WO2009144963A1 - Led light source device, backlight device and liquid crystal display device - Google Patents

Led light source device, backlight device and liquid crystal display device Download PDF

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Publication number
WO2009144963A1
WO2009144963A1 PCT/JP2009/050109 JP2009050109W WO2009144963A1 WO 2009144963 A1 WO2009144963 A1 WO 2009144963A1 JP 2009050109 W JP2009050109 W JP 2009050109W WO 2009144963 A1 WO2009144963 A1 WO 2009144963A1
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WO
WIPO (PCT)
Prior art keywords
light source
light
source device
transparent resin
light emitting
Prior art date
Application number
PCT/JP2009/050109
Other languages
French (fr)
Japanese (ja)
Inventor
博昭 重田
山渕　浩二
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to CN2009801134091A priority Critical patent/CN102007608B/en
Priority to US12/937,775 priority patent/US20110032450A1/en
Publication of WO2009144963A1 publication Critical patent/WO2009144963A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0018—Redirecting means on the surface of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0028—Light guide, e.g. taper
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0091—Reflectors for light sources using total internal reflection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • the present invention relates to an LED light source device, a backlight device, and a liquid crystal display device.
  • an LED light source device including at least a light emitting diode element is known, and is used as a light source of a backlight device installed in a small-sized liquid crystal display device.
  • a conventional backlight device and an LED light source device used as a light source thereof will be described below with reference to FIGS. 39 is a simplified diagram of a conventional backlight device, and FIGS. 40 and 41 are simplified diagrams of a conventional LED light source device.
  • the conventional backlight device 110 includes a light guide plate 101, an LED light source device 102, an optical sheet 103, a reflection sheet 104, and the like. Note that the backlight device 110 illustrated in FIG. 39 is an edge light type.
  • the light guide plate 101 is made of a plate-like member, and has four side end surfaces and two surfaces (front and rear surfaces) perpendicular to the four side end surfaces.
  • a predetermined side end surface of the four side end surfaces of the light guide plate 101 functions as a light incident surface for introducing light from the LED light source device 102 into the inside, and the front surface of the light guide plate 101 is introduced into the inside. It functions as a light emitting surface for emitting the emitted light in a planar shape.
  • the LED light source device 102 is disposed on the light incident surface side of the light guide plate 101, and the optical sheet 103 and the reflection sheet 104 are disposed on the light emitting surface side and the rear surface side of the light guide plate 101, respectively.
  • a plurality of LED light source devices 102 are arranged at predetermined intervals along the light incident surface of the light guide plate 101 in order to ensure sufficient luminance.
  • the LED light source device 102 has a structure as shown in FIGS. 40 and 41, for example.
  • the LED light source device 102 shown in FIG. 40 has a structure in which the light emitting diode element 105 is sealed with a rectangular parallelepiped sealing member 106.
  • 41 has a structure in which the periphery of the light emitting diode element 105 is surrounded by a light reflecting member (inclined surface) 107 (see, for example, Patent Document 1).
  • the light when light is generated by the LED light source device 102, the light is introduced from the light incident surface (predetermined side end surface) of the light guide plate 101 and guided. The light is emitted from the light emission surface (front surface) of the optical plate 101. Thereafter, the light emitted from the light emitting surface of the light guide plate 101 is diffused and collected by the optical sheet 103 to illuminate the rear surface of the liquid crystal display panel 120. Thereby, a desired image is displayed in the display area 120a of the liquid crystal display panel 120. The light leaking from the rear surface of the light guide plate 101 is reintroduced by being reflected by the reflection sheet 104.
  • the LED light source device 102 shown in FIG. 40 when the LED light source device 102 shown in FIG. 40 is used, since the light emitting diode element 105 is sealed with the rectangular parallelepiped sealing member 106, the interface between the light emitting surface of the LED light source device 102 and the atmosphere. More light is totally reflected at. For this reason, the light quantity emitted from the light emitting surface of the LED light source device 102 decreases, and the luminance decreases.
  • the frame of the backlight device 110 is reduced by reducing the distance from the LED light source device 102 to the effective light emitting area (the region corresponding to the display region 120a of the liquid crystal display panel 120). Attempting to do so will darken the area 110a in FIG. 42 and cause luminance unevenness (eyeball unevenness).
  • the LED light source device 102 shown in FIG. 41 since the periphery of the light emitting diode element 105 is surrounded by the light reflecting member (inclined surface) 107, the above inconvenience can be solved.
  • the thickness of the light source device 102 (the height of the light emission surface of the LED light source device 102) increases. For this reason, when the thickness of the backlight device 110 is reduced by reducing the thickness of the light guide plate 101 (the height of the light incident surface of the light guide plate 101), the light emitted from the LED light source device 102 is reflected by the light guide plate 101. It becomes difficult to be introduced into the screen, and the luminance is lowered.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide an LED light source device, a backlight device, and a liquid crystal display device capable of improving luminance characteristics. It is.
  • an LED light source device includes a base member having a mounting surface facing in the light emitting direction, a light emitting diode mounted on the mounting surface of the base member A light emitting body including at least an element, a light emitting surface facing the light emitting direction, and a side connecting the light emitting surface and the mounting surface of the base member so as to cover the light emitting body And a transparent resin member that guides the light generated by the light emitter and emits the light from the light exit surface.
  • the side end surface of the transparent resin member is inclined so that the lateral length of the light emitting surface is larger than the lateral length of the mounting surface of the base member, and the inclined side end surface of the transparent resin member and the atmosphere
  • the interface with is a light reflecting surface.
  • the LED light source device As described above, the light generated by the light emitter by tilting the side end surface of the transparent resin member formed on the mounting surface of the base member so as to cover the light emitter. Is reflected by the inclined side end surface of the transparent resin member, and therefore, it is possible to suppress the total reflection of light at the interface between the light emission surface of the transparent resin member and the atmosphere. For this reason, the light emitted from the LED light source device can be increased. Therefore, if the LED light source device of the present invention is used as the light source of the backlight device, the light introduced into the light guide plate increases, so that the luminance can be improved.
  • the light of the transparent resin member is inclined by inclining the side end surface of the transparent resin member so that the lateral length of the light emitting surface of the transparent resin member is larger than the lateral length of the mounting surface of the base member. Since the emission surface becomes larger in the horizontal direction, the light emitted from the LED light source device can be spread uniformly in the horizontal direction. Therefore, when the LED light source device of the present invention is used as the light source of the backlight device, the distance from the LED light source device to the effective light emitting area (the region corresponding to the display region of the liquid crystal display panel) is reduced, thereby narrowing the backlight device. When trying to frame, it is possible to suppress the occurrence of inconvenience that brightness unevenness (eyeball unevenness) occurs.
  • the backlight device can be thinned by reducing the thickness of the light guide plate (the height of the light incident surface (predetermined side end surface) of the light guide plate).
  • the height of the light emitting surface of the LED light source device can be reduced according to the height of the light incident surface (predetermined side end surface) of the light guide plate.
  • the LED light source device of the present invention as the light source of the backlight device, even if the backlight device is reduced in size (thinner and narrower), it is possible to suppress deterioration in luminance characteristics. be able to.
  • the light emitter includes a light emitting diode element that emits blue light and a phosphor that absorbs blue light and emits fluorescence, and the blue light and the fluorescence are mutually connected. White light obtained by mixing colors is emitted.
  • the LED light source device as compared with the case where white light is generated using a light emitting diode element that emits red light, a light emitting diode element that emits green light, and a light emitting diode element that emits blue light. Can be further reduced in size.
  • the side end surface of the transparent resin member is inclined linearly, the refractive index of the atmosphere is n 0, and the refractive index of the transparent resin member is n 1 Further, the inclination angle ⁇ 1 of the side end surface of the transparent resin member with respect to the normal line of the light emitting surface is set so as to satisfy 70 ° ⁇ ⁇ 1 > sin ⁇ 1 (n 0 / n 1 ).
  • the side end surface of the transparent resin member is inclined in a curved shape, and the curvature of the side end surface of the transparent resin member is the side end surface of the transparent resin member and the atmosphere.
  • the light from the illuminant is set so as to be totally reflected in the light emitting direction at the interface.
  • a concave portion dug from the light emitting surface toward the base member side is formed in the transparent resin member.
  • the concave portion of the transparent resin member is preferably formed in a V shape, and the inclination angle ⁇ 2 of the inner surface of the concave portion of the transparent resin member with respect to the normal line of the light emitting surface is 70 ° ⁇ ⁇ 2 ⁇ 45. It is set to meet °.
  • the concave portion of the transparent resin member is preferably formed in a semicircular shape, the length of the long side of the light emitting diode element is L, and the length from the light emitting diode element to the light emitting surface is S.
  • the radius R of the concave portion of the transparent resin member is set so as to satisfy S ⁇ R ⁇ L / 2. If comprised in this way, the light-diffusion effect in the inside of a transparent resin member can be enlarged more.
  • the transparent resin member is formed so that the thickness on the light emitting surface side is smaller than the thickness on the base member side. If comprised in this way, when using the LED light source device of this invention as a light source of a backlight apparatus, the thickness of the light guide plate (the height of the light incident surface (predetermined side end surface) of the light guide plate) is further reduced. However, there is no inconvenience that the light emitted from the LED light source device does not easily enter the light guide plate. As a result, the backlight device can be further reduced in thickness.
  • the transparent resin member gradually decreases in thickness from the base member side toward the light emission surface side at an inclination angle of 20 ° or more and less than 45 °, and the light emission surface side thickness and the base member side It is preferable that the difference between the thickness and the thickness is 0.1 mm or more.
  • a power supply line for supplying power to the light emitting diode element is formed on the mounting surface of the base member, and the power source line is on a predetermined surface different from the mounting surface of the base member. It is preferable that an external terminal connected to the power supply line is formed. If comprised in this way, when mounting a light emitting diode element on the mounting surface of a base member, the electrical connection to the electric power supply line (external terminal) of a light emitting diode element can be performed easily. Thereby, the productivity of the LED light source device can be increased.
  • the LED light source device can be easily mounted on the external device (electrical connection between the external terminal of the external device and the external terminal of the LED light source device).
  • the electrical conductivity from the device to the light emitting diode element can be increased.
  • At least one of the power supply line and the external terminal is made of a laminate of a Cu plating layer and a Ni—Ag plating layer. If comprised in this way, the electrical conductivity from an external apparatus to a light emitting diode element can be improved more, suppressing the oxidation of Cu and the migration of Ag.
  • the power supply line is made of a laminate of a Cu plating layer and a Ni—Ag plating layer, and the external terminal is made of an Au plating layer. If comprised in this way, durability of an external terminal can be improved. Further, when different types are mounted on external devices, they can be easily mounted on the external devices.
  • the backlight device according to the second aspect of the present invention includes the LED light source device according to the first aspect. If comprised in this way, a brightness
  • the liquid crystal display device includes the backlight device according to the second aspect and a liquid crystal display panel irradiated with light from the backlight device. If comprised in this way, a brightness
  • an LED light source device As described above, according to the present invention, an LED light source device, a backlight device, and a liquid crystal display device capable of improving luminance characteristics can be easily obtained.
  • FIG. 1 is a perspective view of an LED light source device according to a first embodiment of the present invention. It is sectional drawing of the LED light source device by 1st Embodiment shown in FIG. It is a figure for demonstrating the advancing direction of the light inside the LED light source device by 1st Embodiment shown in FIG. It is a figure for demonstrating the 1st example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. It is a figure for demonstrating the 1st example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. It is a figure for demonstrating the 1st example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. It is a figure for demonstrating the 1st example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG.
  • FIG. 2 is a perspective view of a backlight device using the LED light source device according to the first embodiment shown in FIG. 1 as a light source. It is a figure of the state by which the LED light source device by 1st Embodiment shown in FIG. 1 was mounted in the flexible printed wiring board. It is a figure of the state by which the LED light source device by 1st Embodiment shown in FIG. 1 was mounted in the flexible printed wiring board.
  • FIG. 2 is a perspective view of a backlight device using the LED light source device according to the first embodiment shown in FIG. 1 as a light source.
  • FIG. 2 is a perspective view of a backlight device using the LED light source device according to the first embodiment shown in FIG. 1 as a light source. It is a figure for demonstrating the effect of 1st Embodiment. It is a top view for demonstrating the manufacturing process of the LED light source device by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing process of the LED light source device by 1st Embodiment of this invention. It is a top view for demonstrating the manufacturing process of the LED light source device by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing process of the LED light source device by 1st Embodiment of this invention.
  • the LED light source device 1 includes a base member 11, a light emitter 12, and a transparent resin member 13, as shown in FIGS.
  • the base member 11 is made of a material conventionally used as a package member (for example, a high heat-resistant polymer resin or ceramic) and has a light emission direction (a direction in which light emitted from the LED light source device 1 travels). It has the mounting surface 11a which faces.
  • the light emitter 12 is for generating light emitted from the LED light source device 1, and only one light emitter 12 is mounted on the mounting surface 11 a of one base member 11.
  • the light emitting body 12 includes a light emitting diode element 14 that emits blue light and a phosphor 15 that is excited by blue light and emits yellow fluorescence, and the light emitting diode element 14 is covered with the phosphor 15. It has a structure. In such a structure, when the light emitting diode element 14 is driven, blue light is emitted from the light emitting diode element 14, and yellow fluorescence is emitted from the phosphor 15 that has absorbed the blue light. Thereby, in the light emitter 12, light (white light) in which blue light and yellow fluorescence are mixed is generated.
  • the phosphor 15 included in the light emitter 12 is YAG: Ce.
  • the transparent resin member 13 is made of a material conventionally used as a sealing member (for example, a heat-resistant resin such as an epoxy resin or a silicone resin), and a light emitter on the mounting surface 11 a of the base member 11. 12 is covered.
  • the transparent resin member 13 includes a light emitting surface 13a facing the light emitting direction and a pair of side end surfaces (side end surfaces facing the lateral direction (A direction)) that connect the light emitting surface 13a and the mounting surface 11a of the base member 11. ) 13b. Then, the light generated by the light emitter 12 is guided by the transparent resin member 13 and is emitted toward the light emission direction. That is, the light generated by the light emitter 12 is emitted from the light emission surface 13 a of the transparent resin member 13.
  • the transparent resin member 13 is formed on the mounting surface 11a of the base member 11 so as not to be applied to an external terminal 17 described later (see FIG. 5).
  • the transparent resin member 13 has a transparent resin member 13 such that the length in the lateral direction (A direction) of the light emitting surface 13a is greater than the lateral length of the mounting surface 11a of the base member 11.
  • the side end surface 13b of the member 13 is inclined linearly.
  • the interface between the linearly inclined side end surface 13b of the transparent resin member 13 and the atmosphere is made to function as a light reflecting surface for reflecting light toward the light emitting direction inside the transparent resin member 13.
  • Inclination angle theta 1 of linearly inclined side end surface 13b of the transparent resin member 13, the refractive index of the atmosphere and n 0 the refractive index of the transparent resin member 13 to the case of the n 1 the following equation (1 ) Is set to satisfy.
  • the inclination angle ⁇ 1 is based on the normal line of the light incident surface 13 a of the transparent resin member 13.
  • the transparent resin member 13 is provided with a light diffusion region for diffusing light from the light emitter 12.
  • This light diffusion region is arranged in a region facing the light emitter 12 and is composed of a V-shaped recess 13c dug from the light emitting surface 13a of the transparent resin member 13 toward the base member 11 side.
  • inclination-angle (theta) 2 of the inner surface of the V-shaped recessed part 13c of the transparent resin member 13 is set so that the following formula
  • the inclination angle ⁇ 2 is based on the normal line of the light incident surface 13 a of the transparent resin member 13.
  • the light from the light-emitting body 12 advances in the arrow direction in FIG. 3 inside the transparent resin member 13. That is, the light from the light emitter 12 is reflected toward the light emission direction at the interface between the linearly inclined side end face 13b of the transparent resin member 13 and the atmosphere, and the V-shaped recess 13c of the transparent resin member 13 is reflected. The light from the light emitter 12 is reflected so as to spread in the lateral direction (A direction) at the interface between the inner surface and the atmosphere.
  • the power supply line 16 for supplying power to the light emitting diode element 14 is divided into two on the mounting surface 11 a of the base member 11. Is formed.
  • external terminals 17 are formed on each of a pair of side end surfaces (predetermined surfaces) 11b facing the lateral direction (A direction) of the base member 11 and extending to a surface located on the opposite side of the mounting surface 11a.
  • the power supply line 16 and the external terminal 17 are made of the same material, and are formed of a laminate of a Cu plating layer and a Ni—Ag plating layer.
