CN110556469A - LED encapsulation module and display screen - Google Patents

LED encapsulation module and display screen Download PDF

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Publication number
CN110556469A
CN110556469A CN201910770925.7A CN201910770925A CN110556469A CN 110556469 A CN110556469 A CN 110556469A CN 201910770925 A CN201910770925 A CN 201910770925A CN 110556469 A CN110556469 A CN 110556469A
Authority
CN
China
Prior art keywords
led
die bonding
frame
die
units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910770925.7A
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Chinese (zh)
Inventor
徐梦梦
石昌金
谢博学
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Absen Optoelectronic Co Ltd
Huizhou Absen Optoelectronic Co Ltd
Original Assignee
Shenzhen Absen Optoelectronic Co Ltd
Huizhou Absen Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Absen Optoelectronic Co Ltd, Huizhou Absen Optoelectronic Co Ltd filed Critical Shenzhen Absen Optoelectronic Co Ltd
Priority to CN201910770925.7A priority Critical patent/CN110556469A/en
Publication of CN110556469A publication Critical patent/CN110556469A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Abstract

the application discloses an LED packaging module and a display screen, wherein the LED packaging module comprises a plurality of LED units which are packaged into a whole; each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on the same die bonding frame; each LED chip comprises a first electrode and a second electrode, the second electrode of each LED chip is electrically connected with one non-die bonding frame correspondingly, the first electrode of each LED chip is electrically connected with the die bonding frame, and at least two non-die bonding frames which respectively correspond to different LED units are the same non-die bonding frame. Through the mode, the lead frame can be effectively reduced.

Description

LED encapsulation module and display screen
Technical Field
The application relates to the technical field of LED display, in particular to an LED packaging module and a display screen.
Background
The LED display screen has the advantages of wide display color gamut, high brightness, large visual angle, low power consumption, long service life and the like, and has wide market in the fields of inside and outside wall body display in public places such as markets, airports, railway stations and the like. To meet the higher performance requirements of people on display products, the development of LED display screens is moving towards high resolution, which requires LED units with smaller size and pitch.
At present, the LED display screen mostly adopts independent LED packaging form, a plurality of LED chips that represent a pixel are packaged into an independent LED packaging unit, and after the display screen is formed by a plurality of LED packaging units of the packaging mode, the number of lead frames or bonding pads of the display screen is too much, so that the manufacturing difficulty is improved, and the packaging cost is increased.
Disclosure of Invention
The technical problem that this application mainly solved provides LED encapsulation module and display screen, can effectively reduce the quantity of lead frame.
In order to solve the technical problem, the application adopts a technical scheme that: the LED packaging module comprises a plurality of LED units which are packaged into a whole; each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on the same die bonding frame; each LED chip comprises a first electrode and a second electrode, the second electrode of each LED chip is correspondingly and electrically connected with a different non-die bonding frame, the first electrode of each LED chip is electrically connected with the die bonding frame, and at least two non-die bonding frames which respectively correspond to different LED units are the same non-die bonding frame.
In order to solve the above technical problem, another technical solution adopted by the present application is: the utility model provides a display screen, including the above-mentioned LED display module assembly that this application provided.
Compared with the prior art, the beneficial effects of this application are: through encapsulating a plurality of LED units in an organic whole, a plurality of LED chips of every LED unit are fixed in same solid brilliant frame, can effectively reduce the quantity of solid brilliant frame, at least two non-solid brilliant frames that correspond to belonging to different LED units respectively are same non-solid brilliant frame, non-solid brilliant frame is shared to at least two LED units, can effectively reduce the quantity of non-solid brilliant frame, for LED unit individual package, effectively reduce the quantity of lead frame, the simplified structure, a plurality of LED units encapsulate the volume increase that makes the encapsulation module in an organic whole, thereby reduce the welding degree of difficulty and the manufacturing degree of difficulty, improve the mechanical strength of LED encapsulation module.
