CN210607328U - LED packaging assembly and display screen - Google Patents

Abstract

The application discloses LED encapsulation subassembly and display screen, wherein the LED encapsulation subassembly includes a plurality of LED units, encapsulates in an organic whole. Each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on the same die bonding frame; each LED chip comprises a first electrode and a second electrode, the first electrode of each LED chip is electrically connected with the same die bonding frame, and the second electrode of each LED chip is correspondingly electrically connected with one non-die bonding frame. Through the mode, the number of the lead frames can be effectively reduced.

Description

LED packaging assembly and display screen

Technical Field

The application relates to the technical field of LED display, in particular to an LED packaging assembly and a display screen.

Background

The LED display screen has the advantages of wide display color gamut, high brightness, large visual angle, low power consumption, long service life and the like, and has wide market in the fields of inside and outside wall body display in public places such as markets, airports, railway stations and the like. To meet the higher performance requirements of people on display products, the development of LED display screens is moving towards high resolution, which requires LED units with smaller size and pitch.

At present, the LED display screen mostly adopts independent LED packaging form, a plurality of LED chips that represent a pixel are packaged into an independent LED packaging unit, and after the display screen is formed by a plurality of LED packaging units of the packaging mode, the number of lead frames or bonding pads of the display screen is too much, so that the manufacturing difficulty is improved, and the packaging cost is increased.

SUMMERY OF THE UTILITY MODEL

The main technical problem who solves of this application provides LED encapsulation subassembly and display screen, can effectively reduce the quantity of lead frame.

In order to solve the technical problem, the application adopts a technical scheme that: an LED packaging assembly is provided, which comprises a plurality of LED units packaged in a whole.

Each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on the same die bonding frame; each LED chip comprises a first electrode and a second electrode, the first electrode of each LED chip is electrically connected with the same die bonding frame, and the second electrode of each LED chip is correspondingly electrically connected with one non-die bonding frame. Through the mode, the number of the lead frames can be effectively reduced.

In order to solve the above technical problem, another technical solution adopted by the present application is: a display screen is provided, including the above-mentioned LED encapsulation subassembly that this application provided.

Compared with the prior art, the beneficial effects of this application are: through encapsulating a plurality of LED units in an organic whole, all LED chips of every LED unit all are fixed in same solid brilliant frame, and the same solid brilliant frame of first electrode electric connection of every LED chip for LED unit individual package, effectively reduce the quantity of solid brilliant frame, simplify the structure, a plurality of LED units encapsulate in an organic whole and make the volume increase of encapsulation subassembly to reduce the welding degree of difficulty and the manufacturing degree of difficulty, improve the mechanical strength of LED encapsulation subassembly.

Drawings

Fig. 1 is a schematic diagram of a first top view of an embodiment of an LED package assembly of the present application;

FIG. 2 is a schematic diagram of a layout of an LED chip of an embodiment of the present LED package assembly;

FIG. 3 is a second schematic top view of an embodiment of the present LED package assembly;

FIG. 4 is a schematic view of the cross-sectional structure A-A of FIG. 3;

FIG. 5 is a schematic diagram of a third top view of an embodiment of the present LED package assembly;

FIG. 6 is a schematic view of a structure of section B-B of FIG. 5;

FIG. 7 is another schematic view of the structure of section B-B of FIG. 5;

fig. 8 is a schematic structural diagram of an embodiment of a display screen of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, an embodiment of an LED package assembly of the present application includes a plurality of LED units 10. When the LED package assembly is assembled in a display screen, each LED unit 10 becomes a pixel of the display screen. Further, each LED package assembly in the display screen includes a plurality of pixels. Meanwhile, each pixel may include a plurality of sub-pixels. The plurality of LED units 10 are packaged together to form the LED package assembly of the present embodiment. For the light emitting manner of the LED package assembly, the LED package assembly of the present embodiment can be packaged by using TOP packaging technology, so that the LED package assembly of the present embodiment realizes TOP light emission. For a specific chip packaging manner, the LED package assembly of the present embodiment may package the LED chip by using QFN packaging technology and/or PLCC packaging technology, and certainly may also package other packaging technologies, or may package the LED package assembly by comprehensively using a plurality of packaging technologies at the same time.

