CN210743980U - LED packaging body and display screen - Google Patents

Abstract

The application discloses LED packaging body and display screen, LED packaging body include a plurality of LED units, encapsulate in an organic whole. Each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on the same die bonding frame; each LED chip comprises a first electrode and a second electrode, the first electrodes of at least two LED chips are respectively and electrically connected with the die bonding frame and one non-die bonding frame, and the second electrodes are respectively and electrically connected with the other non-die bonding frame. Through the mode, the number of the lead frames can be effectively reduced.

Description

LED packaging body and display screen

Technical Field

The application relates to the technical field of LED display, in particular to an LED packaging body and a display screen.

Background

The LED display screen has the advantages of wide display color gamut, high brightness, large visual angle, low power consumption, long service life and the like, and has wide market in the fields of inside and outside wall body display in public places such as markets, airports, railway stations and the like. To meet the higher performance requirements of people on display products, the development of LED display screens is moving towards high resolution, which requires LED units with smaller size and pitch.

At present, the LED display screen mostly adopts independent LED packaging form, a plurality of LED chips that represent a pixel are packaged into an independent LED packaging unit, and after the display screen is formed by a plurality of LED packaging units of the packaging mode, the number of lead frames or bonding pads of the display screen is too much, so that the manufacturing difficulty is improved, and the packaging cost is increased.

SUMMERY OF THE UTILITY MODEL

The technical problem that this application mainly solved provides LED packaging body and display screen, can effectively reduce the quantity of lead frame.

In order to solve the technical problem, the application adopts a technical scheme that: the LED packaging body comprises a plurality of LED units which are packaged into a whole. Each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on the same die bonding frame; each LED chip comprises a first electrode and a second electrode, the first electrodes of at least two LED chips are respectively and electrically connected with the die bonding frame and one non-die bonding frame, and the second electrodes are respectively and electrically connected with the other non-die bonding frame.

In order to solve the above technical problem, another technical solution adopted by the present application is: a display screen is provided, including the above-mentioned LED packaging body that this application provided.

Compared with the prior art, the beneficial effects of this application are: the LED packaging structure has the advantages that the LED units are packaged into a whole, the first electrodes of at least two LED chips are electrically connected with the die bonding frame and the non-die bonding frame respectively, the second electrodes are electrically connected with the other non-die bonding frame, namely, at least two LED chips in each LED unit share one non-die bonding frame, the number of the non-die bonding frames can be reduced, the number of lead frames is effectively reduced for the independent packaging of the LED units, the structure of the LED packaging body is optimized, the LED units are packaged into a whole, so that the size of the packaging body is increased, the welding difficulty and the manufacturing difficulty are reduced, and the mechanical strength of the LED packaging body is improved.

Drawings

FIG. 1 is a schematic diagram of a first top view of an embodiment of an LED package of the present application;

FIG. 2 is a schematic diagram of a layout of an LED chip of an embodiment of the LED package of the present application;

FIG. 3 is a schematic diagram of a second top view of an embodiment of an LED package of the present application;

FIG. 4 is a schematic diagram of a third top view of an embodiment of an LED package of the present application;

FIG. 5 is a schematic view of the cross-sectional structure A-A of FIG. 4;

FIG. 6 is a schematic diagram of a fourth top view of an embodiment of an LED package of the present application;

FIG. 7 is a schematic view of a structure of section B-B of FIG. 6;

FIG. 8 is another schematic view of the structure of section B-B of FIG. 6;

fig. 9 is a schematic structural diagram of an embodiment of a display screen of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1 to 3, an embodiment of an LED package of the present application includes a plurality of LED units 10. When the LED package is assembled in a display screen, each LED unit 10 becomes a pixel of the display screen. Further, each LED package in the display screen includes a plurality of pixels. Meanwhile, each pixel may include a plurality of sub-pixels. The plurality of LED units 10 are packaged together to form the LED package of the present embodiment. For the light emitting manner of the LED package, the LED package of the present embodiment can be packaged by using TOP packaging technology, so that the LED package of the present embodiment realizes TOP light emission. For a specific chip packaging manner, the LED package of the present embodiment may package the LED chip by using QFN packaging technology and/or PLCC packaging technology, or may package the LED package by using other packaging technologies, or may package the LED package by comprehensively using multiple packaging technologies at the same time.

As shown in fig. 1, each LED unit 10 includes a plurality of LED chips 11, a die bond frame 12, and a plurality of non-die bond frames 13. The LED chip 11 can emit light after being energized. The plurality of LED chips 11 in each LED unit 10 may be the same type of LED chip, or may be different types of LED chips, for example, one or more of a red LED chip, a green LED chip, a blue LED chip, and the like. Of course, other parameters of the LED chip 11 in each LED unit 10, such as power, size, etc., may be the same or different. The LED chips 11 of different LED units 10 may be the same or different.