Drawings
Fig. 1 is a schematic diagram of a first top view structure of an embodiment of an LED package module according to the present application;
FIG. 2 is a schematic diagram of a layout of an LED chip according to an embodiment of the present application;
Fig. 3 is a schematic diagram of a second top view structure of an embodiment of an LED package module according to the present application;
Fig. 4 is a schematic diagram of a third top view structure of an embodiment of an LED package module according to the present application;
FIG. 5 is a schematic diagram of a fourth top view of an embodiment of an LED package module according to the present application;
FIG. 6 is a schematic view of the cross-sectional structure A-A of FIG. 5;
Fig. 7 is a schematic diagram of a fifth top view of an embodiment of an LED package module according to the present application;
FIG. 8 is a schematic view of a structure of section B-B of FIG. 7;
FIG. 9 is another schematic view of the structure of section B-B of FIG. 7;
Fig. 10 is a schematic structural diagram of an embodiment of a display screen of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 to 4, an embodiment of an LED package module of the present application includes a plurality of LED units 10. When the LED package module is assembled in a display screen, each LED unit 10 becomes a pixel of the display screen. Furthermore, each LED packaging module in the display screen comprises a plurality of pixels. Meanwhile, each pixel may include a plurality of sub-pixels. The plurality of LED units 10 are packaged together to form the LED package module of the present embodiment. For the light emitting manner of the LED package module, the LED package module of the present embodiment can be packaged by using TOP packaging technology, so that the LED package module of the present embodiment realizes TOP light emission. For a specific chip packaging manner, the LED package module of this embodiment may package the LED chip by using QFN packaging technology and/or PLCC packaging technology, and certainly may also package other packaging technologies, or may package the LED package module by comprehensively using multiple packaging technologies at the same time.
As shown in fig. 1, each LED unit 10 includes a plurality of LED chips 11, a die bond frame 12, and a plurality of non-die bond frames 13. The LED chip 11 can emit light after being energized. The plurality of LED chips 11 in each LED unit 10 may be the same type of LED chip, or may be different types of LED chips, for example, one or more of a red LED chip, a green LED chip, a blue LED chip, and the like. Of course, other parameters of the LED chip 11 in each LED unit 10, such as power, size, etc., may be the same or different. The LED chips 11 of different LED units 10 may be the same or different.
Each LED chip 11 includes a first electrode (not labeled) and a second electrode (not labeled). The first electrode and the second electrode are positive and negative electrodes, for example. The first electrode is, for example, a positive electrode, and the second electrode is a negative electrode. In this embodiment, the corresponding positive and negative electrodes of the first electrode and the second electrode of different LED chips 11 may be the same or different. For the same situation, for example, the first electrodes of all the LED chips 11 of the LED package module are positive electrodes, and the second electrodes are negative electrodes. For different cases, for example, in one LED unit 10, the first electrode of one LED chip 11 is a positive electrode, the second electrode is a negative electrode, the first electrode of the other LED chip 11 is a negative electrode, and the second electrode is a positive electrode. The arrangement of the positive and negative electrodes of the first and second electrodes of the LED chip 11 can be adjusted and determined according to the requirements of the LED module in the specific design process.
the die bond frame 12 and the non-die bond frame 13 may be used as lead frames for electrically connecting to the first electrode and the second electrode of the LED chip 11, respectively. The plurality of non-die bonding frames 13 of each LED unit 10 are spaced from each other, and the die bonding frames 12 and the non-die bonding frames 13 are spaced from each other.
the die bond frame 12 and the non-die bond frame 13 may be of unitary construction. As shown in fig. 1, the die bond frame 12 and the non-die bond frame 13 may be integral parts of a support 40 of unitary construction. As an example, the die bonding frame 12 and the non die bonding frame 13 may be formed by performing corresponding processes on a single metal substrate, such as a stamping process, and then injection molding may be performed to perform processes such as spacing and insulation on the die bonding frame 12 and the non die bonding frame 13, or electroplating may be performed to form the integrated bracket 40. As another example, a mounting process is performed on an insulating substrate, and the die bonding frame 12 and the non-die bonding frame 13 are attached to the insulating substrate and spaced apart from each other, so that the die bonding frame 12, the non-die bonding frame 13, and the insulating substrate may form the support 40 of an integrated structure. Each LED unit 10 may have a respective one of the legs 40 of the unitary structure, including all of the die bond frames 12 and the non-die bond frames 13 of the unit. The whole LED package module may also have a support 40 of an integrated structure, including the die bond frames 12 and the non-die bond frames 13 of all the LED units 10.
In the present embodiment, at least one surface of each die bond frame 12 of the LED package module is exposed to the side and/or bottom surface of the LED package module. At least one surface of each of the non-die bond frames 13 is exposed to the side and/or bottom surface of the LED package module. The packaging structure is convenient for subsequent welding of the LED packaging module or connection with other components. As shown in fig. 1, the surface of one side of each die attach frame 12 and each non die attach frame 13 is located at the edge of the support 40, after the LED chip 11 is packaged with the support 40, at least one surface of each die attach frame 12 and each non die attach frame 13 located at the edge of the support 40 may be exposed on the side surface and/or the bottom surface of the LED package module, which may facilitate the subsequent wire bonding to the surface of the die attach frame 12 and the non die attach frame 13 exposed on the side surface and/or the bottom surface of the LED package module, thereby implementing the driving of the LED chip 11.