  • One power supply line 16 (16a) is connected to an external terminal 17 (17a) formed on one side end surface 11b of the base member 11, and the other power supply line 16 (16b)
  • the member 11 is connected to an external terminal 17 (17b) formed on the other side end surface 11b.
  • One electrode of the light emitting diode element 14 is connected to the power supply line 16a (external terminal 17a), and the other electrode of the light emitting diode element 14 is connected to the power supply line 16b (external terminal 17b) via the wire 18. It is connected to the.
  • the arrangement positions of the anode electrode (Anode) and the cathode electrode (Cathode) of the LED light source apparatus 1 are the same as the arrangement positions of the anode electrode and the cathode electrode of the conventional LED light source apparatus.
  • the wiring structure of the LED light source device 1 may be as shown in FIGS. 8 to 12 in addition to those shown in FIGS.
  • both the power supply lines 16a and 16b are extended to the mounting region 14a of the light emitting diode element 14, and the light emitting diode element 14 is flip-chip mounted. Also good.
  • the power supply line 16 and the external terminal 17 may be formed of different materials. Specifically, a laminate of a Cu plating layer and a Ni—Ag plating layer may be used as the power supply line 16, and an Au plating layer may be used as the external terminal 17. Furthermore, the external terminal 17 may be extended on the side surface along the horizontal direction (A direction).
  • the LED light source device 1 of the first embodiment can be used as a light source of a backlight device 10 installed in a liquid crystal display device.
  • the backlight device 10 is an edge light type
  • the light guide plate 2 is disposed on the rear surface side of the liquid crystal display panel 20, and the light guide plate 2 faces each other so as to face one of the four side end surfaces.
  • a plurality of LED light source devices 1 arranged at a predetermined interval (for example, 0.1 mm or more) are arranged in a state of being mounted on a flexible printed wiring board (external device) 3.
  • the light emitted from the LED light source device 1 is introduced into the inside from a predetermined side end surface of the light guide plate 2 facing the LED light source device 1, and then emitted from the front surface of the light guide plate 2 to be liquid crystal display panel 20. Irradiate the rear surface. Thereby, a desired image is displayed in the display area 20a of the liquid crystal display panel 20.
  • the optical sheet 4 is disposed on the front surface side of the light guide plate 2
  • the reflective sheet 5 is disposed on the rear surface side of the light guide plate 2. Then, the light emitted from the front surface of the light guide plate 2 is diffused and collected by the optical sheet 4, and the light leaking from the rear surface of the light guide plate 2 is reflected by the reflection sheet 5 and reintroduced.
  • the LED light source device 1 of 1st Embodiment when using the LED light source device 1 of 1st Embodiment as a light source of the backlight apparatus 10, mounting to the flexible printed wiring board 3 of the LED light source device 1 is as shown in FIG. 14 and FIG.
  • the external terminal 17 of the LED light source device 1 and the external terminal 3a of the flexible printed wiring board 3 may be connected.
  • the LED light source device 1 is mounted on the flexible printed wiring board 3 in the same manner as the conventional LED light source device is mounted on the flexible printed wiring board 3. For this reason, when the LED light source device 1 is used as the light source of the backlight device 10, it is possible to easily replace the conventional LED light source device.
  • the LED light source device 1 of 1st Embodiment when using the LED light source device 1 of 1st Embodiment as a light source of the backlight apparatus 10, the LED light source device 1 can also be arrange
  • the side end surface 13b of the transparent resin member 13 is linearly inclined, so that the light generated by the light emitter 12 is linearly inclined to the transparent resin member 13 side end surface 13b. Therefore, the total reflection of light at the interface between the light emitting surface 13a of the transparent resin member 13 and the atmosphere can be suppressed. For this reason, the light radiate
  • the side end surface 13b of the transparent resin member 13 is linearly formed so that the lateral length of the light emitting surface 13a of the transparent resin member 13 is larger than the lateral length of the mounting surface 11a of the base member 11.
  • the light emission surface 13a of the transparent resin member 13 becomes larger in the horizontal direction, so that the light emitted from the LED light source device 1 can be spread uniformly in the horizontal direction. Therefore, if the LED light source device 1 of the first embodiment is used as the light source of the backlight device 10, the distance from the LED light source device 1 to the effective light emitting area (the region corresponding to the display region 20a of the liquid crystal display panel 20).
  • the frame size of the backlight device 10 is reduced by reducing the size of the backlight device 10, it is possible to suppress the inconvenience that the luminance unevenness (eyeball unevenness) occurs.
  • the interface between the linearly inclined side end surface 13a of the transparent resin member 13 and the atmosphere is a light reflecting surface for reflecting the light toward the light emitting direction inside the transparent resin member 13, so that Since it is not necessary to surround the periphery of the light emitting diode element 14 with the prepared light reflecting member or the like, the thickness of the LED light source device 1 (the height of the light emitting surface of the LED light source device 1) can be reduced. Therefore, if the LED light source device 1 of the first embodiment is used as the light source of the backlight device 10, the thickness of the light guide plate 2 (the height of the light incident surface (predetermined side end surface) of the light guide plate 2) is reduced.
  • the height of the light emitting surface of the LED light source device 1 is set to the height of the light incident surface (predetermined side end surface) of the light guide plate 2 as shown in FIG. Can be made small (for example, about 0.5 mm). Thereby, it can suppress that the problem that the brightness
  • the LED light source device 1 of the first embodiment as the light source of the backlight device 10, even if the backlight device 10 is downsized (thinned and narrowed), the luminance characteristics are lowered. Can be suppressed.
  • the structure in which the light-emitting diode element 14 is covered with the phosphor 15 is used as the light-emitting body 12, so that the light-emitting diode element that emits red light and the green light are emitted.
  • the LED light source device 1 can be further reduced in size as compared with the case of using three types of light emitting diode elements, ie, a light emitting diode element and a light emitting diode element that emits blue light.
  • the V-shaped recess 13c is formed on the light emitting surface 13a of the transparent resin member 13, so that the recess 13c of the transparent resin member 13 becomes a light diffusion region. Further, the lateral spread of light inside the transparent resin member 13 can be further increased. Therefore, if the LED light source device 1 of the first embodiment is used as the light source of the backlight device 10, it is not necessary to separately form a light diffusion region in the light guide plate 2. That is, since it is not necessary to perform complicated processing on the light guide plate 2, the manufacturing cost can be reduced. Further, in the case where the light diffusion region is formed on the light guide plate 2, the light diffusion effect may be reduced due to the displacement of the light diffusion region and the LED light source device 1, but in the first embodiment, Such inconvenience does not occur.
  • a plurality of light emitters 12 are attached to the base member 11 by adopting a structure in which only one light emitter 12 is attached to one base member 11.
  • the lateral length of the base member 11 can be reduced.
  • the manufacturing yield can be improved as compared with the structure in which the plurality of light emitters 12 are mounted on the base member 11.
  • the power supply line 16 for supplying power to the light emitting diode element 14 is divided into two on the mounting surface 11a of the base member 11, and the base member is formed.
  • the light emitting diode element 14 is mounted on the mounting surface 11a of the base member 11 by forming the external terminal 17 connected to the power supply line 16 on each of the pair of side end surfaces 11b facing the horizontal direction of Electrical connection of the light emitting diode element 14 to the power supply line 16 (external terminal 17) can be easily performed. Thereby, the productivity of the LED light source device 1 can be increased.
  • the LED light source device 1 is mounted on the flexible printed wiring board 3 (electricity between the external terminal 3a of the flexible printed wiring board 3 and the external terminal 17 of the LED light source device 1 by solder 19). Connection) can be easily performed, and electrical conductivity from the flexible printed wiring board 3 to the light emitting diode element 14 can be increased.
  • the flexible printed wiring board 3 can suppress the light emitting diode while suppressing Cu oxidation and Ag migration.
  • the electrical conductivity to the element 14 can be further increased.
  • the productivity of the LED light source device 1 can be further increased.
  • the layers constituting the power supply line 16 and the external terminal 17 can be made continuous, it is possible to suppress resistance and increase the light-equivalent emission efficiency (lm / W).
  • the light emitting diode element 14 has a wiring structure that can be flip-chip mounted, the wire bonding step can be omitted, so that the productivity of the LED light source device 1 can be further improved. Furthermore, if the light-emitting diode element 14 is flip-chip mounted, heat is easily transmitted to the base member 11, so that heat generation in the light-emitting diode element 14 can be suppressed and the light emission efficiency can be improved.
  • the external terminal 17 is made of an Au plating layer, the durability of the external terminal 17 can be improved. Further, when different types are mounted on the flexible printed wiring board 3, they can be easily mounted on the flexible printed wiring board 3.
  • an elongated base member made of a high heat-resistant polymer resin, ceramic, or the like is used. 11 is prepared. Then, a plurality of through holes 11c penetrating from the upper surface side toward the lower surface side and arranged in the longitudinal direction (A direction) with a predetermined interval are formed in the base member 11.
  • region 1a in a figure is an area
  • a power supply line 16 (16a and 16a) made of a laminate of a Cu plating layer and a Ni—Ag plating layer is provided in each of the plurality of regions 1a on the upper surface of the base member 11.
  • 16b a power supply line 16 (16a and 16a) made of a laminate of a Cu plating layer and a Ni—Ag plating layer.
  • external terminals 17 (17a and 17b) made of a laminate of a Cu plating layer and a Ni—Ag plating layer are formed on the inner side surfaces of the plurality of through holes 11c of the base member 11.
  • the power supply line 16a and the external terminal 17a are connected, and the power supply line 16b and the external terminal 17b are connected.
  • the plurality of light emitting diode elements 14 are placed in each of a plurality of regions 1 a on the upper surface of the base member 11. Place one by one. And each lower surface electrode of the some light emitting diode element 14 is connected to the corresponding electric power supply line 16a. Further, the upper surface electrode of each of the plurality of light emitting diode elements 14 is connected to the corresponding power supply line 16 b via the wire 18. Thereafter, each of the plurality of light emitting diode elements 14 is individually covered with a phosphor 15 made of YAG: Ce. As a result, one light emitter 12 is attached to each of the plurality of regions 1 a on the upper surface of the base member 11.
  • a transparent resin member 13 made of a heat-resistant resin such as an epoxy resin or a silicone resin so as to continuously cover the plurality of light emitters 12 on the upper surface of the base member 11.
  • a transparent resin member 13 made of a heat-resistant resin such as an epoxy resin or a silicone resin so as to continuously cover the plurality of light emitters 12 on the upper surface of the base member 11.
  • a plurality of LED light source devices 1 can be manufactured by a single punching process. Moreover, the side end face 13b inclined linearly and the recessed part 13c used as a light-diffusion area
  • a transparent resin member 23 as shown in FIGS. 25 to 27 is used.
  • the transparent resin member 23 covers the light emitter 12 on the mounting surface 11a of the base member 11, and has a light emitting surface 23a facing the light emitting direction, It has a pair of side end surfaces (side end surfaces facing in the lateral direction (A direction)) 23b connecting the light emitting surface 23a and the mounting surface 11a of the base member 11.
  • the transparent resin member 23 is formed so that the length in the lateral direction (A direction) of the light emitting surface 23a of the transparent resin member 23 is larger than the length in the lateral direction of the mounting surface 11a of the base member 11.
  • the side end surface 23b of the member 23 is inclined in a curved surface shape.
  • the interface between the side end face 23b inclined to the curved surface of the transparent resin member 23 and the atmosphere functions as a light reflecting surface for reflecting light toward the light emitting direction inside the transparent resin member 23.
  • the curvature of the side end face 23b inclined in a curved shape of the transparent resin member 23 is such that light from the light emitter 12 is directed in the light emitting direction at the interface between the side end face 23b inclined in the curved shape of the transparent resin member 23 and the atmosphere. It is set to totally reflect.
  • a light diffusion region for diffusing light from the light emitter 12 is provided in the transparent resin member 23.
  • This light diffusion region is the same as the light diffusion region of the first embodiment, and is disposed in a region facing the light emitter 12 and from the light emitting surface 23a of the transparent resin member 23 to the base member 11. It consists of a V-shaped recess 23c dug toward the side. The inclination angle theta 2 of the inner surface of the V-shaped recess 23c of the transparent resin member 23 satisfies the equation (2) of the first embodiment.
  • the light from the light emitter 12 travels in the direction of the arrow in FIG. 27 inside the transparent resin member 23. That is, light from the light emitter 12 is reflected toward the light emission direction at the interface between the side end face 23b inclined in a curved shape of the transparent resin member 23 and the atmosphere, and the V-shaped recess 23c of the transparent resin member 23 is formed. The light from the light emitter 12 is reflected so as to spread in the lateral direction (A direction) at the interface between the inner surface and the atmosphere.
  • a transparent resin member 33 as shown in FIGS. 28 to 30 is used.
  • the transparent resin member 33 covers the light emitter 12 on the mounting surface 11a of the base member 11, and has a light emitting surface 33a facing the light emitting direction, It has a pair of side end surfaces (side end surfaces facing the lateral direction (A direction)) 33b connecting the light emitting surface 33a and the mounting surface 11a of the base member 11.
  • the lateral length (direction A) of the light emitting surface 33a of the transparent resin member 33 is longer than the lateral length of the mounting surface 11a of the base member 11.
  • the side end face 33b of the transparent resin member 33 is inclined linearly so as to be larger.
  • the interface between the linearly inclined side end surface 33 b of the transparent resin member 33 and the atmosphere is made to function as a light reflecting surface for reflecting light toward the light emitting direction inside the transparent resin member 33.
  • the inclination angle ⁇ 1 of the side end face 33b of the transparent resin member 33 satisfies the expression (1) of the first embodiment.
  • a light diffusion region for diffusing light from the light emitter 12 is provided in the transparent resin member 33.
  • This light diffusion region is arranged in a region facing the light emitter 12 and is composed of a semicircular recess 33c dug from the light emitting surface 33a of the transparent resin member 33 toward the base member 11 side. ing.
  • the radius R of the semicircular recess 33c of the transparent resin member 33 is L, which is the length from the light emitting surface 33a of the transparent resin member 33 to the light emitting diode element 14. Is set to satisfy the following formula (3).
  • the light from the light-emitting body 12 advances in the arrow direction in FIG. 30 inside the transparent resin member 33. That is, the light from the light emitter 12 is reflected toward the light emission direction at the interface between the linearly inclined side end face 33b of the transparent resin member 33 and the atmosphere, and the semicircular recess 33c of the transparent resin member 33 is reflected. The light from the light emitter 12 is reflected so as to spread in the lateral direction (A direction) at the interface between the inner surface and the atmosphere.
  • the remaining configuration of the third embodiment is the same as that of the first embodiment.
  • a semicircular recess 33c is formed on the light emitting surface 33a of the transparent resin member 33, and the semicircular recess 33c functions as a light diffusion region.
  • the light diffusion effect inside can be further increased.
  • a transparent resin member 43 as shown in FIGS. 31 to 33 is used. Similar to the transparent resin member 13 of the first embodiment, the transparent resin member 43 covers the light emitter 12 on the mounting surface 11a of the base member 11, and also has a light emitting surface 43a facing the light emitting direction, It has a pair of side end surfaces (side end surfaces facing the lateral direction (A direction)) 43b that connect the light emitting surface 43a and the mounting surface 11a of the base member 11.
  • the length of the horizontal direction (A direction) of the light-projection surface 43a of the transparent resin member 43 is longer than the length of the horizontal direction of the mounting surface 11a of the base member 11 like the said 2nd Embodiment.
  • the side end face 43b of the transparent resin member 43 is inclined in a curved shape so as to be larger.
  • the interface between the side end face 43 b inclined to the curved surface of the transparent resin member 43 and the atmosphere functions as a light reflecting surface for reflecting light toward the light emitting direction inside the transparent resin member 43.
  • a light diffusion region for diffusing light from the light emitter 12 is provided in the transparent resin member 43.
  • This light diffusion region is the same as the light diffusion region of the third embodiment, is disposed in a region facing the light emitter 12, and extends from the light emitting surface 43 a of the transparent resin member 43 to the base member 11. It consists of a semicircular recess 43c dug toward the side.
  • the radius R of the semicircular recess 43c of the transparent resin member 43 satisfies the expression (3) of the third embodiment.
  • the light from the light emitter 12 travels in the direction of the arrow in FIG. 33 inside the transparent resin member 43. That is, light from the light emitter 12 is reflected toward the light emission direction at the interface between the side end surface 43b inclined in a curved shape of the transparent resin member 43 and the atmosphere, and the semicircular recess 43c of the transparent resin member 43 is reflected. The light from the light emitter 12 is reflected so as to spread in the lateral direction (A direction) at the interface between the inner surface and the atmosphere.