Each LED chip 11 includes a first electrode (not labeled) and a second electrode (not labeled). The first electrode and the second electrode are positive and negative electrodes, for example. The first electrode is, for example, a positive electrode, and the second electrode is a negative electrode. In this embodiment, the corresponding positive and negative electrodes of the first electrode and the second electrode of different LED chips 11 may be the same or different. For the same case, for example, the first electrodes of all the LED chips 11 of the LED package are positive electrodes, and the second electrodes are negative electrodes. For different cases, for example, in one LED unit 10, the first electrode of one LED chip 11 is a positive electrode, the second electrode is a negative electrode, the first electrode of the other LED chip 11 is a negative electrode, and the second electrode is a positive electrode. The arrangement of the positive and negative electrodes of the first and second electrodes of the LED chip 11 can be adjusted and determined according to the requirements of the LED package in the specific design process.

The die bond frame 12 and the non-die bond frame 13 may be used as lead frames for electrically connecting to the first electrode and the second electrode of the LED chip 11, respectively. The plurality of non-die bonding frames 13 of each LED unit 10 are spaced from each other, and the die bonding frames 12 and the non-die bonding frames 13 are spaced from each other.

The die bond frame 12 and the non-die bond frame 13 may be of unitary construction. As shown in fig. 1, the die bond frame 12 and the non-die bond frame 13 may be integral parts of a support 40 of unitary construction. As an example, the die bonding frame 12 and the non die bonding frame 13 may be formed by performing corresponding processes on a single metal substrate, such as a stamping process, and then injection molding may be performed to perform processes such as spacing and insulation on the die bonding frame 12 and the non die bonding frame 13, or electroplating may be performed to form the integrated bracket 40. As another example, a mounting process is performed on an insulating substrate, and the die bonding frame 12 and the non-die bonding frame 13 are attached to the insulating substrate and spaced apart from each other, so that the die bonding frame 12, the non-die bonding frame 13, and the insulating substrate may form the support 40 of an integrated structure. Each LED unit 10 may have a respective one of the legs 40 of the unitary structure, including all of the die bond frames 12 and the non-die bond frames 13 of the unit. The entire LED package may also have a frame 40 of unitary construction, including the die attach frame 12 and the non-die attach frame 13 of all LED units 10.

In the present embodiment, at least one surface of each die bond frame 12 of the LED package is exposed to the side and/or bottom surfaces of the LED package. At least one surface of each of the non-die bond frames 13 is exposed to the side and/or bottom surfaces of the LED package. The packaging structure is convenient for subsequent welding of the LED packaging body or connection with other components. As shown in fig. 1, a surface of one side of each die attach frame 12 and each non die attach frame 13 is located at an edge of the support 40, and after the LED chip 11 is packaged with the support 40, at least one surface of each die attach frame 12 and each non die attach frame 13 located at the edge of the support 40 may be exposed on a side surface and/or a bottom surface of the LED package, which may facilitate subsequent wire bonding to the surface of the die attach frame 12 and the non die attach frame 13 exposed on the side surface and/or the bottom surface of the LED package, thereby implementing driving of the LED chip 11.

In the present embodiment, the plurality of LED chips 11 of each LED unit 10 are fixed to the same die bond frame 12. For example, the die bond frame 12 of each LED unit 10 may be one, and all the LED chips 11 of the LED unit 10 are fixed on the die bond frame 12. In some embodiments, each LED unit 10 may include two or more die bond frames 12, but all the LED chips 11 of the LED unit 10 are fixed on the same die bond frame 12.

Each LED chip 11 may be fixed on the die attach frame 12 by a conductive adhesive or a die attach adhesive. For the fixing manner of the conductive adhesive, the first electrode of the corresponding LED chip 11 can be directly electrically connected to the die attach frame 12 through the conductive adhesive, i.e. the vertical electrode structure. For the die attach adhesive method, the corresponding LED chip 11 is fixed to the die attach frame 12 through the die attach adhesive, and the first electrode and the second electrode are respectively electrically connected to the die attach frame 12 and the non-die attach frame 13 through the leads. As shown in fig. 1, the first electrode of at least one LED chip 11 in each LED unit 10 may be a vertical electrode structure, that is, the first electrode is fixed on the die attach frame 12 through a conductive adhesive, and can be electrically connected to the die attach frame 12 through the conductive adhesive.