In the present embodiment, the plurality of LED chips 11 of each LED unit 10 are fixed to the same die bond frame 12. For example, the die bond frame 12 of each LED unit 10 may be one, and all the LED chips 11 of the LED unit 10 are fixed on the die bond frame 12. In some embodiments, each LED unit 10 may include two or more die bond frames 12, but all the LED chips 11 of the LED unit 10 are fixed on the same die bond frame 12.
Each LED chip 11 may be fixed on the die attach frame 12 by a conductive adhesive or a die attach adhesive. For the fixing manner of the conductive adhesive, the first electrode of the corresponding LED chip 11 can be directly electrically connected to the die attach frame 12 through the conductive adhesive, i.e. the vertical electrode structure. For the die attach adhesive method, the corresponding LED chip 11 is fixed to the die attach frame 12 through the die attach adhesive, and the first electrode and the second electrode are respectively electrically connected to the die attach frame 12 and the non-die attach frame 13 through the leads. As shown in fig. 1, the first electrode of at least one LED chip 11 in each LED unit 10 may be a vertical electrode structure, that is, the first electrode is fixed on the die attach frame 12 through a conductive adhesive, and can be electrically connected to the die attach frame 12 through the conductive adhesive.
As an example, the plurality of LED chips 11 of each LED unit 10 includes at least one red LED chip, at least one green LED chip, and at least one blue LED chip.
Optionally, at least one red LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame 12 by die attach adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 by a lead.
Optionally, at least one blue LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame 12 by die attach adhesive, and the corresponding first electrodes are electrically connected to the die attach frame 12 by leads.
optionally, at least one green LED chip of the LED chips 11 is fixed to the die attach frame 12 through a conductive adhesive, and the corresponding first electrode is electrically connected to the die attach frame 12 through the conductive adhesive. The rest of the LED chips 11 are fixed to the die attach frame by die attach adhesive, and the corresponding first electrodes are electrically connected to the die attach frame 12 by leads.
Through setting up at least one LED chip 11 and fixing and the solid brilliant frame 12 of electric connection through the conducting resin, can effectively promote LED chip 11's luminous efficacy and improve luminance, reduce the thermal resistance of LED encapsulation module, the other LED chips of cooperation are fixed in solid brilliant frame 12 through solid brilliant glue simultaneously, can reduce the encapsulation degree of difficulty of LED encapsulation module.
as shown in fig. 2, the LED chips 11 of each LED unit 10 include a red LED chip 11a, a green LED chip 11b and a blue LED chip 11c, and the LED chips 11 may be arranged in a triangular shape or a linear shape on the die bonding frame 12. The arrangement of the LED chips of different LED units 10 may be the same or different.
As for the connection relationship between the LED chip 11 and the die bond frame 12 and the non-die bond frame 13, the present embodiment can provide a plurality of embodiments as follows.
As shown in fig. 1, this example provides a first embodiment described below:
The plurality of LED chips 11 of each LED unit 10 are fixed to the same die bonding frame 12. The first electrode of each LED chip 11 is electrically connected to the same die bonding frame 12. The second electrode of each LED chip 11 is electrically connected to a different non-die bond frame 13.
As shown in fig. 1, the LED units 10 may be spaced apart from each other. For example, one LED package module may include four LED units 10, and the four LED units 10 may be arranged in an array. Each LED unit 10 may include three LED chips 11, one die bond frame 12, and three non-die bond frames 13. The three LED chips 11 are fixed to one side surface of the die bonding frame 12 at intervals. The first electrode of each LED chip 11 is electrically connected to the die bonding frame 12. The second electrode of each LED chip 11 is electrically connected to different non-die bonding frames 13, the four die bonding frames 12 are arranged in an array, and the three non-die bonding frames 13 of each LED unit 10 can be adjacent to one side of the die bonding frame 12 and arranged at intervals along the direction of the one side, that is, the three non-die bonding frames 13 are arranged opposite to one side of the die bonding frame 12.
in the present embodiment, the die bond frames 12 and any one of the non-die bond frames 13 may not be shared between the LED units 10.
