation module of TOP encapsulation.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. An LED package module using TOP package, comprising:

a plurality of LED units packaged in one body;

each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on the same die bonding frame; each of the LED chips includes a first electrode and a second electrode; the first electrode of each LED chip is electrically connected with the same die bonding frame, the second electrode of each LED chip is correspondingly electrically connected with different non-die bonding frames, and the die bonding frames of at least two LED units are the same die bonding frame.

2. The LED package module of claim 1, wherein:

at least one surface of each die bonding frame is exposed to the side surface and/or the bottom surface of the LED packaging module, and at least one surface of each non-die bonding frame is exposed to the side surface and/or the bottom surface of the LED packaging module.

3. The LED package module of claim 2, wherein:

the LED units are arranged in an array;

the die bonding frames of the LED units arranged at intervals along the row direction are the same die bonding frame; or the die bonding frames of the LED units arranged at intervals in the column direction are the same die bonding frame; or all the die bonding frames of the LED units are the same die bonding frame, the same die bonding frame has at least two surfaces exposed to the side surface and/or the bottom surface of the LED package module, and at least one notch not exposed to the side surface and/or the bottom surface of the LED package module is formed by recessing between the two surfaces.

4. The LED package module according to claim 1 or 2, wherein:

the plurality of LED chips of each of the LED units includes at least one blue LED chip, at least one red LED chip, and at least one green LED chip;

at least one red LED chip in the LED chips is fixed on the die bonding frame through conductive adhesive, and the corresponding first electrode is electrically connected with the die bonding frame through the conductive adhesive; the other LED chips in the plurality of LED chips are fixed on the die bonding frame through die bonding glue, and are electrically connected with the die bonding frame through leads corresponding to the first electrodes; alternatively, the first and second electrodes may be,

at least one blue LED chip in the plurality of LED chips is fixed on the die bonding frame through a conductive adhesive, and the corresponding first electrode is electrically connected with the die bonding frame through the conductive adhesive; the other LED chips in the plurality of LED chips are fixed on the die bonding frame through die bonding glue, and the corresponding first electrodes are electrically connected with the die bonding frame through leads; alternatively, the first and second electrodes may be,

at least one green LED chip in the LED chips is fixed on the die attach frame through conductive adhesive, the corresponding first electrode is electrically connected with the die attach frame through the conductive adhesive, the rest of the LED chips are fixed on the die attach frame through the die attach adhesive, and the corresponding first electrode is electrically connected with the die attach frame through a lead.

5. The LED package module according to claim 1 or 2, wherein:

every LED unit is including forming the notched casing, the LED chip set up in the recess, the casing is formed with one side of recess is the light-emitting side, with the light-emitting side one side that carries on the back mutually is the non-light-emitting side, gu brilliant frame with a plurality of non-solid brilliant frames set up in the non-light-emitting side of casing, the configuration of at least partial surface of recess is the plane of reflection for with the light of a plurality of LED chip transmission reflects outside the recess.

6. The LED package module of claim 5, wherein:

the housing of the plurality of LED units is of an integrally formed structure.

7. The LED package module of claim 5, wherein:

the LED packaging module comprises a light homogenizing film, and the light homogenizing film is covered on the light emitting side of the shell to cover the grooves of the LED units.

8. The LED package module of claim 7, wherein:

the light homogenizing film is provided with a gap between two adjacent grooves, and the gap extends along the peripheries of the grooves.

9. The LED package module of claim 1, wherein:

the LED packaging module is at least a QFN packaging type and/or PLCC packaging type packaging module.

10. A display screen comprising a plurality of LED package modules according to any one of claims 1 to 9 and a driving circuit for driving the plurality of LED package modules to display.