  • the remaining configuration of the fourth embodiment is similar to that of the aforementioned first embodiment.
  • a transparent resin member 53 as shown in FIGS. 34 to 37 is used. Similar to the transparent resin member 13 of the first embodiment, the transparent resin member 53 covers the light emitter 12 on the mounting surface 11a of the base member 11, and has a light emitting surface 53a facing the light emitting direction, It has a pair of side end surfaces (side end surfaces facing the lateral direction (A direction)) 53b that connect the light emitting surface 53a and the mounting surface 11a of the base member 11.
  • the lateral length (direction A) of the light emitting surface 53a of the transparent resin member 53 is longer than the lateral length of the mounting surface 11a of the base member 11.
  • the side end face 53b of the transparent resin member 53 is linearly inclined so as to be larger.
  • the interface between the linearly inclined side end surface 53 b of the transparent resin member 53 and the atmosphere is made to function as a light reflecting surface for reflecting light toward the light emitting direction inside the transparent resin member 53.
  • the light diffusion region (V-shaped recess 53 c) for diffusing light from the light emitter 12 in the lateral direction (A direction) is a transparent resin member 53. Is formed on the light emission surface 53a.
  • the thickness of the transparent resin member 53 on the light emitting surface 53a side is smaller than the thickness on the base member 11 side. Specifically, the thickness of the transparent resin member 53 gradually decreases from the base member 11 side toward the light emitting surface 53a side at an inclination angle ⁇ 3 of 20 ° or more and less than 45 °, and the transparent resin member 53 The difference T between the thickness on the light emitting surface 53a side and the thickness on the base member 11 side is 0.1 mm or more.
  • the remaining configuration of the fifth embodiment is similar to that of the aforementioned first embodiment.
  • the thickness of the transparent resin member 53 on the light emitting surface 53a side is made smaller than the thickness on the base member 11 side, so that the LED light source device 51 of the fifth embodiment is backed.
  • the thickness of the light guide plate 2 (the height of the light incident surface (predetermined side end surface) of the light guide plate 2) is set to the first. Even if it is smaller than the embodiment (for example, about 0.35 mm), there is no inconvenience that the light emitted from the LED light source device 51 does not easily enter the light guide plate 2. As a result, the backlight device 10 can be further reduced in thickness.

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Abstract

Provided is an LED light source device having improved luminance characteristics. The LED light source device (1) is provided with a light emitting body (12) mounted on a mounting surface (11a) of a base member (11), and a transparent resin member (13), which is formed on the mounting surface (11a) and provided with a light emitting surface (13a) and a side end surface (13b). The side end surface (13b) is tilted so that the length of the light emitting surface (13a) in the lateral direction is longer than the length of the mounting surface (11a) in the lateral direction, and an interface between the side end surface (13b) and atmosphere is permitted to be a light reflecting surface.

Description

ＬＥＤ光源装置、バックライト装置および液晶表示装置LED light source device, backlight device, and liquid crystal display device
　この発明は、ＬＥＤ光源装置、バックライト装置および液晶表示装置に関する。 The present invention relates to an LED light source device, a backlight device, and a liquid crystal display device.
　従来、発光ダイオード素子を少なくとも含むＬＥＤ光源装置が知られており、中小型の液晶表示装置に設置されるバックライト装置の光源として用いられている。以下に、図３９～図４１を参照して、従来のバックライト装置およびその光源として用いられるＬＥＤ光源装置について説明する。なお、図３９は、従来のバックライト装置を簡略化した図であり、図４０および図４１は、従来のＬＥＤ光源装置を簡略化した図である。 Conventionally, an LED light source device including at least a light emitting diode element is known, and is used as a light source of a backlight device installed in a small-sized liquid crystal display device. A conventional backlight device and an LED light source device used as a light source thereof will be described below with reference to FIGS. 39 is a simplified diagram of a conventional backlight device, and FIGS. 40 and 41 are simplified diagrams of a conventional LED light source device.
　従来のバックライト装置１１０は、図３９に示すように、導光板１０１、ＬＥＤ光源装置１０２、光学シート１０３および反射シート１０４などを備えている。なお、図３９に示すバックライト装置１１０は、エッジライト型である。 As shown in FIG. 39, the conventional backlight device 110 includes a light guide plate 101, an LED light source device 102, an optical sheet 103, a reflection sheet 104, and the like. Note that the backlight device 110 illustrated in FIG. 39 is an edge light type.
　導光板１０１は、板状部材からなっており、４つの側端面と、その４つの側端面に対して垂直な２つの面（前面および後面）とを有している。この導光板１０１の４つの側端面のうちの所定の側端面は、ＬＥＤ光源装置１０２からの光を内部に導入するための光入射面として機能し、導光板１０１の前面は、内部に導入された光を面状に出射するための光出射面として機能する。ＬＥＤ光源装置１０２は、導光板１０１の光入射面側に配置されており、光学シート１０３および反射シート１０４は、導光板１０１の光出射面側および後面側にそれぞれ配置されている。なお、ＬＥＤ光源装置１０２は、十分な輝度を確保するために、導光板１０１の光入射面に沿って互いに所定の間隔を隔てて複数配置されている。 The light guide plate 101 is made of a plate-like member, and has four side end surfaces and two surfaces (front and rear surfaces) perpendicular to the four side end surfaces. A predetermined side end surface of the four side end surfaces of the light guide plate 101 functions as a light incident surface for introducing light from the LED light source device 102 into the inside, and the front surface of the light guide plate 101 is introduced into the inside. It functions as a light emitting surface for emitting the emitted light in a planar shape. The LED light source device 102 is disposed on the light incident surface side of the light guide plate 101, and the optical sheet 103 and the reflection sheet 104 are disposed on the light emitting surface side and the rear surface side of the light guide plate 101, respectively. A plurality of LED light source devices 102 are arranged at predetermined intervals along the light incident surface of the light guide plate 101 in order to ensure sufficient luminance.
　また、ＬＥＤ光源装置１０２は、たとえば、図４０や図４１に示すような構造を有している。具体的には、図４０に示すＬＥＤ光源装置１０２は、発光ダイオード素子１０５が直方体形状の封止部材１０６で封止された構造を有している。また、図４１に示すＬＥＤ光源装置１０２は、発光ダイオード素子１０５の周囲が光反射部材（傾斜面）１０７で囲まれた構造を有している（たとえば、特許文献１参照）。 Further, the LED light source device 102 has a structure as shown in FIGS. 40 and 41, for example. Specifically, the LED light source device 102 shown in FIG. 40 has a structure in which the light emitting diode element 105 is sealed with a rectangular parallelepiped sealing member 106. 41 has a structure in which the periphery of the light emitting diode element 105 is surrounded by a light reflecting member (inclined surface) 107 (see, for example, Patent Document 1).
　そして、図３９に示した従来のバックライト装置１１０では、ＬＥＤ光源装置１０２で光が生成されると、その光が導光板１０１の光入射面（所定の側端面）から導入されるとともに、導光板１０１の光出射面（前面）から出射される。その後、導光板１０１の光出射面から出射された光は、光学シート１０３で拡散・集光され、液晶表示パネル１２０の後面を照明する。これにより、液晶表示パネル１２０の表示領域１２０ａにおいて、所望の画像が表示される。なお、導光板１０１の後面から漏れた光は、反射シート１０４で反射されることにより再導入される。 In the conventional backlight device 110 shown in FIG. 39, when light is generated by the LED light source device 102, the light is introduced from the light incident surface (predetermined side end surface) of the light guide plate 101 and guided. The light is emitted from the light emission surface (front surface) of the optical plate 101. Thereafter, the light emitted from the light emitting surface of the light guide plate 101 is diffused and collected by the optical sheet 103 to illuminate the rear surface of the liquid crystal display panel 120. Thereby, a desired image is displayed in the display area 120a of the liquid crystal display panel 120. The light leaking from the rear surface of the light guide plate 101 is reintroduced by being reflected by the reflection sheet 104.
特開２００７－１５０３１５号公報JP 2007-150315 A
　しかしながら、上記した従来のＬＥＤ光源装置１０２をバックライト装置１１０の光源として用いる場合には、以下のような不都合が生じる。 However, when the conventional LED light source device 102 described above is used as the light source of the backlight device 110, the following inconvenience occurs.
　すなわち、図４０に示したＬＥＤ光源装置１０２を用いる場合には、発光ダイオード素子１０５を直方体形状の封止部材１０６で封止しているため、ＬＥＤ光源装置１０２の光出射面と大気との界面において全反射される光が多くなる。このため、ＬＥＤ光源装置１０２の光出射面から出射される光量が減少し、輝度が低下してしまう。 That is, when the LED light source device 102 shown in FIG. 40 is used, since the light emitting diode element 105 is sealed with the rectangular parallelepiped sealing member 106, the interface between the light emitting surface of the LED light source device 102 and the atmosphere. More light is totally reflected at. For this reason, the light quantity emitted from the light emitting surface of the LED light source device 102 decreases, and the luminance decreases.
　さらに、この場合には、ＬＥＤ光源装置１０２から出射される光の横方向への広がりが不均一になる。このため、図４２に示すように、ＬＥＤ光源装置１０２から有効発光エリア（液晶表示パネル１２０の表示領域１２０ａに対応する領域）までの距離を小さくすることでバックライト装置１１０の狭額縁化を図ろうとすると、図４２中の領域１１０ａが暗くなり、輝度ムラ（目玉ムラ）の原因となってしまう。 Furthermore, in this case, the lateral spread of the light emitted from the LED light source device 102 becomes non-uniform. For this reason, as shown in FIG. 42, the frame of the backlight device 110 is reduced by reducing the distance from the LED light source device 102 to the effective light emitting area (the region corresponding to the display region 120a of the liquid crystal display panel 120). Attempting to do so will darken the area 110a in FIG. 42 and cause luminance unevenness (eyeball unevenness).
　また、図４１に示したＬＥＤ光源装置１０２を用いる場合には、発光ダイオード素子１０５の周囲を光反射部材（傾斜面）１０７で囲んでいるため、上記した不都合を解消することはできるが、ＬＥＤ光源装置１０２の厚み（ＬＥＤ光源装置１０２の光出射面の高さ）が大きくなる。このため、導光板１０１の厚み（導光板１０１の光入射面の高さ）を小さくすることでバックライト装置１１０の薄型化を図ろうとすると、ＬＥＤ光源装置１０２から出射された光が導光板１０１に導入され難くなり、輝度が低下してしまう。 In addition, when the LED light source device 102 shown in FIG. 41 is used, since the periphery of the light emitting diode element 105 is surrounded by the light reflecting member (inclined surface) 107, the above inconvenience can be solved. The thickness of the light source device 102 (the height of the light emission surface of the LED light source device 102) increases. For this reason, when the thickness of the backlight device 110 is reduced by reducing the thickness of the light guide plate 101 (the height of the light incident surface of the light guide plate 101), the light emitted from the LED light source device 102 is reflected by the light guide plate 101. It becomes difficult to be introduced into the screen, and the luminance is lowered.
　この発明は、上記のような課題を解決するためになされたものであり、この発明の目的は、輝度特性を向上させることが可能なＬＥＤ光源装置、バックライト装置および液晶表示装置を提供することである。 The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an LED light source device, a backlight device, and a liquid crystal display device capable of improving luminance characteristics. It is.
　上記の目的を達成するために、この発明の第１の局面によるＬＥＤ光源装置は、光出射方向に向く装着面を有するベース部材と、ベース部材の装着面上に装着されているとともに、発光ダイオード素子を少なくとも含む発光体と、発光体を覆うようにベース部材の装着面上に形成されているとともに、光出射方向に向く光出射面と、光出射面とベース部材の装着面とを繋ぐ側端面とを有し、発光体で生成された光を導光して光出射面から出射する透明樹脂部材とを備えている。そして、光出射面の横方向の長さがベース部材の装着面の横方向の長さよりも大きくなるように透明樹脂部材の側端面が傾斜しており、透明樹脂部材の傾斜した側端面と大気との界面が光反射面となっている。 In order to achieve the above object, an LED light source device according to a first aspect of the present invention includes a base member having a mounting surface facing in the light emitting direction, a light emitting diode mounted on the mounting surface of the base member A light emitting body including at least an element, a light emitting surface facing the light emitting direction, and a side connecting the light emitting surface and the mounting surface of the base member so as to cover the light emitting body And a transparent resin member that guides the light generated by the light emitter and emits the light from the light exit surface. Then, the side end surface of the transparent resin member is inclined so that the lateral length of the light emitting surface is larger than the lateral length of the mounting surface of the base member, and the inclined side end surface of the transparent resin member and the atmosphere The interface with is a light reflecting surface.
　第１の局面によるＬＥＤ光源装置では、上記のように、発光体を覆うようにベース部材の装着面上に形成された透明樹脂部材の側端面を傾斜させることによって、発光体で生成された光が透明樹脂部材の傾斜した側端面で反射するため、透明樹脂部材の光出射面と大気との界面において光が全反射されるのを抑制することができる。このため、ＬＥＤ光源装置から出射される光を増加させることができる。したがって、本発明のＬＥＤ光源装置をバックライト装置の光源として用いれば、導光板に導入される光が増加するので、輝度を向上させることができる。 In the LED light source device according to the first aspect, as described above, the light generated by the light emitter by tilting the side end surface of the transparent resin member formed on the mounting surface of the base member so as to cover the light emitter. Is reflected by the inclined side end surface of the transparent resin member, and therefore, it is possible to suppress the total reflection of light at the interface between the light emission surface of the transparent resin member and the atmosphere. For this reason, the light emitted from the LED light source device can be increased. Therefore, if the LED light source device of the present invention is used as the light source of the backlight device, the light introduced into the light guide plate increases, so that the luminance can be improved.
　この場合、透明樹脂部材の光出射面の横方向の長さがベース部材の装着面の横方向の長さよりも大きくなるように透明樹脂部材の側端面を傾斜させることによって、透明樹脂部材の光出射面が横方向に大きくなるため、ＬＥＤ光源装置から出射される光を横方向に均一に広げることができる。したがって、本発明のＬＥＤ光源装置をバックライト装置の光源として用いれば、ＬＥＤ光源装置から有効発光エリア（液晶表示パネルの表示領域に対応する領域）までの距離を小さくすることでバックライト装置の狭額縁化を図る場合に、輝度ムラ（目玉ムラ）が発生するという不都合が生じるのを抑制することができる。 In this case, the light of the transparent resin member is inclined by inclining the side end surface of the transparent resin member so that the lateral length of the light emitting surface of the transparent resin member is larger than the lateral length of the mounting surface of the base member. Since the emission surface becomes larger in the horizontal direction, the light emitted from the LED light source device can be spread uniformly in the horizontal direction. Therefore, when the LED light source device of the present invention is used as the light source of the backlight device, the distance from the LED light source device to the effective light emitting area (the region corresponding to the display region of the liquid crystal display panel) is reduced, thereby narrowing the backlight device. When trying to frame, it is possible to suppress the occurrence of inconvenience that brightness unevenness (eyeball unevenness) occurs.
　また、透明樹脂部材の傾斜した側端面と大気との界面を光反射面とすることによって、別途準備した光反射部材などで発光ダイオード素子の周囲を囲む必要がないので、ＬＥＤ光源装置の厚み（ＬＥＤ光源装置の光出射面の高さ）を小さくすることができる。したがって、本発明のＬＥＤ光源装置をバックライト装置の光源として用いれば、導光板の厚み（導光板の光入射面（所定の側端面）の高さ）を小さくすることでバックライト装置の薄型化を図る場合に、ＬＥＤ光源装置の光出射面の高さを導光板の光入射面（所定の側端面）の高さに合わせて小さくすることができる。これにより、ＬＥＤ光源装置から出射された光が導光板に入射し難くなることに起因して、輝度が低下するという不都合が生じるのを抑制することができる。 In addition, by making the interface between the inclined side end face of the transparent resin member and the atmosphere a light reflecting surface, it is not necessary to surround the light emitting diode element with a separately prepared light reflecting member or the like, so the thickness of the LED light source device ( The height of the light emission surface of the LED light source device can be reduced. Therefore, if the LED light source device of the present invention is used as the light source of the backlight device, the backlight device can be thinned by reducing the thickness of the light guide plate (the height of the light incident surface (predetermined side end surface) of the light guide plate). In this case, the height of the light emitting surface of the LED light source device can be reduced according to the height of the light incident surface (predetermined side end surface) of the light guide plate. As a result, it is possible to suppress the inconvenience that the luminance is lowered due to the light emitted from the LED light source device becoming difficult to enter the light guide plate.