By fixing the plurality of LED chips 11 of each LED unit 10 to a die attach frame 12 and electrically connecting the first electrode of each LED chip 11 to the die attach frame 12, the number of die attach frames 12 can be effectively reduced compared to the prior art in which each LED chip 11 corresponds to one die attach frame 12 and one non-die attach frame 13, if the LED package module is packaged in the form of pins, the number of pins can be effectively reduced, and the plurality of LED chips 11 are fixed to one die attach frame 12, each LED chip 11 corresponds to one non-die attach frame 13, the structural stability is improved while the electrical stability of the LED chips 11 is effectively improved, and in addition, the volume of the LED package module can be increased by integrally packaging the plurality of LED units 10, thereby reducing the welding difficulty and the manufacturing difficulty, the mechanical strength of the LED packaging module is improved.
As shown in fig. 3, this example provides a second embodiment described below:
the plurality of LED chips 11 of each LED unit 10 are all fixed to the same die attach frame 12, and the first electrode of each LED chip 11 is electrically connected to the die attach frame 12. The plurality of LED chips 11 of each LED unit 10 are connected to different non-die bond frames 13. For example, the LED chips 11 of each LED unit 10 may correspond to the non-die bond frames 13 one by one, and the second electrode of each LED chip 11 is electrically connected to one non-die bond frame 13 correspondingly. For convenience of explanation, fig. 3 shows the LED chips 11a, 11b, and 11c and the non-die bond frames 13a, 13b, and 13c in fig. 1, but the number of LED chips is not limited to these examples.
As shown in fig. 3, at least two of the non-die bond frames 13b respectively corresponding to different LED units 10 are the same non-die bond frame. In other words, the same non-die bond frame belongs to different LED units 10. For example, based on the first embodiment, at least one non-die bond frame 13 is shared between at least two LED units 10. For example, the die attach frame 13b shown in fig. 3 is common to two corresponding LED units 10, the die attach frame 13b may be regarded as one of the LED units 10, or may be regarded as another LED unit 10, and the second electrodes of one LED chip 11 on the two LED units are connected to the die attach frame 13 b. Of course, the die bond frame 13c shown in fig. 3 is also shared by at least two LED units 10, which can be regarded as the die bond frames 13 of the at least two LED units 10, respectively. Each LED chip 11 in the same LED unit 10 does not share the non-die bond frame 13.
On the basis that the plurality of LED chips 11 in each LED unit 10 share the die bonding frame 12, at least one non-die bonding frame 13 is shared between at least two LED units 10, namely at least two non-die bonding frames 13b respectively belonging to different LED units 10 are the same non-die bonding frame, the number of lead frames such as the non-die bonding frames 13 can be effectively reduced, the structure of the LED packaging module is optimized, and compared with the single packaging of each LED unit 10 in the prior art, the LED packaging module has the advantages that the LED packaging module is increased in size by packaging the plurality of LED units 10 into a whole, the welding difficulty and the manufacturing difficulty are reduced, and the mechanical strength of the LED packaging module is improved.
As shown in fig. 3, a plurality of LED units 10 of the LED package module may be arranged in an array, and the die bonding frames 12 are also arranged in an array and spaced apart from each other. The same non-die bond frame 13b shared by at least two LED units 10 may be disposed between the die bond frames 12 of the at least two LED units 10.
For example, at least two of the non-die bond frames 13b, each corresponding to at least two of the LED units 10 arranged at intervals in the row direction, are the same non-die bond frame. That is, the same one of the non-die bond frames 13b may be regarded as one of the non-die bond frames of at least two LED units 10 disposed at intervals in the row direction, respectively. Specifically, the second electrodes of the LED chips 11a in the at least two LED units 10 are both connected to the same non-die bond frame 13 b. The non-die bonding frames 13b are located between the die bonding frames 12 arranged at intervals in the row direction.
for example, at least two of the die attach frames 13c, each corresponding to at least two of the LED units 10 arranged at intervals in the column direction, are the same die attach frame. That is, the same one of the die attach frames 13c may be regarded as one die attach frame 13c of at least two LED units 10 disposed at intervals in the column direction. The second electrodes of the LED chip 11c in one LED unit 10 and the LED chip 11a of another LED unit on the same column in the column direction as in fig. 3 are connected to the same non-die bond frame 13 c. The non-die bonding frames 13c are positioned between the die bonding frames 12 arranged at intervals in the column direction.
The die attach frame 13 shared by at least two LED units 10 may also be shared by other rows or columns of LED units 10, or even all of the LED units 10.