As an example, the plurality of LED chips 11 of each LED unit 10 includes at least one red LED chip, at least one green LED chip, and at least one blue LED chip.

Optionally, at least one red LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame 12 by die attach adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 by a lead.

Optionally, at least one blue LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame 12 by die attach adhesive, and the corresponding first electrodes are electrically connected to the die attach frame 12 by leads.

Optionally, at least one green LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame by die attach adhesive, and the corresponding first electrodes are electrically connected to the die attach frame 12 by leads.

Through setting up at least one LED chip 11 and fixing and the solid brilliant frame 12 of electric connection through the conducting resin, can effectively promote LED chip 11's luminous efficacy and improve luminance, reduce the thermal resistance of LED packaging body, the other LED chips of cooperation are fixed in solid brilliant frame 12 through solid brilliant glue simultaneously, can reduce the encapsulation degree of difficulty of LED packaging body.

As shown in fig. 2, the LED chips 11 of each LED unit 10 include a red LED chip 11a, a green LED chip 11b and a blue LED chip 11c, and the LED chips 11 may be arranged in a triangular shape or a linear shape on the die bonding frame 12. The arrangement of the LED chips of different LED units 10 may be the same or different.

As for the connection relationship between the LED chip 11 and the die bond frame 12 and the non-die bond frame 13, the present embodiment can provide a plurality of embodiments as follows.

As shown in fig. 1, this example provides a first embodiment described below:

the plurality of LED chips 11 of each LED unit 10 are fixed to the same die bonding frame 12. The first electrode of each LED chip 11 is electrically connected to the same die bonding frame 12. The second electrode of each LED chip 11 is electrically connected to a different non-die bond frame 13.

As shown in fig. 1, the LED units 10 may be spaced apart from each other. For example, one LED package may include four LED units 10, and the four LED units 10 may be arranged in an array. Each LED unit 10 may include three LED chips 11, one die bond frame 12, and three non-die bond frames 13. The three LED chips 11 are fixed to one side surface of the die bonding frame 12 at intervals. The first electrode of each LED chip 11 is electrically connected to the die bonding frame 12. The second electrode of each LED chip 11 is electrically connected to different non-die bond frames 13. The four die attach frames 12 are arranged in an array, and the three non-die attach frames 13 of each LED unit 10 can be adjacent to one side of the die attach frame 12 and arranged at intervals along the direction of the one side, that is, the three non-die attach frames 13 are arranged opposite to one side of the die attach frame 12.

In the present embodiment, the die bond frames 12 and any one of the non-die bond frames 13 may not be shared between the LED units 10.

By fixing the plurality of LED chips 11 of each LED unit 10 to a die attach frame 12 and electrically connecting the first electrode of each LED chip 11 to the die attach frame 12, the number of die attach frames 12 can be effectively reduced compared to the prior art in which each LED chip 11 corresponds to one die attach frame 12 and one non-die attach frame 13, if the LED package is packaged in the form of pins, the number of pins can be effectively reduced, and the plurality of LED chips 11 are fixed to one die attach frame 12, each LED chip 11 corresponds to one non-die attach frame 13, the structural stability is improved while the electrical stability of the LED chips 11 is effectively improved, and further, the volume of the LED package can be increased by integrally packaging the plurality of LED units 10, thereby reducing the welding difficulty and the manufacturing difficulty, the mechanical strength of the LED packaging body is improved.

As shown in fig. 3, this example provides a second embodiment described below:

the plurality of LED chips 11 of each LED unit 10 are fixed to the same die bonding frame 12. The first electrodes of at least two of the LED chips 11 in the LED chips 11 are electrically connected to the die bond frame 12 and one non-die bond frame 13, respectively, and the second electrodes of at least two of the LED chips 11 are electrically connected to another non-die bond frame 13. That is, at least two LED chips 11 in each LED unit 10 share one die attach frame 13, so that the number of die attach frames 13 of the LED package can be effectively reduced.

For convenience of description of the present embodiment, in fig. 3, different LED units 10 are exemplarily denoted by 10a, 10b, 10c, 10d, respectively. The plurality of die attach frames 13 in the LED unit 10a are exemplarily indicated as 13a1 and 13b1, respectively, the plurality of die attach frames 13 in the LED unit 10b are exemplarily indicated as 13a2 and 13b2, respectively, the plurality of die attach frames 13 in the LED unit 10c are exemplarily indicated as 13a3 and 13b1, respectively, and the plurality of die attach frames 13 in the LED unit 10d are exemplarily indicated as 13a4 and 13b2, respectively.