　これらの結果、本発明のＬＥＤ光源装置をバックライト装置の光源として用いることにより、バックライト装置の小型化（薄型化および狭額縁化）を図ったとしても、輝度特性が低下するのを抑制することができる。 As a result, by using the LED light source device of the present invention as the light source of the backlight device, even if the backlight device is reduced in size (thinner and narrower), it is possible to suppress deterioration in luminance characteristics. be able to.
　上記第１の局面によるＬＥＤ光源装置において、好ましくは、発光体は、青色光を発光する発光ダイオード素子と、青色光を吸収して蛍光を発光する蛍光体とを含み、青色光および蛍光が互いに混色することにより得られる白色光を出射する。このように構成することにより、赤色光を発光する発光ダイオード素子、緑色光を発光する発光ダイオード素子および青色光を発光する発光ダイオード素子を用いて白色光を生成する場合に比べて、ＬＥＤ光源装置をより小型化することができる。 In the LED light source device according to the first aspect, preferably, the light emitter includes a light emitting diode element that emits blue light and a phosphor that absorbs blue light and emits fluorescence, and the blue light and the fluorescence are mutually connected. White light obtained by mixing colors is emitted. By configuring in this way, the LED light source device as compared with the case where white light is generated using a light emitting diode element that emits red light, a light emitting diode element that emits green light, and a light emitting diode element that emits blue light. Can be further reduced in size.
　上記第１の局面によるＬＥＤ光源装置において、好ましくは、透明樹脂部材の側端面が直線状に傾斜しており、大気の屈折率をｎ０とし、透明樹脂部材の屈折率をｎ１とした場合に、光出射面の法線に対する透明樹脂部材の側端面の傾斜角度θ１は、７０°≧θ１＞ｓｉｎ－１（ｎ０／ｎ１）を満たすように設定されている。 In the LED light source device according to the first aspect, preferably, the side end surface of the transparent resin member is inclined linearly, the refractive index of the atmosphere is n 0, and the refractive index of the transparent resin member is n 1 Further, the inclination angle θ 1 of the side end surface of the transparent resin member with respect to the normal line of the light emitting surface is set so as to satisfy 70 ° ≧ θ 1 > sin −1 (n 0 / n 1 ).
　また、上記第１の局面によるＬＥＤ光源装置において、好ましくは、透明樹脂部材の側端面が曲面状に傾斜しており、透明樹脂部材の側端面の曲率は、透明樹脂部材の側端面と大気との界面において発光体からの光が光出射方向に向けて全反射するように設定されている。 In the LED light source device according to the first aspect described above, preferably, the side end surface of the transparent resin member is inclined in a curved shape, and the curvature of the side end surface of the transparent resin member is the side end surface of the transparent resin member and the atmosphere. The light from the illuminant is set so as to be totally reflected in the light emitting direction at the interface.
　上記第１の局面によるＬＥＤ光源装置において、透明樹脂部材に、光出射面からベース部材側に向かって掘り込まれた凹部が形成されていることが好ましい。このように構成することにより、透明樹脂部材の凹部が光拡散領域となるため、透明樹脂部材の内部における光の横方向への広がりをより大きくすることができる。したがって、本発明のＬＥＤ光源装置をバックライト装置の光源として用いれば、導光板に光拡散領域を別途形成する必要がなくなる。すなわち、導光板に複雑な加工を施す必要がなくなるので、製造コストを削減することができる。また、導光板に光拡散領域を形成する場合では、光拡散領域とＬＥＤ光源装置との位置がずれることにより光の拡散効果が低下することがあるが、本発明では、そのような不都合が生じることはない。 In the LED light source device according to the first aspect described above, it is preferable that a concave portion dug from the light emitting surface toward the base member side is formed in the transparent resin member. By comprising in this way, since the recessed part of a transparent resin member becomes a light-diffusion area | region, the spread to the horizontal direction of the light inside a transparent resin member can be enlarged more. Therefore, if the LED light source device of the present invention is used as the light source of the backlight device, it is not necessary to separately form a light diffusion region on the light guide plate. That is, since it is not necessary to perform complicated processing on the light guide plate, the manufacturing cost can be reduced. In addition, in the case where the light diffusion region is formed on the light guide plate, the light diffusion effect may be reduced due to the displacement between the light diffusion region and the LED light source device. However, in the present invention, such inconvenience occurs. There is nothing.
　上記の場合、好ましくは、透明樹脂部材の凹部がＶ字状に形成されており、光出射面の法線に対する透明樹脂部材の凹部の内面の傾斜角度θ２は、７０°≧θ２≧４５°を満たすように設定されている。 In the above case, the concave portion of the transparent resin member is preferably formed in a V shape, and the inclination angle θ 2 of the inner surface of the concave portion of the transparent resin member with respect to the normal line of the light emitting surface is 70 ° ≧ θ 2 ≧ 45. It is set to meet °.
　また、上記の場合、好ましくは、透明樹脂部材の凹部が半円状に形成されており、発光ダイオード素子の長辺の長さをＬとし、発光ダイオード素子から光出射面までの長さをＳとした場合に、透明樹脂部材の凹部の半径Ｒは、Ｓ≧Ｒ≧Ｌ／２を満たすように設定されている。このように構成すれば、透明樹脂部材の内部における光の拡散効果をより大きくすることができる。 In the above case, the concave portion of the transparent resin member is preferably formed in a semicircular shape, the length of the long side of the light emitting diode element is L, and the length from the light emitting diode element to the light emitting surface is S. In this case, the radius R of the concave portion of the transparent resin member is set so as to satisfy S ≧ R ≧ L / 2. If comprised in this way, the light-diffusion effect in the inside of a transparent resin member can be enlarged more.
　上記第１の局面によるＬＥＤ光源装置において、好ましくは、透明樹脂部材は、光出射面側の厚みがベース部材側の厚みよりも小さくなるように形成されている。このように構成すれば、本発明のＬＥＤ光源装置をバックライト装置の光源として用いる場合に、導光板の厚み（導光板の光入射面（所定の側端面）の高さ）をさらに小さくしたとしても、ＬＥＤ光源装置から出射された光が導光板に入射し難くなるという不都合が生じることはない。これにより、バックライト装置のさらなる薄型化を図ることができる。 In the LED light source device according to the first aspect, preferably, the transparent resin member is formed so that the thickness on the light emitting surface side is smaller than the thickness on the base member side. If comprised in this way, when using the LED light source device of this invention as a light source of a backlight apparatus, the thickness of the light guide plate (the height of the light incident surface (predetermined side end surface) of the light guide plate) is further reduced. However, there is no inconvenience that the light emitted from the LED light source device does not easily enter the light guide plate. As a result, the backlight device can be further reduced in thickness.
　上記の場合、透明樹脂部材は、２０°以上４５°未満の傾斜角度でベース部材側から光出射面側に向かって厚みが徐々に小さくなり、かつ、光出射面側の厚みとベース部材側の厚みとの差が０．１ｍｍ以上となるように形成されていることが好ましい。 In the above case, the transparent resin member gradually decreases in thickness from the base member side toward the light emission surface side at an inclination angle of 20 ° or more and less than 45 °, and the light emission surface side thickness and the base member side It is preferable that the difference between the thickness and the thickness is 0.1 mm or more.
　上記第１の局面によるＬＥＤ光源装置において、ベース部材の装着面上に、発光ダイオード素子への電力の供給を行う電力供給線が形成されており、ベース部材の装着面とは異なる所定面上に、電力供給線に繋がる外部端子が形成されていることが好ましい。このように構成すれば、発光ダイオード素子をベース部材の装着面上に装着する際に、発光ダイオード素子の電力供給線（外部端子）への電気的な接続を容易に行うことができる。これにより、ＬＥＤ光源装置の生産性を高めることができる。また、外部端子の面積を大きく取れるため、外部機器へのＬＥＤ光源装置の実装（外部機器の外部端子とＬＥＤ光源装置の外部端子との電気的な接続）を容易に行うことができるとともに、外部機器から発光ダイオード素子への電気伝導性を高めることができる。 In the LED light source device according to the first aspect, a power supply line for supplying power to the light emitting diode element is formed on the mounting surface of the base member, and the power source line is on a predetermined surface different from the mounting surface of the base member. It is preferable that an external terminal connected to the power supply line is formed. If comprised in this way, when mounting a light emitting diode element on the mounting surface of a base member, the electrical connection to the electric power supply line (external terminal) of a light emitting diode element can be performed easily. Thereby, the productivity of the LED light source device can be increased. In addition, since the area of the external terminal can be increased, the LED light source device can be easily mounted on the external device (electrical connection between the external terminal of the external device and the external terminal of the LED light source device). The electrical conductivity from the device to the light emitting diode element can be increased.
　上記の場合、好ましくは、電力供給線および外部端子のうちの少なくとも一方は、Ｃｕメッキ層とＮｉ－Ａｇメッキ層との積層体からなっている。このように構成すれば、Ｃｕの酸化やＡｇのマイグレーションを抑制しながら、外部機器から発光ダイオード素子への電気伝導性をより高めることができる。 In the above case, preferably, at least one of the power supply line and the external terminal is made of a laminate of a Cu plating layer and a Ni—Ag plating layer. If comprised in this way, the electrical conductivity from an external apparatus to a light emitting diode element can be improved more, suppressing the oxidation of Cu and the migration of Ag.
　また、上記の場合、電力供給線がＣｕメッキ層とＮｉ－Ａｇメッキ層との積層体からなっており、外部端子がＡｕメッキ層からなっていることが好ましい。このように構成すれば、外部端子の耐久性を高めることができる。また、種類が互いに異なるものを外部機器に実装する場合に、それらの外部機器への実装を容易に行うことができる。 In the above case, it is preferable that the power supply line is made of a laminate of a Cu plating layer and a Ni—Ag plating layer, and the external terminal is made of an Au plating layer. If comprised in this way, durability of an external terminal can be improved. Further, when different types are mounted on external devices, they can be easily mounted on the external devices.
　この発明の第２の局面によるバックライト装置は、上記第１の局面によるＬＥＤ光源装置を備えている。このように構成すれば、容易に、輝度特性を向上させることができる。 The backlight device according to the second aspect of the present invention includes the LED light source device according to the first aspect. If comprised in this way, a brightness | luminance characteristic can be improved easily.
　また、この発明の第３の局面による液晶表示装置は、上記第２の局面によるバックライト装置と、バックライト装置からの光が照射される液晶表示パネルとを備えている。このように構成すれば、容易に、輝度特性を向上させることができる。 The liquid crystal display device according to the third aspect of the present invention includes the backlight device according to the second aspect and a liquid crystal display panel irradiated with light from the backlight device. If comprised in this way, a brightness | luminance characteristic can be improved easily.
　以上のように、本発明によれば、輝度特性を向上させることが可能なＬＥＤ光源装置、バックライト装置および液晶表示装置を容易に得ることができる。 As described above, according to the present invention, an LED light source device, a backlight device, and a liquid crystal display device capable of improving luminance characteristics can be easily obtained.
本発明の第１実施形態によるＬＥＤ光源装置の斜視図である。1 is a perspective view of an LED light source device according to a first embodiment of the present invention. 図１に示した第１実施形態によるＬＥＤ光源装置の断面図である。It is sectional drawing of the LED light source device by 1st Embodiment shown in FIG. 図１に示した第１実施形態によるＬＥＤ光源装置の内部における光の進行方向を説明するための図である。It is a figure for demonstrating the advancing direction of the light inside the LED light source device by 1st Embodiment shown in FIG. 図１に示した第１実施形態によるＬＥＤ光源装置の配線構造の第１の例を説明するための図である。It is a figure for demonstrating the 1st example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. 図１に示した第１実施形態によるＬＥＤ光源装置の配線構造の第１の例を説明するための図である。It is a figure for demonstrating the 1st example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. 図１に示した第１実施形態によるＬＥＤ光源装置の配線構造の第１の例を説明するための図である。It is a figure for demonstrating the 1st example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. 図１に示した第１実施形態によるＬＥＤ光源装置の配線構造の第１の例を説明するための図である。It is a figure for demonstrating the 1st example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. 図１に示した第１実施形態によるＬＥＤ光源装置の配線構造の第２の例を説明するための図である。It is a figure for demonstrating the 2nd example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. 図１に示した第１実施形態によるＬＥＤ光源装置の配線構造の第２の例を説明するための図である。It is a figure for demonstrating the 2nd example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. 図１に示した第１実施形態によるＬＥＤ光源装置の配線構造の第３の例を説明するための図である。It is a figure for demonstrating the 3rd example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. 図１に示した第１実施形態によるＬＥＤ光源装置の配線構造の第３の例を説明するための図である。It is a figure for demonstrating the 3rd example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. 図１に示した第１実施形態によるＬＥＤ光源装置の配線構造の第３の例を説明するための図である。It is a figure for demonstrating the 3rd example of the wiring structure of the LED light source device by 1st Embodiment shown in FIG. 図１に示した第１実施形態によるＬＥＤ光源装置を光源として用いたバックライト装置の斜視図である。FIG. 2 is a perspective view of a backlight device using the LED light source device according to the first embodiment shown in FIG. 1 as a light source. 図１に示した第１実施形態によるＬＥＤ光源装置がフレキシブルプリント配線板に実装された状態の図である。It is a figure of the state by which the LED light source device by 1st Embodiment shown in FIG. 1 was mounted in the flexible printed wiring board. 図１に示した第１実施形態によるＬＥＤ光源装置がフレキシブルプリント配線板に実装された状態の図である。It is a figure of the state by which the LED light source device by 1st Embodiment shown in FIG. 1 was mounted in the flexible printed wiring board. 図１に示した第１実施形態によるＬＥＤ光源装置を光源として用いたバックライト装置の斜視図である。FIG. 2 is a perspective view of a backlight device using the LED light source device according to the first embodiment shown in FIG. 1 as a light source. 図１に示した第１実施形態によるＬＥＤ光源装置を光源として用いたバックライト装置の斜視図である。FIG. 2 is a perspective view of a backlight device using the LED light source device according to the first embodiment shown in FIG. 1 as a light source. 第１実施形態の効果を説明するための図である。It is a figure for demonstrating the effect of 1st Embodiment. 本発明の第１実施形態によるＬＥＤ光源装置の製造プロセスを説明するための平面図である。It is a top view for demonstrating the manufacturing process of the LED light source device by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ光源装置の製造プロセスを説明するための断面図である。It is sectional drawing for demonstrating the manufacturing process of the LED light source device by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ光源装置の製造プロセスを説明するための平面図である。It is a top view for demonstrating the manufacturing process of the LED light source device by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ光源装置の製造プロセスを説明するための断面図である。It is sectional drawing for demonstrating the manufacturing process of the LED light source device by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ光源装置の製造プロセスを説明するための断面図である。It is sectional drawing for demonstrating the manufacturing process of the LED light source device by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ光源装置の製造プロセスを説明するための断面図である。It is sectional drawing for demonstrating the manufacturing process of the LED light source device by 1st Embodiment of this invention. 本発明の第２実施形態によるＬＥＤ光源装置の斜視図である。It is a perspective view of the LED light source device by 2nd Embodiment of this invention. 図２５に示した第２実施形態によるＬＥＤ光源装置の断面図である。It is sectional drawing of the LED light source device by 2nd Embodiment shown in FIG. 図２５に示した第２実施形態によるＬＥＤ光源装置の内部における光の進行方向を説明するための図である。It is a figure for demonstrating the advancing direction of the light inside the LED light source device by 2nd Embodiment shown in FIG. 本発明の第３実施形態によるＬＥＤ光源装置の斜視図である。It is a perspective view of the LED light source device by 3rd Embodiment of this invention. 図２８に示した第３実施形態によるＬＥＤ光源装置の断面図である。It is sectional drawing of the LED light source device by 3rd Embodiment shown in FIG. 図２８に示した第３実施形態によるＬＥＤ光源装置の内部における光の進行方向を説明するための図である。It is a figure for demonstrating the advancing direction of the light inside the LED light source device by 3rd Embodiment shown in FIG. 本発明の第４実施形態によるＬＥＤ光源装置の斜視図である。It is a perspective view of the LED light source device by 4th Embodiment of this invention. 図３１に示した第４実施形態によるＬＥＤ光源装置の断面図である。It is sectional drawing of the LED light source device by 4th Embodiment shown in FIG. 図３１に示した第４実施形態によるＬＥＤ光源装置の内部における光の進行方向を説明するための図である。It is a figure for demonstrating the advancing direction of the light inside the LED light source device by 4th Embodiment shown in FIG. 本発明の第５実施形態によるＬＥＤ光源装置の斜視図である。It is a perspective view of the LED light source device by 5th Embodiment of this invention. 図３４に示した第５実施形態によるＬＥＤ光源装置の断面図である。It is sectional drawing of the LED light source device by 5th Embodiment shown in FIG. 図３４に示した第５実施形態によるＬＥＤ光源装置の透明樹脂部材の形状を説明するための図である。It is a figure for demonstrating the shape of the transparent resin member of the LED light source device by 5th Embodiment shown in FIG. 図３４に示した第５実施形態によるＬＥＤ光源装置の透明樹脂部材の形状を説明するための図である。It is a figure for demonstrating the shape of the transparent resin member of the LED light source device by 5th Embodiment shown in FIG. 第５実施形態の効果を説明するための図である。It is a figure for demonstrating the effect of 5th Embodiment. 従来のバックライト装置を簡略化した図である。It is the figure which simplified the conventional backlight apparatus. 従来のＬＥＤ光源装置を簡略化した図である。It is the figure which simplified the conventional LED light source device. 従来のＬＥＤ光源装置を簡略化した図である。It is the figure which simplified the conventional LED light source device. 従来の問題点を説明するための図である。It is a figure for demonstrating the conventional problem.