As shown in fig. 4, the plurality of die attach frames 13c corresponding to all the LED units 10 are the same die attach frame. That is, each LED unit 10 in the LED package module has an amorphous frame 13c, and the amorphous frame 13c is common to all the LED units 10. In terms of connection, the non-die-bonding frame 13c can be regarded as a non-die-bonding frame 13 of each LED unit 10. The LED chips 11a, 11b, 11c in each LED unit 10 do not share the non-die bond frame 13. For example, the LED package module includes four LED units 10 arranged in an array, and the die attach frame 13c connected to one LED chip 11 in each LED unit 10 and the die attach frame 13c connected to one LED chip 11 in each other LED unit 10 are the same die attach frame 13 c. The same non-die bond frame 13c common to all the LED units 10 may extend from one side edge of the one-piece-structured support 40 to the other side edge of the one-piece-structured support 40, so that the two end surfaces may be exposed to two pairs of side surfaces of the LED package module, respectively.
By integrally packaging the plurality of LED units 10 and setting the plurality of die attach frames 13c corresponding to all the LED units 10 as the same die attach frame 13c, that is, at least one die attach frame 13c is shared between all the LED units 10, the number of lead frames such as the die attach frames 13 can be further effectively reduced compared to the first embodiment of the present embodiment and the single package of each LED unit in the prior art. In addition, the LED units 10 are packaged into a whole, so that the size of the LED packaging module is increased, the welding difficulty and the manufacturing difficulty are reduced, and the mechanical strength of the LED packaging module is improved.
As shown in fig. 4, in the present embodiment, a part of the LED chips 11 in the LED units 10 arranged at intervals in the row direction may share one non-die bond frame 13, and another part of the LED chips 11 in all the LED units 10 may share another non-die bond frame 13, which is further illustrated as follows:
the LED packaging module is provided with a first side surface 1a, a second side surface 1b arranged opposite to the first side surface 1a, a third side surface 1c connected between the first side surface 1a and the second side surface 1b, and a fourth side surface 1d arranged opposite to the third side surface 1 c.
The number of the plurality of LED units 10 is four, and the LED units 10 are divided into a first row of LED units 10 and a second row of LED units 10 along a row direction, each row of LED units 10 includes two LED units 10, each LED unit 10 includes a first LED chip 11a, a second LED chip 11b and a third LED chip 11c, and the LED units are disposed on the die attach frame 12 at intervals along a column direction.
the two first LED chips 11a of the first row of LED units 10 are respectively connected to the same non-die bonding frame 13b, and the shared non-die bonding frame 13b is located between the die bonding frames 12 of the two first row of LED units 10, and one side of the common non-die bonding frame is exposed to the first side 1a of the LED package module. The two die attach frames 13b connected to the two third LED chips 11c of the second row of LED units 10 are the same die attach frame, and the shared die attach frame 13b is located between the die attach frames 12 of the two LED units 10 in the second row, and one side of the common die attach frame is exposed to the second side of the LED package module.
The die attach frame 13c connected to the two third LED chips 11c of the first row of LED units 10 and the die attach frame 13c connected to the two first LED chips 11a of the second row of LED units 10 are the same die attach frame, the common die attach frame 13c is located between the first row of LED units 10 and the second row of LED units 10, and two end surfaces of the die attach frame 13c are exposed to the third side 1c and the fourth side 1d of the LED package module, respectively.
by adopting the packaging scheme, compared with the prior art in which 4 LED units 10 are packaged separately, at least 5 non-die bond frames 13 can be effectively reduced.
In the present embodiment, when a plurality of LED units 10 are packaged together, light beams between the LED units 10 may cross each other, thereby causing a problem of non-uniform color. Referring to fig. 5 to 9, in order to improve these problems, the LED unit 10 of the present embodiment further includes a housing 14 formed with a groove 140. The housings 14 of the LED units 10 may be integrally formed or may be independent from each other, and the light emitting directions are the same. The LED package module of the present embodiment can adopt a TOP package manner, that is, the TOP light can be emitted through the housing 14.
The side of the housing 14 forming the groove 140 is a light-emitting side, and the opposite side is a non-light-emitting side. The die bond frame 12 and the plurality of non-die bond frames 13 may be disposed on the non-light-emitting side of the housing 14. The corresponding positions of the die bonding frame 12 and the non-die bonding frame 13 can be exposed in the groove 140 to facilitate the mounting of the LED chip 11. At least a part of the surface of the groove 140 is configured as a reflective surface 141a, for example, specular reflection or diffuse reflection. Specifically, at least a part of the surface of the groove 140 is coated with a reflective material or provided with a reflective member for reflecting light emitted from the plurality of LED chips 11 out of the groove 140. By providing the housing 14 forming the groove 140 for reflecting the respective light of each LED unit 10, the problem of light crosstalk between the LED units 10 can be improved or avoided, and the optical effect can be improved.
