CN218939451U

CN218939451U - SMD horizontal electrolytic capacitor and carrier tape box

Info

Publication number: CN218939451U
Application number: CN202223225499.5U
Authority: CN
Inventors: 何思丁
Original assignee: Shenzhen Wisdow Reaches Industry Co ltd
Current assignee: Shenzhen Wisdow Reaches Industry Co ltd
Priority date: 2022-12-03
Filing date: 2022-12-03
Publication date: 2023-04-28
Anticipated expiration: 2032-12-03

Abstract

The utility model provides an SMD horizontal electrolytic capacitor and a carrier tape box, wherein the SMD horizontal electrolytic capacitor comprises an anode foil, a cathode foil, electrolytic paper, an aluminum shell and a sealing insulating rubber plug, wherein the electrolytic paper is clamped between the anode foil and the cathode foil, and the anode foil, the cathode foil and the electrolytic paper are wound into cylindrical elements which are contained in the aluminum shell; the positive electrode foil is riveted with a positive electrode connecting sheet terminal, the positive electrode connecting sheet terminal is riveted with a leading-out positive electrode lead, the negative electrode foil is riveted with a negative electrode connecting sheet terminal, and the negative electrode connecting sheet terminal is riveted with a leading-out negative electrode lead; the sealing insulating rubber plug comprises a first layer and a second layer, wherein the first layer is arranged at the port of the aluminum shell, the positive electrode connecting sheet terminal and the negative electrode connecting sheet terminal are inserted into the first layer, the second layer extends to the outside of the aluminum shell from the port of the aluminum shell, and a limiting platform is arranged on the second layer and is matched with the carrier tape box to realize the functions of limiting and preventing errors, so that the sealing insulating rubber plug is suitable for being applied to the SMT automatic paster production process.

Description

SMD horizontal electrolytic capacitor and carrier tape box

Technical Field

The utility model relates to the technical field of electrolytic capacitors, in particular to an SMD horizontal electrolytic capacitor and a carrier tape box.

Background

It is known that electrolytic capacitors have large capacity per unit volume, low price per unit volume, and advantages over other types of capacitors, and circuits such as linear power supplies, switching power supplies, DC/DC conversion, power amplifiers and the like are widely used as filtering and energy storage capacitors.

However, in the conventional direct-insert electrolytic capacitor, a production process of manually inserting or automatically inserting the electrolytic capacitor into a circuit board and then performing wave soldering or manual welding is still required, which seriously affects the quality and efficiency of production; when electronic products are moving to high-density miniaturization and ultra-thin, a process of automatically attaching surface mounted components (SMD) to a circuit board by adopting an SMT machine and then welding by reflow soldering has become mainstream, and SMD devices relatively reduce the volume and weight of the products, have higher yield than direct-insert components, and can improve the production efficiency and save the labor cost.

The traditional SMD patch type electrolytic capacitor solves the problem of the adaptive SMT production process, but has higher price than the traditional direct-insertion type electrolytic capacitor, is vertical, and cannot meet the requirement that the height of the electrolytic capacitor is required to be reduced to the greatest extent when the electrolytic capacitor is attached to a Printed Circuit Board (PCB). In engineering design of some application fields, the direct-insertion electrolytic capacitor is horizontally placed by a method of slotting on a Printed Circuit Board (PCB), so that the method of reducing the total height of the electrolytic capacitor after mounting solves the problem of height, but the method needs manual placement and manual welding, and cannot meet the production process of automatic mounting by an automatic mounting (SMT) machine. Whether the existing vertical SMD patch electrolytic capacitor or the existing direct-insert electrolytic capacitor cannot well meet the requirements, a new aluminum electrolytic capacitor structure is needed in the market, and the problems existing in the direct-insert aluminum electrolytic capacitor and the SMD patch aluminum electrolytic capacitor with the vertical structure are solved.

Disclosure of Invention

In order to solve the problems, the utility model provides an SMD horizontal electrolytic capacitor and a carrier tape box, which are used for solving the problems that the requirements of an SMT automatic paster process cannot be met and the SMT paster process and a horizontal structure paster cannot be solved in the background technology.