符号の説明Explanation of symbols
　　　１、２１、３１、４１、５１　ＬＥＤ光源装置
　　　２　導光板
　　　３　フレキシブルプリント配線板（外部機器）
　　　１０　バックライト装置
　　　１１　ベース部材
　　　１１ａ　装着面
　　　１１ｂ　側端面（所定面）
　　　１２　発光体
　　　１３、２３、３３、４３、５３　透明樹脂部材
　　　１３ａ、２３ａ、３３ａ、４３ａ、５３ａ　光出射面
　　　１３ｂ、２３ｂ、３３ｂ、４３ｂ、５３ｂ　側端面
　　　１３ｃ、２３ｃ、３３ｃ、４３ｃ、５３ｃ　凹部
　　　１４　発光ダイオード素子
　　　１５　蛍光体
　　　１６　電力供給線
　　　１７　外部端子
　　　２０　液晶表示パネル 1, 21, 31, 41, 51 LED light source device 2 Light guide plate 3 Flexible printed wiring board (external device)
DESCRIPTION OF SYMBOLS 10 Backlight apparatus 11 Base member 11a Mounting surface 11b End surface (predetermined surface)
12 Illuminant 13, 23, 33, 43, 53 Transparent resin member 13a, 23a, 33a, 43a, 53a Light exit surface 13b, 23b, 33b, 43b, 53b Side end surface 13c, 23c, 33c, 43c, 53c Recessed portion 14 Light emission Diode element 15 Phosphor 16 Power supply line 17 External terminal 20 Liquid crystal display panel
　（第１実施形態）
　まず、図１～図３を参照して、第１実施形態によるＬＥＤ光源装置の全体構成について説明する。 (First embodiment)
First, the overall configuration of the LED light source device according to the first embodiment will be described with reference to FIGS.
　第１実施形態のＬＥＤ光源装置１は、図１～図３に示すように、ベース部材１１と、発光体１２と、透明樹脂部材１３とを備えている。ベース部材１１は、パッケージ部材として従来から使用されている材料（たとえば、高耐熱ポリマー樹脂やセラミックなど）からなっているとともに、光出射方向（ＬＥＤ光源装置１から出射される光が進行する方向）に向く装着面１１ａを有している。 The LED light source device 1 according to the first embodiment includes a base member 11, a light emitter 12, and a transparent resin member 13, as shown in FIGS. The base member 11 is made of a material conventionally used as a package member (for example, a high heat-resistant polymer resin or ceramic) and has a light emission direction (a direction in which light emitted from the LED light source device 1 travels). It has the mounting surface 11a which faces.
　発光体１２は、ＬＥＤ光源装置１から出射される光を生成するためのものであり、１つのベース部材１１の装着面１１ａ上に１つだけ装着されている。この発光体１２は、青色光を発光する発光ダイオード素子１４と、青色光により励起されて黄色の蛍光を発光する蛍光体１５とを含んでいるとともに、発光ダイオード素子１４が蛍光体１５によって覆われた構造となっている。このような構造では、発光ダイオード素子１４が駆動されると、発光ダイオード素子１４から青色光が発光され、その青色光を吸収した蛍光体１５から黄色の蛍光が発光される。これにより、発光体１２において、青色光と黄色の蛍光とが混色した光（白色光）が生成される。なお、発光体１２に含まれる蛍光体１５は、ＹＡＧ：Ｃｅである。 The light emitter 12 is for generating light emitted from the LED light source device 1, and only one light emitter 12 is mounted on the mounting surface 11 a of one base member 11. The light emitting body 12 includes a light emitting diode element 14 that emits blue light and a phosphor 15 that is excited by blue light and emits yellow fluorescence, and the light emitting diode element 14 is covered with the phosphor 15. It has a structure. In such a structure, when the light emitting diode element 14 is driven, blue light is emitted from the light emitting diode element 14, and yellow fluorescence is emitted from the phosphor 15 that has absorbed the blue light. Thereby, in the light emitter 12, light (white light) in which blue light and yellow fluorescence are mixed is generated. The phosphor 15 included in the light emitter 12 is YAG: Ce.
　透明樹脂部材１３は、封止部材として従来から使用されている材料（たとえば、エポキシ樹脂やシリコーン樹脂などの耐熱性を有する樹脂）からなっているとともに、ベース部材１１の装着面１１ａ上において発光体１２を覆っている。また、透明樹脂部材１３は、光出射方向に向く光出射面１３ａと、その光出射面１３ａとベース部材１１の装着面１１ａとを繋ぐ一対の側端面（横方向（Ａ方向）に向く側端面）１３ｂとを有している。そして、この透明樹脂部材１３によって、発光体１２で生成された光が導光されて光出射方向に向けて出射される。すなわち、発光体１２で生成された光は、透明樹脂部材１３の光出射面１３ａから出射されることになる。なお、この透明樹脂部材１３は、後述する外部端子１７にかからないように、ベース部材１１の装着面１１ａ上に形成されている（図５参照）。 The transparent resin member 13 is made of a material conventionally used as a sealing member (for example, a heat-resistant resin such as an epoxy resin or a silicone resin), and a light emitter on the mounting surface 11 a of the base member 11. 12 is covered. The transparent resin member 13 includes a light emitting surface 13a facing the light emitting direction and a pair of side end surfaces (side end surfaces facing the lateral direction (A direction)) that connect the light emitting surface 13a and the mounting surface 11a of the base member 11. ) 13b. Then, the light generated by the light emitter 12 is guided by the transparent resin member 13 and is emitted toward the light emission direction. That is, the light generated by the light emitter 12 is emitted from the light emission surface 13 a of the transparent resin member 13. The transparent resin member 13 is formed on the mounting surface 11a of the base member 11 so as not to be applied to an external terminal 17 described later (see FIG. 5).
　ここで、第１実施形態では、透明樹脂部材１３の光出射面１３ａの横方向（Ａ方向）の長さがベース部材１１の装着面１１ａの横方向の長さよりも大きくなるように、透明樹脂部材１３の側端面１３ｂが直線状に傾斜している。そして、透明樹脂部材１３の直線状に傾斜した側端面１３ｂと大気との界面を、透明樹脂部材１３の内部において光を光出射方向に向けて反射するための光反射面として機能させている。この透明樹脂部材１３の直線状に傾斜した側端面１３ｂの傾斜角度θ１は、大気の屈折率をｎ０とし、透明樹脂部材１３の屈折率をｎ１とした場合に、以下の式（１）を満たすように設定されている。なお、傾斜角度θ１は、透明樹脂部材１３の光入射面１３ａの法線を基準としたものである。 Here, in the first embodiment, the transparent resin member 13 has a transparent resin member 13 such that the length in the lateral direction (A direction) of the light emitting surface 13a is greater than the lateral length of the mounting surface 11a of the base member 11. The side end surface 13b of the member 13 is inclined linearly. The interface between the linearly inclined side end surface 13b of the transparent resin member 13 and the atmosphere is made to function as a light reflecting surface for reflecting light toward the light emitting direction inside the transparent resin member 13. Inclination angle theta 1 of linearly inclined side end surface 13b of the transparent resin member 13, the refractive index of the atmosphere and n 0 the refractive index of the transparent resin member 13 to the case of the n 1, the following equation (1 ) Is set to satisfy. The inclination angle θ 1 is based on the normal line of the light incident surface 13 a of the transparent resin member 13.
　７０°≧θ１＞ｓｉｎ－１（ｎ０／ｎ１）・・・（１）
　また、第１実施形態では、発光体１２からの光を拡散するための光拡散領域が透明樹脂部材１３に設けられている。この光拡散領域は、発光体１２と対向する領域に配置されており、かつ、透明樹脂部材１３の光出射面１３ａからベース部材１１側に向かって掘り込まれたＶ字状の凹部１３ｃからなっている。そして、透明樹脂部材１３のＶ字状の凹部１３ｃの内面の傾斜角度θ２は、以下の式（２）を満たすように設定されている。なお、傾斜角度θ２は、透明樹脂部材１３の光入射面１３ａの法線を基準としたものである。 70 ° ≧ θ 1 > sin −1 (n 0 / n 1 ) (1)
In the first embodiment, the transparent resin member 13 is provided with a light diffusion region for diffusing light from the light emitter 12. This light diffusion region is arranged in a region facing the light emitter 12 and is composed of a V-shaped recess 13c dug from the light emitting surface 13a of the transparent resin member 13 toward the base member 11 side. ing. And inclination-angle (theta) 2 of the inner surface of the V-shaped recessed part 13c of the transparent resin member 13 is set so that the following formula | equation (2) may be satisfy | filled. The inclination angle θ 2 is based on the normal line of the light incident surface 13 a of the transparent resin member 13.
　７０°≧θ２≧４５°・・・（２）
　これにより、第１実施形態では、透明樹脂部材１３の内部において、発光体１２からの光が図３中の矢印方向に進行することになる。すなわち、透明樹脂部材１３の直線状に傾斜した側端面１３ｂと大気との界面において発光体１２からの光が光出射方向に向けて反射され、かつ、透明樹脂部材１３のＶ字状の凹部１３ｃの内面と大気との界面において発光体１２からの光が横方向（Ａ方向）に広がるように反射される。 70 ° ≧ θ 2 ≧ 45 ° (2)
Thereby, in 1st Embodiment, the light from the light-emitting body 12 advances in the arrow direction in FIG. 3 inside the transparent resin member 13. That is, the light from the light emitter 12 is reflected toward the light emission direction at the interface between the linearly inclined side end face 13b of the transparent resin member 13 and the atmosphere, and the V-shaped recess 13c of the transparent resin member 13 is reflected. The light from the light emitter 12 is reflected so as to spread in the lateral direction (A direction) at the interface between the inner surface and the atmosphere.
　次に、図４～図７を参照して、第１実施形態によるＬＥＤ光源装置の配線構造の第１の例について説明する。 Next, a first example of the wiring structure of the LED light source device according to the first embodiment will be described with reference to FIGS.
　第１実施形態では、図４～図７に示すように、ベース部材１１の装着面１１ａ上に、発光ダイオード素子１４に電力を供給するための電力供給線１６が２つに分割された状態で形成されている。また、ベース部材１１の横方向（Ａ方向）に向く一対の側端面（所定面）１１ｂ上の各々に、装着面１１ａの反対側に位置する面上にまで延びる外部端子１７が形成されている。この電力供給線１６および外部端子１７は、互いに同じ材料によって形成されており、Ｃｕメッキ層とＮｉ－Ａｇメッキ層との積層体からなっている。 In the first embodiment, as shown in FIGS. 4 to 7, the power supply line 16 for supplying power to the light emitting diode element 14 is divided into two on the mounting surface 11 a of the base member 11. Is formed. In addition, external terminals 17 are formed on each of a pair of side end surfaces (predetermined surfaces) 11b facing the lateral direction (A direction) of the base member 11 and extending to a surface located on the opposite side of the mounting surface 11a. . The power supply line 16 and the external terminal 17 are made of the same material, and are formed of a laminate of a Cu plating layer and a Ni—Ag plating layer.
　一方の電力供給線１６（１６ａ）は、ベース部材１１の一方の側端面１１ｂ上に形成された外部端子１７（１７ａ）に接続されているとともに、他方の電力供給線１６（１６ｂ）は、ベース部材１１の他方の側端面１１ｂ上に形成された外部端子１７（１７ｂ）に接続されている。そして、発光ダイオード素子１４の一方電極は、電力供給線１６ａ（外部端子１７ａ）に接続されているとともに、発光ダイオード素子１４の他方電極は、ワイヤ１８を介して電力供給線１６ｂ（外部端子１７ｂ）に接続されている。なお、ＬＥＤ光源装置１のアノード電極（Ａｎｏｄｅ）およびカソード電極（Ｃａｔｈｏｄｅ）の配置位置は、従来のＬＥＤ光源装置のアノード電極およびカソード電極の配置位置と同じになる。 One power supply line 16 (16a) is connected to an external terminal 17 (17a) formed on one side end surface 11b of the base member 11, and the other power supply line 16 (16b) The member 11 is connected to an external terminal 17 (17b) formed on the other side end surface 11b. One electrode of the light emitting diode element 14 is connected to the power supply line 16a (external terminal 17a), and the other electrode of the light emitting diode element 14 is connected to the power supply line 16b (external terminal 17b) via the wire 18. It is connected to the. The arrangement positions of the anode electrode (Anode) and the cathode electrode (Cathode) of the LED light source apparatus 1 are the same as the arrangement positions of the anode electrode and the cathode electrode of the conventional LED light source apparatus.
　ＬＥＤ光源装置１の配線構造としては、図４～図７に示したようなもの以外に、図８～図１２に示すようなものでもよい。 The wiring structure of the LED light source device 1 may be as shown in FIGS. 8 to 12 in addition to those shown in FIGS.
　すなわち、図８および図９に示す第２の例のように、電力供給線１６ａおよび１６ｂの両方を発光ダイオード素子１４の装着領域１４ａにまで延ばし、発光ダイオード素子１４をフリップチップ実装するようにしてもよい。 That is, as in the second example shown in FIGS. 8 and 9, both the power supply lines 16a and 16b are extended to the mounting region 14a of the light emitting diode element 14, and the light emitting diode element 14 is flip-chip mounted. Also good.
　また、図１０～図１２に示す第３の例のように、電力供給線１６および外部端子１７を互いに異なる材料で形成してもよい。具体的には、Ｃｕメッキ層とＮｉ－Ａｇメッキ層との積層体を電力供給線１６とし、Ａｕメッキ層を外部端子１７としてもよい。さらに、外部端子１７を横方向（Ａ方向）に沿った側面上に延ばしてもよい。 Further, as in the third example shown in FIGS. 10 to 12, the power supply line 16 and the external terminal 17 may be formed of different materials. Specifically, a laminate of a Cu plating layer and a Ni—Ag plating layer may be used as the power supply line 16, and an Au plating layer may be used as the external terminal 17. Furthermore, the external terminal 17 may be extended on the side surface along the horizontal direction (A direction).
　ところで、第１実施形態のＬＥＤ光源装置１は、図１３に示すように、液晶表示装置に設置されるバックライト装置１０の光源として用いることが可能である。たとえば、バックライト装置１０がエッジライト型であるとすると、液晶表示パネル２０の後面側に導光板２が配置され、その導光板２の４つの側端面のうちの１つと対向するように、互いに所定の間隔（たとえば、０．１ｍｍ以上）を隔てて並ぶ複数個のＬＥＤ光源装置１がフレキシブルプリント配線板（外部機器）３に実装された状態で配置される。この場合、ＬＥＤ光源装置１から出射された光は、導光板２のＬＥＤ光源装置１と対向する所定の側端面から内部に導入された後、導光板２の前面から放出されて液晶表示パネル２０の後面を照射する。これにより、液晶表示パネル２０の表示領域２０ａにおいて、所望の画像が表示される。なお、このようなバックライト装置１０では、導光板２の前面側に光学シート４が配置され、導光板２の後面側に反射シート５が配置される。そして、導光板２の前面から放出される光が光学シート４によって拡散・集光され、導光板２の後面から漏れた光が反射シート５によって反射されて再導入される。 Incidentally, as shown in FIG. 13, the LED light source device 1 of the first embodiment can be used as a light source of a backlight device 10 installed in a liquid crystal display device. For example, if the backlight device 10 is an edge light type, the light guide plate 2 is disposed on the rear surface side of the liquid crystal display panel 20, and the light guide plate 2 faces each other so as to face one of the four side end surfaces. A plurality of LED light source devices 1 arranged at a predetermined interval (for example, 0.1 mm or more) are arranged in a state of being mounted on a flexible printed wiring board (external device) 3. In this case, the light emitted from the LED light source device 1 is introduced into the inside from a predetermined side end surface of the light guide plate 2 facing the LED light source device 1, and then emitted from the front surface of the light guide plate 2 to be liquid crystal display panel 20. Irradiate the rear surface. Thereby, a desired image is displayed in the display area 20a of the liquid crystal display panel 20. In such a backlight device 10, the optical sheet 4 is disposed on the front surface side of the light guide plate 2, and the reflective sheet 5 is disposed on the rear surface side of the light guide plate 2. Then, the light emitted from the front surface of the light guide plate 2 is diffused and collected by the optical sheet 4, and the light leaking from the rear surface of the light guide plate 2 is reflected by the reflection sheet 5 and reintroduced.