as shown in fig. 5, the surface of the recess 140 of the housing 14 may be parabolic, ellipsoid, spherical or other shape. The light exit side of the housing 14 is formed with an opening, i.e., a light exit port, due to the presence of the groove 140. The light-emitting side surface of the shell 14 between the adjacent grooves 140 can be set to be a black absorption surface, so that light irradiated to the light-emitting side surface from the outside or light emitted by the LED chip can be absorbed and reflected to the light-emitting side surface, the problem of light crosstalk is further improved, the contrast of the LED packaging module which displays when the LED packaging module is assembled on a display screen is improved, and the display effect is improved.
Because each LED unit 10 is provided with the housing 14 to reflect light, the distance between the adjacent grooves 140 is large, the pixel ratio of the LED units 10 is small, and the LED units 10 are split, which may cause the display effect to have obvious granular sensation, thereby affecting the display effect after being assembled on the display screen. In order to improve this problem, as shown in fig. 6 and 7, the LED package module of the present embodiment further includes a light homogenizing film 20. The light uniformizing film 20 is disposed on the light emitting side of the housing 14 to cover the grooves 140 of the plurality of LED units 10.
The light homogenizing film 20 can be silica gel, epoxy resin or other materials, and scattering particles such as titanium dioxide, aluminum oxide, silicon oxide and the like can be added into the light homogenizing film 20, and black light absorbing particles such as graphite or organic dyes and the like can also be added.
Through setting up the light-emitting side that even membrane 20 covers a plurality of LED units 10, can adjust the concentrated light-emitting of each original LED unit 10 to the dispersion light-emitting to the light-emitting of even whole LED encapsulation module effectively improves the graininess of LED encapsulation module when assembling the display screen and show. Moreover, the light-homogenizing film 20 can enlarge the light-emitting area of each LED unit 10 due to the function of dispersing light, so that the ratio of the light-emitting area of each LED unit 10 to the area of the light-emitting side surface is improved, the pixel proportion of the LED packaging module is improved, and the display effect is effectively improved. In addition, even light film 20 also can further even the light between each LED chip 11 in every LED unit 10, so can effectively promote the display effect of LED encapsulation module when assembling the display screen. Of course, the light homogenizing film 20 with a suitable thickness can further improve the pixel ratio of the LED package module, and can further improve the problem of light crosstalk between the LED units 10.
Since the LED chip 11 generates heat during the light emitting process, the light emitted from the light outlet of the groove 140 may cause thermal effect, such as thermal stress, on the light uniformizing film 20, which may affect the reliability of the LED package module. As shown in fig. 6 and 7, in order to improve this problem, the light uniformizing film 20 of the present embodiment is provided with a slit 201.
specifically, the light unifying film 20 forms a slit 201 between two adjacent grooves 140, and the slit 201 extends along the periphery of the groove. For example four LED units 10 arranged in an array, the slits 201 extend between adjacent grooves 140, which may be in the form of a cross.
Through set up gap 201 on even light membrane 20, gap 201 extends along recess 140 is peripheral, can improve even light membrane 20 because the LED module reliability problem that thermal stress arouses, alleviates thermal stress, avoids thermal stress to cause even light membrane 20 to appear shifting or the situation of damaging, effectively protects LED encapsulation module.
The configuration of the housing 14 may have a variety of configurations. As shown in fig. 6 and 8, the first case: the groove 140 may penetrate through the light emitting side and the non-light emitting side of the housing 14, the die bonding frame 12 and the non-die bonding frame 13 are disposed on the non-light emitting side of the housing 14, and when the LED chips 11 are fixed on the die bonding frame 12, the LED chips are located in the groove 140, and the light emitted by the LED chips 14 can be emitted from the light emitting side. For example, the LED package module includes a support 40 of an integrated structure, the support 40 may include all die bonding frames 12 and all non-die bonding frames 13, the support 40 is disposed on the non-light-emitting side of the plurality of housings 14 of the LED package module, and each housing 14 corresponds to each LED unit 10. As shown in fig. 8, at least one side of the support 40 may extend to an outer edge of the housing 14, so that at least one surface of each of the die bond frame 12 and the non-die bond frame 13 may be exposed to a side surface of the LED package module. This case may be a QFN package type or a similar package type.