The utility model is realized by the following technical scheme:

the utility model provides an SMD horizontal electrolytic capacitor, which comprises an anode foil, a cathode foil, electrolytic paper, an aluminum shell and a sealing insulating rubber plug, wherein the electrolytic paper is clamped between the anode foil and the cathode foil, the anode foil, the cathode foil and the electrolytic paper are wound into cylindrical elements, and the elements are accommodated in the aluminum shell;

the anode foil is riveted with an anode connecting sheet terminal, the anode connecting sheet terminal is riveted with a leading-out anode lead, the cathode foil is riveted with a cathode connecting sheet terminal, and the cathode connecting sheet terminal is riveted with a leading-out cathode lead;

the sealing insulating rubber plug comprises a first layer and a second layer, the first layer is arranged at a port of the aluminum shell, the positive electrode connecting sheet terminal and the negative electrode connecting sheet terminal are inserted into the first layer, the second layer extends to the outside of the aluminum shell from the port of the aluminum shell, and the positive electrode lead and the negative electrode lead are partially accommodated in the second layer and partially extend to the outside of the second layer;

and a limiting platform is arranged on the second layer and used for limiting and preventing errors of the SMD horizontal electrolytic capacitor.

Further, two terminal through holes are formed in the first layer, and the positive connecting sheet terminal and the negative connecting sheet terminal are respectively inserted into the two terminal through holes.

Further, two lead through holes are formed in the second layer, the two lead through holes correspond to one terminal through hole respectively, the lead through holes are communicated with the terminal through holes, and the positive electrode lead and the negative electrode lead are partially accommodated in the lead through holes.

Further, the diameter of the first layer is larger than the diameter of the second layer, and the aperture of the terminal through hole is larger than the aperture of the lead through hole.

Further, the positive electrode lead and the negative electrode lead are Z-shaped legs or U-shaped legs or straight legs.

Another aspect proposes a carrier tape cartridge for placing the above SMD horizontal electrolytic capacitor.

Further, a bearing surface is arranged in the carrier tape box and used for bearing the limiting platform.

The utility model has the beneficial effects that:

1. according to the SMD horizontal electrolytic capacitor provided by the utility model, the limiting platform is arranged on the sealing insulating rubber plug, and the limiting platform is matched with the bearing surface in the carrier tape box to play roles of limiting and preventing errors, so that the electrolytic capacitor is placed at a fixed position in the carrier tape box, and the SMT automatic surface mounting process requirement is met.

2. The SMD horizontal electrolytic capacitor provided by the utility model utilizes the existing direct-insert aluminum electrolytic capacitor production equipment and technology in the production link, and well solves the problems of meeting SMT (surface mount technology) technology process and horizontal structure surface mounting under the condition of not increasing equipment investment.

Drawings

Fig. 1 is a schematic diagram of the structure of an SMD horizontal electrolytic capacitor of embodiment 1 of the present utility model;

FIG. 2 is a cross-sectional view of the SMD horizontal electrolytic capacitor of the present utility model;

FIG. 3 is an enlarged view of a partial explosion of the present utility model;

fig. 4 is a schematic structural view of the sealing insulating rubber plug of the present utility model;

FIG. 5 is a cross-sectional view of the sealing insulating plug of the present utility model;

fig. 6 is a cross-sectional view of an SMD horizontal electrolytic capacitor of embodiment 1 of the present utility model mounted in a carrier tape case;

fig. 7 is a schematic view showing a structure in which an SMD horizontal electrolytic capacitor of embodiment 1 of the present utility model is mounted on a printed wiring board (PCB);

fig. 8 is a cross-sectional view of an SMD horizontal electrolytic capacitor of embodiment 2 of the present utility model mounted in a carrier tape case;

fig. 9 is a schematic view showing a structure in which an SMD horizontal electrolytic capacitor of embodiment 2 of the present utility model is mounted on a printed wiring board (PCB);

fig. 10 is a schematic view of the structure of an SMD horizontal electrolytic capacitor according to embodiment 3 of the present utility model;

fig. 11 is a schematic view showing a structure in which an SMD horizontal electrolytic capacitor of embodiment 3 of the present utility model is mounted on a printed wiring board (PCB).

The reference numerals in the drawings indicate: 10. a prime; 11. an anode foil; 12. a cathode foil; 13. electrolyzing paper; 14. an aluminum shell; 15. sealing the insulating rubber plug; 16. a first layer; 17. a second layer; 18. a terminal through hole; 19. a lead wire through hole; 20. a positive electrode connecting piece terminal; 21. a negative electrode connection tab terminal; 22. a positive electrode lead; 23. a negative electrode lead; 24. a limiting platform; 25. a carrier tape cassette; 26. a bearing surface; 27. a Printed Circuit Board (PCB).

Detailed Description

In order to more clearly and completely describe the technical scheme of the utility model, the utility model is further described below with reference to the accompanying drawings.