As shown in fig. 1, each LED unit 10 includes a plurality of LED chips 11, a die bond frame 12, and a plurality of non-die bond frames 13. The LED chip 11 can emit light after being energized. The plurality of LED chips 11 in each LED unit 10 may be the same type of LED chip, or may be different types of LED chips, for example, one or more of a red LED chip, a green LED chip, a blue LED chip, and the like. Of course, other parameters of the LED chip 11 in each LED unit 10, such as power, size, etc., may be the same or different. The LED chips 11 of different LED units 10 may be the same or different.

Each LED chip 11 includes a first electrode (not labeled) and a second electrode (not labeled). The first electrode and the second electrode are positive and negative electrodes, for example. The first electrode is, for example, a positive electrode, and the second electrode is a negative electrode. In this embodiment, the corresponding positive and negative electrodes of the first electrode and the second electrode of different LED chips 11 may be the same or different. For the same case, for example, the first electrodes of all the LED chips 11 of the LED package assembly are positive electrodes, and the second electrodes are negative electrodes. For different cases, for example, in one LED unit 10, the first electrode of one LED chip 11 is a positive electrode, the second electrode is a negative electrode, the first electrode of another LED chip 11 can be a negative electrode, and the second electrode can be a positive electrode. The arrangement of the positive and negative electrodes of the first and second electrodes of the LED chip 11 can be adjusted and determined according to the requirements of the LED assembly in the specific design process.

The die bond frame 12 and the non-die bond frame 13 may be used as lead frames for electrically connecting to the first electrode and the second electrode of the LED chip 11, respectively. The plurality of non-die bonding frames 13 of each LED unit 10 are spaced from each other, and the die bonding frames 12 and the non-die bonding frames 13 are spaced from each other.

The die bond frame 12 and the non-die bond frame 13 may be of unitary construction. As shown in fig. 1, the die bond frame 12 and the non-die bond frame 13 may be integral parts of a support 40 of unitary construction. As an example, the die bonding frame 12 and the non die bonding frame 13 may be formed by performing corresponding processes on a single metal substrate, such as a stamping process, and then injection molding may be performed to perform processes such as spacing and insulation on the die bonding frame 12 and the non die bonding frame 13, or electroplating may be performed to form the integrated bracket 40. As another example, a mounting process is performed on an insulating substrate, and the die bonding frame 12 and the non-die bonding frame 13 are attached to the insulating substrate and spaced apart from each other, so that the die bonding frame 12, the non-die bonding frame 13, and the insulating substrate may form the support 40 of an integrated structure. Each LED unit 10 may have a respective one of the legs 40 of the unitary structure, including all of the die bond frames 12 and the non-die bond frames 13 of the unit. The entire LED package assembly may also have a frame 40 of unitary construction, including the die attach frame 12 and the non-die attach frame 13 of all LED units 10.

In the present embodiment, at least one surface of each die bond frame 12 of the LED package assembly is exposed to the side and/or bottom surfaces of the LED package assembly. At least one surface of each of the non-die bond frames 13 is exposed to the side and/or bottom surfaces of the LED package assembly. The packaging structure is convenient for subsequent welding of the LED packaging assembly or connection with other components. As shown in fig. 1, a surface of one side of each die attach frame 12 and each non die attach frame 13 is located at an edge of the support 40, and after the LED chip 11 is packaged with the support 40, at least one surface of each die attach frame 12 and each non die attach frame 13 located at the edge of the support 40 may be exposed on a side surface and/or a bottom surface of the LED package, which may facilitate subsequent wire bonding to the surface of the die attach frame 12 and the non die attach frame 13 exposed on the side surface and/or the bottom surface of the LED package, so as to drive the LED chip 11.

In the present embodiment, the plurality of LED chips 11 of each LED unit 10 are fixed to the same die bond frame 12. For example, the die bond frame 12 of each LED unit 10 may be one, and all the LED chips 11 of the LED unit 10 are fixed on the die bond frame 12. In some embodiments, each LED unit 10 may include two or more die bond frames 12, but all the LED chips 11 of the LED unit 10 are fixed on the same die bond frame 12.