Specifically, the plurality of LED chips 11 of each LED unit 10 includes at least a first LED chip 11a, a second LED chip 11b, and a third LED chip 11 c. The first LED chip 11a may be one of a red LED chip, a green LED chip, and a blue LED chip, the second LED chip 11b may be another one of the red LED chip, the green LED chip, and the blue LED chip, and the third LED chip 11c may be the remaining one of the red LED chip, the green LED chip, and the blue LED chip.

The first LED chip 11a, the second LED chip 11b and the third LED chip 11c of each LED unit 10 can be fixed to the same die bonding frame 12 of the LED unit 10. The first electrodes of the first LED chip 11a and the third LED chip 11c of each LED unit 10 are electrically connected to the same die bonding frame 12 of the LED unit 10. For example, at least one of the first LED chip 11a and the third LED chip 11c may be fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12, and the remaining LED chips may be fixed to the die attach frame 12 through the die attach adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through a lead. The second electrodes of the first LED chip 11a and the third LED chip 11c are electrically connected to different non-die bond frames 13, respectively. As shown in fig. 3, one first LED chip 11a in each LED unit 10 is connected to the die attach frame 13b1, and a third LED chip 11c is connected to the die attach frame 13a 1.

The second LED chip 11b may be fixed to the die attach frame 12 through a die attach adhesive, and the corresponding first electrode and the corresponding second electrode are electrically connected to the different non-die attach frames 13 through leads, respectively. For example, for the LED unit 10a, the first electrode and the second electrode of the second LED chip 11b are connected to the die attach frame 13a1 and the die attach frame 13b1, respectively. If the number of the second LED chips 11b is two or more, at least one of the non-die bond frames electrically connected to the different second LED chips 11b is different. For example, the first electrode and the second electrode of one second LED chip 11B are respectively connected to the a non-die bond frame and the B non-die bond frame, the first electrode and the second electrode of another second LED chip 11B cannot be simultaneously connected to the a non-die bond frame and the B non-die bond frame, otherwise, the two second LED chips 11B are shorted, and the a non-die bond frame and the C non-die bond frame, or the B non-die bond frame and the D non-die bond frame, or the C non-die bond frame and the D non-die bond frame may be connected between the another second LED chip 11B.

In each LED unit 10, the non-die bond frame 13 connected to the first electrode of the second LED chip 11b and the non-die bond frame 13 connected to the first LED chip 11a are the same non-die bond frame, and/or the non-die bond frame 13 connected to the second electrode of each second LED chip 11b and the non-die bond frame 13 connected to the third LED chip 11c are the same non-die bond frame. That is, the first electrodes of at least two of the LED chips 11 are electrically connected to the die bond frame 12 and one of the non-die bond frames 13 (e.g., 13a1), and the second electrodes are electrically connected to the other non-die bond frame 13 (e.g., 13b 1).

In order to further reduce the number of the die attach frames 13 and further optimize the structure of the LED package, the die attach frames 13 are shared between at least two LED units 10. For example, at least two of the non-die bond frames 13 respectively belonging to different LED units 10 are the same non-die bond frame.

On the basis that at least two LED chips 11 in each LED unit 10 share the non-die bonding frame 13, the at least two non-die bonding frames 13 belonging to different LED units 10 are arranged to be the same die bonding frame, so that the number of the non-die bonding frames 13 can be effectively reduced, and the structure of the LED packaging body is further optimized. In addition, for each LED unit 10 is packaged independently in the prior art, the LED packaging body can be enlarged in size by packaging the LED units 10 into a whole, welding difficulty and manufacturing difficulty are effectively reduced, operations such as welding are facilitated, and mechanical strength is enhanced.

In order to further reduce the number of die bonding frames 12, the die bonding frames 12 may be shared among the LED units 10, for example, at least two die bonding frames 12 respectively belonging to different LED units 10 are the same die bonding frame.

As shown in fig. 3, the LED units 10 are arranged in an array, at least one die attach frame 13 can be shared between the LED units 10 in the first row, and at least one die attach frame 13 can be shared between the LED units 10 in the second row. Alternatively, the LED units 10 in the first column may share the same die bond frame 12. Optionally, the LED units 10 in the second row share the same die bond frame 12.

As shown in fig. 3, taking the number of the LED units 10 as four as an example, the LED units are divided into a first column of LED units and a second column of LED units, each including two LED units 10, and the first column of LED units and the second column of LED units are sequentially arranged along the row direction. Each LED unit 10 includes one first LED chip 11a, one second LED chip 11b, and one third LED chip 11c in the column direction.