　また、第１実施形態のＬＥＤ光源装置１をバックライト装置１０の光源として用いる場合、ＬＥＤ光源装置１のフレキシブルプリント配線板３への実装は、図１４および図１５に示すように、半田１９を用いて、ＬＥＤ光源装置１の外部端子１７とフレキシブルプリント配線板３の外部端子３ａとを接続すればよい。このＬＥＤ光源装置１のフレキシブルプリント配線板３への実装は、従来のＬＥＤ光源装置をフレキシブルプリント配線板３に実装する場合と同様である。このため、ＬＥＤ光源装置１をバックライト装置１０の光源として用いる場合に、従来のＬＥＤ光源装置からの置き換えを容易に行うことが可能となる。 Moreover, when using the LED light source device 1 of 1st Embodiment as a light source of the backlight apparatus 10, mounting to the flexible printed wiring board 3 of the LED light source device 1 is as shown in FIG. 14 and FIG. The external terminal 17 of the LED light source device 1 and the external terminal 3a of the flexible printed wiring board 3 may be connected. The LED light source device 1 is mounted on the flexible printed wiring board 3 in the same manner as the conventional LED light source device is mounted on the flexible printed wiring board 3. For this reason, when the LED light source device 1 is used as the light source of the backlight device 10, it is possible to easily replace the conventional LED light source device.
　なお、第１実施形態のＬＥＤ光源装置１をバックライト装置１０の光源として用いる場合、そのＬＥＤ光源装置１を図１６および図１７に示すように配置することもできる。すなわち、第１実施形態のＬＥＤ光源装置１をバックライト装置１０の光源として用いることで、ＬＥＤ光源装置１の配置位置の変更が容易になり、設計の自由度を向上させることができる。 In addition, when using the LED light source device 1 of 1st Embodiment as a light source of the backlight apparatus 10, the LED light source device 1 can also be arrange | positioned as shown in FIG.16 and FIG.17. That is, by using the LED light source device 1 of the first embodiment as the light source of the backlight device 10, the arrangement position of the LED light source device 1 can be easily changed, and the degree of design freedom can be improved.
　第１実施形態では、上記のように、透明樹脂部材１３の側端面１３ｂを直線状に傾斜させることによって、発光体１２で生成された光が透明樹脂部材１３の直線状に傾斜した側端面１３ｂで反射するため、透明樹脂部材１３の光出射面１３ａと大気との界面において光が全反射されるのを抑制することができる。このため、ＬＥＤ光源装置１から出射される光を増加させることができる。したがって、第１実施形態のＬＥＤ光源装置１をバックライト装置１０の光源として用いるようにすれば、導光板２に導入される光が増加するので、輝度を向上させることができる。 In the first embodiment, as described above, the side end surface 13b of the transparent resin member 13 is linearly inclined, so that the light generated by the light emitter 12 is linearly inclined to the transparent resin member 13 side end surface 13b. Therefore, the total reflection of light at the interface between the light emitting surface 13a of the transparent resin member 13 and the atmosphere can be suppressed. For this reason, the light radiate | emitted from the LED light source device 1 can be increased. Therefore, if the LED light source device 1 of the first embodiment is used as the light source of the backlight device 10, the light introduced into the light guide plate 2 increases, so that the luminance can be improved.
　この場合、透明樹脂部材１３の光出射面１３ａの横方向の長さがベース部材１１の装着面１１ａの横方向の長さよりも大きくなるように、透明樹脂部材１３の側端面１３ｂを直線状に傾斜させることによって、透明樹脂部材１３の光出射面１３ａが横方向に大きくなるため、ＬＥＤ光源装置１から出射される光を横方向に均一に広げることができる。したがって、第１実施形態のＬＥＤ光源装置１をバックライト装置１０の光源として用いるようにすれば、ＬＥＤ光源装置１から有効発光エリア（液晶表示パネル２０の表示領域２０ａに対応する領域）までの距離を小さくすることでバックライト装置１０の狭額縁化を図る場合に、輝度ムラ（目玉ムラ）が発生してしまうという不都合が生じるのを抑制することができる。 In this case, the side end surface 13b of the transparent resin member 13 is linearly formed so that the lateral length of the light emitting surface 13a of the transparent resin member 13 is larger than the lateral length of the mounting surface 11a of the base member 11. By inclining, the light emission surface 13a of the transparent resin member 13 becomes larger in the horizontal direction, so that the light emitted from the LED light source device 1 can be spread uniformly in the horizontal direction. Therefore, if the LED light source device 1 of the first embodiment is used as the light source of the backlight device 10, the distance from the LED light source device 1 to the effective light emitting area (the region corresponding to the display region 20a of the liquid crystal display panel 20). When the frame size of the backlight device 10 is reduced by reducing the size of the backlight device 10, it is possible to suppress the inconvenience that the luminance unevenness (eyeball unevenness) occurs.
　さらに、透明樹脂部材１３の直線状に傾斜した側端面１３ａと大気との界面を、透明樹脂部材１３の内部において光を光出射方向に向けて反射するための光反射面とすることによって、別途準備した光反射部材などで発光ダイオード素子１４の周囲を囲む必要がないので、ＬＥＤ光源装置１の厚み（ＬＥＤ光源装置１の光出射面の高さ）を小さくすることができる。したがって、第１実施形態のＬＥＤ光源装置１をバックライト装置１０の光源として用いるようにすれば、導光板２の厚み（導光板２の光入射面（所定の側端面）の高さ）を小さくすることでバックライト装置１０の薄型化を図る場合に、図１８に示すように、ＬＥＤ光源装置１の光出射面の高さを導光板２の光入射面（所定の側端面）の高さに合わせて小さく（たとえば、約０．５ｍｍ）にすることができる。これにより、ＬＥＤ光源装置１から出射された光が導光板２に入射し難くなることに起因して、輝度が低下してしまうという不都合が生じるのを抑制することができる。 In addition, the interface between the linearly inclined side end surface 13a of the transparent resin member 13 and the atmosphere is a light reflecting surface for reflecting the light toward the light emitting direction inside the transparent resin member 13, so that Since it is not necessary to surround the periphery of the light emitting diode element 14 with the prepared light reflecting member or the like, the thickness of the LED light source device 1 (the height of the light emitting surface of the LED light source device 1) can be reduced. Therefore, if the LED light source device 1 of the first embodiment is used as the light source of the backlight device 10, the thickness of the light guide plate 2 (the height of the light incident surface (predetermined side end surface) of the light guide plate 2) is reduced. Thus, when reducing the thickness of the backlight device 10, the height of the light emitting surface of the LED light source device 1 is set to the height of the light incident surface (predetermined side end surface) of the light guide plate 2 as shown in FIG. Can be made small (for example, about 0.5 mm). Thereby, it can suppress that the problem that the brightness | luminance falls resulting from the light radiate | emitted from the LED light source device 1 becoming difficult to inject into the light-guide plate 2 arises.
　これらの結果、第１実施形態のＬＥＤ光源装置１をバックライト装置１０の光源として用いることにより、バックライト装置１０の小型化（薄型化および狭額縁化）を図ったとしても、輝度特性が低下するのを抑制することができる。 As a result, by using the LED light source device 1 of the first embodiment as the light source of the backlight device 10, even if the backlight device 10 is downsized (thinned and narrowed), the luminance characteristics are lowered. Can be suppressed.
　また、第１実施形態では、上記のように、発光ダイオード素子１４が蛍光体１５で覆われた構造体を発光体１２とすることによって、赤色光を発光する発光ダイオード素子、緑色光を発光する発光ダイオード素子および青色光を発光する発光ダイオード素子の３種類の発光ダイオード素子を用いる場合に比べて、ＬＥＤ光源装置１をより小型化することができる。 In the first embodiment, as described above, the structure in which the light-emitting diode element 14 is covered with the phosphor 15 is used as the light-emitting body 12, so that the light-emitting diode element that emits red light and the green light are emitted. The LED light source device 1 can be further reduced in size as compared with the case of using three types of light emitting diode elements, ie, a light emitting diode element and a light emitting diode element that emits blue light.
　また、第１実施形態では、上記のように、透明樹脂部材１３の光出射面１３ａにＶ字状の凹部１３ｃを形成することによって、その透明樹脂部材１３の凹部１３ｃが光拡散領域となるため、透明樹脂部材１３の内部における光の横方向への広がりをより大きくすることができる。したがって、第１実施形態のＬＥＤ光源装置１をバックライト装置１０の光源として用いるようにすれば、導光板２に光拡散領域を別途形成する必要がなくなる。すなわち、導光板２に複雑な加工を施す必要がなくなるので、製造コストを削減することができる。また、導光板２に光拡散領域を形成する場合では、光拡散領域とＬＥＤ光源装置１との位置がずれることにより光の拡散効果が低下してしまうことがあるが、第１実施形態では、そのような不都合が生じることはない。 In the first embodiment, as described above, the V-shaped recess 13c is formed on the light emitting surface 13a of the transparent resin member 13, so that the recess 13c of the transparent resin member 13 becomes a light diffusion region. Further, the lateral spread of light inside the transparent resin member 13 can be further increased. Therefore, if the LED light source device 1 of the first embodiment is used as the light source of the backlight device 10, it is not necessary to separately form a light diffusion region in the light guide plate 2. That is, since it is not necessary to perform complicated processing on the light guide plate 2, the manufacturing cost can be reduced. Further, in the case where the light diffusion region is formed on the light guide plate 2, the light diffusion effect may be reduced due to the displacement of the light diffusion region and the LED light source device 1, but in the first embodiment, Such inconvenience does not occur.
　また、第１実施形態では、上記のように、１つのベース部材１１に対して発光体１２が１つだけ装着された構造にすることによって、ベース部材１１に複数の発光体１２が装着された構造に比べて、ベース部材１１の横方向の長さを小さくすることができる。これにより、ベース部材１１に反りなどが発生するのを抑制することができる。したがって、第１実施形態のＬＥＤ光源装置１をバックライト装置１０の光源として用いる場合に、ベース部材１１に反りなどが発生することに起因して、ＬＥＤ光源装置１から導光板２への入光効率が低下するという不都合が生じるのを抑制することができる。また、ベース部材１１に複数の発光体１２が装着された構造よりも製造歩留りを向上させることができる。 In the first embodiment, as described above, a plurality of light emitters 12 are attached to the base member 11 by adopting a structure in which only one light emitter 12 is attached to one base member 11. Compared with the structure, the lateral length of the base member 11 can be reduced. Thereby, it is possible to suppress the warpage of the base member 11. Therefore, when the LED light source device 1 according to the first embodiment is used as the light source of the backlight device 10, light is incident on the light guide plate 2 from the LED light source device 1 due to warpage of the base member 11. The inconvenience that the efficiency is lowered can be suppressed. Further, the manufacturing yield can be improved as compared with the structure in which the plurality of light emitters 12 are mounted on the base member 11.
　また、第１実施形態では、上記のように、ベース部材１１の装着面１１ａ上に、発光ダイオード素子１４に電力を供給するための電力供給線１６を２つに分割して形成し、ベース部材１１の横方向に向く一対の側端面１１ｂ上の各々に、電力供給線１６に繋がる外部端子１７を形成することによって、発光ダイオード素子１４をベース部材１１の装着面１１ａ上に装着する際に、発光ダイオード素子１４の電力供給線１６（外部端子１７）への電気的な接続を容易に行うことができる。これにより、ＬＥＤ光源装置１の生産性を高めることができる。また、外部端子１７の面積を大きく取れるため、フレキシブルプリント配線板３へのＬＥＤ光源装置１の実装（半田１９によるフレキシブルプリント配線板３の外部端子３ａとＬＥＤ光源装置１の外部端子１７との電気的な接続）を容易に行うことができるとともに、フレキシブルプリント配線板３から発光ダイオード素子１４への電気伝導性を高めることができる。 In the first embodiment, as described above, the power supply line 16 for supplying power to the light emitting diode element 14 is divided into two on the mounting surface 11a of the base member 11, and the base member is formed. When the light emitting diode element 14 is mounted on the mounting surface 11a of the base member 11 by forming the external terminal 17 connected to the power supply line 16 on each of the pair of side end surfaces 11b facing the horizontal direction of Electrical connection of the light emitting diode element 14 to the power supply line 16 (external terminal 17) can be easily performed. Thereby, the productivity of the LED light source device 1 can be increased. Further, since the area of the external terminal 17 can be increased, the LED light source device 1 is mounted on the flexible printed wiring board 3 (electricity between the external terminal 3a of the flexible printed wiring board 3 and the external terminal 17 of the LED light source device 1 by solder 19). Connection) can be easily performed, and electrical conductivity from the flexible printed wiring board 3 to the light emitting diode element 14 can be increased.
　この場合、ベース部材１１の装着面１１ａ上に形成された透明樹脂部材１３が外部端子１７にかからないようにすることによって、透明樹脂部材１３の内部において光が外部端子１７で反射されることがないので、意図しない光成分が発生してしまうのを抑制することができる。また、端子間でショートが発生するのを抑制することもできる。 In this case, by preventing the transparent resin member 13 formed on the mounting surface 11 a of the base member 11 from being applied to the external terminal 17, light is not reflected by the external terminal 17 inside the transparent resin member 13. Therefore, it is possible to suppress the generation of unintended light components. It is also possible to suppress the occurrence of a short circuit between the terminals.
　なお、電力供給線１６および外部端子１７がＣｕメッキ層とＮｉ－Ａｇメッキ層との積層体からなっていれば、Ｃｕの酸化やＡｇのマイグレーションを抑制しながら、フレキシブルプリント配線板３から発光ダイオード素子１４への電気伝導性をより高めることができる。また、電力供給線１６および外部端子１７を同時に形成することができるので、ＬＥＤ光源装置１の生産性をより高めることが可能となる。さらに、電力供給線１６および外部端子１７を構成する各層を連続した層にすることができるので、抵抗を抑え、電力換算の発光効率（ｌｍ／Ｗ）を高くすることが可能となる。 If the power supply line 16 and the external terminal 17 are made of a laminate of a Cu plating layer and a Ni—Ag plating layer, the flexible printed wiring board 3 can suppress the light emitting diode while suppressing Cu oxidation and Ag migration. The electrical conductivity to the element 14 can be further increased. Moreover, since the power supply line 16 and the external terminal 17 can be formed simultaneously, the productivity of the LED light source device 1 can be further increased. Furthermore, since the layers constituting the power supply line 16 and the external terminal 17 can be made continuous, it is possible to suppress resistance and increase the light-equivalent emission efficiency (lm / W).
　また、発光ダイオード素子１４をフリップチップ実装することが可能な配線構造とすれば、ワイヤボンディング工程を省略することができるので、ＬＥＤ光源装置１の生産性のさらなる向上を図ることが可能となる。さらに、発光ダイオード素子１４をフリップチップ実装すれば、ベース部材１１に熱が伝わり易くなるので、発光ダイオード素子１４での発熱を抑制し、発光効率を向上させることができる。 In addition, if the light emitting diode element 14 has a wiring structure that can be flip-chip mounted, the wire bonding step can be omitted, so that the productivity of the LED light source device 1 can be further improved. Furthermore, if the light-emitting diode element 14 is flip-chip mounted, heat is easily transmitted to the base member 11, so that heat generation in the light-emitting diode element 14 can be suppressed and the light emission efficiency can be improved.
　また、外部端子１７がＡｕメッキ層からなっていれば、外部端子１７の耐久性を高めることができる。また、種類が互いに異なるものをフレキシブルプリント配線板３に実装する場合に、それらのフレキシブルプリント配線板３への実装を容易に行うことができる。 Further, if the external terminal 17 is made of an Au plating layer, the durability of the external terminal 17 can be improved. Further, when different types are mounted on the flexible printed wiring board 3, they can be easily mounted on the flexible printed wiring board 3.