Each LED chip 11 may be fixed on the die attach frame 12 by a conductive adhesive or a die attach adhesive. For the fixing manner of the conductive adhesive, the first electrode of the corresponding LED chip 11 can be directly electrically connected to the die attach frame 12 through the conductive adhesive, i.e. the vertical electrode structure. For the die attach adhesive method, the corresponding LED chip 11 is fixed to the die attach frame 12 through the die attach adhesive, and the first electrode and the second electrode are respectively electrically connected to the die attach frame 12 and the non-die attach frame 13 through the leads. As shown in fig. 1, the first electrode of at least one LED chip 11 in each LED unit 10 may be a vertical electrode structure, that is, the first electrode is fixed on the die attach frame 12 through a conductive adhesive, and can be electrically connected to the die attach frame 12 through the conductive adhesive.

As an example, the plurality of LED chips 11 of each LED unit 10 includes at least one red LED chip, at least one green LED chip, and at least one blue LED chip.

Optionally, at least one red LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame 12 by die attach adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 by a lead.

Optionally, at least one blue LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame 12 by die attach adhesive, and the corresponding first electrodes are electrically connected to the die attach frame 12 by leads.

Optionally, at least one green LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame by die attach adhesive, and the corresponding first electrodes are electrically connected to the die attach frame 12 by leads.

Through setting up at least one LED chip 11 and fixing the brilliant frame 12 through conducting resin fixed and electric connection, can effectively promote LED chip 11's luminous efficacy and improve luminance, reduce the thermal resistance of LED encapsulation subassembly, the remaining LED chip of cooperation is fixed in solid brilliant frame 12 through solid brilliant glue simultaneously, can reduce the encapsulation degree of difficulty of LED encapsulation subassembly.

As shown in fig. 2, the LED chips 11 of each LED unit 10 include a red LED chip 11a, a green LED chip 11b and a blue LED chip 11c, and the LED chips 11 may be arranged in a triangular shape or a linear shape on the die bonding frame 12. The arrangement of the LED chips of different LED units 10 may be the same or different.

As for the connection relationship between the LED chip 11 and the die bond frame 12 and the non-die bond frame 13, the present embodiment can provide the following embodiments.

The plurality of LED chips 11 of each LED unit 10 are fixed to the same die bonding frame 12. The first electrode of each LED chip 11 is electrically connected to the same die bonding frame 12. The second electrode of each LED chip 11 is electrically connected to a different non-die bond frame 13.

As shown in fig. 1, the LED units 10 may be spaced apart from each other. For example, one LED package assembly may include four LED units 10, and the four LED units 10 may be arranged in an array. Each LED unit 10 may include three LED chips 11, one die bond frame 12, and three non-die bond frames 13. The three LED chips 11 are fixed to one side surface of the die bonding frame 12 at intervals. The first electrode of each LED chip 11 is electrically connected to the die bonding frame 12. The second electrode of each LED chip 11 is electrically connected to different non-die bonding frames 13, the four die bonding frames 12 are arranged in an array, and the three non-die bonding frames 13 of each LED unit 10 can be adjacent to one side of the die bonding frame 12 and arranged at intervals along the direction of the one side, that is, the three non-die bonding frames 13 are arranged opposite to one side of the die bonding frame 12.

Specifically, two of the LED units 10 are located in the first row, and the other two LED units 10 are located in the second row.

The die bonding frames 12 of the two LED units 10 in the first row are spaced along the first side 1a of the LED package, and each side is exposed to the first side 1a of the LED package. That is, one side of each of the two die attach frames 12 of the two LED units is exposed to the first side 1 a.

The three non-die bond frames 13 of one LED unit 10 in the first row are spaced along the third side 1c of the LED package, and each side is exposed to the third side 1c of the LED package, and the opposite side is disposed with the corresponding die bond frame 12. That is, one side surface of each of the three non-die bonding frames 13 of the LED unit 10 is exposed to the third side surface 1c of the LED package assembly, and the other side surface of the LED unit 10 opposite to the three non-die bonding frames 13 is disposed opposite to the die bonding frame 12 of the LED unit 10.