The number of all the non-die bond frames 13 of the four LED units 10 is six. That is, the total number of all the non-die bond frames of all the LED units is six. The six amorphous frames are respectively a first amorphous frame 13a1, a second amorphous frame 13a2, a third amorphous frame 13a3, a fourth amorphous frame 13a3, a fifth amorphous frame 13b1 and a sixth amorphous frame 13b 2.

In particular, the first column of LED units may comprise a first LED unit 10a adjacent to the first side 1a and a second LED unit 10b adjacent to the second side 1 b. The second column of LED units comprises a third LED unit 10c adjacent to the first side 1a and a fourth LED unit 10d adjacent to the second side 1 b.

The second electrodes of the second LED chip 11b and the third LED chip 11c of the first LED unit 10a are electrically connected to the first non-die bond frame 13a 1. One side of the first die attach frame 13a1 is exposed to the second side 1b of the LED package. Second electrodes of the second LED chip 11b and the third LED chip 11c of the second LED unit 10b are electrically connected to the second die attach frame 13a2, and at least one side of the second die attach frame 13a2 is exposed to the second side 1b and/or the third side 1c of the LED package.

The second LED chip 11b of the third LED unit 10c and the second electrode of the third LED chip 11c are electrically connected to the third die attach frame 13a3, and one side of the third die attach frame 13a3 is exposed to the fourth side 1d of the LED package. The second electrodes of the second LED chip 11b and the third LED chip 11c of the fourth LED unit 10d are electrically connected to the fourth die attach frame 13a4, and at least one side of the fourth die attach frame 13a4 is exposed to the second side 1b and/or the fourth side 1d of the LED package.

The second electrode of the first LED chip 11a and the first electrode of the second LED chip 11b of each of the first LED unit 10a and the third LED unit 10c are electrically connected to the fifth non-die bond frame 13b 1. The second electrode of the first LED chip 11a and the first electrode of the second LED chip 11b of each of the second LED unit 10b and the fourth LED unit 10d are electrically connected to the sixth non-die bond frame 13b 2.

The fifth non-die bond frame 13b1 may be located between the die bond frame 12 of the first column of LED units and the die bond frame 12 of the second column of LED units. One end face of the fifth amorphous frame 13b1 is exposed to the first side face 1a of the LED package, and the other end face of the fifth amorphous frame 13b1 opposite to the first end face extends along the second side face 1b of the LED package by a first length.

The sixth amorphous frame 13b2 may be located between the die attach frame 12 of the first column of LED units and the die attach frame 12 of the second column of LED units. One end face of the sixth amorphous frame 13b2 is exposed to the second side face 1b of the LED package, and the other end face of the sixth amorphous frame 13b2 opposite to the first side face 1a of the LED package extends a second length. Optionally, the second electrode of the first LED chip 11a and the first electrode of the second LED chip 11b of each of the second LED unit 10b and the fourth LED unit 10d are electrically connected to the opposite end of the sixth non-die bond frame 13b 2.

Optionally, the second length is greater than the first length, and the second length may be at least half of the length of the die attach frame 12 of the second row of LED units in the row direction. In this embodiment, the second length of the sixth non-die bonding frame 13b1 is greater than that of the fifth non-die bonding frame 13b, and the second length may be at least half of the length of the die bonding frame 12 of the second row of LED units in the row direction, so that the first LED chip 11a and the second LED chip 11b of each of the second LED unit 10b and the fourth LED unit 10d can be connected to the other end of the sixth non-die bonding frame 13b1, the lengths of the leads of the first LED chip 11a and the second LED chip 11b can be reduced, the stability of electrical connection can be improved, and when the colors of the first LED chip 11a, the second LED chip 11b, and the third LED chip 11c in each unit 10 are arranged in the same color, the LED package can drive the first LED chip 11a and the second LED chip 11b of each LED unit 10, and the display effect after being assembled to the display screen can be improved.

Through the above specific arrangement, compared with the connection mode in which each LED unit 10 includes one die bond frame 12 and three non-die bond frames 13 and four LED units 10 include sixteen frames in the first embodiment, two die bond frames 12 and six non-die bond frames 13 can be reduced, so that eight lead frames are reduced, and the structure is effectively simplified.

In the present embodiment, when a plurality of LED units 10 are packaged together, light beams between the LED units 10 may cross each other, thereby causing a problem of non-uniform color. Referring to fig. 4 to 8, in order to improve these problems, the LED unit 10 of the present embodiment further includes a housing 14 formed with a groove 140. The housings 14 of the LED units 10 may be integrally formed or may be independent from each other, and the light emitting directions are the same. The LED package of the present embodiment can adopt a TOP package manner, that is, the LED package can emit light from the TOP by the action of the housing 14.