　次に、図１９～図２４を参照して、第１実施形態によるＬＥＤ光源装置の製造プロセスについて説明する。 Next, a manufacturing process of the LED light source device according to the first embodiment will be described with reference to FIGS.
　第１実施形態のＬＥＤ光源装置１（図１および図２参照）を製造する際には、まず、図１９および図２０に示すように、高耐熱ポリマー樹脂やセラミックなどからなる細長状のベース部材１１を準備する。そして、そのベース部材１１に、上面側から下面側に向けて貫通し、かつ、長手方向（Ａ方向）に互いに所定の間隔を隔てて配列された複数のスルーホール１１ｃを形成する。なお、図中の複数の領域１ａは、後にＬＥＤ光源装置１となる領域である。 When manufacturing the LED light source device 1 (see FIGS. 1 and 2) of the first embodiment, first, as shown in FIGS. 19 and 20, an elongated base member made of a high heat-resistant polymer resin, ceramic, or the like is used. 11 is prepared. Then, a plurality of through holes 11c penetrating from the upper surface side toward the lower surface side and arranged in the longitudinal direction (A direction) with a predetermined interval are formed in the base member 11. In addition, the some area | region 1a in a figure is an area | region used as the LED light source device 1 later.
　次に、図２１および図２２に示すように、ベース部材１１の上面上の複数の領域１ａの各々に、Ｃｕメッキ層とＮｉ－Ａｇメッキ層との積層体からなる電力供給線１６（１６ａおよび１６ｂ）を形成する。また、同時に、ベース部材１１の複数のスルーホール１１ｃの内側面上の各々に、Ｃｕメッキ層とＮｉ－Ａｇメッキ層との積層体からなる外部端子１７（１７ａおよび１７ｂ）を形成する。なお、この際には、電力供給線１６ａと外部端子１７ａとが接続され、電力供給線１６ｂと外部端子１７ｂとが接続された状態にする。 Next, as shown in FIGS. 21 and 22, in each of the plurality of regions 1a on the upper surface of the base member 11, a power supply line 16 (16a and 16a) made of a laminate of a Cu plating layer and a Ni—Ag plating layer is provided. 16b). At the same time, external terminals 17 (17a and 17b) made of a laminate of a Cu plating layer and a Ni—Ag plating layer are formed on the inner side surfaces of the plurality of through holes 11c of the base member 11. At this time, the power supply line 16a and the external terminal 17a are connected, and the power supply line 16b and the external terminal 17b are connected.
　次に、図２３に示すように、青色光を発光する複数個の発光ダイオード素子１４を準備した後、その複数個の発光ダイオード素子１４をベース部材１１の上面上の複数の領域１ａの各々に１つずつ配置する。そして、複数個の発光ダイオード素子１４の各々の下面電極を、対応する電力供給線１６ａに接続する。また、複数個の発光ダイオード素子１４の各々の上面電極を、対応する電力供給線１６ｂにワイヤ１８を介して接続する。その後、ＹＡＧ：Ｃｅからなる蛍光体１５によって、複数個の発光ダイオード素子１４の各々を別個に覆う。これにより、ベース部材１１の上面上の複数の領域１ａの各々に、発光体１２が１つずつ装着された状態となる。 Next, as shown in FIG. 23, after preparing a plurality of light emitting diode elements 14 that emit blue light, the plurality of light emitting diode elements 14 are placed in each of a plurality of regions 1 a on the upper surface of the base member 11. Place one by one. And each lower surface electrode of the some light emitting diode element 14 is connected to the corresponding electric power supply line 16a. Further, the upper surface electrode of each of the plurality of light emitting diode elements 14 is connected to the corresponding power supply line 16 b via the wire 18. Thereafter, each of the plurality of light emitting diode elements 14 is individually covered with a phosphor 15 made of YAG: Ce. As a result, one light emitter 12 is attached to each of the plurality of regions 1 a on the upper surface of the base member 11.
　次に、図２４に示すように、ベース部材１１の上面上に、複数個の発光体１２を連続して覆うように、エポキシ樹脂やシリコーン樹脂などの耐熱性を有する樹脂からなる透明樹脂部材１３を形成する。この後、金型を用いた抜き加工により、図２４に示した構造体を図中の破線に沿って切断する。これにより、複数個のＬＥＤ光源装置１（図１および図２参照）が一括して作製される。 Next, as shown in FIG. 24, a transparent resin member 13 made of a heat-resistant resin such as an epoxy resin or a silicone resin so as to continuously cover the plurality of light emitters 12 on the upper surface of the base member 11. Form. Thereafter, the structure shown in FIG. 24 is cut along a broken line in the drawing by punching using a mold. Thereby, the some LED light source device 1 (refer FIG. 1 and FIG. 2) is produced collectively.
　上記した第１実施形態の製造プロセスでは、１回の抜き加工で複数個のＬＥＤ光源装置１を作製することができる。また、容易に、直線状に傾斜した側端面１３ｂや光拡散領域となる凹部１３ｃを透明樹脂部材１３に形成することができる。 In the manufacturing process of the first embodiment described above, a plurality of LED light source devices 1 can be manufactured by a single punching process. Moreover, the side end face 13b inclined linearly and the recessed part 13c used as a light-diffusion area | region can be easily formed in the transparent resin member 13. FIG.
　（第２実施形態）
　次に、図２５～図２７を参照して、第２実施形態によるＬＥＤ光源装置の全体構成について説明する。 (Second Embodiment)
Next, the overall configuration of the LED light source device according to the second embodiment will be described with reference to FIGS.
　第２実施形態のＬＥＤ光源装置２１では、図２５～図２７に示すような透明樹脂部材２３が用いられている。この透明樹脂部材２３は、上記第１実施形態の透明樹脂部材１３と同様、ベース部材１１の装着面１１ａ上において発光体１２を覆っているとともに、光出射方向に向く光出射面２３ａと、その光出射面２３ａとベース部材１１の装着面１１ａとを繋ぐ一対の側端面（横方向（Ａ方向）に向く側端面）２３ｂとを有している。 In the LED light source device 21 of the second embodiment, a transparent resin member 23 as shown in FIGS. 25 to 27 is used. Like the transparent resin member 13 of the first embodiment, the transparent resin member 23 covers the light emitter 12 on the mounting surface 11a of the base member 11, and has a light emitting surface 23a facing the light emitting direction, It has a pair of side end surfaces (side end surfaces facing in the lateral direction (A direction)) 23b connecting the light emitting surface 23a and the mounting surface 11a of the base member 11.
　ここで、第２実施形態では、透明樹脂部材２３の光出射面２３ａの横方向（Ａ方向）の長さがベース部材１１の装着面１１ａの横方向の長さよりも大きくなるように、透明樹脂部材２３の側端面２３ｂが曲面状に傾斜している。そして、透明樹脂部材２３の曲面状に傾斜した側端面２３ｂと大気との界面を、透明樹脂部材２３の内部において光を光出射方向に向けて反射するための光反射面として機能させている。この透明樹脂部材２３の曲面状に傾斜した側端面２３ｂの曲率は、透明樹脂部材２３の曲面状に傾斜した側端面２３ｂと大気との界面において発光体１２からの光が光出射方向に向けて全反射するように設定されている。 Here, in the second embodiment, the transparent resin member 23 is formed so that the length in the lateral direction (A direction) of the light emitting surface 23a of the transparent resin member 23 is larger than the length in the lateral direction of the mounting surface 11a of the base member 11. The side end surface 23b of the member 23 is inclined in a curved surface shape. The interface between the side end face 23b inclined to the curved surface of the transparent resin member 23 and the atmosphere functions as a light reflecting surface for reflecting light toward the light emitting direction inside the transparent resin member 23. The curvature of the side end face 23b inclined in a curved shape of the transparent resin member 23 is such that light from the light emitter 12 is directed in the light emitting direction at the interface between the side end face 23b inclined in the curved shape of the transparent resin member 23 and the atmosphere. It is set to totally reflect.
　また、第２実施形態では、発光体１２からの光を拡散するための光拡散領域が透明樹脂部材２３に設けられている。この光拡散領域は、上記第１実施形態の光拡散領域と同様のものであって、発光体１２と対向する領域に配置されているとともに、透明樹脂部材２３の光出射面２３ａからベース部材１１側に向かって掘り込まれたＶ字状の凹部２３ｃからなっている。なお、透明樹脂部材２３のＶ字状の凹部２３ｃの内面の傾斜角度θ２は、上記第１実施形態の式（２）を満たしている。 In the second embodiment, a light diffusion region for diffusing light from the light emitter 12 is provided in the transparent resin member 23. This light diffusion region is the same as the light diffusion region of the first embodiment, and is disposed in a region facing the light emitter 12 and from the light emitting surface 23a of the transparent resin member 23 to the base member 11. It consists of a V-shaped recess 23c dug toward the side. The inclination angle theta 2 of the inner surface of the V-shaped recess 23c of the transparent resin member 23 satisfies the equation (2) of the first embodiment.
　これにより、第２実施形態では、透明樹脂部材２３の内部において、発光体１２からの光が図２７中の矢印方向に進行することになる。すなわち、透明樹脂部材２３の曲面状に傾斜した側端面２３ｂと大気との界面において発光体１２からの光が光出射方向に向けて反射され、かつ、透明樹脂部材２３のＶ字状の凹部２３ｃの内面と大気との界面において発光体１２からの光が横方向（Ａ方向）に広がるように反射される。 Thus, in the second embodiment, the light from the light emitter 12 travels in the direction of the arrow in FIG. 27 inside the transparent resin member 23. That is, light from the light emitter 12 is reflected toward the light emission direction at the interface between the side end face 23b inclined in a curved shape of the transparent resin member 23 and the atmosphere, and the V-shaped recess 23c of the transparent resin member 23 is formed. The light from the light emitter 12 is reflected so as to spread in the lateral direction (A direction) at the interface between the inner surface and the atmosphere.
　なお、第２実施形態のその他の構成は、上記第１実施形態と同様である。 In addition, the other structure of 2nd Embodiment is the same as that of the said 1st Embodiment.
　第２実施形態では、上記のように構成することによって、上記第１実施形態と同様の効果を得ることができる。 In the second embodiment, the same effects as in the first embodiment can be obtained by configuring as described above.
　（第３実施形態）
　次に、図２８～図３０を参照して、第３実施形態によるＬＥＤ光源装置の全体構成について説明する。 (Third embodiment)
Next, the overall configuration of the LED light source device according to the third embodiment will be described with reference to FIGS.
　第３実施形態のＬＥＤ光源装置３１では、図２８～図３０に示すような透明樹脂部材３３が用いられている。この透明樹脂部材３３は、上記第１実施形態の透明樹脂部材１３と同様、ベース部材１１の装着面１１ａ上において発光体１２を覆っているとともに、光出射方向に向く光出射面３３ａと、その光出射面３３ａとベース部材１１の装着面１１ａとを繋ぐ一対の側端面（横方向（Ａ方向）に向く側端面）３３ｂとを有している。 In the LED light source device 31 of the third embodiment, a transparent resin member 33 as shown in FIGS. 28 to 30 is used. Like the transparent resin member 13 of the first embodiment, the transparent resin member 33 covers the light emitter 12 on the mounting surface 11a of the base member 11, and has a light emitting surface 33a facing the light emitting direction, It has a pair of side end surfaces (side end surfaces facing the lateral direction (A direction)) 33b connecting the light emitting surface 33a and the mounting surface 11a of the base member 11.
　ここで、第３実施形態では、上記第１実施形態と同様、透明樹脂部材３３の光出射面３３ａの横方向（Ａ方向）の長さがベース部材１１の装着面１１ａの横方向の長さよりも大きくなるように、透明樹脂部材３３の側端面３３ｂが直線状に傾斜している。そして、透明樹脂部材３３の直線状に傾斜した側端面３３ｂと大気との界面を、透明樹脂部材３３の内部において光を光出射方向に向けて反射するための光反射面として機能させている。なお、透明樹脂部材３３の側端面３３ｂの傾斜角度θ１は、上記第１実施形態の式（１）を満たしている。 Here, in the third embodiment, as in the first embodiment, the lateral length (direction A) of the light emitting surface 33a of the transparent resin member 33 is longer than the lateral length of the mounting surface 11a of the base member 11. Also, the side end face 33b of the transparent resin member 33 is inclined linearly so as to be larger. The interface between the linearly inclined side end surface 33 b of the transparent resin member 33 and the atmosphere is made to function as a light reflecting surface for reflecting light toward the light emitting direction inside the transparent resin member 33. Note that the inclination angle θ 1 of the side end face 33b of the transparent resin member 33 satisfies the expression (1) of the first embodiment.
　また、第３実施形態では、発光体１２からの光を拡散するための光拡散領域が透明樹脂部材３３に設けられている。この光拡散領域は、発光体１２と対向する領域に配置されており、かつ、透明樹脂部材３３の光出射面３３ａからベース部材１１側に向かって掘り込まれた半円状の凹部３３ｃからなっている。そして、透明樹脂部材３３の半円状の凹部３３ｃの半径Ｒは、発光ダイオード素子１４の長辺の長さをＬとし、透明樹脂部材３３の光出射面３３ａから発光ダイオード素子１４までの長さをＳとした場合に、以下の式（３）を満たすように設定されている。 In the third embodiment, a light diffusion region for diffusing light from the light emitter 12 is provided in the transparent resin member 33. This light diffusion region is arranged in a region facing the light emitter 12 and is composed of a semicircular recess 33c dug from the light emitting surface 33a of the transparent resin member 33 toward the base member 11 side. ing. The radius R of the semicircular recess 33c of the transparent resin member 33 is L, which is the length from the light emitting surface 33a of the transparent resin member 33 to the light emitting diode element 14. Is set to satisfy the following formula (3).
　Ｓ≧Ｒ≧Ｌ／２・・・（３）
　これにより、第３実施形態では、透明樹脂部材３３の内部において、発光体１２からの光が図３０中の矢印方向に進行することになる。すなわち、透明樹脂部材３３の直線状に傾斜した側端面３３ｂと大気との界面において発光体１２からの光が光出射方向に向けて反射され、かつ、透明樹脂部材３３の半円状の凹部３３ｃの内面と大気との界面において発光体１２からの光が横方向（Ａ方向）に広がるように反射される。 S ≧ R ≧ L / 2 (3)
Thereby, in 3rd Embodiment, the light from the light-emitting body 12 advances in the arrow direction in FIG. 30 inside the transparent resin member 33. That is, the light from the light emitter 12 is reflected toward the light emission direction at the interface between the linearly inclined side end face 33b of the transparent resin member 33 and the atmosphere, and the semicircular recess 33c of the transparent resin member 33 is reflected. The light from the light emitter 12 is reflected so as to spread in the lateral direction (A direction) at the interface between the inner surface and the atmosphere.
　なお、第３実施形態のその他の構成は、上記第１実施形態と同様である。 The remaining configuration of the third embodiment is the same as that of the first embodiment.
　第３実施形態では、上記のように構成することによって、上記第１実施形態と同様の効果を得ることができる。 In the third embodiment, the same effects as in the first embodiment can be obtained by configuring as described above.
　また、第３実施形態では、透明樹脂部材３３の光出射面３３ａに半円状の凹部３３ｃを形成し、その半円状の凹部３３ｃを光拡散領域として機能させることによって、透明樹脂部材３３の内部における光の拡散効果をより大きくすることができる。 In the third embodiment, a semicircular recess 33c is formed on the light emitting surface 33a of the transparent resin member 33, and the semicircular recess 33c functions as a light diffusion region. The light diffusion effect inside can be further increased.
　（第４実施形態）
　次に、図３１～図３３を参照して、第４実施形態によるＬＥＤ光源装置の全体構成について説明する。 (Fourth embodiment)
Next, the overall configuration of the LED light source device according to the fourth embodiment will be described with reference to FIGS.
　第４実施形態のＬＥＤ光源装置４１では、図３１～図３３に示すような透明樹脂部材４３が用いられている。この透明樹脂部材４３は、上記第１実施形態の透明樹脂部材１３と同様、ベース部材１１の装着面１１ａ上において発光体１２を覆っているとともに、光出射方向に向く光出射面４３ａと、その光出射面４３ａとベース部材１１の装着面１１ａとを繋ぐ一対の側端面（横方向（Ａ方向）に向く側端面）４３ｂとを有している。 In the LED light source device 41 of the fourth embodiment, a transparent resin member 43 as shown in FIGS. 31 to 33 is used. Similar to the transparent resin member 13 of the first embodiment, the transparent resin member 43 covers the light emitter 12 on the mounting surface 11a of the base member 11, and also has a light emitting surface 43a facing the light emitting direction, It has a pair of side end surfaces (side end surfaces facing the lateral direction (A direction)) 43b that connect the light emitting surface 43a and the mounting surface 11a of the base member 11.