The three non-die bond frames 13 of the other LED unit 10 in the first row are arranged at intervals along the fourth side 1d of the LED package, and each side is exposed to the fourth side 1d of the LED package, and the other opposite side is disposed with the corresponding die bond frame 12. That is, one side surface of each of the three non-die bonding frames 13 of the other LED unit 10 is exposed to the fourth side surface 1d of the LED package assembly, and the other side surface of the other LED unit 10 opposite to the three non-die bonding frames 13 is disposed opposite to the die bonding frame 12 of the other LED unit 10.

The die bonding frames 12 of the two LED units 10 in the second row are spaced along the second side 1b of the LED package assembly, and each side is exposed to the second side 1b of the LED package assembly. That is, one side of each of the two die attach frames 12 of the two LED units is exposed to the second side 1 b.

The three non-die bond frames 13 of one LED unit 10 in the second row are arranged at intervals along the third side surface 1c of the LED package assembly, and one side surface of each non-die bond frame is exposed to the third side surface 1c of the LED package assembly, and the other side surface opposite to the third side surface is arranged opposite to the corresponding die bond frame 12. That is, one side surface of each of the three non-die bonding frames 13 of the LED unit 10 is exposed to the third side surface 1c of the LED package assembly, and the other side surface of the three non-die bonding frames 13 of the LED unit 10 opposite to the one side surface thereof is disposed opposite to the die bonding frame 12 of the LED unit 10.

The three non-die bond frames 13 of another LED unit 10 in the second row are arranged at intervals along the fourth side 1d of the LED package assembly, and one side of each non-die bond frame is exposed to the fourth side 1d of the LED package assembly, and the other opposite side is opposite to the corresponding die bond frame 12. That is, one side surface of each of the three non-die bond frames 13 of the other LED unit 10 is exposed to the fourth side surface 1d of the LED package assembly, and the other side surface of the three non-die bond frames 13 of the other LED unit 10 opposite to the one side surface thereof is disposed opposite to the die bond frame 12 of the other LED unit 10.

In the present embodiment, the die bond frames 12 and any one of the non-die bond frames 13 may not be shared between the LED units 10.

By fixing the plurality of LED chips 11 of each LED unit 10 to a die attach frame 12 and electrically connecting the first electrode of each LED chip 11 to the die attach frame 12, the number of die attach frames 12 can be effectively reduced compared to the prior art in which each LED chip 11 corresponds to one die attach frame 12 and one non-die attach frame 13, the number of leads can be effectively reduced if the LED package assembly is packaged in the form of leads, and the plurality of LED chips 11 are fixed to one die attach frame 12 and each LED chip 11 corresponds to one non-die attach frame 13, which can effectively improve the electrical stability of the LED chips 11 while improving the structural stability, and further, the volume of the LED package assembly can be increased by integrally packaging the plurality of LED units 10, thereby reducing the welding difficulty and the manufacturing difficulty, the mechanical strength of the LED packaging assembly is improved.

In the present embodiment, when a plurality of LED units 10 are packaged together, light beams between the LED units 10 may cross each other, thereby causing a problem of non-uniform color. Referring to fig. 3 to 7, in order to improve these problems, the LED unit 10 of the present embodiment further includes a housing 14 formed with a groove 140. The housings 14 of the LED units 10 may be integrally formed or may be independent from each other, and the light emitting directions are the same. The LED package assembly of the present embodiment can adopt a TOP package manner, i.e., the TOP light can be emitted through the housing 14.

The side of the housing 14 forming the groove 140 is a light-emitting side, and the opposite side is a non-light-emitting side. The die bond frame 12 and the plurality of non-die bond frames 13 may be disposed on the non-light-emitting side of the housing 14. The corresponding positions of the die bonding frame 12 and the non-die bonding frame 13 can be exposed in the groove 140 to facilitate the mounting of the LED chip 11. At least a part of the surface of the groove 140 is configured as a reflective surface 141a, for example, specular reflection or diffuse reflection. Specifically, at least a part of the surface of the groove 140 is coated with a reflective material or provided with a reflective member for reflecting light emitted from the plurality of LED chips 11 out of the groove 140. By providing the housing 14 forming the groove 140 for reflecting the respective light of each LED unit 10, the problem of light crosstalk between the LED units 10 can be improved or avoided, and the optical effect can be improved.