For this situation, in the present embodiment, the die bonding frame 12 is used to fix the LED chip 11, and after the corresponding electrical connection is performed, the encapsulating material layer 30 can be used to cover one side of the bracket 40 where the LED chip 11 is disposed, and the other side of the bracket 40 opposite to the LED chip 11, so that the surface of at least one side of the bracket 14 is exposed at two sides of the LED package module. Therefore, the LED chip 11 can be effectively packaged and protected, and the problem of light crosstalk caused by light leakage in the prior art is solved.
As shown in fig. 9, the second case: the housing 14 includes a side wall 141 and a bottom wall 142. The side wall 141 and the bottom wall 142 enclose a recess 140. The die bonding frame 12 and the non-die bonding frame 13 are arranged on one side of the bottom wall 142 facing the groove 140. The support 40 of the LED package module comprises all the die bond frames 12 and all the non-die bond frames 13 of the whole LED package module. The stent 40 includes at least one bend 401. The bending section 401 extends from inside the groove 140 to a side of the bottom wall 142 opposite to the groove 140, and bends to cover a part of the bottom wall 142 of the housing 14. For example, a gap is formed at the joint of the bottom wall 142 and the side wall 141, so that the bending section 401 extends out of the groove 140 from the inside of the groove 140 through the gap, and then bends to the side of the bottom wall 142 opposite to the side wall 141, thereby covering a part of the bottom wall 142. At least one surface of each of the die bond frame 12 and the non-die bond frame 13 can be exposed to the side surface and the bottom surface of the package module. This case may be a PLCC package type or the like.
For this situation, in the present embodiment, the die bonding frame 12 is used to fix the LED chip 11, and after the corresponding electrical connection is performed, the encapsulating material layer 30 can be used to cover one side of the bracket 40 where the LED chip 11 is disposed and the other side of the bracket 40 opposite to the LED chip 11, so that the side and the bottom of the bending section 401 can be exposed at two sides of the LED package module. Therefore, the LED chip 11 can be effectively packaged and protected, and the problem of light crosstalk caused by light leakage in the prior art is solved.
As shown in fig. 10, an embodiment of the display screen of the present application provides a display screen 3, which includes a plurality of LED package modules 1 and a driving circuit 2, where the driving circuit 2 is configured to drive the plurality of LED package modules 1 to perform display. For example, the driving circuit 2 may drive the LED package module 1 to display through an active or passive manner. The drive circuit 2 may be driven by using an existing drive circuit 2.
To sum up, the LED encapsulation module that this application LED encapsulation module embodiment and this application display screen embodiment provided can reduce the quantity of lead frame effectively, simplifies the structure, collects a plurality of LED units moreover and can effectively increase the volume of LED encapsulation module in an organic whole to reduce the welding degree of difficulty and the manufacturing degree of difficulty, improve the mechanical strength of LED encapsulation module.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (10)

1. An LED package module, comprising:
A plurality of LED units packaged in one body;
each LED unit comprises a plurality of LED chips, a die bonding frame and a plurality of non-die bonding frames, the die bonding frames and the non-die bonding frames are arranged at intervals, and the LED chips are fixed on the same die bonding frame; each LED chip comprises a first electrode and a second electrode, the second electrode of each LED chip is electrically connected with different non-die bonding frames correspondingly, the first electrode of each LED chip is electrically connected with the same die bonding frame, and at least two non-die bonding frames which respectively belong to different LED units are the same non-die bonding frame.
2. The LED package module of claim 1, wherein:
At least one surface of each die bonding frame is exposed to the side surface and/or the bottom surface of the LED packaging module, and at least one surface of each non-die bonding frame is exposed to the side surface and/or the bottom surface of the LED packaging module.
3. The LED package module of claim 2, wherein:
the LED units are arranged in an array; the LED module comprises at least two LED units, wherein at least two non-die bonding frames which respectively belong to the at least two LED units arranged at intervals along the row direction are the same non-die bonding frame; and/or the presence of a gas in the gas,
at least two non-die bonding frames which respectively belong to at least two LED units arranged at intervals along the column direction are the same non-die bonding frame; alternatively, the first and second electrodes may be,
The plurality of non-die bond frames respectively belonging to each LED unit are the same non-die bond frame.