　ここで、第４実施形態では、上記第２実施形態と同様、透明樹脂部材４３の光出射面４３ａの横方向（Ａ方向）の長さがベース部材１１の装着面１１ａの横方向の長さよりも大きくなるように、透明樹脂部材４３の側端面４３ｂが曲面状に傾斜している。そして、透明樹脂部材４３の曲面状に傾斜した側端面４３ｂと大気との界面を、透明樹脂部材４３の内部において光を光出射方向に向けて反射するための光反射面として機能させている。 Here, in 4th Embodiment, the length of the horizontal direction (A direction) of the light-projection surface 43a of the transparent resin member 43 is longer than the length of the horizontal direction of the mounting surface 11a of the base member 11 like the said 2nd Embodiment. Also, the side end face 43b of the transparent resin member 43 is inclined in a curved shape so as to be larger. The interface between the side end face 43 b inclined to the curved surface of the transparent resin member 43 and the atmosphere functions as a light reflecting surface for reflecting light toward the light emitting direction inside the transparent resin member 43.
　また、第４実施形態では、発光体１２からの光を拡散するための光拡散領域が透明樹脂部材４３に設けられている。この光拡散領域は、上記第３実施形態の光拡散領域と同様のものであって、発光体１２と対向する領域に配置されているとともに、透明樹脂部材４３の光出射面４３ａからベース部材１１側に向かって掘り込まれた半円状の凹部４３ｃからなっている。なお、透明樹脂部材４３の半円状の凹部４３ｃの半径Ｒは、上記第３実施形態の式（３）を満たしている。 In the fourth embodiment, a light diffusion region for diffusing light from the light emitter 12 is provided in the transparent resin member 43. This light diffusion region is the same as the light diffusion region of the third embodiment, is disposed in a region facing the light emitter 12, and extends from the light emitting surface 43 a of the transparent resin member 43 to the base member 11. It consists of a semicircular recess 43c dug toward the side. The radius R of the semicircular recess 43c of the transparent resin member 43 satisfies the expression (3) of the third embodiment.
　これにより、第４実施形態では、透明樹脂部材４３の内部において、発光体１２からの光が図３３中の矢印方向に進行することになる。すなわち、透明樹脂部材４３の曲面状に傾斜した側端面４３ｂと大気との界面において発光体１２からの光が光出射方向に向けて反射され、かつ、透明樹脂部材４３の半円状の凹部４３ｃの内面と大気との界面において発光体１２からの光が横方向（Ａ方向）に広がるように反射される。 Thus, in the fourth embodiment, the light from the light emitter 12 travels in the direction of the arrow in FIG. 33 inside the transparent resin member 43. That is, light from the light emitter 12 is reflected toward the light emission direction at the interface between the side end surface 43b inclined in a curved shape of the transparent resin member 43 and the atmosphere, and the semicircular recess 43c of the transparent resin member 43 is reflected. The light from the light emitter 12 is reflected so as to spread in the lateral direction (A direction) at the interface between the inner surface and the atmosphere.
　なお、第４実施形態のその他の構成は、上記第１実施形態と同様である。 The remaining configuration of the fourth embodiment is similar to that of the aforementioned first embodiment.
　第４実施形態では、上記のように構成することによって、上記第２および第３実施形態と同様の効果を得ることができる。 In the fourth embodiment, by configuring as described above, it is possible to obtain the same effects as those of the second and third embodiments.
　（第５実施形態）
　次に、図３４～図３７を参照して、第５実施形態によるＬＥＤ光源装置の全体構成について説明する。 (Fifth embodiment)
Next, the overall configuration of the LED light source device according to the fifth embodiment will be described with reference to FIGS.
　第５実施形態のＬＥＤ光源装置５１では、図３４～図３７に示すような透明樹脂部材５３が用いられている。この透明樹脂部材５３は、上記第１実施形態の透明樹脂部材１３と同様、ベース部材１１の装着面１１ａ上において発光体１２を覆っているとともに、光出射方向に向く光出射面５３ａと、その光出射面５３ａとベース部材１１の装着面１１ａとを繋ぐ一対の側端面（横方向（Ａ方向）に向く側端面）５３ｂとを有している。 In the LED light source device 51 of the fifth embodiment, a transparent resin member 53 as shown in FIGS. 34 to 37 is used. Similar to the transparent resin member 13 of the first embodiment, the transparent resin member 53 covers the light emitter 12 on the mounting surface 11a of the base member 11, and has a light emitting surface 53a facing the light emitting direction, It has a pair of side end surfaces (side end surfaces facing the lateral direction (A direction)) 53b that connect the light emitting surface 53a and the mounting surface 11a of the base member 11.
　ここで、第５実施形態では、上記第１実施形態と同様、透明樹脂部材５３の光出射面５３ａの横方向（Ａ方向）の長さがベース部材１１の装着面１１ａの横方向の長さよりも大きくなるように、透明樹脂部材５３の側端面５３ｂが直線状に傾斜している。そして、透明樹脂部材５３の直線状に傾斜した側端面５３ｂと大気との界面を、透明樹脂部材５３の内部において光を光出射方向に向けて反射するための光反射面として機能させている。 Here, in the fifth embodiment, as in the first embodiment, the lateral length (direction A) of the light emitting surface 53a of the transparent resin member 53 is longer than the lateral length of the mounting surface 11a of the base member 11. Also, the side end face 53b of the transparent resin member 53 is linearly inclined so as to be larger. The interface between the linearly inclined side end surface 53 b of the transparent resin member 53 and the atmosphere is made to function as a light reflecting surface for reflecting light toward the light emitting direction inside the transparent resin member 53.
　また、第５実施形態では、上記第１実施形態と同様、発光体１２からの光を横方向（Ａ方向）に拡散するための光拡散領域（Ｖ字状の凹部５３ｃ）が透明樹脂部材５３の光出射面５３ａに形成されている。 In the fifth embodiment, similarly to the first embodiment, the light diffusion region (V-shaped recess 53 c) for diffusing light from the light emitter 12 in the lateral direction (A direction) is a transparent resin member 53. Is formed on the light emission surface 53a.
　さらに、第５実施形態では、透明樹脂部材５３の光出射面５３ａ側の厚みがベース部材１１側の厚みよりも小さくなっている。具体的には、２０°以上４５°未満の傾斜角度θ３で透明樹脂部材５３の厚みがベース部材１１側から光出射面５３ａ側に向かって徐々に小さくなっており、かつ、透明樹脂部材５３の光出射面５３ａ側の厚みとベース部材１１側の厚みとの差Ｔが０．１ｍｍ以上となっている。 Furthermore, in the fifth embodiment, the thickness of the transparent resin member 53 on the light emitting surface 53a side is smaller than the thickness on the base member 11 side. Specifically, the thickness of the transparent resin member 53 gradually decreases from the base member 11 side toward the light emitting surface 53a side at an inclination angle θ 3 of 20 ° or more and less than 45 °, and the transparent resin member 53 The difference T between the thickness on the light emitting surface 53a side and the thickness on the base member 11 side is 0.1 mm or more.
　なお、第５実施形態のその他の構成は、上記第１実施形態と同様である。 The remaining configuration of the fifth embodiment is similar to that of the aforementioned first embodiment.
　第５実施形態では、上記のように構成することによって、上記第１実施形態と同様の効果を得ることができる。 In the fifth embodiment, by configuring as described above, the same effect as in the first embodiment can be obtained.
　また、第５実施形態では、上記のように、透明樹脂部材５３の光出射面５３ａ側の厚みをベース部材１１側の厚みよりも小さくすることによって、第５実施形態のＬＥＤ光源装置５１をバックライト装置１０（図１３参照）の光源として用いるようにすれば、図３８に示すように、導光板２の厚み（導光板２の光入射面（所定の側端面）の高さ）を第１実施形態よりも小さく（たとえば、約０．３５ｍｍ）したとしても、ＬＥＤ光源装置５１から出射された光が導光板２に入射し難くなるという不都合が生じることはない。これにより、バックライト装置１０のさらなる薄型化を図ることができる。 Further, in the fifth embodiment, as described above, the thickness of the transparent resin member 53 on the light emitting surface 53a side is made smaller than the thickness on the base member 11 side, so that the LED light source device 51 of the fifth embodiment is backed. If used as the light source of the light device 10 (see FIG. 13), as shown in FIG. 38, the thickness of the light guide plate 2 (the height of the light incident surface (predetermined side end surface) of the light guide plate 2) is set to the first. Even if it is smaller than the embodiment (for example, about 0.35 mm), there is no inconvenience that the light emitted from the LED light source device 51 does not easily enter the light guide plate 2. As a result, the backlight device 10 can be further reduced in thickness.
　なお、今回開示された実施形態は、すべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した実施形態の説明ではなく特許請求の範囲によって示され、さらに、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 In addition, it should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

Claims (14)

  1. 　光出射方向に向く装着面を有するベース部材と、
    　前記ベース部材の装着面上に装着されているとともに、発光ダイオード素子を少なくとも含む発光体と、
    　前記発光体を覆うように前記ベース部材の装着面上に形成されているとともに、前記光出射方向に向く光出射面と、前記光出射面と前記ベース部材の装着面とを繋ぐ側端面とを有し、前記発光体で生成された光を導光して前記光出射面から出射する透明樹脂部材とを備え、
    　前記光出射面の横方向の長さが前記ベース部材の装着面の前記横方向の長さよりも大きくなるように前記透明樹脂部材の側端面が傾斜しており、
    　前記透明樹脂部材の傾斜した側端面と大気との界面が光反射面となっていることを特徴とするＬＥＤ光源装置。     A base member having a mounting surface facing the light emitting direction;
    A light emitter mounted on the mounting surface of the base member and including at least a light emitting diode element;
    A light emitting surface that is formed on the mounting surface of the base member so as to cover the light emitter and that faces the light emitting direction, and a side end surface that connects the light emitting surface and the mounting surface of the base member. A transparent resin member that guides the light generated by the light emitter and emits the light from the light exit surface;
    The side end surface of the transparent resin member is inclined so that the lateral length of the light emitting surface is larger than the lateral length of the mounting surface of the base member,
    The LED light source device, wherein an interface between the inclined side end surface of the transparent resin member and the atmosphere is a light reflecting surface.
  2. 　前記発光体は、青色光を発光する発光ダイオード素子と、前記青色光を吸収して蛍光を発光する蛍光体とを含み、前記青色光および前記蛍光が互いに混色することにより得られる白色光を出射することを特徴とする請求項１に記載のＬＥＤ光源装置。 The light emitter includes a light emitting diode element that emits blue light and a phosphor that absorbs the blue light and emits fluorescence, and emits white light obtained by mixing the blue light and the fluorescence with each other. The LED light source device according to claim 1.
  3. 　前記透明樹脂部材の側端面が直線状に傾斜しており、
    　前記大気の屈折率をｎ０とし、前記透明樹脂部材の屈折率をｎ１とした場合に、前記光出射面の法線に対する前記透明樹脂部材の側端面の傾斜角度θ１は、７０°≧θ１＞ｓｉｎ－１（ｎ０／ｎ１）を満たすように設定されていることを特徴とする請求項１に記載のＬＥＤ光源装置。     The side end surface of the transparent resin member is inclined linearly,
    When the refractive index of the atmosphere is n 0 and the refractive index of the transparent resin member is n 1 , the inclination angle θ 1 of the side end surface of the transparent resin member with respect to the normal of the light emitting surface is 70 ° ≧ 2. The LED light source device according to claim 1, wherein the LED light source device is set to satisfy θ 1 > sin −1 (n 0 / n 1 ).
  4. 　前記透明樹脂部材の側端面が曲面状に傾斜しており、
    　前記透明樹脂部材の側端面の曲率は、前記透明樹脂部材の側端面と前記大気との界面において前記発光体からの光が前記光出射方向に向けて全反射するように設定されていることを特徴とする請求項１に記載のＬＥＤ光源装置。     The side end surface of the transparent resin member is inclined in a curved shape,
    The curvature of the side end face of the transparent resin member is set so that light from the light emitter is totally reflected in the light emitting direction at the interface between the side end face of the transparent resin member and the atmosphere. The LED light source device according to claim 1.
  5. 　前記透明樹脂部材に、前記光出射面から前記ベース部材側に向かって掘り込まれた凹部が形成されていることを特徴とする請求項１に記載のＬＥＤ光源装置。 2. The LED light source device according to claim 1, wherein a concave portion dug from the light emitting surface toward the base member side is formed in the transparent resin member.
  6. 　前記透明樹脂部材の凹部がＶ字状に形成されており、
    　前記光出射面の法線に対する前記透明樹脂部材の凹部の内面の傾斜角度θ２は、７０°≧θ２≧４５°を満たすように設定されていることを特徴とする請求項５に記載のＬＥＤ光源装置。     The concave portion of the transparent resin member is formed in a V shape,
    The inclination angle θ 2 of the inner surface of the concave portion of the transparent resin member with respect to the normal line of the light emitting surface is set so as to satisfy 70 ° ≧ θ 2 ≧ 45 °. LED light source device.
  7. 　前記透明樹脂部材の凹部が半円状に形成されており、
    　前記発光ダイオード素子の長辺の長さをＬとし、前記発光ダイオード素子から前記光出射面までの長さをＳとした場合に、前記透明樹脂部材の凹部の半径Ｒは、Ｓ≧Ｒ≧Ｌ／２を満たすように設定されていることを特徴とする請求項５に記載のＬＥＤ光源装置。     The concave portion of the transparent resin member is formed in a semicircular shape,
    When the length of the long side of the light emitting diode element is L and the length from the light emitting diode element to the light emitting surface is S, the radius R of the concave portion of the transparent resin member is S ≧ R ≧ L The LED light source device according to claim 5, which is set to satisfy / 2.
  8. 　前記透明樹脂部材は、前記光出射面側の厚みが前記ベース部材側の厚みよりも小さくなるように形成されていることを特徴とする請求項１に記載のＬＥＤ光源装置。 The LED light source device according to claim 1, wherein the transparent resin member is formed so that a thickness on the light emitting surface side is smaller than a thickness on the base member side.
  9. 　前記透明樹脂部材は、２０°以上４５°未満の傾斜角度で前記ベース部材側から前記光出射面側に向かって厚みが徐々に小さくなり、かつ、前記光出射面側の厚みと前記ベース部材側の厚みとの差が０．１ｍｍ以上となるように形成されていることを特徴とする請求項８に記載のＬＥＤ光源装置。 The transparent resin member gradually decreases in thickness from the base member side toward the light emitting surface side at an inclination angle of 20 ° or more and less than 45 °, and the thickness on the light emitting surface side and the base member side The LED light source device according to claim 8, wherein the LED light source device is formed so that a difference from the thickness of the LED becomes 0.1 mm or more.
  10. 　前記ベース部材の装着面上に、前記発光ダイオード素子への電力の供給を行う電力供給線が形成されており、前記ベース部材の装着面とは異なる所定面上に、前記電力供給線に繋がる外部端子が形成されていることを特徴とする請求項１に記載のＬＥＤ光源装置。 A power supply line for supplying power to the light emitting diode element is formed on the mounting surface of the base member, and an external connected to the power supply line on a predetermined surface different from the mounting surface of the base member The LED light source device according to claim 1, wherein a terminal is formed.
  11. 　前記電力供給線および前記外部端子のうちの少なくとも一方は、Ｃｕメッキ層とＮｉ－Ａｇメッキ層との積層体からなっていることを特徴とする請求項１０に記載のＬＥＤ光源装置。 11. The LED light source device according to claim 10, wherein at least one of the power supply line and the external terminal is formed of a laminate of a Cu plating layer and a Ni—Ag plating layer.
  12. 　前記電力供給線がＣｕメッキ層とＮｉ－Ａｇメッキ層との積層体からなっており、
    　前記外部端子がＡｕメッキ層からなっていることを特徴とする請求項１１に記載のＬＥＤ光源装置。     The power supply line comprises a laminate of a Cu plating layer and a Ni-Ag plating layer;
    The LED light source device according to claim 11, wherein the external terminal is made of an Au plating layer.
  13. 　請求項１～１２のいずれかに記載のＬＥＤ光源装置を備えていることを特徴とするバックライト装置。 A backlight device comprising the LED light source device according to any one of claims 1 to 12.
  14. 　請求項１３に記載のバックライト装置と、
    　前記バックライト装置からの光が照射される液晶表示パネルとを備えていることを特徴とする液晶表示装置。     The backlight device according to claim 13,
    A liquid crystal display device, comprising: a liquid crystal display panel irradiated with light from the backlight device.
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