As shown in fig. 4, the surface of the recess 140 of the housing 14 may be parabolic, ellipsoid, spherical or other shape. The light exit side of the housing 14 is formed with an opening, i.e., a light exit port, due to the presence of the groove 140. The light-emitting side surface of the shell 14 between the adjacent grooves 140 can be set to be a black absorption surface, so that light irradiated to the light-emitting side surface from the outside or light emitted by the LED chip 11 is reflected to the light-emitting side surface, the problem of light crosstalk is further improved, the contrast of display of the LED packaging assembly when the LED packaging assembly is assembled on a display screen is improved, and the display effect is improved.

Because each LED unit 10 is provided with the housing 14 to reflect light, the distance between the adjacent grooves 140 is large, the pixel ratio of the LED units 10 is small, and the LED units 10 are split, which may cause the display effect to have obvious granular sensation, thereby affecting the display effect when the display screen is assembled. To improve this problem, as shown in fig. 5 and 6, the LED package assembly of the present embodiment further includes a light uniformizing film 20. The light uniformizing film 20 is disposed on the light emitting side of the housing 14 to cover the grooves 140 of the plurality of LED units 10.

The light homogenizing film 20 can be silica gel, epoxy resin or other materials, and scattering particles such as titanium dioxide, aluminum oxide, silicon oxide and the like can be added into the light homogenizing film 20, and black light absorbing particles such as graphite or organic dyes and the like can also be added.

Through setting up the light-emitting side that even membrane 20 covers a plurality of LED units 10, can adjust the concentrated light-emitting of each original LED unit 10 to the dispersion light-emitting to the light-emitting of even whole LED encapsulation subassembly effectively improves the granular sensation of LED encapsulation subassembly when assembling the display screen and show. Moreover, the light-homogenizing film 20 can enlarge the light-emitting area of each LED unit 10 due to the function of dispersing light, so that the ratio of the light-emitting area of each LED unit 10 to the area of the light-emitting side surface is improved, the pixel proportion of the LED packaging assembly is improved, and the display effect is effectively improved. In addition, the light homogenizing film 20 can further homogenize light among the LED chips 11 in each LED unit 10, so that the display effect of the LED package assembly when the LED package assembly is assembled to a display screen can be effectively improved. Of course, the light homogenizing film 20 with a suitable thickness can further improve the pixel ratio of the LED package assembly, and can further improve the problem of light crosstalk between the LED units 10.

Since the LED chip 11 generates heat during light emitting process, the light emitted from the light outlet of the groove 140 may cause thermal effect, such as thermal stress, on the light uniforming film 20, which may affect the reliability of the LED package assembly. As shown in fig. 5 and 6, in order to improve this problem, the light uniformizing film 20 of the present embodiment is provided with a slit 201.

Specifically, the light unifying film 20 forms a slit 201 between two adjacent grooves 140, and the slit 201 extends along the periphery of the groove. For example four LED units 10 arranged in an array, the slits 201 extend between adjacent grooves 140, which may be in the form of a cross.

Through setting up gap 201 on even membrane 20, gap 201 extends along recess 140 is peripheral, can improve even membrane 20 because the LED encapsulation reliability problem that thermal stress arouses, alleviates thermal stress, avoids thermal stress to cause even membrane 20 to appear shifting or the situation of damaging, effectively protects LED encapsulation.

The configuration of the housing 14 may have a variety of configurations. As shown in fig. 4 and 6, the first case: the groove 140 may penetrate through the light emitting side and the non-light emitting side of the housing 14, the die bonding frame 12 and the non-die bonding frame 13 are disposed on the non-light emitting side of the housing 14, and when the LED chips 11 are fixed on the die bonding frame 12, the LED chips are located in the groove 140, and the light emitted by the LED chips 14 can be emitted from the light emitting side. For example, the LED package assembly includes a bracket 40 having an integral structure, the bracket 40 may include all die bonding frames 12 and all non-die bonding frames 13, the bracket 40 is disposed on the non-light-emitting side of a plurality of housings 14 of the LED package assembly, and each housing 14 corresponds to each LED unit 10. As shown in fig. 6, at least one side of the support 40 may extend to an outer edge of the housing 14, so that at least one surface of each of the die bond frame 12 and the non-die bond frame 13 may be exposed to a side of the LED package assembly. This case may be a QFN package type or a similar package type.