Example 1

Referring to fig. 1-7, the present utility model provides an SMD horizontal electrolytic capacitor, comprising an anode foil 11, a cathode foil 12, an electrolytic paper 13, an aluminum case 14, and a sealing insulating rubber plug 15, wherein the electrolytic paper 13 is sandwiched between the anode foil 11 and the cathode foil 12, the anode foil 11, the cathode foil 12, and the electrolytic paper 13 are wound into a cylindrical element 10, and the element 10 is accommodated in the aluminum case 14; positive electrode connecting piece terminal 20 is riveted on positive electrode foil 11, positive electrode lead 22 is riveted on positive electrode connecting piece terminal 20, negative electrode connecting piece terminal 21 is riveted on negative electrode foil 12, and negative electrode lead 23 is riveted on negative electrode connecting piece terminal 21.

In this embodiment, the sealing insulating rubber plug 15 is a soft rubber plug, and can be deformed elastically, in this embodiment, the sealing insulating rubber plug 15 is made of natural or synthetic rubber, as shown in fig. 1, a circle of concave groove towards the inside is formed on the aluminum shell 14, when the sealing insulating rubber plug 15 is installed in the aluminum shell 14, deformation is generated by the pressing of the circle of groove, and the sealing insulating rubber plug 15 is also fixed inside the aluminum shell 14. As shown in fig. 4, the sealing insulating rubber plug 15 includes a first layer 16 and a second layer 17, the diameter of the first layer 16 is larger than that of the second layer 17, as shown in fig. 2, the first layer 16 is installed at a port of the aluminum shell 14, that is, the first layer 16 is located above the element 10, and the first layer 16 mainly plays a role of sealing and insulating. As shown in fig. 4 and 5, the first layer 16 is provided with two terminal through holes 18, and the positive connecting tab terminal 20 and the negative connecting tab terminal 21 are respectively inserted into the two terminal through holes 18. The second layer 17 is provided with two lead through holes 19, the two lead through holes 19 respectively correspond to one terminal through hole 18, the lead through holes 19 and the terminal through holes 18 are communicated, and the positive lead 22 and the negative lead 23 are both partially accommodated in the lead through holes 19. The aperture of the terminal through hole 18 is larger than the aperture of the lead through hole 19. The positive electrode connecting tab terminal 20 and the negative electrode connecting tab terminal 21 are inserted into the first layer 16, the second layer 17 extends from the end of the aluminum can 14 to the outside of the aluminum can 14, and the positive electrode lead 22 and the negative electrode lead 23 are partially accommodated in the lead through hole 19 and partially extend to the outside of the second layer 17; and a limiting platform 24 is arranged on the second layer 17, and the limiting platform 24 is used for limiting and preventing errors of the SMD horizontal electrolytic capacitor.

As shown in fig. 6, the SMD horizontal electrolytic capacitors with the positive electrode lead 22 and the negative electrode lead 23 of the zigzag pins need to be adapted to the corresponding carrier tape box 25, and the function of the limiting platform 24 is to contact with a carrying surface 26 arranged in the carrier tape box 25 in the loading process of the SMD horizontal electrolytic capacitor, so as to play roles of error prevention and limiting. The limiting platform 24 and the bearing surface 26 are contacted with each other, so that the SMD horizontal electrolytic capacitor is fixed in position when being in the carrier tape box 25, and the SMD horizontal electrolytic capacitor can be limited not to shake back and forth. When the SMD horizontal electrolytic capacitor is placed in the carrier tape box 25, the normal placement position is that the limit platform 24 and the bearing surface 26 just can be contacted with each other, and then the height of the SMD horizontal electrolytic capacitor does not exceed the upper edge of the carrier tape box 25. When the SMD horizontal electrolytic capacitor is reversely placed, the limiting platform 24 is not in contact with the bearing surface 26, so that the SMD horizontal electrolytic capacitor cannot be placed flatly, the SMD horizontal electrolytic capacitor is higher than the upper edge of the carrier tape box 25, and the limiting platform 24 has an error proofing function.

In this embodiment, as shown in fig. 7, a schematic diagram of the SMD horizontal electrolytic capacitor mounted on a Printed Circuit Board (PCB) 27 is shown, a slot hole dedicated to the placement of the SMD horizontal electrolytic capacitor is formed in the Printed Circuit Board (PCB) 27, the height of the zigzag pin defines the size of the slot on the Printed Circuit Board (PCB), the size of the slot on the printed circuit board matches with the height of the zigzag pin of the SMD horizontal electrolytic capacitor, so as to ensure that the SMD horizontal electrolytic capacitor contacts with a bonding pad on the Printed Circuit Board (PCB) 27, and when the SMD horizontal electrolytic capacitor is placed in the slot hole with proper matching, the mounting height of the SMD horizontal electrolytic capacitor is further defined.