4. The LED package module of claim 3, wherein:
The LED die bonding frame comprises a plurality of LED units, a plurality of LED chips and a plurality of lead frames, wherein the number of the LED units is four, the LED units are divided into a first row of LED units and a second row of LED units along the row direction, the first row of LED units and the second row of LED units respectively comprise two LED units, each LED unit comprises a first LED chip, a second LED chip and a third LED chip, and the LED units are arranged on the die bonding frame at intervals along the column direction;
the LED packaging module is provided with a first side face, a second side face arranged opposite to the first side face, a third side face connected between the first side face and the second side face and a fourth side face arranged opposite to the third side face; the non-die bonding frames respectively connected with the two first LED chips of the first row of LED units are the same non-die bonding frame, are positioned between the two die bonding frames of the first row of LED units, and have one side surface exposed to the first side surface of the LED packaging module; the two non-die bonding frames respectively connected with the two third LED chips of the second row of LED units are the same non-die bonding frame, are positioned between the two die bonding frames of the second row of LED units, and have one side surface exposed to the second side surface of the LED packaging module; the non-die-bonding frame, to which the two third LED chips of the first row of LED units are connected respectively, and the non-die-bonding frame, to which the two first LED chips of the second row of LED units are connected respectively, are the same non-die-bonding frame, and are located between the first row of LED units and the second row of LED units, and both end surfaces of the non-die-bonding frame are exposed to the third side and the fourth side of the LED package module, respectively.
5. The LED package module of claim 1, wherein:
The plurality of LED chips of each of the LED units includes at least one blue LED chip, at least one red LED chip, and at least one green LED chip;
at least one red LED chip in the LED chips is fixed on the die bonding frame through conductive adhesive, and the corresponding first electrode is electrically connected with the die bonding frame through the conductive adhesive; the other LED chips in the plurality of LED chips are fixed on the die bonding frame through die bonding glue, and are electrically connected with the die bonding frame through leads corresponding to the first electrodes; alternatively, the first and second electrodes may be,
at least one blue LED chip in the plurality of LED chips is fixed on the die bonding frame through a conductive adhesive, and the corresponding first electrode is electrically connected with the die bonding frame through the conductive adhesive; the other LED chips in the plurality of LED chips are fixed on the die bonding frame through die bonding glue, and the corresponding first electrodes are electrically connected with the die bonding frame through leads; alternatively, the first and second electrodes may be,
At least one green LED chip in the LED chips is fixed on the die attach frame through conductive adhesive, the corresponding first electrode is electrically connected with the die attach frame through the conductive adhesive, the rest of the LED chips are fixed on the die attach frame through the die attach adhesive, and the corresponding first electrode is electrically connected with the die attach frame through a lead.
6. The LED package module of claim 1, wherein:
every LED unit is including forming the notched casing, the LED chip set up in the recess, the casing is formed with one side of recess is the light-emitting side, with the light-emitting side one side that carries on the back mutually is the non-light-emitting side, gu brilliant frame with a plurality of non-solid brilliant frames set up in the non-light-emitting side of casing, the configuration of at least partial surface of recess is the plane of reflection for with the light of a plurality of LED chip transmission reflects outside the recess.
7. The LED package module of claim 6, wherein:
the housing of the plurality of LED units is of an integrally formed structure.
8. The LED package module of claim 6, wherein:
The LED packaging module comprises a light homogenizing film, the light homogenizing film is covered on the light emitting side of the shell to cover the grooves of the LED units, wherein the light homogenizing film is adjacent to each other, gaps are formed between the grooves, and the gaps extend along the peripheries of the grooves.
9. The LED package module of claim 1, wherein:
The LED packaging module is at least a QFN packaging type and/or PLCC packaging type packaging module.
10. A display screen comprising a plurality of LED package modules according to any one of claims 1 to 9 and a driving circuit for driving the plurality of LED package modules to display.
CN201910770925.7A 2019-08-20 2019-08-20 LED encapsulation module and display screen Pending CN110556469A (en)

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CN111179774A (en) * 2020-01-21 2020-05-19 深圳市艾比森光电股份有限公司 LED display module and LED display screen

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CN203026503U (en) * 2012-11-13 2013-06-26 佛山市国星光电股份有限公司 LED device for display screen and display module
CN204991756U (en) * 2015-07-22 2016-01-20 厦门市信达光电科技有限公司 Polycrystal LED packaging support and polycrystal LED packaging body
CN210607322U (en) * 2019-08-20 2020-05-22 深圳市艾比森光电股份有限公司 LED encapsulation module and display screen

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CN203026503U (en) * 2012-11-13 2013-06-26 佛山市国星光电股份有限公司 LED device for display screen and display module
CN204991756U (en) * 2015-07-22 2016-01-20 厦门市信达光电科技有限公司 Polycrystal LED packaging support and polycrystal LED packaging body
CN210607322U (en) * 2019-08-20 2020-05-22 深圳市艾比森光电股份有限公司 LED encapsulation module and display screen

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