For this situation, in the present embodiment, the die bonding frame 12 is used to fix the LED chip 11, and after the corresponding electrical connection is performed, the encapsulating material layer 30 can be used to cover one side of the support 40 where the LED chip 11 is disposed, and the other side of the support 40 opposite to the LED chip 11, so that the surface of at least one side of the support 14 is exposed at two sides of the LED package assembly. Therefore, the LED chip 11 can be effectively packaged and protected, and the problem of light crosstalk caused by light leakage in the prior art is solved.

As shown in fig. 7, the second case: the housing 14 includes a side wall 141 and a bottom wall 142. The side wall 141 and the bottom wall 142 enclose a recess 140. The die bonding frame 12 and the non-die bonding frame 13 are arranged on one side of the bottom wall 142 facing the groove 140. The support 40 of the LED package assembly includes all of the die attach frames 12 and all of the non-die attach frames 13 of the entire LED package assembly. The stent 40 includes at least one bend 401. The bending section 401 extends from inside the groove 140 to a side of the bottom wall 142 opposite to the groove 140, and bends to cover a part of the bottom wall 142 of the housing 14. For example, a gap is formed at the joint of the bottom wall 142 and the side wall 141, so that the bending section 401 extends out of the groove 140 from the inside of the groove 140 through the gap, and then bends to the side of the bottom wall 142 opposite to the side wall 141, thereby covering a part of the bottom wall 142. At least one surface of each of the die bond frame 12 and the non-die bond frame 13 can be exposed to the side and bottom surfaces of the package assembly. This case may be a PLCC package type or the like.

For this situation, in the present embodiment, the die bonding frame 12 is used to fix the LED chip 11, and after the corresponding electrical connection is performed, the packaging material layer 30 can be used to cover one side of the support 40 where the LED chip 11 is disposed, and the other side of the support 40 opposite to the LED chip 11, so that the side and the bottom of the bending section 401 can be exposed at two sides of the LED package assembly. Therefore, the LED chip 11 can be effectively packaged and protected, and the problem of light crosstalk caused by light leakage in the prior art is solved.

As shown in fig. 8, the display panel 3 of the present application includes a plurality of LED packages 1 and a driving circuit 2, where the driving circuit 2 is used for driving the plurality of LED packages 1 for displaying. For example, the driving circuit 2 can drive the LED package assembly 1 to display through an active or passive manner. The drive circuit 2 may be driven by using an existing drive circuit 2.

To sum up, the LED encapsulation subassembly that this application LED encapsulation subassembly embodiment and this application display screen embodiment provided can reduce the quantity of lead frame effectively, simplifies the structure, collects a plurality of LED units moreover and can effectively increase the volume of LED encapsulation subassembly in an organic whole to reduce the welding degree of difficulty and the manufacturing degree of difficulty, improve the mechanical strength of LED encapsulation subassembly.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (10)

1. An LED package assembly, comprising:

a plurality of LED units packaged in one body;

each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on the same die bonding frame; each LED chip comprises a first electrode and a second electrode, the first electrode of each LED chip is electrically connected with the same die bonding frame, and the second electrode of each LED chip is correspondingly electrically connected with different non-die bonding frames.

2. The LED package assembly of claim 1, wherein:

at least one surface of each die bonding frame is exposed to the side surface and/or the bottom surface of the LED packaging assembly, and at least one surface of each non-die bonding frame is exposed to the side surface and/or the bottom surface of the LED packaging assembly.