The side of the housing 14 forming the groove 140 is a light-emitting side, and the opposite side is a non-light-emitting side. The die bond frame 12 and the plurality of non-die bond frames 13 may be disposed on the non-light-emitting side of the housing 14. The corresponding positions of the die bonding frame 12 and the non-die bonding frame 13 can be exposed in the groove 140 to facilitate the mounting of the LED chip 11. At least a part of the surface of the groove 140 is configured as a reflective surface 141a, for example, specular reflection or diffuse reflection. Specifically, at least a part of the surface of the groove 140 is coated with a reflective material or provided with a reflective member for reflecting light emitted from the plurality of LED chips 11 out of the groove 140. By providing the housing 14 forming the groove 140 for reflecting the respective light of each LED unit 10, the problem of light crosstalk between the LED units 10 can be improved or avoided, and the optical effect can be improved.

As shown in fig. 5, the surface of the recess 140 of the housing 14 may be parabolic, ellipsoid, spherical or other shape. The light exit side of the housing 14 is formed with an opening, i.e., a light exit port, due to the presence of the groove 140. The light-emitting side surface of the shell 14 between the adjacent grooves 140 can be set to be a black absorption surface, so that light irradiated to the light-emitting side surface from the outside or light emitted by the LED chip 11 is reflected to the light-emitting side surface, the problem of light crosstalk is further improved, the contrast of the LED package body displaying when the LED package body is assembled on a display screen is improved, and the display effect is improved.

Because each LED unit 10 is provided with the housing 14 to reflect light, the distance between the adjacent grooves 140 is large, the pixel ratio of the LED units 10 is small, and the LED units 10 are split, which may cause the display effect to have obvious granular sensation, thereby affecting the display effect after being assembled on the display screen. In order to improve this problem, as shown in fig. 6 and 7, the LED package of the present embodiment further includes a light uniformizing film 20. The light uniformizing film 20 is disposed on the light emitting side of the housing 14 to cover the grooves 140 of the plurality of LED units 10.

The light homogenizing film 20 can be silica gel, epoxy resin or other materials, and scattering particles such as titanium dioxide, aluminum oxide, silicon oxide and the like can be added into the light homogenizing film 20, and black light absorbing particles such as graphite or organic dyes and the like can also be added.

Through setting up the light-emitting side that even membrane 20 covers a plurality of LED units 10, can adjust the concentrated light-emitting of each original LED unit 10 to the dispersion light-emitting to the light-emitting of even whole LED packaging body effectively improves the graininess of LED packaging body when assembling the display screen and show. Moreover, the light-homogenizing film 20 can enlarge the light-emitting area of each LED unit 10 due to the function of dispersing light, so as to improve the ratio of the light-emitting area of each LED unit 10 to the area of the light-emitting side surface, thereby improving the pixel ratio of the LED package and effectively improving the display effect. In addition, the light homogenizing film 20 can further homogenize light among the LED chips 11 in each LED unit 10, so that the display effect of the LED package when being assembled to a display screen can be effectively improved. Of course, the light homogenizing film 20 with a suitable thickness can further improve the pixel ratio of the LED package and the problem of crosstalk between the LED units 10.

Since the LED chip 11 generates heat during light emitting, when light is emitted from the light outlet of the groove 140, the heat effect, such as thermal stress, may be caused to the light uniforming film 20, which may affect the reliability of the LED package. As shown in fig. 6 and 7, in order to improve this problem, the light uniformizing film 20 of the present embodiment is provided with a slit 201.

Specifically, the light unifying film 20 forms a slit 201 between two adjacent grooves 140, and the slit 201 extends along the periphery of the groove. For example four LED units 10 arranged in an array, the slits 201 extend between adjacent grooves 140, which may be in the form of a cross.

Through set up gap 201 on even membrane 20, gap 201 extends along recess 140 is peripheral, can improve even membrane 20 because the LED packaging body reliability problem that thermal stress arouses, alleviates thermal stress, avoids thermal stress to cause even membrane 20 to appear shifting or the situation of damaging, effectively protects the LED packaging body.

The configuration of the housing 14 may have a variety of configurations. As shown in fig. 5 and 7, the first case: the groove 140 may penetrate through the light emitting side and the non-light emitting side of the housing 14, the die bonding frame 12 and the non-die bonding frame 13 are disposed on the non-light emitting side of the housing 14, and when the LED chips 11 are fixed on the die bonding frame 12, the LED chips are located in the groove 140, and the light emitted by the LED chips 14 can be emitted from the light emitting side. For example, the LED package includes a support 40 of an integrated structure, the support 40 may include all die bonding frames 12 and all non-die bonding frames 13, the support 40 is disposed on the non-light-emitting side of the plurality of housings 14 of the LED package, and each housing 14 corresponds to each LED unit 10. As shown in fig. 7, at least one side of the support 40 may extend to an outer edge of the housing 14, so that at least one surface of each of the die bond frame 12 and the non-die bond frame 13 may be exposed to a side surface of the LED package. This case may be a QFN package type or a similar package type.