Example 2

Referring to fig. 2, 3, 8 and 9, an SMD horizontal electrolytic capacitor is proposed based on example 1, in which the positive electrode lead 22 and the negative electrode lead 23 are straight pins. As shown in fig. 8, a cross-sectional view of the SMD horizontal electrolytic capacitor of the present embodiment is mounted in a carrier tape case 25.

In this embodiment, as shown in fig. 9, a schematic diagram of the SMD horizontal electrolytic capacitor of this embodiment is shown on a Printed Circuit Board (PCB) 27, so that it is known that the SMD horizontal electrolytic capacitor with the electrode leads of the straight pins is mounted in slots on the Printed Circuit Board (PCB) 27, and the slots specially matching the size and shape for mounting the horizontal SMD electrolytic capacitor are formed on the Printed Circuit Board (PCB) 27, so that the straight pins are in contact with pads on the Printed Circuit Board (PCB) 27, thereby defining the mounting height of the SMD bedroom electrolytic capacitor. In another case, a slot hole which is specially matched with the horizontal SMD electrolytic capacitor for installation and has proper shape is arranged on the Printed Circuit Board (PCB) 27, so that the limit platform 24 on the second layer 17 of the sealing insulation rubber plug 15 is contacted with the PCB, and meanwhile, the straight pin is contacted with the bonding pad on the Printed Circuit Board (PCB), thereby limiting the installation height of the SMD horizontal electrolytic capacitor.

Example 3

Referring to fig. 10 and 11, an SMD horizontal electrolytic capacitor is proposed based on example 1, in which the positive electrode lead 22 and the negative electrode lead 23 are U-shaped legs. As shown in fig. 11, the SMD horizontal electrolytic capacitor of the present embodiment is schematically mounted on a Printed Circuit Board (PCB) 27, and it can be seen that the U-shaped leg meets the requirements of the chip mounting process without slotting the PCB. When the positive electrode lead 22 and the negative electrode lead 23 are U-shaped legs, the positive electrode lead 22 and the negative electrode lead 23 are generally provided so as not to cover the limiting platform 24, which is more convenient to use.

Of course, there are various other embodiments of the present utility model, based on which those of ordinary skill in the art can obtain other embodiments without any inventive effort, which fall within the scope of the present utility model.

Claims

1. The SMD horizontal electrolytic capacitor is characterized by comprising an aluminum shell and a sealing insulating rubber plug, wherein the sealing insulating rubber plug comprises a first layer and a second layer, the first layer is arranged at a port of the aluminum shell, and the second layer extends to the outside of the aluminum shell from the port of the aluminum shell;

2. The SMD paddle electrolytic capacitor of claim 1 further comprising an anode foil, a cathode foil, an electrolytic paper sandwiched between said anode foil and said cathode foil, said anode foil, said cathode foil, said electrolytic paper wound into cylindrical form of a can, said can contained within said aluminum housing.

3. The SMD horizontal electrolytic capacitor according to claim 2, wherein said anode foil is riveted with a positive connection tab terminal, said positive connection tab terminal is riveted with a positive lead, said cathode foil is riveted with a negative connection tab terminal, said negative connection tab terminal is riveted with a negative lead, said positive connection tab terminal and said negative connection tab terminal are inserted into said first layer, and said positive lead and said negative lead are partially housed in said second layer and partially extend outside said second layer.

4. The SMD horizontal electrolytic capacitor according to claim 3, wherein said first layer is provided with two terminal through holes, and said positive electrode connecting tab terminal and said negative electrode connecting tab terminal are respectively inserted into two of said terminal through holes.

5. The SMD horizontal electrolytic capacitor according to claim 4, wherein said second layer is provided with two lead through holes, each of said two lead through holes being corresponding to one of said terminal through holes, said lead through holes and said terminal through holes being in communication, said positive electrode lead and said negative electrode lead being partially accommodated in said lead through holes.

6. The SMD horizontal electrolytic capacitor of claim 5, wherein a diameter of said first layer is larger than a diameter of said second layer, and a pore diameter of said terminal via is larger than a pore diameter of said lead via.

7. The SMD horizontal electrolytic capacitor according to claim 3, wherein said positive electrode lead and said negative electrode lead are zigzag pins or U-pins or straight pins.

8. A carrier tape cassette for placing the SMD horizontal electrolytic capacitor as claimed in any one of claims 1 to 7.

9. The carrier tape cartridge of claim 8, wherein a bearing surface is provided in the carrier tape cartridge, the bearing surface being configured to bear against the restraining platform.