3. The LED package assembly of claim 2, wherein:

the LED packaging assembly is provided with a first side face, a second side face opposite to the first side face, a third side face connected between the first side face and the second side face, and a fourth side face opposite to the third side face;

the LED units are four in number and are arranged in an array, wherein two LED units are positioned in a first row, and the other two LED units are positioned in a second row; each LED unit comprises a die bonding frame and three non-die bonding frames;

the die bonding frames of the two LED units positioned in the first row are arranged at intervals along the first side surface of the LED packaging assembly, and one side surface of each die bonding frame is exposed to the first side surface of the LED packaging assembly; the three non-die-bonding frames of the LED unit positioned in the first row are arranged at intervals along a third side surface of the LED packaging assembly, one side surface of each non-die-bonding frame is exposed to the third side surface of the LED packaging assembly, and the other opposite side of each non-die-bonding frame is arranged with the corresponding die-bonding frame; the three non-die-bonding frames of the other LED unit positioned in the first row are arranged at intervals along the fourth side surface of the LED packaging assembly, one side surface of each non-die-bonding frame is exposed to the fourth side surface of the LED packaging assembly, and the other opposite side of each non-die-bonding frame is arranged with the corresponding die-bonding frame;

the die bonding frames of the two LED units positioned in the second row are arranged at intervals along the second side surface of the LED packaging assembly, and one side surface of each die bonding frame is exposed to the second side surface of the LED packaging assembly; the three non-die-bonding frames of the LED unit in the second row are arranged at intervals along a third side of the LED package assembly, and each non-die-bonding frame has one side exposed to the fourth side of the LED package assembly and the other opposite side opposite to the third side of the LED package assembly; the three non-die-bonding frames of the other LED unit in the second row are arranged at intervals along a fourth side surface of the LED packaging assembly, one side surface of each non-die-bonding frame is exposed to the fourth side surface of the LED packaging assembly, and the other side surface opposite to the fourth side surface is arranged opposite to the corresponding die-bonding frame.

4. The LED package assembly of any of claims 1 to 3, wherein:

the plurality of LED chips of each of the LED units includes at least one blue LED chip, at least one red LED chip, and at least one green LED chip;

at least one red LED chip in the LED chips is fixed on the die bonding frame through conductive adhesive, and the corresponding first electrode is electrically connected with the die bonding frame through the conductive adhesive; the other LED chips in the plurality of LED chips are fixed on the die bonding frame through die bonding glue, and are electrically connected with the die bonding frame through leads corresponding to the first electrodes; alternatively, the first and second electrodes may be,

at least one blue LED chip in the plurality of LED chips is fixed on the die bonding frame through a conductive adhesive, and the corresponding first electrode is electrically connected with the die bonding frame through the conductive adhesive; the other LED chips in the plurality of LED chips are fixed on the die bonding frame through die bonding glue, and the corresponding first electrodes are electrically connected with the die bonding frame through leads; alternatively, the first and second electrodes may be,

at least one green LED chip in the LED chips is fixed on the die attach frame through conductive adhesive, the corresponding first electrode is electrically connected with the die attach frame through the conductive adhesive, the rest of the LED chips are fixed on the die attach frame through the die attach adhesive, and the corresponding first electrode is electrically connected with the die attach frame through a lead.

5. The LED package assembly of claim 1, wherein:

every LED unit is including forming the notched casing, a plurality of LED chips set up in the recess, the casing is formed with one side of recess is the light-emitting side, with the one side that the light-emitting side carried on the back mutually is the non-light-emitting side, gu brilliant frame with a plurality of non-solid brilliant frames set up in the non-light-emitting side of casing, the at least partial surface configuration of recess is the plane of reflection, is used for with the light reflection of a plurality of LED chip transmission goes out outside the recess.

6. The LED package assembly of claim 5, wherein:

the housing of the plurality of LED units is of an integrally formed structure.

7. The LED package assembly of claim 5, wherein:

the LED packaging assembly comprises a light homogenizing film, and the light homogenizing film is covered on the light emitting side of the shell to cover the grooves of the LED units; the light homogenizing film is provided with a gap between two adjacent grooves, and the gap extends along the periphery of the grooves.

8. The LED package assembly of claim 1, wherein:

the LED packaging assembly is at least a QFN packaging type and/or PLCC packaging type packaging assembly.

9. The LED package assembly of claim 1, wherein:

the number of the LED chips is three, and the three LED chips are arranged on the same die bonding frame in a triangular or linear mode at intervals.

10. A display screen comprising a plurality of LED package assemblies as claimed in any one of claims 1 to 9.

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