For this situation, in the present embodiment, the die bonding frame 12 is used to fix the LED chip 11, and after the corresponding electrical connection is performed, the encapsulating material layer 30 can be used to cover one side of the bracket 40 where the LED chip 11 is disposed, and the other side of the bracket 40 opposite to the LED chip 11, so that the surface of at least one side of the bracket 14 is exposed at two sides of the LED package. Therefore, the LED chip 11 can be effectively packaged and protected, and the problem of light crosstalk caused by light leakage in the prior art is solved.

As shown in fig. 8, the second case: the housing 14 includes a side wall 141 and a bottom wall 142. The side wall 141 and the bottom wall 142 enclose a recess 140. The die bonding frame 12 and the non-die bonding frame 13 are arranged on one side of the bottom wall 142 facing the groove 140. The support 40 of the LED package includes all of the die bond frames 12 and all of the non-die bond frames 13 of the entire LED package. The stent 40 includes at least one bend 401. The bending section 401 extends from inside the groove 140 to a side of the bottom wall 142 opposite to the groove 140, and bends to cover a part of the bottom wall 142 of the housing 14. For example, a gap is formed at the joint of the bottom wall 142 and the side wall 141, so that the bending section 401 extends out of the groove 140 from the inside of the groove 140 through the gap, and then bends to the side of the bottom wall 142 opposite to the side wall 141, thereby covering a part of the bottom wall 142. At least one surface of each of the die bond frame 12 and the non-die bond frame 13 can be exposed to the side and bottom surfaces of the package. This case may be a PLCC package type or the like.

For this situation, in the present embodiment, the die attach frame 12 is used to fix the LED chip 11, and after the corresponding electrical connection is performed, the encapsulating material layer 30 can be used to cover one side of the support 40 where the LED chip 11 is disposed and the other side of the support 40 opposite to the LED chip 11, so that the side and the bottom of the bending section 401 can be exposed on the surface of the LED package. Therefore, the LED chip 11 can be effectively packaged and protected, and the problem of light crosstalk caused by light leakage in the prior art is solved.

As shown in fig. 9, an embodiment of a display screen 3 according to the present application provides a display screen, which includes a plurality of LED packages 1 and a driving circuit 2, where the driving circuit 2 is configured to drive the plurality of LED packages 1 to perform display. For example, the driving circuit 2 may drive the LED package 1 to display through an active or passive manner. The drive circuit 2 may be driven by using an existing drive circuit 2.

To sum up, the LED packaging body that this application LED packaging body embodiment and this application display screen embodiment provided can reduce the quantity of lead frame effectively, simplifies the structure, collects a plurality of LED units moreover and can effectively increase the volume of LED packaging body in an organic whole to reduce the welding degree of difficulty and the manufacturing degree of difficulty, improve the mechanical strength of LED packaging body.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (10)

1. An LED package, comprising:

a plurality of LED units packaged in one body;

each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on the same die bonding frame;

each LED chip comprises a first electrode and a second electrode, the first electrodes of at least two of the LED chips are respectively and electrically connected with the die bonding frame and one of the non-die bonding frames, and the second electrodes are respectively and electrically connected with the other non-die bonding frame.

2. The LED package of claim 1, wherein:

at least two of the non-die bonding frames respectively belonging to different LED units are the same non-die bonding frame.

3. The LED package of claim 2, wherein:

the die bonding frames of the at least two LED units are the same die bonding frame.

4. The LED package of claim 3, wherein:

the LED units are arranged in an array, at least two non-die bonding frames which respectively belong to different LED units arranged at intervals along the row direction are the same non-die bonding frame, and the die bonding frames of different LED units arranged at intervals along the column direction are the same die bonding frame.

5. The LED package of claim 4, wherein:

the LED package body is provided with a first side face, a second side face opposite to the first side face, a third side face connected between the first side face and the second side face, and a fourth side face opposite to the third side face, wherein the first side face and the second side face are arranged at intervals along the column direction, and the third side face and the fourth side face are arranged at intervals along the row direction;

the LED units are four in number and are divided into a first row of LED units and a second row of LED units, each of the first row of LED units and the second row of LED units comprises two LED units, and the first row of LED units and the second row of LED units are sequentially arranged along the row direction; the LED chips of each LED unit comprise a first LED chip, a second LED chip and a third LED chip which are sequentially arranged at intervals along the row direction, and first electrodes of the first LED chip and the third LED chip are electrically connected with the die bonding frame;

the number of all the non-die bonding frames of the four LED units is six, and the non-die bonding frames are respectively a first non-die bonding frame, a second non-die bonding frame, a third non-die bonding frame, a fourth non-die bonding frame, a fifth non-die bonding frame and a sixth non-die bonding frame;

the first column of LED units comprises a first LED unit adjacent to the first side surface and a second LED unit adjacent to the second side surface, second electrodes of the second LED chip and the third LED chip of the first LED unit are electrically connected with the first non-die bond frame, and one side surface of the first non-die bond frame is exposed to the second side surface of the LED packaging body; second electrodes of the second LED chip and the third LED chip of the second LED unit are electrically connected with the second die attach frame, and at least one side surface of the second die attach frame is exposed to the second side surface and/or the third side surface of the LED package body;

the second row of LED units comprises a third LED unit adjacent to the first side surface and a fourth LED unit adjacent to the second side surface, second electrodes of the second LED chip and the third LED chip of the third LED unit are electrically connected with the third non-die bond frame, and one side surface of the third non-die bond frame is exposed to the fourth side surface of the LED packaging body; second electrodes of the second LED chip and the third LED chip of the fourth LED unit are electrically connected to the fourth die attach frame, and at least one side of the fourth die attach frame is exposed to the second side and/or the fourth side of the LED package;

the second electrode of the first LED chip and the first electrode of the second LED chip of each of the first LED unit and the third LED unit are both electrically connected with the fifth non-die bond frame, and the second electrode of the first LED chip and the first electrode of the second LED chip of each of the second LED unit and the fourth LED unit are both electrically connected with the sixth non-die bond frame.

6. The LED package of claim 5, wherein:

the die bonding frames of the two LED units of the first row of LED units are the same die bonding frame, and the die bonding frames of the two LED units of the second row of LED units are the same die bonding frame;

the fifth non-die bonding frame is positioned between the die bonding frames of the first row of LED units and the die bonding frames of the second row of LED units, and one end face of the fifth non-die bonding frame is exposed to the first side face of the LED packaging body;

the sixth non-die bonding frame is located between the die bonding frames of the first row of LED units and the die bonding frames of the second row of LED units, and one end face of the sixth non-die bonding frame is exposed to the second side face of the LED packaging body.

7. The LED package of claim 1, wherein:

the plurality of LED chips of each of the LED units includes at least one blue LED chip, at least one red LED chip, and at least one green LED chip;

at least one red LED chip in the LED chips is fixed on the die bonding frame through conductive adhesive, and the corresponding first electrode is electrically connected with the die bonding frame through the conductive adhesive; the other LED chips in the plurality of LED chips are fixed on the die bonding frame through die bonding glue, and are electrically connected with the die bonding frame through leads corresponding to the first electrodes; alternatively, the first and second electrodes may be,

at least one blue LED chip in the plurality of LED chips is fixed on the die bonding frame through a conductive adhesive, and the corresponding first electrode is electrically connected with the die bonding frame through the conductive adhesive; the other LED chips in the plurality of LED chips are fixed on the die bonding frame through die bonding glue, and the corresponding first electrodes are electrically connected with the die bonding frame through leads; alternatively, the first and second electrodes may be,

at least one green LED chip in the LED chips is fixed on the die attach frame through conductive adhesive, the corresponding first electrode is electrically connected with the die attach frame through the conductive adhesive, the rest of the LED chips are fixed on the die attach frame through the die attach adhesive, and the corresponding first electrode is electrically connected with the die attach frame through a lead.

8. The LED package of claim 1, wherein:

every LED unit is including being formed with the notched casing, the casing is formed with one side of recess is the light-emitting side, with the light-emitting side one side that carries on the back mutually is the non-light-emitting side, gu brilliant frame with a plurality of non-solid brilliant frames set up in the non-light-emitting side of casing, a plurality of LED chip intervals set up in the recess, at least partial surface of recess sets up to the plane of reflection, be used for with the light reflection of a plurality of LED chip transmission goes out outside the recess.

9. The LED package of claim 8, wherein:

the LED packaging body comprises a light homogenizing film, the light homogenizing film is covered on the light emitting side of the shell to cover the grooves of the LED units, a gap is formed between every two adjacent grooves by the light homogenizing film, and the gap extends along the periphery of the grooves;

the LED packaging body is at least a QFN packaging type and/or PLCC packaging type packaging body.

10. A display screen comprising a plurality of LED packages according to any one of claims 1-9.

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